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THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
On-Chip Antennas for Multi-
Chip RF Data Transmission
Dr. Kathleen Melde
Professor, ECE
University of Arizona
Department of Electrical and Computer Engineering
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Agenda
Introduction
System Evaluation of Existing Solutions
Single Antenna Wireless Interconnect
Two-Element Array Wireless Interconnect
Conclusion and Future Concepts
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
High Performance Computing
Computing Performance (Data Rate) β Clock Speed (Clock Frequency)
However,
Instead of increasing clock speed,
Data Clusters Weather/Climate Modeling
πππ€ππ β ππΆππππ Γ πΆπΏπππ Γ πππ’ππππ¦2 Switching Power
The complicated computation problem is
divided into several small tasks
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Multi-Core Computation Enables
Larger and Faster EM Simulation
HFSS on Nanostructured Structures
Structure on 1 core
w/ 24 GB
Structure on 12 core
w/ 256GB
HFSS Simulation of Surface
Roughness On 12 Cores
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Challenges in Interconnects
IBM Power and Z-Enterprise Systems (http://www.ibm.com)
Data Clusters Multi-Core Multi-Chip in Module Multi-Core in Single Chip
Increased parallel processer chips inside the module (Chip Size Reduction)
Physical wire density and I/O numbers will be the package design concerns
High speed data I/O numbers; Reduction on chip sizes; Unchanged
package wired interconnect
From International Technology Roadmap of Semiconductor (ITRS http://www.itrs.net)
20 mm
20 mm
ISSCC 2013 (32nm Process)
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 202020
40
60
80
100
120
140
160
180
200
min
imum
glo
ba
l in
terc
onn
ect
pitch (
nm
)
2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 202010
12
14
16
18
20
22
24
26
28
30
32
time (year)
gate
le
ng
th (
nm
)
2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 20200
20
40
60
80
100
120
140
160
180
200
time (year)
I/O
pitch
siz
e (
um
)
Predicted Semiconductor Size [1]
Predicted Size for Chip-Package
Interconnect
32 nm to 22 nm to 14 nm to 10 nm
150 um to 110 um (Pitch Size)
Pin Density Increases Incrementally
1.5
mm
1.27
mm
1.0
mm
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Antenna Point to Point
Interconnects Can Simplify Routing
(a) Dipole on a chip
10% to 15% Efficiency
(b) Folded monopole with ground shielding
Poor Impedance Matching
(c) PIFA
Mainly Radiate Upwards
Physical wires in neighboring cores
Wireless transmission for core aggregations with 60 GHz antennas in
routers
Router
CORE
Router Router
Router
CORE
CORE
CORE
CORE
CORE
CORECORE
CORE
CORE
CORE
CORE
Broad Radiation Pattern
Antenna for Data Transmission
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Recent Solutions (Antenna on Chip) 60 GHz Antenna Design
π‘πππΏπ = πνβ²β² + ππ
πνβ²β
πππνβ²
On-Chip Dipole [1] On-Chip PIFA [2] [3]
On-Chip Yagi-Uda [4] with Directors
Antenna designed at the
top of metal layer
Radiation focused on the
Upward/Downward
Sufficient Bandwidth
Low Radiation Efficiency
Horizontal Radiation
Sufficient Bandwidth
Low Radiation
Efficiency
Dielectric Loss inside Si
ππ = 10 π/π Conductivity
At 60 GHz, π‘πππΏπ = 0.2564
In Lossy FR4, π‘πππΏπ = 0.04
