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BCM® Bus Converter Rev 1.0 vicorpower.comPage 1 of 24 12/2013 800 927.9474
S
NRTLC US
BCM® Bus Converter
Unregulated DC-DC Converter
BCM380y475x1K2A30
S
NRTLC US
Features
• Up to 1200 W continuous output power
• 1876 W/in3 power density
• 97.9 % peak efficiency
• 4242 Vdc isolation
• Parallel operation for multi-kW arrays
• OV, OC, UV, short circuit and thermal protection
• 6123 through-hole ChiP package
n 2.494 ” x 0.898 ” x 0.286 ”
( 63.34 mm x 22.80 mm x 7.26 mm)
Typical Applications
• 380 DC Power Distribution
• High End Computing Systems
• Automated Test Equipment
• Industrial Systems
• High Density Power Supplies
• Communications Systems
• Transportation
Product Description
The VI Chip® Bus Converter (BCM®) is a high efficiencySine Amplitude Converter™ (SAC™), operating from a 260 to410 VDC primary bus to deliver an isolated 32.5 to 51.3 VDCunregulated secondary voltage.
The BCM380y475x1K2A30 offers low noise, fast transientresponse, and industry leading efficiency and power density. Inaddition, it provides an AC impedance beyond the bandwidthof most downstream regulators, allowing input capacitancenormally located at the input of a POL regulator to be located atthe input of the BCM module. With a K factor of 1/8, thatcapacitance value can be reduced by a factor of 64x, resultingin savings of board area, material and total system cost.
Leveraging the thermal and density benefits of Vicor’s ChiPpackaging technology, the BCM module offers flexible thermalmanagement options with very low top and bottom sidethermal impedances. Thermally-adept ChiP-based powercomponents, enable customers to achieve low cost powersystem solutions with previously unattainable system size,weight and efficiency attributes, quickly and predictably.
Product Ratings
VIN = 380 V ( 260 – 410 V) POUT = up to 1200 W
VOUT = 47.5 V ( 32.5 – 51.3 V)(NO LOAD)
K = 1/8
BCM® Bus Converter Rev 1.0 vicorpower.comPage 2 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
Typical Application
BCM380y475x1K2A30 + PRM + VTM, non-isolated Remote Sense Configuration
BCM380y475x1K2A30 + PRM + VTM Adaptive Loop Configuration
PRM
ENABLE
TRIM
SHARE/CONTROL NODE
AL
IFB
VC
VT
VAUX
REF/REF_EN
+IN
–IN
+OUT
–OUT
TM
VC
PC
+IN
–IN –OUT
+OUTAdaptive Loop Temperature Feedback
VTM Start Up Pulse
SGND
SGND
SGND
ISOLATION BOUNDRYLOAD_RTN
VTM
PRIMARY SECONDARY
BCM
VAUX
EN
+IN
–IN
+OUT
–OUT
enable/disableswitch
FUSE
ISOLATION BOUNDRY
PRIMARY SECONDARY
TM
RI_PRM_CER
RTRIM_PRM
RAL_PRM
SGND
CI_BCM_ELEC
SOURCE_RTN
VIN
RI_PRM_DAMP
LI_PRM_FLT
RO_PRM_DAMP
LO_PRM_FLT
CO_PRM_CER
LOAD
VOUT
CO_VTM_CER
enable/disableswitch
External Current Sense
SGND
SGND
Voltage Reference with Soft Start
Voltage Sense and Error Amplifier(Differential)
VTM Start up Pulse
SGND
IN OUT
GND
V +
VOUT
–IN+IN
V –
PRM
ENABLE
TRIM
SHARE/CONTROL NODE
AL
IFB
VC
VT
VAUX
REF/REF_EN
+IN
–IN
+OUT
–OUT
SGND
SGND
TM
VC
PC
+IN
–IN –OUT
+OUT
ISOLATION BOUNDRY
VTM
PRIMARY SECONDARY
REF 3312 SGND
Vol
tage
Sen
se
SGND
LOAD
BCM
VAUX
EN
+IN
–IN
+OUT
–OUT
enable/disableswitch
FUSE
ISOLATION BOUNDRY
PRIMARY SECONDARY
TM
VIN C
I_BCM_ELEC
SOURCE_RTN
SGND
CI_PRM_ELEC
RI_PRM_DAMP
LI_PRM_FLT
RO_PRM_DAMP
LO_PRM_FLT C
O_PRM_CER
CO_VTM_CER
VREF
enable/disableswitch
BCM® Bus Converter Rev 1.0 vicorpower.comPage 3 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
1 2
A
B
C
D
E E’
D’
B’
+IN +OUT
TOP VIEW
6123 ChiP Package
A’
VAUX
EN
+OUT
-OUT
-OUT-IN
TM
Pin Configuration
BCM® Bus Converter Rev 1.0 vicorpower.comPage 4 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
Absolute Maximum RatingsThe absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.
Parameter Comments Min Max Unit
+IN to –IN -1 480 V
VIN slew rate (operational) -1 1 V/µs
Isolation voltage, input to output 4242 V
+OUT to –OUT -1 60 V
TM to –IN -0.3 4.6 V
EN to –IN -0.3 5.5 V
VAUX to –IN -0.3 4.6 V
Part Ordering Information
DeviceInput Voltage
RangePackage Type
OutputVoltage x 10
TemperatureGrade
OutputPower
RevisionPackageSize
Version
BCM 380 y 475 x 1K2 A 3 0
BCM = BCM 380 = 260 to 410 V P = ChiP Through Hole 475 = 47.5 VC = 0 to 100°CT = -40 to 125°CM = -55 to 125°C
1K2 = 1,200 W A 3 = 6123 0
Standard Models
Part Number VIN Package Type VOUT Temperature Power Package Size
BCM380P475C1K2A30 260 to 410 V ChiP Through Hole47.5 V
32.5 to 51.25 V0 to 100°C 1,200 W 6123
All products shipped in JEDEC compliant trays.
BCM® Bus Converter Rev 1.0 vicorpower.comPage 5 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
Electrical Specifications
Specifications apply over all line and load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40 °C ≤ TINTERNAL
≤ 125 °C (T-Grade); All other specifications are at TINTERNAL = 25 ºC unless otherwise noted.
