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More Imaging Luc De Mey - CEO - CMOSIS SA

Annual Review / June 28, 2011

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

More Imaging

• CMOSIS: Vision & Mission

• CMOSIS’s Business Concept

• On-Going R&D: More Imaging

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS’s Vision

Image capture is a key technology with ever growing number of

applications.

Specific imaging applications require specific and optimized Image Sensors.

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS’s Mission

Be a leading supplier of Image Sensors optimized for Industrial,

Professional and Scientific Applications.

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS’s Business Model

Development, Qualification, Production and Supply of CMOS Image Sensors

‣ Standard of-the-shelf Sensors

‣ Custom(ised) Sensors

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Markets

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS’s Company Details

•  Creation November 16, 2007

•  Capital 5.300.000 €

•  Investors

– Management and Personnel

– Financial Investors: Capital-E, Vinnof, ING Belgium, ING Activator Fund

•  Personnel 35

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Company Details

Facilities Antwerp

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Company Details

Facilities Antwerp

Area: 1100 m2

‣  class 100 cleanroom ‣  8” and 12“ wafer tester

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS class 100 Clean Room

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS: 25 years of CMOS Image Sensor History

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS’s Team Publications

> 100 man-years of relevant experience

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

Patent/Patent Applications

•  New CMOS pixel architectures (8-T)

•  New on-chip ADC’s

•  BSI technology

•  CMOS TDI

•  Wafer scale imagers

•  CMOS binning techniques

•  Total: 12 patent families

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS’s Patents - IP

•  12 CMOSIS patents filed in 2009-2010

•  1st patent granted, protecting our column AD converter structure

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Standard Products

Standard Products

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Standard Products

•  CMOSIS Machine Vision: CMV

•  CMOSIS Low Noise: CLN

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMV2000

CMV12000 CMV4000

CMOSIS Standard Products CMV

•  Applications

–  Machine Vision - Factory Automation

–  Broadcast

–  Motion Analysis

–  High End Surveillance

–  Matrix Code Reading

–  Intelligent Traffic Systems - ITS

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Standard Products CMV

TypePixel pitch

µmOptical format FPS Bits Status

300

2000

4000

12000

7,4 1/3” 600 12 Samples August ’11

5,5 2/3”340

75

10

12Production

5,5 1”180

45

10

12Production

5,5∅ 28 mm

APS-like

180

300

350

12

10

8

Samples May ’11

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Standard Products CMV

•  Common features –  Global pipelined shutter (8-T) –  Low FPN

–  Digital serial LVDS interface

–  Low dark noise

–  High electronic shutter efficiency

–  Column ADCs

–  Integrated sequencer/controller

–  0.18 µm CMOS Image sensor technology

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Standard Products

CMOSIS New CMV12000

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

New CMOSIS CMV12000

•  Global pipelined 8T pixel shutter with CDS –  Global shutter required in machine vision market –  High sensitivity achieved through CDS and high conversion gain

–  High shutter efficiency because of pixel architecture

•  High speed column ramp ADC architecture

•  High resolution with high frame rate –  12 Mpixels

–  Fully pipelined readout scheme •  Designed for > 300 fps @ 10 bit resolution → I/O speed > 36 GbpsCurrently

ongoing tests show even:

> 400 fps (full frame) @ 10 bit resolution → I/O speed > 50 Gbps

> 1000 fps (HD 2M) @ 10 bit resolution → I/O speed > 25 Gbps

What makes this sensor unique?

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMV12000 Sensor features

Feature

Resolution 4096 x 3072

Pixel size 5.5 µm x 5.5 µm

Max. frame rate 180 fps (12 bit) 300 fps (10 bit) 350 fps (8 bit)

Pixel control Row windowing (up to 32 separate ROIs), sub-sampling, 2x2 binning

Image flipping X and Y mirroring

Output 64 LVDS outputs @ 600 Mbps

Multiplexing To 32, 16, 8, 4 and 2 or 1 output(s)

Sensor output 8 bit, 10 bit, 12 bit

Package Ceramic µPGA package (237 pins)

Power consumption < 2.5 W (full frame, 300 fps, 10 bit)

Technology 0.18 µm CIS 1P4M

Noise < 10/13 e-

Dynamic range > 62/60 dB

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMV12000 Sample image

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMV Standard Products

•  CMV2000/4000 à Industry standard à CMOSIS inside

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS CMV2000 Movie

CMV2000, 300fps

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CLN1000 Standard Product - Low Noise

TypePixel pitch

µmOptical format FPS Bits Status

1000 10 1” 20 Analog Samples Available

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CLN1000 Standard Products CLN - Low Noise

Common features

–  4T, dual transfer gate rolling shutter pixel

–  Low dark noise: 3,3 e-

–  High full well: 99.000 e-

–  High linear dynamic range: 89 dB

–  0.18 µm CMOS Image sensor technology

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CLN1000 - Low Noise

•  Applications

–  Surveillance

–  Microscopy

–  Diagnostics

–  Astronomy

–  X-ray

–  Fluorescence

–  Luminescence

–  ...

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

Standard Products

Custom Design

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

Analysis and Architectural Study

Device Test & Characterization

Detailed Design & Layout

Prototyping

Device Qualification & Production

CMOSIS Custom Design

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Full Custom CIS Projects

Active projects:

‣ 3 Space customers, 5 active projects: ESA, CNES,

‣  >12 Industrial customers

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Customised Standard Products

•  Custom packages

•  Chip-Scale Packaging

•  Custom cover glass: NIR filter, ARC, band-pass filters,

•  Integrated Thermo Electric Cooler (TEC)

•  Custom color filters

•  Back Side Illumination

•  ....

