modelling of ion - driven deuterium retention in w o.v. ogorodnikova in collaboration with

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Modelling of ion - driven deuterium retention in W O.V. Ogorodnikova in collaboration with J. Roth and M. Mayer MPI für Plasmaphysik, EURATOM Association, Garching, Germany. Ion implantation and TDS. D retention in W has been studied in ion beam experiments: monoenergetic ion beam - PowerPoint PPT Presentation

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© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Modelling of ion - driven deuterium retention in W

O.V. Ogorodnikova

in collaboration with

J. Roth and M. MayerMPI für Plasmaphysik, EURATOM Association,

Garching, Germany

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Ion implantation and TDS

D retention in W has been studied in ion beam experiments: monoenergetic ion beam

E = 200 eV D+ to 3 keV D+

T = 300 K to 600 K

D inventory in W increases as a square root of fluence at RT => diffusion-limited trapping.

1021 1022 1x1023 1024 1x10251018

1019

1020

1021

W

200 eV, RT100%

Deu

teri

um r

etai

ned,

D/m

2

Incident fluence, D+/m2

Ogorodnikova O.V., Roth J., Mayer M., J. Nucl. Mater. 313-316 (2003) 469-477

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Ion implantation and TDS

D retention in W has been studied in ion beam experiments: monoenergetic ion beam

E = 200 eV D+ to 3 keV D+

T = 300 K to 600 K

D inventory in W increases as a square root of fluence at RT => diffusion-limited trapping.

Most of D are trapped in the bulk at high fluences.

1021 1022 1x1023 1024 1x10251018

1019

1020

1021

NRA< 6 m

W

200 eV, RT100%

Deu

teri

um r

etai

ned,

D/m

2

Incident fluence, D+/m2

Ogorodnikova O.V., Roth J., Mayer M., J. Nucl. Mater. 313-316 (2003) 469-477

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

200 400 600 8000,00

0,40

0,80 experiments

1022 D/m2

1023 D/m2

200 eV D+, RT -> W

Des

orpt

ion

flux

, 1019

D/m

2 s

Temperature, K

1021 1022 1x1023 1024 1x10251018

1019

1020

1021

W

200 eV, RT100%

Deu

teri

um r

etai

ned,

D/m

2

Incident fluence, D+/m2

TDS shows two peaks.Both peaks grow with fluence.Second peak (high-temperature) grows faster.

Ion implantation and TDS

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

1021 1022 1x1023 1024 1x10251018

1019

1020

1021

W

200 eV, RT100%

Deu

teri

um r

etai

ned,

D/m

2

Incident fluence, D+/m2

Pre-implantation with intermediate TDS increases the second peak.

Ion implantation and TDS

200 400 600 800 10000,00

0,20

0,40

0,60

0,80

1,00

200 300 400 500 600 700 800 900 1000200 300 400 500 600 700 800 900 1000

200 eV D+ -> W

F=1022 D/m2, RT virgin W re-used W

Des

orpt

ion

flux

, 1019

D/m

2 s

Temperature, K

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Modelling of D retention in PCW

trapping

Implantation, I0

Permeation, JL

Desorption, J0

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Modelling of D retention in PCW

trapping

Implantation, I0

Permeation, JL

Desorption, J0

Natural trapsIon-induced traps

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Dislocations, Grain boundaries

Bubbles, Vacancies

200 400 600 8000,00

0,40

0,80 experiments

1022

D/m2

1023

D/m2

200 eV D+, RT -> W

Des

orpt

ion

flux

, 1019

D/m

2 s

Temperature, K

calculations

1021 1022 1x1023 1024 1x10251018

1019

1020

1021

200 eV, RT100%

Deu

teri

um r

etai

ned,

D/m

2

Incident fluence, D+/m2

Modelling of D retention in PCW

Diffusion model with two kinds of traps describes well experimental data.

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

200 400 600 8000,00

0,40

0,80 experiments

1022

D/m2

1023

D/m2

200 eV D+, RT -> W

Des

orpt

ion

flux

, 1019

D/m

2 s

Temperature, K

calculations

Modelling of D retention in PCW

W(x,t)=Wm(1 – exp(-(1-r)I0xt/Wm))

Rate of defect production = f (initial traps, ion flux, ion energy, temperature)

0 1000 2000 3000 4000 5000 600010191020102110221023102410251026102710281029

vacancies

dislocations

intrinsic traps

F=1024 D/m2200 eV D+ -> W

ion-induced traps

Tra

p co

ncen

trat

ion,

m-3

x, nm

Ion-induced traps distributes near the surface and natural traps distributes along whole W thickness