Attribute Symbol Conditions / Notes Min Typ Max Unit
PowertrainInput voltage range, continuous VIN_DC 260 410 V
Input voltage range, transient VIN_TRANSFull current or power supported, 50 ms max,
260 410 V10% duty cycle max
VIN µController Active VµC_ACTIVEVIN voltage where µC is initialized,
120 V(ie VAUX = Low, powertrain inactive)
Input Voltage Slew Rate dVIN/dt VIN_UVLO- ≤ VIN ≤ VIN_OVLO+ 0.001 1000 V/ms
Quiescent current IQDisabled, EN Low, VIN = 380 2
mATINTERNAL ≤ 100ºC 4
No load power dissipation PNL
VIN = 380 V, TINTERNAL = 25 ºC 9.0 11.7
WVIN = 380 V 5.9 18
VIN = 260 V to 410 V, TINTERNAL = 25 ºC 13
VIN = 260 V to 410 V 20
Inrush current peak IINR_P
VIN = 410 V, COUT = 100 µF, 4 RLOAD = 25% of full load current A
TINTERNAL ≤ 100ºC 7
DC input current IIN_DC At POUT= 1200 W, TINTERNAL ≤ 100ºC 3.5 A
Transformation ratio K K = VOUT/ VIN, at no load 1/8 V/V
Output power (average) POUT_AVGActual maximum power depends on cooling strategy
1200 WSee Figure 1
Output power (peak) POUT_PK 10 ms max, POUT ≤ POUT_AVG 1500 W
Output current (average) IOUT_AVG 25.7 A
Output current (peak) IOUT_PK 10 ms max, IOUT ≤ IOUT_AVG 32.2 A
VIN = 380 V, IOUT = 25.7 A 97.1 97.6
Efficiency (ambient) hAMB VIN = 260 V to 410 V, IOUT = 25.7 A 96.4 %
VIN = 380 V, IOUT = 12.85 A 97.2 97.7
Efficiency (hot) hHOT VIN = 380 V, IOUT = 25.7 A; TINTERNAL = 100 °C 96.5 97 %
Efficiency (over load range) h20% 5.14 A < IOUT < 25.7 A, TINTERNAL ≤ 100ºC 92 %
ROUT_COLD VIN = 380 V, IOUT = 25.7 A, TINTERNAL = -40 °C 13 16.7 23
Output resistance ROUT_AMB VIN = 380 V, IOUT = 25.7 A 21 25.8 31 mΩROUT_HOT VIN = 380 V, IOUT = 25.7 A, TINTERNAL = 100 °C 30 35 40
Switching frequency FSW 1.23 1.25 1.28 MHz
COUT = 0 F, IOUT = 25.7 A, VIN = 380 V, 195
Output voltage ripple VOUT_PP 20 MHz BW mV
TINTERNAL ≤ 100ºC 300
Input inductance (parasitic) LIN_PARFrequency 2.5 MHz (double switching frequency),
6.7 nHSimulated lead model
Output inductance (parasitic) LOUT_PARFrequency 2.5 MHz (double switching frequency),
1.3 nHSimulated lead model
Input Series inductance (internal) LIN_INTReduces the need for input decoupling
1.2 µHinductance in BCM arrays
Effective Input capacitance (internal) CIN_INT Effective value at 380 VIN 0.37 µF
BCM® Bus Converter Rev 1.0 vicorpower.comPage 6 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
Attribute Symbol Conditions / Notes Min Typ Max Unit
Powertrain (Cont.)Effective Output capacitance (internal) COUT_INT Effective value at 47.5 VOUT 25.6 µF
Effective Output capacitance (external) COUT_EXTExcessive capacitance may drive module into
0 100 µFSC protection
Array Effective Output capacitanceCOUT_AEXT Max = Number of Modules
(external)COUT_AEXT * 50 % of Rated Module COUT_EXT Max
Applications note 06 "Using BCMs in high power Array"
Protection
Auto Restart Time tAUTO_RESTARTStartup into a persistent fault condition.
292.5 357.5 msNon-Latching fault detection given VIN > VIN_UVLO+
Input overvoltage lockout threshold VIN_OVLO+ 420 434.5 450 V
Input overvoltage recovery threshold VIN_OVLO- 405 424 440 V
Input overvoltage lockout hysteresis VIN_OVLO_HYST 10.5 V
Overvoltage lockout response time tOVLO 100 µs
Input undervoltage lockout threshold VIN_UVLO- 200 221 240 V
Input undervoltage recovery threshold VIN_UVLO+ 225 243 259 V
Input undervoltage lockout hysteresis VIN_UVLO_HYST 15 V
Undervoltage lockout response time tUVLO 100 µs
Undervoltage startup delay tUVLO+_DELAY From VIN = VIN_UVLO+ to powertrain active, EN floating 20 ms
Soft-Start time tSOFT-STARTFrom powertrain active
1 msFast Current limit protection disabled during Soft-Start
Output overcurrent trip threshold IOCP 28 37 50 A
Output overcurrent response time constant tOCP Effective internal RC filter 3.2 ms
Short circuit protection trip threshold ISCP 45 A
Short circuit protection response time tSCP 1 µs
Overtemperature shutdown threshold tOTP Temperature sensor located inside controller IC 125 ºC
Undertemperature shutdown threshold tUTP Temperature sensor located inside controller IC -45 ºC
Undertemperature Restart time tUTP_RESTARTStartup into a persistent fault condition.
3 sNon-Latching fault detection given VIN > VIN_UVLO+
Electrical Specifications (Cont.)
Specifications apply over all line and load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40 °C ≤ TINTERNAL
≤ 125 °C (T-Grade); All other specifications are at TINTERNAL = 25 ºC unless otherwise noted.
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BCM380y475x1K2A30
16
18
20
22
24
26
28
30
32
34
260 275 290 305 320 335 350 365 380 395 410
Ou
tpu
t C
urr
ent
(A)
Input Voltage (V)
Output Current vs Input Voltage
I (ave) I (pk), t < 10 ms
700
800
900
1000
1100
1200
1300
1400
1500
1600
260 275 290 305 320 335 350 365 380 395 410
Ou
tpu
t P
ow
er (
W)
Input Voltage (V)
Output Power vs Input Voltage
P (ave) P (pk), t < 10 ms
Figure 1 — Safe thermal operating area
Figure 2 — Safe electrical operating area
0
10
20
30
40
50
60
70
80
90
100
110
0 10 20 30 40 50 60 70 80 90 100 110
Ou
tpu
t C
apac
itan
ce(%
Rat
ed C
OU
T M
AX
)
Load Current (% IOUT_AVG_O
)
Startup Load Current vs Output Capacitance
Ou
tpu
t P
ow
er (
W)
Output Power vs. Case Temperature
Case Temperature (°C)
One side cooling One side cooling and leads Double Side cooling and leads
0
200
400
600
800
1000
1200
1400
35 45 55 65 75 85 95 105 115 125
Figure 3 — Safe operating area; Start Up Load current vs. Output capacitance
BCM® Bus Converter Rev 1.0 vicorpower.comPage 8 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
Signal Characteristics
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40 °C ≤ TINTERNAL
≤ 125 °C (T-Grade); All other specifications are at TINTERNAL = 25 ºC unless otherwise noted.
