itrs 2.0 mart graef, paolo gargini -...
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ITRS 2.0 Mart Graef, Paolo Gargini
2013 ITRS
2012 ITRS
Update
International Technology Roadmap for Semiconductors (ITRS) 1998 - now
2011 ITRS
2010 ITRS
Update
2009 ITRS
http://www.itrs.net Japan
Korea
Europe
Taiwan
USA
2008 ITRS
Update
2007 ITRS
2006 ITRS
Update
2005 ITRS
2004 ITRS
Update
2003 ITRS
2002 ITRS
Update
2001 ITRS
2000 ITRS
Update
1999 ITRS
1998 ITRS
Update
1997 NTRS
1994 NTRS
1992 NTRS
1991 MicroTech
2000 Report
USA
ITRS Objective
• Provide guidance to the semiconductor industry by predicting technology trends in the industry, spanning 15 years (near-term 1-6 yrs; long-term 7-15 yrs)
ITRS Technology Working Groups
1. System Drivers
2. Design
3. Test & Test Equipment
4. Process Integration, Devices & Structures
5. RF and Analog/Mixed Signal
6. Emerging Research Devices
7. Emerging Research Materials
8. Front End Processes
9. Lithography
10.Interconnect
11.Factory Integration
12.Assembly & Packaging
13.Environment, Safety & Health
14.Yield Enhancement
15.Metrology
16.Modeling & Simulation
Impact of the ITRS
• Provides a benchmark for the semiconductor industry
• Identifies technology challenges
• Generates industrial and academic research agenda
• Is used by policy-makers
Reaching dimension/complexity limits
Complexity in # of devices
1 µm
10 mm
100 µm
10 nm
1 Å
1958 1947
1 1000 1M 1G 1T
2020 Beyond CMOS?
Source: STMicroelectronics
2014
Validated concept
Quantum computing Spintronics Molecular electronics Nanotubes Graphene
“More Moore” & “More than Moore”
Source: ITRS (2011)
Smart microsystems: More Moore + More than Moore
More Moore
More than Moore
Data Processing
& Storage
Power
Radio
Sensor &
Actuator
Heterogeneous Integration
Technology diversification in the ITRS
Introduction
More-than-Moore
concept
Towards
ITRS 2.0
MEMS Working
Group started
Cooperation
with iNEMI
started
MtM Workshops in
2011, 2012, 2013,
2014
Device Technologies
& Architectures
Generic
Functions
System
View
Driving
Applications
Lead
markets
Society Needs
Automotive Lighting Healthcare Energy
DA1
SV1
GF2 Communication Energy
harvesting Sensing Illumination
DTAn DTA1 DTA4 DTA2 DTA1 MEMS
DA2
SV2
DA3
SV3
Smart
catheter
SV4
Device Technologies
& Architectures
Generic
Functions
System
View
Driving
Applications
Lead
markets Automotive Lighting Healthcare Energy
DA1
SV1
GF2 Communication Energy
harvesting Sensing Illumination
DTAn DTA1 DTA4 DTA2 DTA1 MEMS
DA2
SV2
DA3
SV3
Smart
catheter
SV4
Computing
Data
center
SV0
Data
processing
Data
storage
Moore’s Law Extended
ITRS 2.0 Focus Topics
• System Integration—studies and recommends system architectures to meet the needs of the industry. It prescribes ways of assembling heterogeneous building blocks into coherent systems.
• Outside System Connectivity—refers to physical and wireless technologies that connect different parts of systems.
• Heterogeneous Integration—refers to the integration of separately manufactured technologies that in the aggregate provide enhanced functionality.
• Heterogeneous Components—describes devices that do not necessarily scale according to “Moore's Law,” and provide additional functionalities, such as power generation and management, or sensing and actuating.
• Beyond CMOS—describes devices, focused on new physical states, which provide functional scaling substantially beyond CMOS, such as spin-based devices, ferromagnetic logic, and atomic switch.
• More Moore—refers to the continued shrinking of horizontal and vertical physical feature sizes to reduce cost and improve performance.
• Manufacturing—consists of tools and processes necessary to produce items at affordable cost in high volume.
More than Moore
Assessment of Driving Forces
Heterogeneous
Integration
Heterogeneous
Components
System
Integration
Outside System
Connectivity
More
Moore
Beyond
CMOS
Factory
Integration /
Manufacturing
Applications: Internet of Things
Mobile
communication
Information
Smart
Automotive Big Data
Green Energy
Technology
Medical
Healthcare
ITRS 2.0 Information Flow
1. System Integration identifies global ecosystem drivers and translates them into trends and indicators.
2. Heterogeneous Integration, Heterogeneous Components and Outside System Connectivity identify specific trends, drivers, challenges and roadblocks related to their fields.
3. System Integration provides inputs to all the Focus Teams
4. More than Moore and More Moore provide inputs to Factory Integration
ITRS Realignment: Focus Teams
Focus Topics Focus Teams
System Integration System Drivers X
Outside System Connectivity ERM, RF/AMS X X
Heterogeneous Integration Assembly & Packaging X X X
Heterogeneous Components MEMS X X
Beyond CMOS ERD X X X
More Moore PIDS X X X X X X
Manufacturing Factory Integration X X X
Fro
nt
End
Pro
cess
ing
Expertise Teams
Fact
ory
inte
grat
ion
Mo
del
ling
& s
imu
lati
on
Ass
emb
ly &
Pac
kagi
ng
MEM
S
Lith
ogr
aph
y
Des
ign
Test
Emer
gin
g R
esea
rch
Mat
eria
ls
Emer
gin
g R
esea
rch
Dev
ices
RF/
An
alo
g &
Mix
ed S
ign
al
ESH
Inte
rco
nn
ect
Met
rolo
gy
Pro
cess
Inte
grat
ion
, Dev
ices
& S
tru
ctu
res
Yiel
d
Beyond CMOS Efforts Based on Future Market Drivers
Computing/ Communication
Today’s ITRS Focus
Internet-of-Things
- Sensor integrated with CMOS
- Energy-harvesting devices - Low power devices
(e.g. TFET, NEMS) - Embedded NVM (low
power, low cost) - RF and wireless - Security
Cloud/Big Data
- Optical interconnects - Storage Class Memory - Efficient DC-DC converters - Data driven computing - Security
Emerging Research Devices’ areas of focus: Today:
- Emerging Logic - Emerging Memory
In the future, add: - Optical components - Sensor integration - Energy-harvesting - Circuit blocks and architectures for IoT, cloud - DC-DC converters
ITRS 2.0 Status
• The 7 Focus ITWGs have been formed
• Few additional members are under consideration
• Several meetings were held to date
• Draft outlines of the 7 programs have been generated
• First face to face meeting was held on July 7th, 2014
• Review (3) cycles identified
• 2014 ITRS white paper in preparation
More than Moore
Assessment of Driving Forces
Heterogeneous
Integration
Heterogeneous
Components
System
Integration
Outside System
Connectivity
More
Moore
Beyond
CMOS
Factory
Integration /
Manufacturing
Applications: Internet of Things
Mobile
communication
Information
Smart
Automotive Big Data
Green Energy
Technology
Medical
Healthcare
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