0.85 eV 1.45 eV

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Dislocations, Grain boundaries

Bubbles, Vacancies

200 400 600 8000,00

0,40

0,80 experiments

1022

D/m2

1023

D/m2

200 eV D+, RT -> W

Des

orpt

ion

flux

, 1019

D/m

2 s

Temperature, K

calculations

Modelling of D retention in PCW

W(x,t)=Wm(1 – exp(-(1-r)I0xt/Wm))

Rate of defect production = f (initial traps, ion flux, ion energy, temperature)

0 1000 2000 3000 4000 5000 600010191020102110221023102410251026102710281029

vacancies

dislocations

intrinsic traps

F=1024 D/m2200 eV D+ -> W

ion-induced traps

Tra

p co

ncen

trat

ion,

m-3

x, nm

Ion-induced traps distributes near the surface and natural traps distributes along whole W thickness

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Modelling of D retention in PCW

W(x,t)=Wm(1 – exp(-(1-r)I0xt/Wm))

Rate of defect production = f (initial traps, ion flux, ion energy, temperature)

0 1000 2000 3000 4000 5000 600010191020102110221023102410251026102710281029

vacancies

dislocations

intrinsic traps

F=1024 D/m2200 eV D+ -> W

ion-induced traps

Tra

p co

ncen

trat

ion,

m-3

x, nm

Ion-induced traps distributes near the surface and natural traps distributes along whole W thickness

200 400 600 800 10000,00

0,20

0,40

0,60

0,80

1,00

200 300 400 500 600 700 800 900 1000200 300 400 500 600 700 800 900 1000

200 eV D+ -> W

F=1022 D/m2, RT virgin W re-used W

Des

orpt

ion

flux

, 1019

D/m

2 s

Temperature, K

=10-2

=10-3

Rate of defect production is higher for pre-implantation with intermediate TDS

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Modelling of D retention in PCW

0 1000 2000 3000 4000 5000 600010191020102110221023102410251026102710281029

vacancies

dislocations

intrinsic traps

F=1024 D/m2200 eV D+ -> W

ion-induced traps

Tra

p co

ncen

trat

ion,

m-3

x, nm0 1000 2000 3000 4000 5000 6000

1023

1x1024

1025

1026

1027

200 eV D+ -> PCW

F=1024 D/m2

T=393 K

T=323 K

exp, Alimov [19] calculations

D c

once

ntra

tion,

D/m

3

x, nm

Ion-induced traps distributes near the surface and natural traps distributes along whole W thickness

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Which kinds of ion-induced defects of 1.45 eV can be produced by low energy ions? =>

- 200 eV cannot produce vacancies (Eth=860 eV)

- D self-aggregation in clusters due to stress field created by implanted deuterium

Modelling of D retention in PCW

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Why D agglomerates in clusters only near the implantation surface? =>

Because of stress field induced by ion implantation

Modelling of D retention in PCW

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

D agglomeration in clusters and bubble growth

Tension and stress=>Displacement of W atom=>Di-vacancy=>Bubble growth

D traps by vacancy Several D trap by vacancy

=> =>

Tension and stress=>Dislocation (loop punching?)

Conditions for bubble formation:1) Saturation in D concentration2) Saturation in vacancies

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Temperature effect

1021 1022 1x1023 1024 1x10251018

1019

1020

1021

W

200 eV, 380-470 K

200 eV, RT100%

Deu

teri

um r

etai

ned,

D/m

2

Incident fluence, D+/m2

An increase of the temperature results in a decrease of D retention for recrystallized ´virgin´ PCW

At 400 K D retention increases with fluence faster than at RT

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

An increase of the temperature results in a decrease of D retentionfor recrystallized ´virgin´ PCW

Model describes well temperature dependence.

300 400 500 600 700

1018

1019

1020

1021

500 eV D+

200 eV D+ -> WRet

aine

d de

uter

ium

, D/m

2

Irradiation temperature, K

exp. TDS [present work] calculations [present work] TDS [Haazs], SCW

F=1024D/m2

D retention decreases with temperature for ´virgin´ W

Temperature effect

1021 1022 1x1023 1024 1x10251018

1019

1020

1021

200 eV, 380-470 K

200 eV, RT100%

Deu

teri

um r

etai

ned,

D/m

2

Incident fluence, D+/m2

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

An increase of the temperature results in a decrease of D retentionfor recrystallized ´virgin´ PCW

Model describes well temperature dependence.