• The TM pin is a standard analog I/O configured as an outputfrom an internal µC.
• µC 250 kHz PWM output internally pulled high to 3.3 V.
• The TM pin monitors the internal temperature of the controller IC within an accuracy of ±5°C.
Temperature Monitor
• The EN pin is a standard analog I/O configured as an input to an internal µC.
• It is internally pulled high to 3.3 V.
• When held low the BCM® internal bias will be disabled and the powertrain will be inactive.
• In an array of BCMs, EN pins should be interconnected to synchronize startup and permit startup into full load conditions.
ENABLE Control
SIGNAL TYPE STATE ATTRIBUTE SYMBOL CONDITIONS / NOTES MIN TYP MAX UNIT
EN Pull-down Resistance (External) REN_EXT Module may not start with lower value 0.4 kΩStart Up
EN to Powertrain active time tEN_STARTVIN > VIN_UVLO+, EN held low both
250 µsconditions satisfied for t > tUVLO+_DELAY
ANALOGRegular
EN Voltage Threshold VEN_TH 0.7 V
INPUTOperation
EN Resistance (Internal) REN_INT Internal pull up resistor 1.5 kΩEN Disable Threshold VEN_DISABLE_TH 0.30 V
Fault Time off tENABLE_OFFModule will ignore attempts to .
292.5 357.5 msre-enable during time off
SIGNAL TYPE STATE ATTRIBUTE SYMBOL CONDITIONS / NOTES MIN TYP MAX UNIT
Start Up Powertrain active to TM time tVAUX Powertrain active to TM PWM 100 µs
TM Duty Cycle VTM 18.18 68.18 %
TM Current ITM 4 mA
Recommended External filtering:
DIGITAL Regular TM Capacitance (External) CTM_EXT Recommended External filtering 0.01 µF
OUTPUT Operation TM Resistance (External) RTM_EXT Recommended External filtering 1 kΩ
Specifications using recommended filter:
TM Gain ATM 10 mV/°C
TM Voltage Reference VTM_AMB Controller TINTERNAL = 27°C 1.27 V
RTM_EXT = 1 KΩ, CTM_EXT = 0.01 µF, 28 mV
TM Voltage Ripple VTM_PP VIN = 380 V, IOUT = 25.7 A
TINTERNAL ≤ 100ºC 40 mV
BCM® Bus Converter Rev 1.0 vicorpower.comPage 9 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
SIGNAL TYPE STATE ATTRIBUTE SYMBOL CONDITIONS / NOTES MIN TYP MAX UNIT
Start Up Powertrain active to VAUX time tVAUX Powertrain active to VAUX high 2 ms
VAUX Voltage VVAUX 2.8 3.3 V
ANALOG VAUX Avaliable Current IVAUX 4 mA
OUTPUT RegularVAUX Voltage Ripple VVAUX_PP
50 mV
Operation TINTERNAL ≤ 100ºC 100 mV
VAUX Capacitance (External) CVAUX_EXT 0.01 µF
VAUX Resistance (External) RVAUX_EXT VIN < VµC_ACTIVE 1.5 kΩ
Fault VAUX Fault Response Time tFR_TMFrom fault detection to
10 µsVAUX = 2.8 V, CVAUX = 0 pF
• The VAUX pin is a standard analog I/O configured as an outputfrom an internal µC.
• VAUX is internally connected to µC output as internally pulled high to a 3.3 V regulator with 2% tolerance, a 1% resistor of 1.5 KΩ.
• VAUX can be used as a "Ready to process full power" flag. This pin transitions VAUX voltage after a 2 ms delay from the start of powertrain activating, signaling the end of softstart.
• VAUX can be used as "Fault flag". This pin is pulled low internallywhen a fault protection is detected.
Auxilary Voltage Source
Signal Characteristics (Cont.)
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40 °C ≤ TINTERNAL
≤ 125 °C (T-Grade); All other specifications are at TINTERNAL = 25 ºC unless otherwise noted.
BCM® Bus Converter Rev 1.0 vicorpower.comPage 10 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
BCM Module Timing diagram
EN TM+IN
BIDI
R
INPU
T
V OU
T
OU
TPU
T
INPUT VOLT
AGE TURN-ON
OUTPUT TURN-ON IN
PUT OVER VOLTAGE
INPUT REST
ARTENABLE
PULLED LO
W
ENABLE PULLE
D HIGH SHORT CIRCUIT EVENT IN
PUT VOLTAGE TURN-O
FF
OU
TPU
T
OU
TPU
T
V AU
X
EN & V
AUXINTERNAL P
ull-up
STAR
TUP
OVE
R VO
LTAG
EEN
ABLE
CO
NTR
OL O
VER
CURR
ENT
SHU
TDO
WN
µcINITIALIZ
E
VIN
_OV
LO-
VIN
_OV
LO+
VIN
_UV
LO+
Vµ
C_A
CT
IVE
VN
OM
VIN
_UV
LO
-
t SC
Pt U
VL
O+
_DE
LAY
t VA
UX
t AU
TO
-RE
ST
AR
Tt W
AIT
≥ t E
NA
BLE
_OF
F
BCM® Bus Converter Rev 1.0 vicorpower.comPage 11 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
BCM Logic Diagram
VIN > VIN_UVLO+ EN (Floa ng or Driven high)
True for time > tUVLO+_DELAY
:
• VIN_UVLO
< VIN
< VIN_OVLO
• EN (Held Low at startup)
VIN
Applied
VµC_ACTIVE
< VIN
< VIN_UVLO+
Pin status:
• TM Low
• EN High
• VAUX Low
Powertrain Inactive
Pin status:
• TM PWM
• EN High
• VAUX Low
Powertrain Inactive
tUVLO+_DELAY
tEN_START
tSOFT_START
tUTP_RESTART
tAUTO_RESTART
Pin status:
• TM PWM
• EN High
• VAUX High
Condition: tVAUX
Powertrain Active
Pin status:
• TM Low
• EN High
• VAUX Low
Powertrain Inactive
EN (Floating or Driven high)
t > tENABLE_OFF
EN (Held Low)
VIN_UVLO
< VIN
< VIN_OVLO
VIN_UVLO
< VIN
< VIN_OVLO
SCP,Startup Load: (I
IN + C
OUT_EXT) > Startup SOA
OTP, OCP,SCP, OVLO,UVLO
UTP
OTP, UTP, OCP,SCP, OVLO, UVLO
Pin status:
• TM Low
• EN Low
• VAUX Low
Powertrain Inactive
EN (Held Low)
(250µsTyp)
(20msTyp)
(3sTyp)
(292.5msMin)(1msTyp)
(2msTyp)
BCM® Bus Converter Rev 1.0 vicorpower.comPage 12 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
Application CharacteristicsThe following values, typical of an application environment, are collected using one side cooling thermal solution unless otherwise noted.See associated figures for general trend data.
