iw modul mini wave soldering - eutect gmbh · mini wave soldering selective soldering system iw...
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O X I D e - a N D P U L S e - F R e e F O R O P t I m U m Q U a L I t y
c O m P e t e N c e a c R O S S t h e S t a N D a R D
Mini wave solderingSeLectIVe SOLDeRINg SyStem
IwmODUL
n Selective shielding gas soldering process
n Reproducible solder quality
n Spatter free soldering
n constant, laminar solder flow
n Specific solder nozzles
n Solder flow circular/one-sided
n One/two controllable solder waves
n Solder wave height controlling
n Pulse-free induction solder pump
n automatic solder refeeding
n wear-restistant coating
n Low maintenance
I N N O V a t I O N a N D m O D U L a R c O m b I N a t I O N S a F e g U a R D P R O c e S S e S a N D Q U a L I t y
I N N O V a t I O N a N D m O D U L a R c O m b I N a t I O N S a F e g U a R D P R O c e S S e S a N D Q U a L I t y
n benefitsthe selective soldering wave with its shielding gas atmosphere guarantees a soldering process free of oxides and residues. thanks to the continuously pumped solder wave, the heat transfer from the molten solder becomes homogeneous, transmit-ted continously to the solder point geometry. the flowing wave of solder cleans surplus resdues of flux, oxides and dirt from the soldering site.
n modularitythe modular solder tank sizes, along with the electromagnetic and pulse- free solder pumping system as well as the quick-change solder nozzles forms the basic process module. Redundant temperature control, the constant sol-der bath leven, optional solder wave height adjustment and continuous refeeding of solder wire guarantee maximum system autonomy.
n Performancethe capillary fill level solder saturation physically distinguishes the solder point in a self-adjusting manner. the ideal solder geometry is reflected reliably in pad/pin form, pin/hole posi-tion and thermal mass distributions in the Pcb layout. Solder through-routes, meniscuses and intermetallic phase characteristics round off the overall performance in a reproducible manner.
mini wave solderingSeLectIVe SOLDeRINg SyStemS
IwmODUL
FUNctIONaL PRINcIPLe
n One-sided solder exit
n circular solder exitn Nozzle principles
Spot nozzle
Solder area
Ring nozzle Linear nozzle matrix nozzle
eUtect® gmbh · Filsenbergstraße 10 · 72144 Dusslingen · germany
telefon +49 (0) 70 72-9 28 90-0 · Fax +49 (0) 70 72-9 28 90-92 · www.eutect.de · info@eutect.de
t e c h N I c a L D a t a
tyPe Iw1 tyPe Iw1-2
All electronic solders permitted
Solder wire pull-in 1 to 6 mmwire reel 1 to 20 kgShielding gas consumption 800 – 3000 l/hShielding gas pressure 1 – 3 bar
Nitrogen
Forming gas
Nitrogen with formic acid
Control platform
embedded-Pc
twincat Soft-SPS
ethercat, fieldbus for measuring data
acquisition and cycle control
Interfaces
Fieldbus ethercat (optional caNopen and Profibus Db)
Digital I/Os
ethernet
USb
Process data acquisition
Solder bath temperature rdundant
Solder bath height
Solder wave height
Solder refeed
Shielding gas
Solder coil colour
Display
touch 11“ bis 19“/remote
Operating systemmS win XP embedded
System dimension
model Iw1 (simple solder pump)Length 510 mmwidth 260 mmheight (excluding nozzle) 170 mm
model Iw1-2 (double solder pump) Length 510 mmwidth 365 mm
height (excluding nozzle) 170 mm
Elektromagnetic induction solder pump
Pump power P= 400 w or P= 800 wmodel Iw1 One controllable solder pump model Iw1-2 two controllable solder pumps
Solder nozzle fitting location
model Iw1 (depth x width) 90 x 160 mmmodel Iw1-2 (depth x width) 90 x 260 mm
System weight
model Iw1 approx. 45 kgmodel Iw1-2 approx. 65 kgmodel Iw1 solder tank approx. 2,5 l/20 kg model Iw1-2 solder tank approx. 5,0 l/40 kg
Heat output
heat-up time 30 to 45 min.Solder temperature adjustment up to 400 °cSolder temperature adjustment max. up to 550 °c (Option)Solder bath height measurement mIN/maX levelSolder wave height optional solderadjustment automationSpezific solder nozzles Quick-change systemalloy wear ceramic coating
IwmODUL
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