geringer a-1 us_software manual
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A-Series A-1
Software Manual
LynxOS is a registered trademark of the
„LynuxWorks“ company
(The reproduction, transmission or use of this document or its con- tents is not permitted without written authority. Offenders will be liable for damages. All rights, including rights creat- ed by patent grant or registration of a utility model or design, are re- served.)
(We have checked the contents of the printed documentation to en- sure that it is in agreement with the hardware and software described therein. However, since discrepancies cannot be ruled out, we cannot assume responsibility for complete agreement. The information given in this printed documentation is however regularly reviewed and nec- essary corrections included in subsequent editions. We would appreciate any suggestions for improvements.)
Geringer Halbleitertechnik GmbH & Co KG
2012 All rights reserved Subject to change without prior notice
To be ordered from:
Geringer Halbleitertechnik GmbH &Co KG
Liebigstr. 1
93092 Barbing
Germany
Printed by Geringer
3
Software Manual A-1 Content
Content
1 Bonding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1 Notes on safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1.1 Safety at work . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1.2 Hazards when bonding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1.3 Safety device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1.4 EBP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.2 Backgroun d knowledge: bonding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.3 Backgroun d knowledge: software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.3.1 Setup Tool . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.3.2 Screen layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.3.3 Keyboard functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1.3.4 Entering coordinates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1.4 File menu (F)
1.4.1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Save As ... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1.4.2 Load application data... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1.4.3 Load machine data... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1.4.4 Delete File ... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
1.4.5 Complete backup to DAT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
1.4.6 Complete restore from DAT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
1.4.7 Save a Program to Floppy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1.4.8 Restore a Program from Floppy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1.4.9 Import Program from
FTP-Server15
1.4.10 Export Program to FTP-Server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1.4.11 Quit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
1.5 Mode menu
1.5.1
(O). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
DCL Camera Scale (O 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
1.5.2 DCL Tool Offset (O 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
1.5.3 DCL Camera <–> Tool Offset (O 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
1.5.4 EPO Camera <–> Dispenser Offset (O 7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
1.5.5 Learn Substrate Positions (O 9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
1.5.6 Learn Module Positions ( 10) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
1.5.7 Learn Wafer Radius (O 21) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
1.5.8 Camera-Needle Offset (O 25) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
1.5.9 WFS Learn Chip (O 30). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
1.5.10 WFS Learn Chip Index (O 31) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
1.5.11 MWC Camera Scale (O 51) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
1.5.12 MWC Wafertable <–> DCL Trafo (O 52) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
1.5.13 MWC Camera <–> Tool Offset (O 53). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
1.5.14 Option Lookup Camera Scale (O 60) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4
Content Software Manual A-1
1.6 Application
1.6.1
Pages menu (A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Substrate type (A6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
1.6.2 Substrate Position (A 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
1.6.3 Module Position (A 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
1.6.4 Bond Position (A 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
1.6.5 Epo Position (A 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
1.6.6 Alignment (A 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
1.6.7 Production Data (A 9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
1.6.8 Wafer Data (A 20) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
1.6.9 Wafer Recognition (A 21) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
1.6.10 Option: Wafer Magazine (A 25) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
1.6.11 Lookup camera (A 40) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
1.6.12 Oven Profile (A 60) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
1.7 Machine Pages menu (M) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
1.7.1 DCL Machine Data (M 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
1.7.2 EPO Machine Data (M 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
1.7.3 DCL Toolholder Positions (M 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
1.7.4 Corridor Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
1.7.5 DCL Tool Offset (M 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
1.7.6 DCL Limits (M 7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
1.7.7 EPO Limits (M 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
1.7.8 Oven Settings (M 9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
1.7.9 Wafer Machine Data (M 22) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
1.7.10 Die Ejector Rotor Position (M 24) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
1.8 Service men
1.8.1
u (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
Reinit motors (S 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
1.8.2 Deinit motors (S 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
1.8.3 Wizard (S 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
1.8.4 Configuration (S 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
1.8.5 Machine Counter (S 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
1.8.6 Change Epoxy (S 7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
1.8.7 Cycle Times (S 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
1.8.8 Tool hits (S 9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
1.8.9 Diebonder I/O page (S 10) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
1.8.10 Indexer IO page (S 11) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
1.8.11 Indexer Settings (S 12) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
1.8.12 Inputlift Page (S 13). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
1.8.13 Outputlift Page (S 14) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
1.8.14 Motor Service (S 15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
1.8.15 Get Versions (S 20) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
1.8.16 User Administration (S 90) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
1.8.17 Change User Level (S 91) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
1.8.18 Show Logfiles (Service 98) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
1.8.19 Set Printer Format (S 99) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
1.9 Preparation s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
1.9.1 Switching on the bonder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
1.9.2 Train the machine-specific parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
1.9.3 Setting up an application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
1.9.4 Indexer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
5
Software Manual A-1 1 Bonding
1.1 Notes on safety
1 BO ND IN G
1.1 Notes on sa fety
1.1.1 Safety at work
GERINGER Halbleitertechnik bonding
machines are state of the art and comply with
safety-related rules and regulations.
