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Form #: CSI-D-686 Document 004

Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • sales@micross.com • www.micross.com

October 21, 2014 • Revision 1.1

MYXFC64GJDDN

Features• Tin-leadballmetallurgy• MultiMediaCard(MMC)controllerand64GB

NANDFlash• VCC:2.7–3.6V• VCCQ(dualvoltage):1.65–1.95V;2.7–3.6V• Typicalcurrentconsumption

� Standbycurrent:160μA

� Activecurrent(RMS):80mA

MMC - Specific Features• JEDEC/MMCstandardversion4.41-compliant(JEDEC

StandardNo.84-A441)-SPImodenotsupported(seewww.jedec.org/sites/default/files/docs/JESD84-A441.pdf)

� Advanced11-signalinterface� x1,x4,andx8I/Os,selectablebyhost� MMCmodeoperation� Commandclasses:class0(basic);class2(blockread);class4(blockwrite);class5(erase);class6(writeprotection);class7(lockcard)

� MMCplus™andMMCmobile™protocols� Temporarywriteprotection� 52MHzclockspeed(MAX)� Bootoperation(high-speedboot)� Sleepmode� Replay-protectedmemoryblock(RPMB)� Secureeraseandtrim� Hardwareresetsignal� Multiplepartitionswithenhancedattribute� Permanentandpower-onwriteprotection� Doubledatarate(DDR)function� High-priorityinterrupt(HPI)� Enhancedreliablewrite� Configurablereliabilitysettings� Backgroundoperation� Fullyenhancedconfigurable

� Backward-compatiblewithpreviousMMCmodes

• ECCandblockmanagementimplemented

Options Code

• Package(Sn63Pb37solder)

� 169-ballLFBGA BG(14mmx18mmx1.4mm)

• OperatingTemperature

� Industrial(-40°C≤TC≤+85°C) IT

MMC Controller and 64GB NAND FlashAdvanced information. Subject to change without notice.

Table 1: MLC Partition Performance

Condition MYXFC64GJDDN Units

Sequential write 20 MB/s

Sequential read 44 MB/s

Rando write 90 IOPs

Random read 1100 IOPs

Note:Businx8I/Omode.Sequentialaccessof1MBchunk;randomaccessof4KBchunk.Additionalperformancedata,suchaspowerconsumptionortimingfordifferentdevicemodes,willbeprovidedinaseparatedocumentuponcustomerrequest.

MicronPart.No.MTFC64GJDDN-4M

Form #: CSI-D-686 Document 004

Micross US (Americas) • 407.298.7100Micross UK (EMEA & ROW) • +44 (0) 1603 788967

sales@micross.comwww.micross.com

MYXFC64GJDDN • MMC controller and 64GB NAND FlashAdvanced information. Subject to change without notice.

October 21, 2014 • Revision 1.1

Figure 1: 169-Ball FBGA (Top View, Ball Down)

Figure 2: 169-B all LFBGA 14.0mm x 18.00mm x 1.4mm (Package Code: DN)

Notes: 1. All dimensions are in millimeters.2. Solder ball material: Sn63/Pb373. Micron – MTFC64GJDDN-4M

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