3
4
5
6
7
8
9
10
11
12
13
14
260 275 290 305 320 335 350 365 380 395 410
Po
wer
Dis
sip
atio
n (
W)
Input Voltage (V)
No Load Power Dissipation vs. Line
- 40°C 25°C 80°CTTOP SURFACE CASE
:
96.0
96.3
96.5
96.8
97.0
97.3
97.5
97.8
98.0
-40 -20 0 20 40 60 80 100
Case Temperature (ºC)
Full Load Efficiency vs. TCASE
260 V 380 V 410 V
Fu
ll L
oad
Eff
icie
ncy
(%
)
VIN
:
Efficiency and Power Dissipation, -40º Case
Eff
icie
ncy
(%
)
Po
wer
Dis
sip
atio
n (
W)
0
8
16
24
32
40
48
88
90
92
94
96
98
100
0.0 2.6 5.1 7.7 10.3 12.9 15.4 18.0 20.6 23.1 25.7
Load Current (A)
260 V 380 V 410 V
η
PD
VIN :
Figure 4 — No load power dissipation vs. VIN Figure 5 — Full load efficiency vs. temperature; VIN
Figure 6 — Efficiency and power dissipation at TINTERNAL = -40 °C
Efficiency and Power Dissipation, 25º Case
Eff
icie
ncy
(%
)
Po
wer
Dis
sip
atio
n (
W)
0
8
16
24
32
40
48
88
90
92
94
96
98
100
0.0 2.6 5.1 7.7 10.3 12.9 15.4 18.0 20.6 23.1 25.7
Load Current (A)
260 V 380 V 410 V
η
PD
VIN :
Efficiency and Power Dissipation, 80º Case
Eff
icie
ncy
(%
)
Po
wer
Dis
sip
atio
n (
W)
0
8
16
24
32
40
48
88
90
92
94
96
98
100
0.0 2.6 5.1 7.7 10.3 12.9 15.4 18.0 20.6 23.1 25.7
Load Current (A) 260 V 380 V 410 V
η
PD
VIN :
Figure 7 — Efficiency and power dissipation at TINTERNAL = 25 °C
0
10
20
30
40
50
-40 -20 0 20 40 60 80 100
RO
UT (
mΩ
)
Case Temperature (°C)
ROUT vs. TCASE at VIN = 380 V
25.7 AIOUT
:
Figure 8 — Efficiency and power dissipation at TINTERNAL = 80 °C Figure 9 — ROUT vs. temperature
BCM® Bus Converter Rev 1.0 vicorpower.comPage 13 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
Figure 12 — 0 A– 25.7 A transient response:CIN = 2.2 µF, no external COUT
Figure 11 — Full load ripple, 2.2 µF CIN; No external COUT. Boardmounted module, scope setting : 20 MHz analog BW
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Vo
ltag
e R
ipp
le (
mV
PK
-PK)
Load Current (A)
Output Voltage Ripple vs. Load
380 VVIN
:
100
90
80
70
60
50
4030
20
10
0
Figure 10 — VRIPPLE vs. IOUT ; No external COUT. Board mounted module, scope setting : 20 MHz analog BW
Figure 13 — 25.7 A – 0 A transient response: CIN = 2.2 µF, no external COUT
BCM® Bus Converter Rev 1.0 vicorpower.comPage 14 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
General Characteristics
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40 °C ≤ TINTERNAL
≤ 125 °C (T-Grade); All other specifications are at TINTERNAL = 25 ºC unless otherwise noted.
Human Body Model,
"ESDA / JEDEC JDS-001-2012" Class I-C (1kV to < 2 kV)
Charge Device Model,
"JESD 22-C101-E" Class II (200V to < 500V)
Attribute Symbol Conditions / Notes Min Typ Max Unit
Mechanical
Length L 62.96 / [2.479] 63.34 / [2.494] 63.72 / [2.509] mm / [in]
Width W 22.67 / [0.893] 22.80 / [0.898] 22.93 / [0.903] mm / [in]
Height H 7.21 / [0.284] 7.26 / [0.286] 7.31 / [0.288] mm / [in]
Volume Vol Without heatsink 10.48 / [0.640] cm3/ [in3]
Weight W 41 / [1.45] g / [oz]
Nickel 0.51 2.03
Lead finish Palladium 0.02 0.15 µm
Gold 0.003 0.051
Thermal
BCM380P475C1K2A30 (C-Grade) 0 100 °C
Operating temperature TINTERNAL BCM380P475T1K2A30 (T-Grade) -40 125 °C
BCM380P475M1K2A30 (M-Grade) N/A N/A °C
Thermal resistance top side fINT-TOPEstimated thermal resistance to
1.24 °C/Wmaximum temperature internalcomponent from isothermal top
Thermal resistance leads fINT-LEADSEstimated thermal resistance to
7 °C/Wmaximum temperature internalcomponent from isothermal leads
Thermal resistance bottom side fINT-BELLYEstimated thermal resistance to
1.24 °C/Wmaximum temperature internalcomponent from isothermal bottom
Thermal capacity 34 Ws /°C
Assembly
BCM380P475C1K2A30 (C-Grade) 0 85 °C
Storage Temperature TST BCM380P475T1K2A30 (T-Grade) -55 125 °C
BCM380P475M1K2A30 (M-Grade) N/A N/A °C
ESDHBM
ESD Withstand
ESDCDM
BCM® Bus Converter Rev 1.0 vicorpower.comPage 15 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
Telcordia Issue 2 - Method I Case III;25°C Ground Benign, Controlled
MIL-HDBK-217Plus Parts Count -25°C Ground Benign, Stationary,Indoors / Computer
General Characteristics (Cont.)