R I S K O F D E A T H
Persons with cardiac pacemakers or
implanted medical devices must keep at
least one metre clear of bonding machi-
nes. Bonding machines operate with
strong electromagnetic fields. These
fields can affect cardiac pacemakers.
1.1.2 Hazards when bonding
D A N G E R
Keep well clear of the working zone of the
machine and indexer while the equipment
is in operation. Moving machinery hazard.
Operate the machine only with all covers
and doors closed. Do not remove covers
while the machine is in operation. Always
return the bond head to its home position
before penetrating the machine's working
zone. Moving machinery hazard.
Always comply with the manufacturer's
instructions when handling forming gas.
D A N G E R
Do not work on the machine at the same
time as other persons.
Use the bonder only
• in compliance with the manufacturer's
intended use
• in perfect safety-related working order.
Incorrect use means risk of fatal injury to
the user and others and can cause
damage to the machine and property.
Have safety-related defects repaired
immediately by trained, qualified specia-
lists.
C A U T I O N
Do not position the microscope and
microscope holder in the working zone of
the bond head. Crash hazard.
1.1.3 Safety device
You can stop the bonder at any time, regardless of
its operating status, by pressing the EMERGENCY
STOP switch. The switch latches in the depressed
position.
C A U T I O N
Faults must be rectified by trained, quali-
fied personnel working in compliance
with all safety precautions. To restart the bonder after an emergency stop:
ÆMake sure that the fault which lead to actuation
of the EMERGENCY STOP switch has been
rectified.
ÆReset the EMERGENCY STOP switch: turn the
knurled ring of the switch clockwise.
ÆSwitch on the bonder.
6
1 Bonding
1.2 Background knowledge: bonding
Software Manual A-1
1.1.4 EBP
The operator must have a conductive connection
to the machine in order to prevent electronic com-
ponents being damaged by electrostatic
discharge. This connection is made to the EBP
(Earth Bonding Point), which prevents the static
charge passing from the operator to the machine.
C A U T I O N
Components can be damaged if you work
without a connection to the EBP. Always
put on the earthing strap before touching
components.
ÆAlways wear the earthing strap in such a way
that it remains in contact with your skin.
ÆPlug the cable connected to the earthing strap
into the bonder's EBP.
1. 2 Back ground knowledge: bonding A die bonder is designed to pick up a small compo-
nent (the die or chip) from a carrier (wafer, waffle
pack, gel pack, bowl feeder, tape feeder) and bond
it onto a larger component (the substrate).
Bonder
The substrates enter the bonder from the left and
are carried clamping station by the indexer, before
exiting from the machine on the right. An input
system can be mounted on the left and/or an
output system on the right if the machine is not
integrated directly into a production line.
Bond process
The chips are bonded to the substrate by means of
an adhesive process or a thermal process (eutec-
tic process)
Adhesive process
The bond head (dispenser or stamp) applies the
adhesive to the substrate.
Stamp
A stamp dips into the epoxy adhesive in the squee-
gee unit and applies the adhesive to the substrate.
Dispenser
The dispenser applies the epoxy adhesive to the
substrate from a cartridge by means of a capillary
needle.
Moving wafer camera
The MWC is used to find the next chip on the wafer
clamped in position on the wafer frame.
Bonding process
When scanning is completed the bond head unit
(die collet) moves into position over the chip, the
chip ejector separates the chip from the wafer foil,
the DCL tool carries it (held by vacuum) to the
bond position. The chip is released at this position
and a slight pressure exerted to press it into the
epoxy adhesive applied beforehand.
The wafer frames are removed from the wafer
magazine in the chip-handling system and retur-
ned to the magazine once the chips have been
removed.
