mtd6502b - 5v 3-phase bldc sinusoidal sensorless fan motor … · 2011. 5. 2. · motor (also...
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5V 3-Phase BLDC Sinusoidal Sensorless Fan Motor Driver
MTD6502B
Features:• Position Sensorless BLDC Drivers
(No Hall Sensor Required)• 180° Sinusoidal Drive, for High Efficiency and Low
Acoustic Noise• Support 2V to 5.5V Power Supplies• Direction Control:
- Forward direction: connect DIR pin to GND or leave floating
- Reverse direction: connect DIR pin to VDD• Speed Control through Power Supply Modulation
(PSM) and/or Pulse-Width Modulation (PWM)• Built-in Frequency Generator (FG Output Signal)• Built-in Lock-up Protection and Automatic
Recovery Circuit (External Capacitor not Necessary)
• Built-in Over Current Limitation• Built-in Thermal Shutdown Protection• No External Tuning Required• Available Packages:
- 3 mm x 3 mm TDFN-10
Applications:• Notebook CPU Cooling Fans• 5V 3-Phase Brushless DC Motors
Description:The MTD6502B device is a 3-phase full-wave driver forbrushless sensorless DC motors. It features 180°sinusoidal drive, high torque output and silent drive.With adaptive features, parameters and a wide rangeof power-supplies (2V to 5.5V), the MTD6502B deviceis intended to cover a wide range of motorcharacteristics, while requiring minimum externalcomponents. Speed control can be achieved througheither power supply modulation or pulse-widthmodulation (using the PWM digital input pin).
With the compact packaging and minimum bill-of-material (integrated power transistors, no Hall sensor,no external tuning), the MTD6502B is best suited forlow-cost fan applications requiring high efficiency andlow acoustic noise, such as notebook CPU coolingfans. Frequency generator (FG) output enables theprecision speed control in closed-loop applications.The MTD6502B driver includes a lock-up protectionmode, which turns off the output current when themotor is under lock condition, and an automaticrecovery that enables the fan to run when the lockcondition is removed. The motor overcurrent limitationand thermal-shutdown protection are included forsafety-enhanced operations.
The MTD6502B is available in a compact thermally-enhanced 3 mm x 3 mm TDFN package.
Package TypesMTD6502B3x3 TDFN*
VDD
GND
OUT1
DIR
VCC
1
2
34
9
8
76
PWMFG
* Includes Exposed Thermal Pad (EP); see Table 2-1.
EP11
5
10
OUT2
OUT3
GND
© 2011 Microchip Technology Inc. DS25003B-page 1
MTD6502B
Functional Block DiagramThermal protection
VDD
OUT1
OUT2ControllerPWM OUT3
VCC
Short-circuit protection
Out
put D
rive
Circ
uit
Motor Phase Detection Circuit
Over-current protection
Sof
t Sw
itchi
ng D
rive
VCC
Regulator
VREF
GND
VCC
DIR
FG
DS25003B-page 2 © 2011 Microchip Technology Inc.
MTD6502B
Typical ApplicationRecommended External Components for Typical ApplicationElement Type/Value Comment
C1 ≥1 µF Connect as close as possible to IC input pinsC2 ≥1 µF Connect as close as possible to IC input pinsR1 ≥10 kΩ Connect to Vlogic on microcontroller side
OUT1
GND
OUT2 GND
DIR
PWM
OUT3
1
2
4
5 6
7
9
10
VDD VCC3 8
R1
MCU Side (Vlogic)
C1C2
PWM Input(1-100 kHz)
FG
VCC
MTD
6502
B
© 2011 Microchip Technology Inc. DS25003B-page 3
MTD6502B
NOTES:DS25003B-page 4 © 2011 Microchip Technology Inc.
MTD6502B
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†Power Supply Voltage (VCC_MAX) ...................... -0.7 to +7.0VMaximum Output Voltage (VOUT_MAX) ............... -0.7 to +7.0VMaximum Output Current(2) (IOUT_MAX) ....................1000 mAFG Maximum Output Voltage (VFG_MAX) ........... -0.7 to +7.0VFG Maximum Output Current (IFG_MAX).....................5.0 mAVDD Maximum Voltage (VDD_MAX) ..................... -0.7 to +4.0VPWM Maximum Voltage (VPWM_MAX) ................ -0.7 to +7.0VAllowable Power Dissipation(2)(PD_MAX).........................1.5WMaximum Junction Temperature (TJ) ..........................+150°C
† Notice: Stresses above those listed under “MaximumRatings” may cause permanent damage to the device. This isa stress rating only and functional operation of the device atthose or any other conditions above those indicated in theoperational listings of this specification is not implied.Exposure to maximum rating conditions for extended periodsmay affect device reliability.
Note 1: Reference PCB, according to JEDECstandard EIA/JESD 51-9.
2: IOUT is also internally limited, accordingto limits defined in the ElectricalCharacteristics.