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40 °C ≤ TINTERNAL
≤ 125 °C (T-Grade); All other specifications are at TINTERNAL = 25 ºC unless otherwise noted.
Attribute Symbol Conditions / Notes Min Typ Max Unit
Soldering
Peak time above 217°C N/A N/A s
Peak heating rate during reflow N/A N/A °C/s
Peak cooling rate post reflow N/A N/A °C/s
Safety
IN to OUT 4,242
Isolation voltage VHIPOT IN to CASE 2,121 VDC
OUT to CASE 2,121
Isolation capacitance CIN_OUT Unpowered unit 620 780 940 pF
Isolation resistance RIN_OUT At 500 Vdc 10 MΩ
MTBF 3.53 MHrs
3.90 MHrs
cTUVus
Agency approvals / standards cURus CE Marked for Low Voltage Directive and RoHS Recast Directive, as applicable
BCM® Bus Converter Rev 1.0 vicorpower.comPage 16 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
C01
C02
Q01
C03
C04
C05
C06
C07
C08
C09
C10
L01
Current Flow detection+ Forward IIN sense
I IN
Sta
rtu
p
Cir
cuit
+V
IN /4
SE
PIC
EN
Cr
COUT
+V
OU
T
-VO
UT
+V
IN
-VIN
EN
TM
PW
MT
M
EN
VA
UX
Dif
fere
nti
al C
urr
ent
Sen
sin
g
Fu
ll-B
rid
ge
Syn
chro
no
us
Rec
tifi
cati
on
Pri
mar
y S
tag
e
Fas
t C
urr
ent
Lim
it
Analog Controller
Digital Controller
SE
PIC
Cn
trl
On
/Off
Tem
per
atu
re
Sen
sor
Q02
Q03
Q04
Q05
Q06
Q07
Q08
Lr
Sec
on
dar
y S
tag
e
Q11
Q12
Q09
Q10
+V
cc
-Vcc
3.3v
L
inea
r R
egu
lato
r
+V
IN /4
( +
VIN
/4 )
-X
Slo
w C
urr
ent
Lim
it
Mo
du
lato
r
Pri
mar
y an
d
Sec
on
dar
y G
ate
Dri
ve T
ran
sfo
rmer
1.5
kΩ
1.5
kΩ
So
ft-S
tart
VA
UX
Ove
r-T
emp
U
nd
er-T
emp
Ove
r V
olt
age
Un
der
Vo
ltag
e
Sta
rtu
p /
Re-
star
t D
elay
BCM Module Block Diagram
BCM® Bus Converter Rev 1.0 vicorpower.comPage 17 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
The Sine Amplitude Converter (SAC™) uses a high frequency resonanttank to move energy from input to output. (The resonant tank isformed by Cr and leakage inductance Lr in the power transformerwindings as shown in the BCM module Block Diagram). The resonantLC tank, operated at high frequency, is amplitude modulated as afunction of input voltage and output current. A small amount ofcapacitance embedded in the input and output stages of the module issufficient for full functionality and is key to achieving high powerdensity.
The BCM380y475x1K2A30 SAC can be simplified into the preceedingmodel.
At no load:
VOUT = VIN • K (1)
K represents the “turns ratio” of the SAC. Rearranging Eq (1):
K =VOUT (2)VIN
In the presence of load, VOuT is represented by:
VOUT = VIN • K – IOUT • ROUT (3)
and IOuT is represented by:
IOUT =IIN – IQ (4)K
ROuT represents the impedance of the SAC, and is a function of theRDSOn of the input and output MOSFETs and the winding resistance ofthe power transformer. Iq represents the quiescent current of the SACcontrol, gate drive circuitry, and core losses.
The use of DC voltage transformation provides additional interestingattributes. Assuming that ROuT = 0 Ω and Iq = 0 A, Eq. (3) now becomesEq. (1) and is essentially load independent, resistor R is now placed inseries with VIn.
The relationship between VIn and VOuT becomes:
VOUT = (VIN – IIN • RIN) • K (5)
Substituting the simplified version of Eq. (4) (Iq is assumed = 0 A) into Eq. (5) yields:
VOUT = VIN • K – IOUT • RIN • K2 (6)
+
–
+
–
VOUT
COUTVIN
V•I
K
+
–
+
–CIN
IOUT
RCOUT
IQ
ROUT
RCIN
23 mA
1/8 • IOUT 1/8 • VIN
RCIN 21.5 mΩ
1.49 nH
117 mΩ
25.6 µFIQ
LIN_LEADS = 6.7 nH IOUT
VIN
R
SACK = 1/32Vin
Vout+–
VINVOUT
RIN
SAC™K = 1/8
Figure 16 — K = 1/8 Sine Amplitude Converter with series input resistor
Figure 15 — BCM module AC model
COUT
LOUT_LEADS = 1.3 nH
LIN_INT = 1.2 µH
CIN 0.37 µF
25.8 mΩROUT
RCOUT 510 µΩ
VOUT
Sine Amplitude Converter™ Point of Load Conversion
BCM® Bus Converter Rev 1.0 vicorpower.comPage 18 of 24 12/2013 800 927.9474
BCM380y475x1K2A30 This is similar in form to Eq. (3), where ROuT is used to represent thecharacteristic impedance of the SAC™. However, in this case a real R onthe input side of the SAC is effectively scaled by K2 with respect to the output.
Assuming that R = 1 Ω, the effective R as seen from the secondary side is 15.6 mΩ, with K = 1/8 .
A similar exercise should be performed with the additon of a capacitoror shunt impedance at the input to the SAC. A switch in series with VInis added to the circuit. This is depicted in Figure 16.
A change in VIn with the switch closed would result in a change incapacitor current according to the following equation:
IC(t) = CdVIN (7)dt
Assume that with the capacitor charged to VIn, the switch is openedand the capacitor is discharged through the idealized SAC. In this case,
IC= IOUT • K (8)
substituting Eq. (1) and (8) into Eq. (7) reveals:
IOUT =C • dVOUT (9)K2 dt
The equation in terms of the output has yielded a K2 scaling factor forC, specified in the denominator of the equation.
A K factor less than unity results in an effectively larger capacitance onthe output when expressed in terms of the input. With a K = 1/8 asshown in Figure 17, C=1 µF would appear as C= 64 µF when viewed from the output.
