laird technologies mmp

Laird Technologies MMP

April 2008

The Laird Group PLC Overview

• Founded in mid 1800’s

• Headquartered in London, UK

• Quoted on the London Stock Exchange (symbol LARD)

and a member of the FTSE 250 index

• Employer of 10,000+ people in North America, Europe and Asia

• 2006 revenue of approximately $1200 million

Laird Technologies

• Founded in mid 1990’s• Headquartered in St. Louis, Missouri, USA• Annual revenue almost $1B dollars• Over 10,000 employees globally in

engineering, manufacturing and sales• Industry Business Units:

– Handset

– Automotive

– Datacom

– I&I– Consumer

Worldwide Locations

50 sites around the world 10,000 employees

Not all sites are represented in this graphic. Some sites are close together

1996 1998 2000 20042002 2006

Magnes

Family Tree

The Laird Technologies Mission

“To be the leader in design and supply

of customized performance-critical

products for wireless and other

advanced electronics applications.”

Revenue Distribution

0%

25%

50%

75%

100%

2002 2003 2004 2005 2006

Asia

Europe

Americas

0%

25%

50%

75%

100%

2002 2003 2004 2005 2006

Asia

Europe

Americas

Revenue by Origin

Revenue by Destination

Handsets IT

Telecom Automotive/transport

Industrial Military/Aero/Security

Consumer Medical

Other

Revenue Splits - 2007

global solutions: local support

• Technology leadership in all products offered

• Direct support for global and large OEM programs

• Broad market coverage

• Broad product line within business units

• Local manufacturing and engineering

• Low cost producer of high volume products

• Add complementary product lines

Strategy

Core Competencies

• Bias for action – speed of response

• Global footprint

• Key customer access and relationships

• Broad product line to same customers

• Ability to bundle technology – “convergence products”

• RF design

• Identifying, buying, integrating niche segments of high margin, customized electronics components and systems

Serving a Diverse Range of Leading Global Companies

Topics Today

• MMP (Mobile Metal Products)

• Handset Products

• Technologies

• Manufacturing Sites

• Program Support Structure

MMP

• Mobile Metal Products– Board Level Shielding– Combo Products– Decorative / Visual Metals– MAP (Hinges)

Technical CharacteristicsBoard Level Shielding

Surface Mount Shield Options

• 2 Piece pre-assembled frame and cover (Tin Plate CRS not available as cover will

reflow to frame)

• 2 Piece system surface mount frame with manually installed cover

• Multi-Compartmental Shields replace multiple single shields

• 1 Piece Surface Mount Shields

– Formed and Drawn technologies

• 1 Piece Shield w/ Tear-Away Feature (EZ Peel / Pop-Top)

• Surface Mount Clips with BLS and MIP shield (EcE and TPE types)

Materials used for BLS

• Tin Plated Cold Rolled Steel (CRS) – Cheapest option

• Nickel Silver

• Stainless Steel Tin Plated

• Tin Plate Phos bronze

• ALL materials used are RoHs compliant

Cellular Handsets

• Board Interface contacts• Shielding of various

functions

EMI Product Portfolio• Surface Mount Contact (SMC) – Standard or Custom Designs

Standard Contacts

Packaged in Tape and Reel for Automatic

Placement on SMT Lines

FEA of Design

Custom Contacts Packaged in Tape and

Reel for Automatic Placement on SMT Lines

Custom Contacts

• Match system productivity to program size

• Implement Technologies that maximize yields

• In-line and In-Die secondary operations

• Technologies to reduce material usages

• Real-time Quality Assurance and Quality Control

• Match tool life to program size (15m to 100m)

BLS Manufacturing Technology Objectives-Deliver High Quality Parts at the Lowest Cost

System Approach

•Feeder•Press•Washer•Labeling•Inspection•Packaging

Other automated operations•Laser welding•Tapping•Pin insertion•Assembly

In-die and In-Line Assembly

In-die Assy.• 100-300 pieces/min.•High die Cost•Carbide technology•8-12 week tool lead-time•>98% yield•>50m die life

In-line Assy.• 100-180 pieces/min.•Low die cost•Modular•4 week tool lead-time•>96% yield•>15m die life

100% Automated Co-planarity Inspection

PEG AOI

Combo Products

• LT has the internal ability to produce complex metal stampings and insert molded parts.