[1] F. Gutierrez Jr. 2009, [2] Y. P. Zhang 2005, [3] [4] H.-R. Chuang 2008
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Recent Solutions (Antenna in Package)
Cavity for Silicon Chip
YagiDirectors
Aperture-Feed AiP Design [5] Bondwire Antenna [6]
LTCC Yagi-Uda with Directors [7]
Radiation focused
Upward/Downward
Sufficient Bandwidth
Horizontal
Radiation
3 GHz
Bandwidth
(Narrow)
Horizontal
Radiation
2 GHz
Bandwidth
(Narrow)
[5] D. Liu 2011, [6] K. K. O 2009, [7] Y. P. Zhang 2008
60 GHz Antenna Design
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Performance Comparison
Referen
ce
Antenna
Type
Frequency
Maximum
Radiation
Gain
-10 dB S11
Bandwidth
Comments
[1]
On-Chip
Dipole
60 GHz -8.5 dBi 12 GHz
Low gain; Low
Efficiency
[2]
On-Chip
PIFA
60 GHz -19 dBi 12 GHz
Low gain; Low
Efficiency
[3]
On-Chip
Meander
PIFA
60 GHz -15.7 dBi 10 GHz
Low gain; Low
Efficiency
[4]
On-Chip
Yagi with
directors
60 GHz -10.6 dBi 10 GHz
Low gain; Low
Efficiency
[5]
Aperture-
Coupled
Patch
60 GHz -8 dBi 10 GHz
Maximum gain at
vertical direction (8
dBi)
[6]
Bondwire
Antenna
60 GHz -3 dBi 3 GHz Narrow bandwidth
[7]
Yagi
Antenna
with
directors
60 GHz +6 dBi 2 GHz
Large packaged area
and complicated
cavity design
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
How to quantify the
wireless link performance ?
The power needed in TX/RX to recover path loss in the wireless interconnect
Friis equation d is the transmission distance; G denotes the
antenna gains in TX/RX (Same in TX/RX site)
PRE should be reduced for the high efficient wireless interconnect
Bandwidth should also be considered TX RX
Wireless
Interconnect
π΅π’ππππ‘ =
β10πππ 1 β π112 2 π
4ππ
2
πΊ2
π΅π ππ΅ π»π§
Budget denotes the power loss required to be
recovered by the circuits in TX/RX at the expense
of operating bandwidth
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 31
2
3
4
5
6
7
8x 10
-9
transmission distance (cm)
bud
ge
t (d
B/H
z)
on-chip dipole [15]
on-chip PIFA [16]
on-chip meander PIFA [17]
on-chip Yagi with directors [18]
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
2
4
6
8
10
12
14
16x 10
-9
transmission distance (cm)
bud
ge
t (d
B/H
z)
in-package aperture-coupled patch [19]
in-package bondwire [20]
in-package Yagi with directors [21]
ππ πΈ = β10πππ 1 β π112 2
π
4ππ
2
πΊ2
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Chip to Chip Wireless Interconnect
Design Goals
TX RXWireless
Interconnect To achieve design goal:
1. Horizontal Transmission Gain
2. High Radiation Efficiency
3. Wide Operating Bandwidth
π΅π’ππππ‘ =
β10πππ 1 β π112 2 π
4ππ
2
πΊ2
π΅π ππ΅ π»π§
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
2
4
6
8
10
12
14
16x 10
-9
transmission distance (cm)
bud
ge
t (d
B/H
z)
in-package aperture-coupled patch [19]
in-package bondwire [20]
in-package Yagi with directors [21]
Design Goal Area
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Single Antenna Design Stack-Up
Low Loss Silicon Substrate
Ground Shield
Antenna
Dielectric
AMC Layer
Low Loss Silicon Substrate
Ground Shield
Antenna
Dielectric
Low Loss Silicon Substrate Low Loss Silicon Substrate
Ground Shield
Vertical FeedElectric conductor
Actual
source
Image
ΞΈr=180Β°
ΞΈr=0Β°
Direct
Direct
Reflected
Reflected
I1
I2=-I
1
I2=I
1
I1
Magnetic conductor
Actual
source
Image
Artificial Magnetic Conductor (AMC):
(a) With Vias (EBG Structure) (b) Without Vias
Maintain AMC behavior