Low impedance is a key requirement for powering a high-current, low-voltage load efficiently. A switching regulation stage should haveminimal impedance while simultaneously providing appropriatefiltering for any switched current. The use of a SAC between theregulation stage and the point of load provides a dual benefit of scalingdown series impedance leading back to the source and scaling up shuntcapacitance or energy storage as a function of its K factor squared.However, the benefits are not useful if the series impedance of the SACis too high. The impedance of the SAC must be low, i.e. well beyond thecrossover frequency of the system.
A solution for keeping the impedance of the SAC low involvesswitching at a high frequency. This enables small magnetic componentsbecause magnetizing currents remain low. Small magnetics mean smallpath lengths for turns. use of low loss core material at high frequenciesalso reduces core losses.
The two main terms of power loss in the BCM module are:
n no load power dissipation (PnL): defined as the power used to power up the module with an enabled powertrainat no load.
n Resistive loss (ROuT): refers to the power loss across the BCM® module modeled as pure resistive impedance.
PDISSIPATED = PNL + PROUT (10)
Therefore,
POUT = PIN – PDISSIPATED = PIN – PNL – PROUT (11)
The above relations can be combined to calculate the overall moduleefficiency:
h =POUT = PIN – PNL – PROUT (12)PIN PIN
=VIN • IIN – PNL – (IOUT)2 • ROUT
VIN • IIN
= 1 – (PNL + (IOUT)2 • ROUT)VIN• IIN
C
S
SACK = 1/32Vin
Vout+–
VINVOUTC
SAC™K = 1/8
Figure 17 — Sine Amplitude Converter with input capacitor
S
BCM® Bus Converter Rev 1.0 vicorpower.comPage 19 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
Input and Output Filter Design
A major advantage of SAC™ systems versus conventional PWMconverters is that the transformer based SAC does not require externalfiltering to function properly. The resonant LC tank, operated atextreme high frequency, is amplitude modulated as a function of inputvoltage and output current and efficiently transfers charge through theisolation transformer. A small amount of capacitance embedded in theinput and output stages of the module is sufficient for full functionalityand is key to achieving power density.
This paradigm shi requires system design to carefully evaluateexternal filters in order to:
n Guarantee low source impedance:To take full advantage of the BCM module’s dynamic response, the impedance presented to its input terminals must be low from DC to approximately 5 MHz. The connection of the bus converter module to its power source should be implemented with minimal distribution inductance. If the interconnect inductance exceeds 100 nH, the input should be bypassed with a RC damper to retain low source impedance and stable operation. With an interconnect inductance of 200 nH, the RC damper may be as high as 1 µF in series with 0.3 Ω. A single electrolytic or equivalent low-q capacitor may be used in place of the series RC bypass.
n Further reduce input and/or output voltage ripple without
sacrificing dynamic response:Given the wide bandwidth of the module, the source response is generally the limiting factor in the overall system response. Anomalies in the response of the source will appear at the output of the module multiplied by its K factor.
n Protect the module from overvoltage transients imposed
by the system that would exceed maximum ratings and
induce stresses:The module input/output voltage ranges shall not be exceeded. An internal overvoltage lockout function prevents operation outside of the normal operating input range. Even when disabled, the powertrain is exposed to the applied voltage and power MOSFETs must withstand it.
Total load capacitance at the output of the BCM module shall notexceed the specified maximum. Owing to the wide bandwidth and lowoutput impedance of the module, low-frequency bypass capacitanceand significant energy storage may be more densely and efficientlyprovided by adding capacitance at the input of the module. Atfrequencies <500 kHz the module appears as an impedance of ROuTbetween the source and load.
Within this frequency range, capacitance at the input appears aseffective capacitance on the output per the relationship defined in Eq. (13).
COUT =CIN (13)K2
This enables a reduction in the size and number of capacitors used in atypical system.
Thermal Considerations
The ChiP package provides a high degree of flexibility in that it presentsthree pathways to remove heat from internal power dissipatingcomponents. Heat may be removed from the top surface, the bottomsurface and the leads. The extent to which these three surfaces arecooled is a key component for determining the maximum power that isavailable from a ChiP, as can be seen from Figure 1.
Since the ChiP has a maximum internal temperature rating, it isnecessary to estimate this internal temperature based on a real thermalsolution. Given that there are three pathways to remove heat from theChiP, it is helpful to simplify the thermal solution into a roughlyequivalent circuit where power dissipation is modeled as a currentsource, isothermal surface temperatures are represented as voltagesources and the thermal resistances are represented as resistors. Figure18 shows the “thermal circuit” for a VI Chip® BCM module 6123 in anapplication where the top, bottom, and leads are cooled. In this case,the BCM power dissipation is PDTOTAL and the three surfacetemperatures are represented as TCASE_TOP, TCASE_BOTTOM, and TLEADS. Thisthermal system can now be very easily analyzed using a SPICEsimulator with simple resistors, voltage sources, and a current source.The results of the simulation would provide an estimate of heat flowthrough the various pathways as well as internal temperature.
Alternatively, equations can be written around this circuit andanalyzed algebraically:
TINT – PD1 • 1.24 = TCASE_TOP
TINT – PD2 • 1.24 = TCASE_BOTTOM
TINT – PD3 • 7 = TLEADS
PDTOTAL = PD1+ PD2+ PD3
Where TInT represents the internal temperature and PD1, PD2, and PD3
represent the heat flow through the top side, bottom side, and leadsrespectively.
+–
+–
+–
MAX INTERNAL TEMP
TCASE_BOTTOM
(°C) TLEADS
(°C) TCASE_TOP
(°C)Power Dissipation (W)
Thermal Resistance Top
Thermal Resistance Bottom Thermal Resistance Leads
+–
+–
MAX INTERNAL TEMP
TCASE_BOTTOM
(°C) TLEADS
(°C) TCASE_TOP
(°C)Power Dissipation (W)
Thermal Resistance Top
Thermal Resistance Bottom Thermal Resistance Leads
Figure 18 — Double side cooling and leads thermal model
Figure 19 — One side cooling and leads thermal model
1.24 °C / W
1.24 °C / W 7 °C / W
1.24 °C / W
1.24 °C / W 7 °C / W
BCM® Bus Converter Rev 1.0 vicorpower.comPage 20 of 24 12/2013 800 927.9474
BCM380y475x1K2A30 Figure 19 shows a scenario where there is no bottom side cooling. Inthis case, the heat flow path to the bottom is le open and theequations now simplify to:
TINT – PD1 • 1.24 = TCASE_TOP
TINT – PD3 • 7 = TLEADS
PDTOTAL = PD1 + PD3
Figure 20 shows a scenario where there is no bottom side and leadscooling. In this case, the heat flow path to the bottom is le open andthe equations now simplify to:
TINT – PD1 • 1.24 = TCASE_TOP
PDTOTAL = PD1
Please note that Vicor has a suite of online tools, including a simulatorand thermal estimator which greatly simplify the task of determiningwhether or not a BCM thermal configuration is valid for a givencondition. These tools can be found at:http://www.vicorpower.com/powerbench.