• Molding can be TPE or EcE

• Combo (MCS) Drawn Frames with Molding [TPE or Conductive Silicone]

Simulation of Draw Forming

Drawn Part

Molded Part

Location CapabilitiesLocation Primary activities/productsSchaumburg, IL BLS Combo Deco Development, Prototype and Project Management

Liberec, Czech Republic BLS Manufacturing and all other LT products

Tianjin, China Board level shielding and Combo (Overmold) products

Shanghai, China Board level shielding and Contacts Manufacturing

San Jose, CA Business Development , BLS and other EMI

Stockholm, Sweden Business Development for EU, Prototype

Shenzhen, China Business Development for Decorative Metals, BLS and metal stampings

Chennai, India BLS Production only

Reynosa, Mexico BLS Production* 2009 Mass Production

San Jose, CA (Business Development)

Chicago, IL. (Business Development) Stockholm, Sweden

(Business Development)Liberec, Czech Republic (Manufacturing)

Tianjin, China (Manufacturing BLS and Combo)

Shanghai, China (Business Development, Manufacturing)

Chennai, India (BLS Manufacturing)

Shenzhen, China (Business Development, Manufacturing Decorative Metals)

Reynosa, Mexico

DECORATIVE METALS

What is a decorative metal?

• Exterior metals to a customer application.

• Typically has a class 1 finish.

• May be plated, colored, etch, etc.

• Provides ASTHETIC appeal to end customer product

• Can also be an enclosure for the application

Areas of Technology Development

Metal Bases• SS stamping/drawing• Al stamping/drawing• Electroforming• Ti stamping/drawing• Die casting• Extrusions

Decorative Finishing Technologies• Laser decoration• Electro-polish• Anodizing• Diamond cutting• Plasma Vapor Deposition of metals

and finishes• Electro-deposition• Chrome, Gold, other platings• Painting• Ni/Cr free coatings

ALL Possible either internal or through supply

Core Tech.Stainless Steel

AluminumTitanium

Mg Die-cast

Laser decoration

Electro deposition

PVDMAM

Polishing

Anodizing

Electro-polish

KeyLT- CurrentLT - Vendor LT- Planned 2008

Painting

Core Decoration Tech.

Mesh formingDiamond cutting

Hairline brush

Simple Decoration

Gold plating

Chrome plating

Photo Etch

Silver plating

Laser welding

Teflon coating

Visual Metals

Sand Blast

PVD

Painting AnodizingPainting

Visual Metal & Hinge Market Roadmap1H08

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New Clean Room Layout for Decorative Metals (LT- Shenzhen)

Pain

ting

Line 1

Process: Al 6061 , stamping, polishing, anodizing, bright surface cutting.

Process: SUS304 BA, stamping, electro polishing, selective Hairline.

Process: SUS304 BA, stamping, polishing, Hairline, PVD, Laser marking.

Process: SUS304 BA, stamping, electro polishing, selective Hairline.

Process: SUS304 BA, stamping, 3 coatings, soft touch.

Decorative Metals

• Laser Coloring on Stainless Steel

Decorative Metals

• Complex Forming

• Electro Polishing

Additional “colors”

Process: Sus304 BA, stamping, polishing, PVD (Black, Silver, golden)

Decorative Metals

• LCD Flip Retainer• Part is:

– Stamped from stainless steel– Electro polished– Selectively colored electro

coated (selectivity allows for surface conductivity of grounding finger).

back side

Mg die casting + Passivation + Cu plating + Powder coating

Mg die casting + Passivation + Cu plating + bright Cr plating + PVD

Mg die casting + Passivation + Cu plating + dull Cr plating + PVD

Speaker mesh

Wire mesh plus Chrome plating

Photo Etching, secondary forming, electro polishing

Speaker Details

Speaker mesh

Wire mesh plus Chrome plating

SIM Tray

Stamping + ED coating + laser etching

Camera Bezel

Process: SUS316L,stamping, Photo Etching, stamping, electro polishing, Etch.

Display Bezel

Process: Sus304 BA, stamping, polishing, PVD (Black), Laser.

MAP (Hinges)

MAP

• Mechanical Actuated Products– Hinges provides handheld devices the ability to

fold, rotate or slide to allow access to screens or keypads. These capabilities are key aspects to allow these devices to become smaller now and in the future

• MAP comes from 2007 Acquisition of M2Sys, a Korean company.

Locations

R&D Hinges

R&D

Questions