Maintain Surface Wave
Additional Vias
Eliminate Surface Wave
ππ = 10 π/π Conductivity ππ = 10 π/π Conductivity
ππ = 10 π/π Conductivity ππ = 10 π/π Conductivity
130 um
260 um
700 um
RO3003
C4 Bumps
D. Sievenpiper. 1999 F. Yang. 2003 πππ = π11 + π12ππππ
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Single Antenna Design
Dielectric
Antenna
Vertical Feed
h2
h1
Ground-Shielded Conductor
AMC Layer
Low Loss Silicon Substrate
Bump
Silicon Circuitry
YX
Zw
g
ant_w
ant_l X
Y Z
AMC Layer
Antenna
ππ = 10 π/π Conductivity
Overview of Designed 60 GHz RF Interconnect
Cross-Section View Top View
w g ant_w ant_l
580 um 120 um 900 um 1100 um
130 um
260 um
700 um
Rogers 3003 Substrate (Ξ΅r = 3.1;
tanΞ΄ = 0.002)
Antenna Layer Metal + Vertical
Conductor Feeding = Folded-
Monopole Design Designed Dimensions
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Perfect E BoundaryPerfect E
Boundary
Perfect H Boundary
Perfect H Boundary
One Unit AMC Patch
Ground Plane
Plane Wave Excitation
How AMC Layer is Determined
Unit cell Determine the size of periodic patch in AMC layer
Waveguide simulation is utilized to model the plane
wave propagation towards the designed AMC
Reflection phase is determined by phase of S11
50 52 54 56 58 60 62 64 66 68 70-80
-60
-40
-20
0
20
40
60
80
Frequency (GHz)
Refl
ecti
on
Ph
ase (
Deg
ree)
w=0.53 mm
w=0.58 mm
w=0.63 mm
ΞΈr=0Β°is generated at 60 GHz
indicating AMC behavior
RO3003
are used
Ξ΅r =3.1
tanΞ΄ = 0.002
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
ππ§2 + ππ₯
2 = ππ2 = π2νπππ = π0
2νπππν0π0
Air
Medium
kx
kzx
y
z
k0 and kd are the intrinsic
phase constants inside the
air and the medium.
Dispersion Relation
Designed periodically-patched AMC maintains wave propagation inside
the medium.
Fundamental TM0 surface mode exists inside the medium, according to
the eigenmode calculation and the dispersion relation.
Propagation with AMC Layer
0 500 1000 1500 2000 2500 30000
20
40
60
80
100
Propagation Constant (rad/m)
Fre
qu
en
cy (
GH
z)
TM0 mode Propagation with AMC
TM0 mode Propagation without AMC
Light Propagation
Wave Propagation in Medium
k0 < kx < kd around 60 GHz
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Single Antenna Design (Antenna Design)
ant_want_l
Feedingπππ‘_π +
πππ‘_π€
2+ β1 + β2 =
ππ2
50 52 54 56 58 60 62 64 66 68 70-35
-15
5
25
45
65
85
105
125
Frequency (GHz)
Imp
ed
an
ce (
Oh
m)
1mm Length
1.1mm Length
1.2mm Length
1mm Length
1.1mm Length
1.2mm Length
Imaginary Part
Real Part
Resonance Region
Tail Region
Antenna Layer Design
Determine the resonant point
Note:
Match at the tail region rather
than the resonance region
The tail region has the flat-
impedance response which is
beneficial to the antennaβs
operating bandwidth
Antenna Impedances with AMC with different antenna lengths
The length of vertical feeding (total
substrate height)
Top antenna
layer
THE UNIVERSITY OF
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Single Antenna Design (Simulation)
50 52 54 56 58 60 62 64 66 68 70-100
-50
0
50
100
150
200
Frequency (GHz)
Imp
ed
an
ce (
Oh
m)
Resistance (AMC)
Reactance (AMC)
Resistance (No AMC)
Reactance (No AMC)
50 52 54 56 58 60 62 64 66 68 70-30
-25
-20
-15
-10
-5
0
Frequency (GHz)
Refl
ecti
on
Co
eff
icie
nt
(dB
)
Without AMC Layer
With AMC Layer
Over 10 GHz Bandwidth For Antenna with AMC layer
Y
X
Ο
With AMC Without AMC