D retention decreases with temperature for ´virgin´ W.

Most of D are in the bulk.

Temperature effect

1021 1022 1x1023 1024 1x10251018

1019

1020

1021

200 eV, 380-470 K

200 eV, RT100%

Deu

teri

um r

etai

ned,

D/m

2

Incident fluence, D+/m2

300 400 500 600 700 800

1018

1019

1020

1021

1022

3000 eV D+

500 eV D+

200 eV D+ -> WRet

aine

d de

uter

ium

, D/m

2

Irradiation temperature, K

NRA up to 7 m [Alimov] exp. TDS [present work] calculations [present work] TDS [Haazs], SCW

F=1024D/m2

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Lower D retention for 3 keV than for 200 eV at high fluences

Implantation energy effect

1021 1022 1x1023 1024 1x10251018

1019

1020

1021

3 keV, 373-400 K

200 eV, RT100%

Deu

teri

um r

etai

ned,

D/m

2

Incident fluence, D+/m2

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Implantation energy effect

1021 1022 1x1023 1024 1x10251018

1019

1020

1021

D(x,t)

D=const

3 keV, 373-400 K

100%

Deu

teri

um r

etai

ned,

D/m

2

Incident fluence, D+/m2

Increase of the stress field =>increase of the diffusion coefficient

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Implantation energy effect

1021 1022 1x1023 1024 1x10251018

1019

1020

1021

D(x,t)

D=const

3 keV, 373-400 K

100%

Deu

teri

um r

etai

ned,

D/m

2

Incident fluence, D+/m20 500 1000 1500 2000

0

10

20

F=1023 D/m2

F=1022 D/m2

F=1024 D/m2

D(x,t) at T=400 K

Dif

fusi

on c

oeff

icie

nt, 1

0-11 m

2 /s

x, nm

)/)()1(exp()/1(1(),( 0 mmm utxIrDDDtxD Increase of the stress field =>increase of the diffusion coefficient

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Implantation energy effect

1021 1022 1x1023 1024 1x10251018

1019

1020

1021

D(x,t)

D=const

3 keV, 373-400 K

100%

Deu

teri

um r

etai

ned,

D/m

2

Incident fluence, D+/m2

Increase of the stress field =>increase of the diffusion coefficient

0 10000 20000 300001023

1024

1025

1026

1027

1028

3 keV, 393 K

F=1024 D/m2

200 eV, RT

D c

once

ntra

tion,

m-3

x, nm

Calculated depth profiles

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Ion-induced defects are produced during implantation by deuterium self-aggregation due to the stress field induced by the incident ion flux

• D retains in W in ion-induced defects and natural defects

• An increase of ion energy (or/and ion flux) results in an increase of the stress field in the implantation region. As a result the diffusion coefficient near the implantation region increases.

• Both no recrystallization and intermediate TDS (annealing up to 1200 K) increase the rate of defect production

Conclusions

The rate of ion-induced defect production depends on the energy of the incident ions, ion flux, sample temperature and initial trap concentration

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Discussion

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Implantation energy effect

1021 1022 1x1023 1024 1x10251018

1019

1020

1021

3 keV, 373-400 K

200 eV, RT100%

Deu

teri

um r

etai

ned,

D/m

2

Incident fluence, D+/m2

Increase of the stress field =>increase of the diffusion coefficient

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

An increase of the temperature results in a decrease of D retentionfor recrystallized ´virgin´ PCW

Model describes well temperature dependence.

D retention decreases with temperature for ´virgin´ W.

D retention has a maximum for re-used W.

Implantation history effect

1021 1022 1x1023 1024 1x10251018

1019

1020

1021 re-used, 420 K

200 eV, 380-470 K

200 eV, RT100%

Deu

teri

um r

etai

ned,

D/m

2

Incident fluence, D+/m2

300 400 500 6000

2

4

6

8

200 eV D+

500 eV D+

500 eV D+

re-used W

´virgin´ W

F=1023 D/m2Ret

enti

on, 1

020 D

/m2

Irradiation temperature, K

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

D retention in the second peak increases with temperature for re-used W

300 400 500 600 700 800 9000,0

0,4

0,8

300 400 500 600 700 800 900

200 eV ->W

RT 473 K

electropolished,heated at 1573 K 3 hours

Des

orpt

ion

rate

, 1019

D/m

2 s

Temperature, K300 400 500 600 700 800 900

0,0

1,0

2,0

3,0

300 400 500 600 700 800 900

200 eV -> W as received F=1023 D/m2

RT 473 K

Des

orpt

ion

rate

, 1019

D/m

2 s

Temperature, K

Recrystallized W As-received W after multiple implantation

Implantation history effect

D retention in the second peak decreases with temperature for recrystallized W

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

An increase of the temperature results in a decrease of D retentionfor recrystallized ´virgin´ PCW

Model describes well temperature dependence.

