introduction to princo pkg plateform
Post on 28-May-2015
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DESCRIPTION
FO-WLP, eWLP, Coreless
TRANSCRIPT
Reliability
Moisture sensitivity level 1(MSL1) Pass Ball pull after multi-reflow Pass Thermal cycle test-IPC-TC3 Pass High temperature/humidity test Pass Biased HTMT Pass
MOS device
Metal layerCu pillar/Si interposer/Si-Si stack
Wire bond/Bump/Princo uBump
OrganicSubstrate/Assembly
PCB/FPC/Assembly
TSV
MOS device
Metal layerWire bond/Bump/Princo uBump
OrganicSubstrate/Assembly
PCB/FPC/Assembly
Front-end/Foundry Back-end/OSAT PCB/EMS/Module
Front-end/Foundry
Middle-end/Foundry or OSAT Back-end/OSAT
PCB/EMS/Module
Chip owner’s solution
At present:
Near future:
Princo’s solution
Ready for your questions & requirement!
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