Current Sharing
The performance of the SAC™ topology is based on efficient transfer ofenergy through a transformer without the need of closed loop control.For this reason, the transfer characteristic can be approximated by anideal transformer with a positive temperature coefficient seriesresistance.
This type of characteristic is close to the impedance characteristic of aDC power distribution system both in dynamic (AC) behavior and forsteady state (DC) operation.
When multiple BCM modules of a given part number are connected inan array they will inherently share the load current according to theequivalent impedance divider that the system implements from thepower source to the point of load.
Some general recommendations to achieve matched array impedancesinclude:
n Dedicate common copper planes within the PCB to deliver and return the current to the modules.
n Provide as symmetric a PCB layout as possible among modules
n An input filter is required for an array of BCMs in order to prevent circulating currents.
For further details see An:016 using BCM Bus Converters in High Power Arrays.
Fuse Selection
In order to provide flexibility in configuring power systems VI Chip® modules are not internally fused. Input line fusing of VI Chip products is recommended at system level to provide thermalprotection in case of catastrophic failure.
The fuse shall be selected by closely matching system requirements with the following characteristics:
n Current rating
(usually greater than maximum current of BCM module)
n Maximum voltage rating
(usually greater than the maximum possible input voltage)
n Ambient temperature
n nominal melting I2t
n Recommend fuse: ≤ 5 A Bussmann PC-Tron
Reverse Operation
BCM modules are capable of reverse power operation. Once the unit isstarted, energy will be transferred from secondary back to the primarywhenever the secondary voltage exceeds VIn • K. The module willcontinue operation in this fashion for as long as no faults occur.
The BCM380y475x1K2A30 has not been qualified for continuousoperation in a reverse power condition. Furthermore fault protectionswhich help protect the module in forward operation will not fullyprotect the module in reverse operation.
Transient operation in reverse is expected in cases where there issignificant energy storage on the output and transient voltages appearon the input. Transient reverse power operation of less than 10 ms, 10%duty cycle is permitted and has been qualified to cover these cases.
BCM®1R0_1
ZIN_EQ1 ZOUT_EQ1
ZOUT_EQ2
Vout
ZOUT_EQn
ZIN_EQ2
ZIN_EQn
R0_2
R0_n
BCM®2
BCM®n
LoadDC
Vin
+
Figure 21 — BCM module array
+–
MAX INTERNAL TEMP
TCASE_BOTTOM
(°C) TLEADS
(°C) TCASE_TOP
(°C)Power Dissipation (W)
Thermal Resistance Top
Thermal Resistance Bottom Thermal Resistance Leads
Figure 20 — One side cooling thermal model
1.24 °C / W
1.24 °C / W 7 °C / W
BCM® Bus Converter Rev 1.0 vicorpower.comPage 21 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
BCM Module Through Hole Package Mechanical Drawing and Recommended Land Pattern
11.40.449
22.80±.13.898±.005
31.671.247
63.34±.382.494±.015
0
0
0
0
TOP VIEW (COMPONENT SIDE)
1.52.060
(2) PL.
1.02.040
(3) PL.
11.43.450
1.52.060
(4) PL.
0
30.9
11.
217
30
.91
1.21
7
0
2.75.108
8.25.325
2.75.108
8.25.325
8.00.315
1.38.054
1.38.054
4.13.162
8.00.315
0
0
BOTTOM VIEW
.41.016
(9) PL.
4.17.164
(9) PL.
7.26±.05.286±.002
SEATING.
PLANE
.05 [.002]
2.03.080
PLATED THRU.25 [.010]
ANNULAR RING(2) PL.
1.52.060
PLATED THRU.25 [.010]
ANNULAR RING(3) PL.
2.03.080
PLATED THRU.38 [.015]
ANNULAR RING(4) PL.
0
2.75±.08.108±.003
8.25±.08.325±.003
2.75±.08.108±.003
8.25±.08.325±.003
8.00±.08.315±.003
4.13±.08.162±.003
1.38±.08.054±.003
1.38±.08.054±.003
8.00±.08.315±.003
0
30.9
1±.0
81.
217±
.003
30
.91±
.08
1.21
7±.0
03
0
0
+IN
TM
EN
VAUX
-IN
+OUT
+OUT
-OUT
-OUT
RECOMMENDED HOLE PATTERN(COMPONENT SIDE)
NOTES:
1- RoHS COMPLIANT PER CST-0001 LATEST REVISION.2- UNLESS SPECIFIED OTHERWISE, DIMESIONS ARE MM / [INCH].
BCM® Bus Converter Rev 1.0 vicorpower.comPage 22 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
BCM Module Recommended Top Heat Sink Push Pin Location
NOTES:
2- MAKE FROM VICOR P/N 32618.
3- FINISH: CLEAR FINISH, RoHS COMPLIANT PER CST-0001, LATEST REVISION PER A.) CHROMIUM FREE, OR B.) TRIVALENT CHROMIUM IN ACCORDANCE WITH MIL-DTL-5541, TYPE II, CLASS 1A OR 3. SEE CST-0003 FOR TYPES OF AVAILABLE FINISHES.
4- REMOVE ALL BURRS AND SHARP EDGES.
5- <> DENOTES CRITICAL CHARACTERISTIC FOR LOT INSPECTION.
6- ROHS COMPLIANT, LEAD FREE PER CST-0001 LATEST REVISION.
1- UNLESS SPECIFIED OTHERWISE, DIMESIONS ARE MM / [INCH].
32.941.297
<>
1.27.050
11.00.433
.44.017
2.47.097
32.061.262
.076 / [.003] <>
61.502.421
<>
14.28.562
32.9401.297
<>
6.00.236
(4) PL.
27.9401.100
<>
2.50.098
3.30.130
(4) PL.<>
6.67.263
(4) PL.