ELECTRICAL CHARACTERISTICSElectrical Specifications: Unless otherwise specified, all limits are established for TA = +25°C
Parameters Sym Min Typ Max Units Conditions
Power Supply Voltage VCC 2 — 5.5 VPower Supply Current IVCC — 50 — µA PWM = 0, VCC = 5VOUTx High Resistance RON(H) — 0.75 1 Ω IOUT = 0.5A, VCC = 5VOUTx Low Resistance RON(L) — 0.75 1 Ω IOUT = 0.5A, VCC = 5VOUTx Total Resistance RON(H+L) — 1.5 2 Ω IOUT = 0.5A, VCC = 5VVDD Output Voltage VDD — 3 — V VCC = 3.3V to 5.5V
— VCC – 0.2 — V VCC < 3.3VPWM Input Frequency fPWM 1 — 100 kHzPWM Input H Level VPWM_H 0.55*VCC — VCC VPWM Input L Level VPWM_L 0 — 0.2*VCC VPWM Internal Pull-Up Current IPWM_L — — 55 µA PWM = 0DIR Internal Pull-Down Current IDIR — 20 — µAFG Output Pin Low Level Voltage VOL_FG — — 0.25 V IFG = -1 mAFG Output Pin Leakage Current ILH_FG — — 10 µA VFG = 5.5VLock Protection Operating Time
TRUN — 0.5 — s
Lock Protection Waiting Time TWAIT 4.5 5 5.5 sOvercurrent Protection IOC_MOT — 750 — mAThermal Shutdown TSD — 170 — °CThermal Shutdown Hysteresis TSD_HYS — 25 — °C
© 2011 Microchip Technology Inc. DS25003B-page 5
MTD6502B
TEMPERATURE SPECIFICATIONSElectrical Specifications: Unless otherwise specified, all limits are established for VCC = 5.0V, TA = +25°C
Parameters Sym Min Typ Max Units Conditions
Temperature RangesOperating Temperature TOPR -40 — +125 °CStorage Temperature Range TSTG -55 — +150 °CThermal Package ResistancesThermal Resistance, 10L-TDFN θJA — 68 — °C/W
DS25003B-page 6 © 2011 Microchip Technology Inc.
MTD6502B
2.0 PIN DESCRIPTIONSThe descriptions of the pins are listed in Table 2-1.
TABLE 2-1: MTD6502B PIN FUNCTION TABLEMTD6502B3x3 TDFN Type Name Function
1 O FG Motor speed indication output2, 6 — GND Negative voltage supply (ground)
3 — VDD Internal regulator output (for decoupling only)4 O OUT1 Single phase coil output pin5 O OUT2 Single phase coil output pin7 O OUT3 Single phase coil output pin8 — VCC Positive voltage supply for motor driver9 I DIR Motor Rotation Direction:
- Forward direction: connect pin to GND or leave floating- Reverse direction: connect pin to VDD
10 I PWM PWM input signal for speed control11 — EP Exposed Thermal Pad (EP)
Legend: I = Input; O = Output
© 2011 Microchip Technology Inc. DS25003B-page 7
MTD6502B
NOTES:DS25003B-page 8 © 2011 Microchip Technology Inc.
MTD6502B
3.0 FUNCTIONAL DESCRIPTIONThe MTD6502B generates a full-wave signal to drive a3-phase sensorless BLDC motor. High efficiency andlow-power consumption are achieved due to the CMOStransistors and synchronous rectification drive type.
3.1 Speed ControlThe rotational speed of the motor can be controlledeither through the PWM digital input signal, or by actingdirectly on the power supply (VCC). When the PWMsignal is High (or left open), the motor rotates at fullspeed. When the PWM signal is Low, the motor isstopped (and the IC outputs are set to high-impedance). By changing the PWM duty cycle, thespeed can be adjusted. Notice that the PWM frequencyhas no special meaning for the motor speed and isasynchronous with the activation of the outputtransistors. Thus, the user has the maximum freedomto choose the PWM system frequency within a widerange (from 1 kHz to 100 kHz), while the outputtransistor activation always occurs at a fixed rate(20 kHz, or 30 kHz), which is outside of the range ofaudible frequencies.
3.2 Motor Rotation DirectionThe current carrying order of the outputs depends onthe DIR pin state (Rotation Direction) according toTable 3-1.
3.3 Frequency Generator FunctionThe Frequency Generator output (FG) is a “Hall-sensorequivalent” digital output, that gives information to anexternal controller about the speed and phase of themotor. The FG pin is an open collector output,connecting to a logical voltage level through anexternal pull-up resistor. When a lock (or out-of-sync)
situation is detected by the driver, this output is set tohigh-impedance until the motor is restarted. Leave thepin open when not used.
3.4 Lock-up Protection and Automatic Restart
If the motor is blocked and cannot rotate freely, alock-up protection circuit detects this situation anddisables the driver (by setting its outputs to high-impedance), in order to prevent the motor coil fromburnout. After a “waiting time” (TWAIT), the lock-upprotection is released and normal operation resumesfor a given time (TRUN). If the motor is still blocked, anew period of waiting time is started. TWAIT and TRUNtimings are fixed internally, so that no external capacitoris needed.
