lecture 15 - university of texas at...

ChE 384T / 323

Lecture 15Chemical Engineering for Micro/Nano Fabrication

ChE 384T / 323 W. Hinsberg, IBM

Polymer Permability

ChE 384T / 323 W.D. Hinsberg, et.al. IBM, Almaden

ChE 384T / 323

ChE 384T / 323

ChE 384T / 323

ChE 384T / 323

ChE 384T / 323 Hiroshi Ito, IBM

Thermogravimetric analysis

ChE 384T / 323

ChE 384T / 323

Effects of filtered air (top) and 10ppb NMP (bottom) on positive images printed in the meta- (left) and para- (right) P(HOST-co-BOCST) resists.

ChE 384T / 323

ChE 384T / 323

The “Family”

ChE 384T / 323

ESCAP

• Acrylic reduces solubility of NMP

• Acrylic ester more thermally stable than the t-butyl carbonate

• Enables post apply bake Temp > Tg

• Bake > Tg decreases permeance

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Hiroshi Ito

ChE 384T / 323

IBM Mainframe Circuit Board

one of 20 layers printed circuit board that contained nearly a

mile of wire interconnections used in IBM Mainframes.

ChE 384T / 323

SU-8 Negative Resist

ChE 384T / 323

IBM CGR Negative Resist

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PAG

ChE 384T / 323

ChE 384T / 323

ChE 384T / 323

Entergris, Inc

Air purification system