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Custom Package

Integrated Thermo Electric Cooler

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Custom Package

Chip-Scale Packaging

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS R&D

More Imaging

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Technology differentiators…

Low noise global shutter pixels

Fast column AD converters

Backside illumination technology

High frame rates High dynamic range

pixels

Thin back-end process

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Core Technologies

•  Global shutter pixels with low read noise, high shutter efficiency, and low FPN

•  High speed on chip 10/12/14 bit column ADC’s

•  Backside Thinning and Illumination

•  CMOS Time Delay and Integration (TDI)

•  Radiation hardened CIS

•  Large area (wafer scale) imagers with high yields (stitching!)

•  CIS system-on-a-chip

•  Very high frame rate imagers

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Long Term R&D Plan

•  Move to more advanced CMOS technologies: 0.110 µm or below

–  Smaller pixels

–  More complex pixels

–  Better electro-optical performance

•  On chip image processing electronics > smart imagers

•  Improved image sensor performances:

–  Lower read noise: ≤1e-

–  Increase full well: higher SNR

–  High performance ADC: resolution, speed

–  ≥ 1 GBit/s LVDS type interfaces

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Long Term R&D Plan

Smaller Technologies

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

Global shutter pixel – smaller pixels

8 transistors, 2 source followers, 2 capacitors

Need for smaller optical formats & complex pixels ⇒ smaller technologies

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

The importance of a thin back-end

6 µm pixel

…even for a large pixel

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS moves to smaller technologies…

•  First tape-out’s in 110/90 nm/300mm

•  Moving to 90/65 nm/300mm

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

Excellent quantum efficiency

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

Excellent angular response > 95% at 20° angel

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS smaller architectures – 300mm

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS smaller architectures – 300mm

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Long Term R&D Plan

Back Side Illumination

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

Backside Illumination – Address Many Challenges

Sensitivity

Dynamic Range

Frame Rate

Resolution

Functionality

Angular Response

Higher QE

Higher sensitivity

More readout lines

No metal blocking

More complex pixels

Smaller pixels

Picture by Dr. Avi Strum, TowerJazz

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

High End Image Sensor Challenges

Sensitivity Dynamic Range Frame Rate

Resolution Functionality Angular Response Picture by Dr. Avi Strum, TowerJazz

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

Backside illumination: applications

•  Scientific and industrial vision markets –  Performance : low noise, high QE

–  Large pixels: MTF / cross-talk less problematic

–  Monochrome

–  Increased UV sensitivity: for inspection, analysis applications, EUV for science/space.

–  Global shutter, without degradation of noise and PLS in BSI

–  Performance: low dark current, good read noise

Our developments focuses on this area

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

FSI & BSI CMV4000 4 Mpixel – 180 fps

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

FSI & BSI CMV2000 2.2 Mpixel 340 fps

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

•  Development on CMOSIS CMV2000 / CMV4000te (EUV),

•  Excellent PLS: 1/20,000 – best in world for BSI global shutter sensor

•  Not (only) for visible light QE improvement –  Extension of sensitivity to UV, EUV, electron detection

CMOSIS Back Side Illumination

Frontside CMV2000 with µlens Backside CMV2000

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

Backside illumination: quantum efficiency

+ improvement of yield (hot clusters)

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

Cause of low sensitivity in blue & UV

Dead-zone below 450nm caused by pre-doped profile out-diffusing during CMOS processing.

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

Solutions to enhance blue response

Get rid of the dead zone through either:

1.  Backside implant + (laser) anneal with Excico Laser

2.  Further etching of the silicon

3.  Deposition of a layer with fixed negative charge (Sapphire Al2O3)

4.  A combination of 2 & 3

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

QE – further etch improves QE again

57

Some improvement in blue but not good enough yet

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS BSI Flow

Start material: SOI wafer specific doping profile!

Wafer processing: !0.18 µm CMOS!

Wafer bonding!(adhesive or ox-ox)!

Backside implant!

Laser anneal!

Pad opening!

Packaging (assembly)!

Wafer test! AR coating (+CFA, …)!

Final test!

Thinning - stop on BOX!

Silicon etch!

Al2O deposition!

BOX etch!

CMOSIS Proprietary Flow

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Long Term R&D Plan

> High Dynamic Range

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

More dynamic range with 2 transfer gates

Pixel with 2 floating diffusions –  First transfer to smallest FD

High gain for dark signals

–  Second transfer of remaining photocharges to larger FD

low gain for bright signals

–  2 outputs per pixel

–  Simplification: select which FD to use based upon required gain.

TX1  

TX2  

FD2

PPD

FD1

Cfd1 << Cfd2

TX2   TX1  PPD_P  

PPD_N  FD2   FD1  

P-­‐epi  

illumination

Out

image1

image2

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CLN1000 - 70 dB + 70 dB = 90 dB

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CLN1000 CHARACTERIZATION TABLE

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CLN1000 SENSOR FUNCTIONALITY

LOW GAIN CHANNEL HIGH GAIN CHANNEL

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

High Dynamic Range & BSI

•  BSI version:

!  Fully functional

!  SOI start material: 3um epi

!  Customized post-processing

!  Buried oxide (BOX) remove

!  Excellent QE in UV

•  Future development

!  Digital out (on-chip column-level ADC)

!  Timing on-chip

!  Full product

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

QE – 10 µm pixel, 3 µm thickness BSI

UV sensitivity

© copyright 2011– CMOSIS SA Annual Review / June 28, 2011

CMOSIS Manufacturing Flow – Fabs:

- 180nm

- 110/90nm - 90/65nm

- 180nm

- 180nm

- 180nm

More Imaging Luc De Mey - CEO - CMOSIS SA

Annual Review / June 28, 2011

Thanks' for your attention!

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