mechanical specifications, pad layout, and mounting

378091416

MECHANICAL SPECIFICATIONS

Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed

Multilayer Organic (MLO®) Filters

Footprint A

Mechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

379091416

SUGGESTED PCB LAYOUT

Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Multilayer Organic (MLO®) Filters

Footprint A

Mechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

380091416

PAD CONNECTIONS

Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]

3

3 3 3 3

33333

3 3 3 3

22

Multilayer Organic (MLO®) Filters

Footprint A

Mechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

381091416

MECHANICAL SPECIFICATIONS

Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed

Multilayer Organic (MLO®) Filters

Footprint B

Mechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

382

SUGGESTED PCB LAYOUT

Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Multilayer Organic (MLO®) Filters

Footprint B

Mechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

383

PAD CONNECTIONS

Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]

Multilayer Organic (MLO®) Filters

Footprint B

Mechanical Specifications, Pad Layout, and Mounting Recommendations

3

3 3 3 33

3 33333

3 3 3 3 3

22

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

384

MECHANICAL SPECIFICATIONS

Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed

Multilayer Organic (MLO®) Filters

Footprint C

Mechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

385

SUGGESTED PCB LAYOUT

Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Footprint C

Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

386

PAD CONNECTIONS

Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]

Footprint C

3

3

3

3

31 2

3

3

3

3

3

3

3

3

3

3

3

3

3

3

3

3

Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

387

MECHANICAL SPECIFICATIONS

Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed

Footprint D

Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

388

SUGGESTED PCB LAYOUT

Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Footprint D

Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

389

PAD CONNECTIONS

Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]

Footprint D

3

3

3 3 3 3 3 3 3

3 3 3 3 3 3 3

3 3 3 3 3 3 3

1 2

Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

390

MECHANICAL SPECIFICATIONS

Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed

Footprint E

Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

391

SUGGESTED PCB LAYOUT

Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Footprint E

Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

392

PAD CONNECTIONS

Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]

Footprint E

3

3 3 3 3 3 3 3 3 3 3

3 3 3 3 3 3 3 3 3

3 3 3 3 3 3 3 31 2

Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

393

MECHANICAL SPECIFICATIONS

Input / output pads shown in Blue. Grounding pads shown in black.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed

Footprint E1

Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

394

SUGGESTED PCB LAYOUT

Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Footprint E1

Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

395

PAD CONNECTIONS

Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in black.Dimensions in inches [mm]

Footprint E1

3

3 3 3 3 3 3 3 3 3 3

3 3 3 3 3 3 3 3 3

3 3 3 3 3 3 3 31 2

Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

396

MECHANICAL SPECIFICATIONS

Input / output pads shown in Blue. Grounding pads shown in black.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed

Footprint E2

Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

397

SUGGESTED PCB LAYOUT

Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Footprint E2

Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

398

PAD CONNECTIONS

Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in Black.Dimensions in inches [mm]

Footprint E2

3

3 3 3 3 3 3 3 3 3 3

3 3 3 3 3 3 3 3 3

3 3 3 3 3 3 3 31 2

Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

399

MECHANICAL SPECIFICATIONS

Input / output pads shown in Blue. Grounding pads shown in gray.Dimensions in inches [mm]Tolerances are +/-0.002 [0.05], unless noted.Dimensions nominal unless otherwise noted.All contact areas are gold plated, including I/O pads.100 mil cavity height above device. Please contact factory if alternate clearance is needed

Footprint F

Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

400

SUGGESTED PCB LAYOUT

Dimensions in inches [mm].Dimensions nominal unless otherwise noted.Line width for I/O pads should be designed to match 50-ohm characteristic impedance, depending on PCB material and thickness. Grounding for these lines not shown. Please see DXF file in part data package.All contact areas are gold plated, including I/O pads.Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Footprint F

Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

401

PAD CONNECTIONS

Pins 1 & 2 are input / output. Shown in Blue.Pin 3 - grounding pads. Shown in gray.Dimensions in inches [mm]

Footprint F

3 3 3 3 3 3 3 3 3 3

3 3 3 3 3 3 3 3 3

3 33 3 3 3 3 3 3

3

1 2

Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

402

MOUNTING RECOMMENDATIONS

AUTOMATED SMT ASSEMBLYThe following section describes the guidelines for automated SMT assembly of MLO® RF devices which are typically Land Grid Array (LGA) packages or side termination SMT pacages.Control of solder and solder paste volume is critical for surface mount assembly of MLO® RF devices onto the PCB.

Stencil thickness and aperture openings should be adjusted according to the optimal solder volume. The following are general recommendations for SMT mounting of MLO® devices onto the PCB.

SMT REFLOW PROFILECommon IR or convection reflow SMT processes shall be used for the assembly. Standard SMT reflow profiles, for eutectic and Pb free solders, can be used to surface mount the MLO® devices onto the PCB. In all cases, a temperature gradient of 3°C/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. Additional soak time and slower preheating time may be required

to improve the out-gassing of solder paste. In addition, the reflow profile depends on the PCB density and the type of solder paste used. Standard no-clean solder paste is generally recommended. If another type of flux is used, complete removal of flux residual may be necessary. Example of a typical lead free reflow profile is shown below.

Critical ZoneTL to Tp

Ramp-down

Ramp-up

Ts max

25t 25ºC to Peak

Ts min

tsPreheat

Tptp

TL tL

Time

Temperature

Figure A. Typical Lead Free Profile and Parameters

Profile Parameter Pb free, Convection, IR/ConvectionRamp-up rate (Tsmax to Tp 3ºC/second max.

Preheat temperature (Ts min to Ts max) 150ºC to 200ºCPreheat time (ts) 60 – 180 seconds

Time above TL, 217ºC (tL) 60 – 120 secondsPeak temperature (Tp) 260°C

Time within 5ºC of peak temperature (tp) 10 – 20 secondsRamp-down rate 4ºC/second max.

Time 25ºC to peak temperature 6 minutes max.

Multilayer Organic (MLO®) FiltersMechanical Specifications, Pad Layout, and Mounting Recommendations

– rf microwave products –

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.