Horizontal
Radiation Gain
0 dBi for x
direction
- 3 dBi for y
directions
β’ The field is blocked by solid conductor
β’ 94 % Radiation Efficiency
Si (Ο = 10 S/m)
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Antenna Layer
AMC Layer
Ground Layer
Glue-Bonded
LaminatesSemi-Rigid
Cable
1.85 mm
connector
Single Antenna Design (Fabrication)
Procedure:
1. Etching
2. Drilling
3. Glue-Bonding
4. Cable and
Connector
Connecting
PTFE Type Substrate
(Polytetrafluoroethylene)
Note:
Inner conductor of semi-rigid cable as vertical
feeding structure in this prototype fabrication
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Single Antenna Design
(Simulation and Measurement Comparison)
50 52 54 56 58 60 62 64 66 68-70
-60
-50
-40
-30
-20
-10
0
Frequency (GHz)
Scatt
eri
ng
Para
mete
rs (
dB
)
Reflection Coefficient Measurment
Transmission Calculationwith Cable Effects Transmission Measurement
VNA Noise Level
d= 10 mm
50 52 54 56 58 60 62 64 66 68-70
-60
-50
-40
-30
-20
-10
0
Frequency (GHz)
Scatt
eri
ng
Para
mete
rs(d
B)
Reflection Coefficient Measurment
Transmission Calculationwith Cable Effects
Transmission Measurement
VNA Noise Level
d= 10 mm
53 55 57 59 61 63 65 67-40
-35
-30
-25
-20
-15
-10
-5
0
Frequency (GHz)
Refl
ecti
on
Co
eff
icie
nt
(dB
)
Simulation without Cable Effects
Measurement with Cable Effects
Simulation with Cable Effects
(1) Operating (S11) Bandwidth Measurement
(2) Transmission Measurements
The measured bandwidth ranges
from 54 GHz to 67 GHz (13 GHz)
Multiple S11 resonances comes from
the non-ideal transition between the
connector and the cable (Can not be
calibrated out; modeled in ADS)
Horizontal Transmission
Measurement is achieved at different
antenna placements
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Single Antenna Design
(Performance Comparison)
Referen
ce
Antenna
Type
Frequency
Maximum
Radiation
Gain
-10 dB S11
Bandwidth
Comments
[4]
On-Chip
Yagi with
directors
60 GHz -10.6 dBi 10 GHz
Low gain; Low
efficiency
[5]
Aperture-
Coupled
Patch
60 GHz -8 dBi 10 GHz
Maximum gain at
vertical direction (8
dBi)
[6]
Bondwire
Antenna
60 GHz -3 dBi 3 GHz Narrow bandwidth
[7]
Yagi
Antenna
with
directors
60 GHz +6 dBi 2 GHz
Large packaged area
and complicated
cavity design
This
Work
AMC
Antenna
60 GHz -0.5 dBi 13 GHz
Small occupied area,
reasonable
transmission gain;
High efficiency;
Broadband
bandwidth
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Single Antenna Design
(Wireless Link Budget)
Recall the defined budget :
π΅π’ππππ‘ =
β10πππ 1 β π112 2 π
4ππ
2
πΊ2
π΅π ππ΅ π»π§
TX RXWireless
Interconnect
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
2
4
6
8
10
12
14
16x 10
-9
transmission distance (cm)
bud
ge
t (d
B/H
z)
in-package aperture-coupled patch [17]
in-package bondwire [18]
in-package Yagi with four directors [19]
This Work
Design Goal Area
Meet the 60 GHz Wireless Interconnect Design Goal
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Two-Element Wireless Interconnect Design
Unit cell
Increased directivity to further reduce wireless link budget
Maintain the Wide Operating Bandwidth
Design Goal:
Single Wireless Interconnect Anticipated high
directive antennas on
the router chip
Two-Element Wireless
Interconnect
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Two-Element Wireless Interconnect Design
(Proposed Stack-Up)
