introduction to material sci-eng
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Fundamentals of materialsScience and Engineering
Credits: 3+1ECTS : 6
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Introduction to MaterialsScience and Engineering
1.1 What is Materials Science andEngineering?
1.2 Classification of Materials
1.3 Functional Classification ofMaterials
1.4 Classification of Materials Basedon Structure
1.5 Environmental and Other Effects
1.6 Materials Design and Selection
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Section 1.1What is Materials Science and
Engineering?
Materials Science and Engineering
Composition means the chemical make-up of amaterial.
Structuremeans a description of the arrangementsof atoms or ions in a material.
Synthesisis the process by which materials aremade from naturally occurring or other chemicals.
Processingmeans different ways for shapingmaterials into useful components or changing theirproperties.
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Materials Science
Mater. Sci. investigates relationshipsbetween structure and properties
Mater Sci. teaches basic concepts andprinciples for all materials with regard to
Physics, Chemistry and Mathematics.
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Structure
Electronic StructureElectronic structure specifiesinteractions between atoms
(interatomic bond formation)
Atomic Structure
Atomic arrangements inmaterials
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Microscopic Structure
The arrangement of smallgrains that can only be
determined withmicroscopes
Macroscopic StructureStructural elements thatcan be seen with naked eye
Structure
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Angstrom = 1 = 1/10,000,000,000 meter = 10-10
mNanometer = 10 nm = 1/1,000,000,000 meter = 10-9m
Micrometer = 1m = 1/1,000,000 meter = 10-6mMillimeter = 1mm = 1/1,000 meter = 10-3m
Interatomic distance ~ a couple Humans hair ~ 50 m
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2003 Brooks/Cole Publishing / Thomson Learning
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2003Brooks/ColePublishing
/ThomsonLearning
Figure 1.1 Application of the tetrahedron of materials scienceand engineering to ceramic superconductors. Note that themicrostructure-synthesis and processing-composition are allinterconnected and affect the performance-to-cost ratio
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Figure 1.2 Application of the tetrahedron of materials scienceand engineering to sheet steels for automotive chassis. Notethat the microstructure-synthesis and processing-compositionare all interconnected and affect the performance-to-cost ratio
2003Brooks/ColePublishing/ThomsonLearning
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2003Brooks/ColePublishing/ThomsonLearning
Figure 1.3 Application of the tetrahedron of materialsscience and engineering to semiconducting polymers formicroelectronics
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Section 1.2Classification of Materials
Metals and AlloysCeramics, Glasses,and Glass-ceramicsPolymers (plastics), Thermoplastics and Thermosets
SemiconductorsComposite Materials
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Table 1.1 Representative examples,applications, and properties for each
category of materials
Example of Applications Properties
Metals and AlloysGray cast iron Automobile engine blocks Castable, machinable,
vibration dampingCeramics andGlassesSiO2-Na2O-CaO Window glass Optically transparent,
thermally insulatingPolymersPolyethylene Food packaging Easily formed into thin,
flexible, airtight film
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Example of Applications Properties
SemiconductorsSilicon Transistors and integrated Unique electrical
circuits behavior
Composites Carbide cutting tools for High hardness, yetTungsten carbide machining good shock resistance-cobalt (WC-Co)
Table 1.1 Continued
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2003Brooks/ColePublishing/ThomsonLearning
Figure 1.4 Representative strengths of various categories ofmaterials
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Figure 1.5 A section through ajet engine. The forwardcompression section operates at
low to medium temperatures,and titanium parts are oftenused. The rear combustionsection operates at hightemperatures and nickel-basedsuperalloys are required. The
outside shell experiences lowtemperatures, and aluminumand composites are satisfactory.(Courtesy of GE AircraftEngines.)
Figure 1.6 A variety of complexceramic components, includingimpellers and blades, which allow
turbine engines to operate moreefficiently at highertemperatures. (Courtesy ofCertech, Inc.)
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2003
Brooks/ColePublishing/ThomsonLearning
Figure 1.7 Polymerization occurs when small molecules,
represented by the circles, combine to produce larger molecules,or polymers. The polymer molecules can have a structure thatconsists of many chains that are entangled but not connected(thermoplastics) or can form three-dimensional networks inwhich chains are cross-linked (thermosets)
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Figure 1.8 Polymersare used in a variety
of electronicdevices, includingthese computer dipswitches, wheremoisture resistanceand low
conductivity arerequired. (Courtesyof CTS Corporation.)
Figure 1.9Integrated circuits
for computers andother electronicdevices rely on theunique electricalbehavior ofsemiconducting
materials.(Courtesy of RogersCorporation.)
Figure 1.10 The X-wing for advanced
helicopters relies ona material composedof a carbon-fiber-reinforced polymer.(Courtesy of SikorskyAircraft Division
United TechnologiesCorporation.)
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Section 1.3Functional Classification of
MaterialsAerospaceBiomedicalElectronic Materials
Energy Technology and Environmental TechnologyMagnetic MaterialsPhotonic or Optical MaterialsSmart MaterialsStructural Materials
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2003Brooks/ColePublishing/ThomsonLearning
Figure 1.11Functionalclassification ofmaterials.Notice thatmetals, plastics,and ceramicsoccur indifferentcategories. Alimited number
of examples ineach category isprovided
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Section 1.4Classification of Materials-Based on Structure
Crystalline materialis a material comprised of one ormany crystals. In each crystal, atoms or ions show along-range periodic arrangement.
Single crystalis a crystalline material that is madeof only one crystal (there are no grain boundaries).Grains are the crystals in a polycrystalline material.Polycrystallinematerialis a material comprised ofmany crystals (as opposed to a single-crystal materialthat has only one crystal).Grain boundaries are regions between grains of apolycrystalline material.
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Section 1.5Environmental and Other Effects
Effects of following factors must be accounted for indesign to ensure that components do not failunexpectedly:
TemperatureCorrosionFatigueStrain Rate
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2003Brooks/ColePub
lishing/ThomsonLearning
Figure 1.12Increasingtemperature normallyreduces the strengthof a material.Polymers are suitable
only at lowtemperatures. Somecomposites, specialalloys, and ceramics,have excellentproperties at high
temperatures
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2003Brooks/ColePublish
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Figure 1.13 Skin operating temperatures for aircraft haveincreased with the development of improved materials.(After M. Steinberg, Scientific American, October, 1986.)
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Figure 1-14 Schematic of a X-33 plane prototype. Notice the
use of different materials for different parts. This type ofvehicle will test several components for the Venturestar(From A Simpler Ride into Space, by T.K. Mattingly,October, 1997, Scientific American, p. 125. Copyright 1997 Slim Films.)
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Section 1.6Materials Design and Selection
Densityis mass per unit volume of a material,usually expressed in units of g/cm3or lb/in.3
Strength-to-weight ratiois the strength of a materialdivided by its density; materials with a high strength-to-weight ratio are strong but lightweight.
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