R2.00.079TYP
3.00.118TYP
1.14.045MINTYP<>
2.50.098
27.9401.100
29.661.168
2.184.086
2X M2-.4 x 3.5MM DP TAP
BCM® Bus Converter Rev 1.0 vicorpower.comPage 23 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
BCM Module Recommended Belly Heat Sink Mounting Location
3.10.122
(4) PL.NON-PLATEDTHRU HOLESEE NOTE 1
0
0
13.97.550
(3) PL.
16.60.654
(2) PL.
13.97.550
(3) PL.
16.60.654
(2) PL.
20.0
0.7
87(2
) PL
.
16.4
7.6
48(2
) PL
.
7.
71.3
03
16.4
7.6
48(2
) PL
.
20.0
0.7
87(2
) PL
.
7.
71.3
03
2.29±.08.090±.003
(4) PL.PLATED
THRU HOLE .64
.025
ANNULAR RING
2.03.080
(2) PL.PLATED
THRU HOLE .38
.015
ANNULAR RING
CHIP OUTLINE
6123RECOMMENDED LAND PATTERN
TOP SIDE SHOWN
M2.5X0.45 THRU ALL(4) PL.
32.941.297(2) PL.
<>
R2.00.079
(4) PL.
27.9401.100(3) PL.
<>
33.201.307(2) PL.
<>
8.80.346
(2) PL.
11.43.450
(2) PL.
61.50±.252.421±.010
3.30.130
(4) PL.<>
2.80.110
THRU ALL(2) PL.
8.00.315
(4) PL.
6.45.254
(2) PL.
45°(4) PL.
<>
23.04.907
10.75.423
(2) PL.
14.28.562
(2) PL.
15.418.607<>
40.0001.575(2) PL.
<>
50.802.000
19.50.768
.13/[.005] T A
.08 / 25.4 X 25.4
[.003 / 1 X 1]SEE NOTE 5<>
A
NOTES:
CLEAR FINISH, RoHS COMPLIANT PER CST-0001, LATEST REVISION PER 1.A.) CHROMIUM FREE, OR B.) TRIVALENT CHROMIUM IN ACCORDANCE WITH MIL-DTL-5541, TYPE II, CLASS 1A OR 3. SEE CST-0003 FOR TYPES OF AVAILABLE FINISHES.SEE VICOR P/N 40510 FOR EXTRUSION PROFILE.2.MATERIAL: ALUM ALLOY 6063-T53.REMOVE ALL BURRS AND BREAK ALL SHARP EDGES.4.IF NECESSARY, EXTRUDE OVERSIZE AND MACHINE BASE AND INSIDE5.SURFACE TO ACHIEVE FLATNESS AND PARALLELISM. <> DENOTES CRITICAL CHARACTERISTIC FOR LOT INSPECTION.6.
7. UNLESS SPECIFIED OTHERWISE, DIMESIONS ARE MM / [INCH].
BCM® Bus Converter Rev 1.0 vicorpower.comPage 24 of 24 12/2013 800 927.9474
BCM380y475x1K2A30
Vicor’s comprehensive line of power solutions includes high density AC-DC and DC-DC modules andaccessory components, fully configurable AC-DC and DC-DC power supplies, and complete custompower systems.
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. Vicor makes norepresentations or warranties with respect to the accuracy or completeness of the contents of this publication. Vicor reserves the right to makechanges to any products, specifications, and product descriptions at any time without notice. Information published by Vicor has been checked andis believed to be accurate at the time it was printed; however, Vicor assumes no responsibility for inaccuracies. Testing and other quality controls areused to the extent Vicor deems necessary to support Vicor’s product warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed. Specifications are subject to change without notice.
Vicor’s Standard Terms and ConditionsAll sales are subject to Vicor’s Standard Terms and Conditions of Sale, which are available on Vicor’s webpage or upon request.
Product WarrantyIn Vicor’s standard terms and conditions of sale, Vicor warrants that its products are free from non-conformity to its Standard Specifications (the“Express Limited Warranty”). This warranty is extended only to the original Buyer for the period expiring two (2) years after the date of shipmentand is not transferable.UNLESS OTHERWISE EXPRESSLY STATED IN A WRITTEN SALES AGREEMENT SIGNED BY A DULY AUTHORIZED VICOR SIGNATORY, VICOR DISCLAIMSALL REPRESENTATIONS, LIABILITIES, AND WARRANTIES OF ANY KIND (WHETHER ARISING BY IMPLICATION OR BY OPERATION OF LAW) WITHRESPECT TO THE PRODUCTS, INCLUDING, WITHOUT LIMITATION, ANY WARRANTIES OR REPRESENTATIONS AS TO MERCHANTABILITY, FITNESS FORPARTICULAR PURPOSE, INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT, OR ANY OTHER MATTER.
This warranty does not extend to products subjected to misuse, accident, or improper application, maintenance, or storage. Vicor shall not be liablefor collateral or consequential damage. Vicor disclaims any and all liability arising out of the application or use of any product or circuit and assumesno liability for applications assistance or buyer product design. Buyers are responsible for their products and applications using Vicor products andcomponents. Prior to using or distributing any products that include Vicor components, buyers should provide adequate design, testing andoperating safeguards.
Vicor will repair or replace defective products in accordance with its own best judgment. For service under this warranty, the buyer must contactVicor to obtain a Return Material Authorization (RMA) number and shipping instructions. Products returned without prior authorization will bereturned to the buyer. The buyer will pay all charges incurred in returning the product to the factory. Vicor will pay all reshipment charges if theproduct was defective within the terms of this warranty.
Life Support PolicyVICOR’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESSPRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF VICOR CORPORATION. As used herein, life supportdevices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to performwhen properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to theuser. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause thefailure of the life support device or system or to affect its safety or effectiveness. Per Vicor Terms and Conditions of Sale, the user of Vicor productsand components in life support applications assumes all risks of such use and indemnifies Vicor against all liability and damages.
Intellectual Property NoticeVicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent applications) relating to theproducts described in this data sheet. No license, whether express, implied, or arising by estoppel or otherwise, to any intellectual property rights isgranted by this document. Interested parties should contact Vicor's Intellectual Property Department.
The products described on this data sheet are protected by the following U.S. Patents Numbers:5,945,130; 6,403,009; 6,710,257; 6,911,848; 6,930,893; 6,934,166; 6,940,013; 6,969,909; 7,038,917; 7,145,186; 7,166,898; 7,187,263;7,202,646; 7,361,844; D496,906; D505,114; D506,438; D509,472; and for use under 6,975,098 and 6,984,965.
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emailCustomer Service: custserv@vicorpower.comTechnical Support: apps@vicorpower.com
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