Intermediate TDS increases the amount of initial high-temperature traps

Calculations using the higher rate of defect production are in a good agreement with experiments.

300 400 500 600 700 800 9000,0

0,4

0,8

300 400 500 600 700 800 900

200 eV ->W

RT 473 K

electropolished,heated at 1573 K 3 hours

Des

orpt

ion

rate

, 1019

D/m

2 s

Temperature, K300 400 500 600 700 800 900

0,0

1,0

2,0

3,0

300 400 500 600 700 800 900

200 eV -> W as received F=1023 D/m2

RT 473 K

Des

orpt

ion

rate

, 1019

D/m

2 s

Temperature, K

Implantation history effect

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

The increase of amount of initial traps increases the rate of deuterium cluster formation

Both intermediate TDS and no recrystallization increase the amount of initial traps

Modelling of D retention in PCW

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

W: 3 keV D+, RT

400 600 800 10000.00

0.42

0.83

1.25

1.67

2.08

2.50

annealed W

3 keV -> W

1024D/m2, 373 K

5.641023(D/m)2

373 K, unannealed W

Des

orpt

ion

flux

, 1019

D/m

2 s

Temperature, K

Deuterium retention in W

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Conditions for cluster formation in W

- Initial amount of defects

- Low solubility and diffusivity

- Low porosity

Acceleration of rate of cluster growth- High ion flux or/and ion energy

Conditions for cluster formation and bubble growth

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Implantation energy effect

1021 1022 1x1023 1024 1x10251018

1019

1020

1021

3 keV, 373-400 K

200 eV, RT100%

Deu

teri

um r

etai

ned,

D/m

2

Incident fluence, D+/m2

Increase of the stress field =>increase of the diffusion coefficient

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Experiments

off-normal events & ELM´s• D retention in damage W n-irradiation

He-irradiation

• D retention at high implantation temperature (T=800 K - 1000 K) at different ion fluxes

R & D

Modelling

• Competition of erosion/diffusion

• Soret effect

• Maxwellian energy distribution

• Diffusion in tension field

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Is D retention in W a problem for ITER ?

• Competition of erosion/diffusion

• Deposition of impurities, codeposition ?

• Damages in the near surface region by off-normal events

• Diffusion in tension field

W as a divertor

Tplasma: 1-20 eVParticle flux : 1022 – 1024 /m2/sTw : ~1000 K

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Is D retention in W a problem for ITER ?

• Competition of erosion/diffusion

• Deposition of impurities, codeposition ?

• Damaged by off-normal events near surface region

• Diffusion in tension field

• Temperature of W can be important

• Diffusion in tension field

W as a divertor

Tplasma: 1-20 eVParticle flux : 1022 – 1024 /m2/sTw : ~1000 K

W as a FW

Tplasma: 1-5 eV ?

Particle flux : ~ 1020 /m2/sTw : ~500 K ?

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Is D retention in W a problem for ITER ?

• Competition of erosion/diffusion

• Deposition of impurities, codeposition ?

• Damaged by off-normal events near surface region

• Diffusion in tension field

• Temperature of W can be important

• Diffusion in tension field

W as a divertor

Tplasma: 1-20 eVParticle flux : 1022 – 1024 /m2/sTw : ~1000 K

W as a FW

Tplasma: 1-5 eV ?

Particle flux : ~ 1020 /m2/sTw : ~500 K ?

Bulk retention can be of concern

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Is D retention in W a problem for ITER ?

• Competition of erosion/diffusion

• Deposition of impurities, codeposition ?

• Damaged by off-normal events near surface region

• Diffusion in tension field

• Temperature of W can be important

• Diffusion in tension field

W as a divertor

Tplasma: 1-20 eVParticle flux : 1022 – 1024 /m2/sTw : ~1000 K

W as a FW

Tplasma: 1-5 eV ?

Particle flux : ~ 1020 /m2/sTw : ~500 K ?

Bulk retention can be of concern

n-irradiation – strong trapping in vacancies distributed over all W thickness

© Olga Ogorodnikova, 9th ITPA, Garching, May 7-9, 2007

Talk outline• Experimental data

• Modelling of D retention in PCW

– Temperature effect

– Implantation history effect

– Ion energy effect

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