3.5 Overcurrent ProtectionThe motor peak current is limited by the driver to a fixedvalue (defined internally), thus limiting the maximumpower dissipation in the coils.
3.6 Thermal ShutdownThe MTD6502B has a thermal protection functionwhich detects when the die temperature exceedsTJ = +170°C. When this temperature is reached, thecircuit enters Thermal Shutdown mode, and theoutputs OUT1, OUT2 and OUT3 are disabled (high-impedance), avoiding the IC destruction and allowingthe circuit to cool down. Once the junction temperature(TJ) has dropped below +145°C, the normal operationresumes (thermal detection circuit has +25°Chysteresis function).
FIGURE 3-1: Thermal Protection Hysteresis.
3.7 Internal Voltage RegulatorVDD voltage is generated internally and is used tosupply the internal logical blocks. The VDD pin is usedto connect an external decoupling capacitor (1 µF, orhigher). Notice that this pin is for IC internal use, and isnot designed to supply DC current to external blocks.
Note: The standard output frequency is 30 kHz.The 20 kHz output frequency option isavailable upon request.
TABLE 3-1: MOTOR ROTATION DIRECTION OPTIONS (DIR PIN)
DIR Pin State Rotation Direction
Outputs Activation Sequence
Connected to GND or Floating
Forward OUT1 → OUT2 → OUT3
Connected to VDD
Reverse OUT3 → OUT2 → OUT1
Note: FG/2 option is available upon request for8-pole applications.
TJ+145°
Thermal shutdown
+170°
Normal operation
© 2011 Microchip Technology Inc. DS25003B-page 9
MTD6502B
3.8 BEMF Coefficient SettingKm is the electro-mechanical coupling coefficient of themotor (also referred to as “motor constant” or “BEMFconstant”). Depending on the conventions in use, theremay be some inconsistency in the exact definition ofKm and its measurement criteria among different motormanufacturers. In order to work with various motorapplications, the MTD6502B offers various options toadopt a wide range of BEMF coefficient. The BEMFcoefficient (Km) is defined as the peak value of thephase-to-phase BEMF voltage, normalized to theelectrical speed of the motor.TABLE 3-2: KM OPTIONSKm (mV/Hz) Range
Phase-to-Phase OptionMin Max
3.25 6.5 06.5 13 113 26 2
DS25003B-page 10 © 2011 Microchip Technology Inc.
MTD6502B
4.0 PACKAGING INFORMATION
4.1 Package Marking Information
XXXXYYWW
NNN
Legend: XX...X Customer-specific informationY Year code (last digit of calendar year)YY Year code (last 2 digits of calendar year)WW Week code (week of January 1 is week ‘01’)NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn)* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it willbe carried over to the next line, thus limiting the number of availablecharacters for customer-specific information.
3e
3e
10-Lead TDFN (3x3x0.9 mm) Example
Device Code
MTD6502B-LC1-00 AAAAMTD6502B-LC1-01 AAABMTD6502B-LC1-02 AAAC
AAAA1104256
PIN 1PIN 1
© 2011 Microchip Technology Inc. DS25003B-page 11
MTD6502B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
DS25003B-page 12 © 2011 Microchip Technology Inc.
MTD6502B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
© 2011 Microchip Technology Inc. DS25003B-page 13
MTD6502B
NOTES:DS25003B-page 14 © 2011 Microchip Technology Inc.
MTD6502B
APPENDIX A: REVISION HISTORY
Revision B (May 2011)• Updated PWM Input H Level value in the
Electrical Characteristics table.
Revision A (March 2011)• Original Release of this Document.
© 2011 Microchip Technology Inc. DS25003B-page 15
MTD6502B
NOTES:DS25003B-page 16 © 2011 Microchip Technology Inc.
MTD6502B
PRODUCT IDENTIFICATION SYSTEMTo order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. -X XX -XX
Km RangePackageTape&ReelDevice
Device: MTD6502B-L: 3-Phase BLDC Sinusoidal Sensorless Fan Motor Driver (Tape and Reel)
Package: C1 = Plastic Dual Flat, No Lead Package, 3x3x0.9 mm Body (TDFN)
Km Range Value: See Table 3-2 for details.
Examples:a) MTD6502B-LC1-00 Tape and Reel,
10LD TDFN Pkg, Km Range Value = 0
b) MTD6502B-LC1-01 Tape and Reel,10LD TDFN Pkg, Km Range Value = 1
c) MTD6502B-LC1-02 Tape and Reel,10LD TDFN Pkg, Km Range Value = 2
Value
© 2011 Microchip Technology Inc. DS25003B-page 17
MTD6502B
NOTES:DS25003B-page 18 © 2011 Microchip Technology Inc.
MTD6502B
Note the following details of the code protection feature on Microchip devices:• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights.
© 2011 Microchip Technology Inc.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their respective companies.
© 2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-61341-132-2
DS25003B-page 19
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
DS25003B-page 20 © 2011 Microchip Technology Inc.
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