Cross-Section View Top View
w g ant_w ant_l d
600 um 120 um 700 um 1350 um 2200 um
Dielectric
Antenna Layer
AMC Layer
Ground Layer
Dielectric
Feeding Layer
Plated Through Holey
z
x
h1
h2
h3
Silicon Circuits
C4 Bumps
ππ = 10 π/π Conductivity
d
X
Y
Z
AMC
Layer
ant_l
ant_w
gw
200 um
200 um
200 um
Discussion:
Multi-Layer with Plated Through
Hole Process (Ceramic Substrate)
Rogers 4003 Substrate (Ξ΅r = 3.55;
tanΞ΄ = 0.003)
PCB Manufacturing Process (Mass
Production)
Same Concept as single 60 GHz
AMC Antenna
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ARIZONA TUCSON ARIZONA
Package Stack-up:
Four layer metal stack-up design
Plated through hole (PTH) via is
utilized as the vertical feeding of the
RF interconnect in this design
Antenna
Layer
AMC Layer
Ground Layer
Feeding Layer
Dielectric
Antenna Layer
AMC Layer
Ground Layer
Dielectric
Feeding Layer
Plated Through Holey
z
x
h1
h2
h3
Silicon Circuits
C4 Bumps
Cross-Section View Design Procedure:
1. AMC Layer Design
2. Single 60 GHz Antenna Design
on the AMC Layer
3. Two-Element Array (Placement
Considerations)
4. Bottom Layer Feeding Circuit
Design
5. Feeding Consideration for
GSG Probing Measurement
Two-Element Wireless Interconnect Design
(Proposed Stack-Up)
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ARIZONA TUCSON ARIZONA
πΈπ‘ππ‘ππ =πΈπ πππππ π, π, π
πΓ πβπππ Γ 2 cos
ππ
πsinπ
Horizontal E-Field distribution
once Identical Antennas are
conducted simultaneously
Y
X
1
2
Antennas 1 and 2 On
x direction(mm)
y d
irectio
n(m
m)
Electric Field (V/m)
-6 -4 -2 0 2 4 6
-6
-4
-2
0
2
4
6
200 400 600 800 1000 1200 1400
Array Factor along y direction with
different antennaβs separated
distance
cosππ
πsinπ = 0
The minimum (null) array factor will be determined:
π = 90Β° π = 270Β° or ππ
π= π +
1
2π
When n is 0, d should
be wavelength (2.5 mm
in this design)
Two-Element Wireless Interconnect Design
(Combined-Field)
1 1.5 2 2.5 3 3.5 4 4.50
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
separated distance of two antennas(mm)
ma
gn
itud
e o
f a
rra
y f
acto
r (A
F)
Separated distance isimplemented at 2.2 mmfor this design
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ARIZONA TUCSON ARIZONA
HFSS Simulated radiation pattern in the horizontal XY plane
5 dB gain enhancement
No absolute null along y direction
(The separated distance is 2.3 mm
rather than ideal 2.5 mm)
Maximum 0dBi
gain at -X
direction
Y
X
Ο
Y
X
Ο
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 310
15
20
25
30
35
40
transmission distance (cm)
req
uir
ed r
ecove
red P
ow
er
(dB
m)
Single Antenna System
Double-Antenna System
TX/RX Link Budget is reduced
Single Antenna
Operation:
Two-Element Wireless Interconnect Design
(Transmission Gain Enhance)
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Feeding layer design for two antenna array
The feed design contains:
1. Power combiner
2. Quarter wavelength transformer to have
the impedance transformation
3. Via-less transition from CBCPW to
Microstrip structures for GSG Probing
Measurement
Two-Element RF Interconnect Design
(Feeding Circuit Design)
Microwave Power Divider
Quarter-Wavelength Transformer
CBCPW-MS Transition
πd/4
CBCPW Via
Via
50Ξ© MS
50Ξ© MS
35Ξ© MS
50Ξ© MS
stub_l
cpw_l
cpw_w
cpw_g
ms50_w ms35_w d
ms35_lms50_l
Open stub can be treated as the
short stub design after the π/4
impedance transformation.
The short structure can ensure
the complete ground/reference
current flow
Without the transition design, there
will be ground discontinuity between
the CPW and MS structures. Large
insertion loss and reflection loss will
occur
ant_d 2200 um
ms_w 400 um
ms2_w 700 um
cpw_w 115 um
cpw_g 75 um
cpw_l 1580 um
stub_l 768 um
Detailed
Dimensions of
Feeding Layer
Circuit Design
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Probe Station Holder
Feeding Layer
Antenna Layer
Two-Element Wireless Interconnect Design
(Operating Bandwidth Measurement)
GSG Probe Measurement Setup
50 52 54 56 58 60 62 64 66 68 70-35
-30
-25
-20
-15
-10
-5
0
Frequency (GHz)
Re
flectio
n C
oe
ffic
ien
t (d
B)
Simulation
Measurement
Simulated and Measured Performances
Discussion:
Measured Operating (S11) Bandwidth: 11
GHz (From 56 GHz to 67 GHz)
Transmission Gain is enhanced to 5 dBi
according to the simulated radiation pattern
THE UNIVERSITY OF
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Two-Element Wireless Interconnect Design
(Performance Comparison)
Performance Comparison Table
Reference Antenna
Type Frequency
Maximum
Radiation Gain
-10 dB S11
Bandwidth Comments
[4] On-Chip Yagi
with directors 60 GHz -10.6 dBi 10 GHz Low gain; Low efficiency
[4]
Aperture-
Coupled
Patch
60 GHz -8 dBi 10 GHz Maximum gain at vertical
direction (8 dBi)
[6] Bondwire
Antenna 60 GHz -3 dBi 3 GHz Narrow bandwidth
[7] Yagi Antenna
with directors 60 GHz +6 dBi 2 GHz
Large packaged area and
complicated cavity design
Previous
Work
AMC Antenna
(Single) 60 GHz -0.5 dBi 13 GHz
Small occupied area,
reasonable transmission
gain; High efficiency;
Broadband bandwidth
This Work
AMC Antenna
(Two-
Element)
60 GHz +5 dBi 11 GHz
High transmission gain;
High efficiency;
Broadband bandwidth
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Two-Element Wireless Interconnect Design
(Wireless Link Budget)
Recall the defined budget :
π΅π’ππππ‘ =
β10πππ 1 β π112 2 π
4ππ
2
πΊ2
π΅π ππ΅π π»π§ TX RX
Wireless
Interconnect
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 331.5
2
2.5
3x 10
-9
transmission distance (cm)
bud
ge
t (d
B/H
z)
Single 60GHz RF Interconnect
Two-Element RF Interconnect
Meets the Design Goal:
Keep reducing the budget for
TX/RX Circuits
THE UNIVERSITY OF
ARIZONA TUCSON ARIZONA
Conclusion
Router-Based, Hybrid Interconnects for Multi-Chip Module
System Evaluation; Performance Metrics; Wireless Link
Budget
Single 60 GHz Single AMC type Wireless Interconnect
(Concept, Fabrication, Measurement) (13 GHz Operating
Bandwidth, -0.5dBi horizontal transmission gain)
Two-Element Wireless Interconnect Design (Concept,
Fabrication, Measurement) (5 dBi horizontal
transmission gain, 11 GHz Operating Bandwidth,
Reduced Wireless Link Budget)
THE UNIVERSITY OF
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Discussion
The material is based upon work supported by the National Science
Foundation under Grant ECCS-1027703
Dr. Ho-Hsin Yeh Reshmaa Liyakath Basha,
Marcos Vargas, Sungjong Yoo
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