7
Software Manual A-1 1 Bonding
1.3 Background knowledge: software
1.3 Back ground knowledge: software
I M P O R T A N T
The subsections below contain descriptions of
all menus and their parameters. Read this sec-
tion carefully and familiarise yourself with its
contents before you start bonding.
1.3.1 Setup Tool
If you press any button during initialisation the boot
process is interrupted and the system displays the
Setup Tool screen (text prompt to press any but-
ton).
When you press Quit to shut down the bonder, the
Start menu shown below is displayed:
„ Restart Application: Starts the machine soft-
ware. Setup Tool is exited, the ordinary boot
process is resumed and a startup script is pro-
cessed. The machine powers up to the default
mode.
„ Reboot System: Reboots the operating system
and the machine software
„ Shutdown System: Shuts down the operating
system to a defined state for Power Off
„ Setup Tool: Starts the input masks for the custo-
mer-specific bonder configuration
Setup Tool
The Setup Tool window can only be accessed
through a login mechanism with two user levels.
User levels Meaning
operator The default is no password. Functions
marked black in the menu cannot be
accessed
User levels Meaning
admin All functions can be accessed, once
the correct password has been
entered
System Settings
The current system time and date are displayed
and can be corrected if necessary.
Networking
Settings for the network.
TCP IP Settings
„ Host name: computer name
„ IP Address: IP address
„ Network Mask: Network mask
If the bonder is disconnected from the network,
"0.0.0.0" should be entered in the "IP Address" and
"Network Mask" fields.
The computer has to be rebooted before it can be
initialised with a new IP address.
Routing
Settings for two network routes and a standard
gateway.
NTP Configuration
Time synchronisation with a server of your choice.
In order to avoid compilation errors when remote
maintenance is performed for the bonder, it has to be synchronised with the server on which the soft-
ware changes are implemented.
Hostdatabase
Setting for automatic configuration.
8
1 Bonding
1.3 Background knowledge: software
Software Manual A-1
Dropdown menu Description
Graphics The graphics adapter card
installed in the system
ATI ATI graphics adapter card
MATROX M MATROX M graphics adapter
card
Monitor The monitor installed in the
system
Std_CRT Standard cathode-ray-tube
monitor
Std_LCD Liquid crystal display
LCD with Touch-sensitive liquid crystal
touchscreen display for interfacing with the
software
Mouse The mouse used in the system
default/Trackball Use the system's default poin-
ting device
Hardware Configuration
The Hardware Configuration item is for defining
the hardware elements that comprise the bonder.
Hardware Configuration > Graphics
Submenu for basic machine settings.
Dropdown menu
Dropdown menu Description
MS/serial Connect a serial mouse of your
choice
Keyboard Language settings for the key-
board
German German keyboard
English English keyboard
When you are satisfied that all the settings are cor-
rect:
ÆPress <F10> to update the configuration file
The system has to be rebooted before the new
configuration can be activated.
Hardware Configuration > Serial Interfaces
Submenu for configuring the serial interface for
special hardware.
Dropdown menu
Dropdown menu Description
Configuration Type of bonder
Die bonder Die bonder
Wire bonder Wire bonder with DFLEX/M500
hardware card
Wirebonder old Wire bonder with LONGSHINE
hardware card
When you are satisfied that all the settings are cor-
rect:
ÆPress <F10> to update the configuration file
The system has to be rebooted before the new
configuration can be activated.
9
Software Manual A-1 1 Bonding
1.3 Background knowledge: software
Printer Configuration
net Printer
Installs a network printer
„ Format: Entry Format "Postscript" or "PCL"
„ IP: IP address
„ raw -queue
„ ascii - queue
Software Configuration
Implementations
„ Install setupTool Update: Software update of
Setup Tool and bond programs from floppy disk
drive and DAT drive
„ Full System Backup: Complete system backup
(operating system and user data)
„ User Data Backup: Backup of the user data
„ User Data Restore: Restore the user data from
backup medium
Change Password for User
Once the original password has been entered in
order to access the correct level, you can enter a
new password and must then repeat your entry by
way of confirmation. If you exit without entering a
new password, you deactivate the password
function for the user in question.
1.3.2 Screen layout
Main menu
The user interface is SAA-compliant. You can
choose one of four main menus from the menu bar:
„ File: Administration of the bond programs (see
"1.4 File menu (F)" on page 1-13)
„ Mode: Parameters and machine data for confi-
guring the bonding process for a particular appli-
cation (see "1.5 Mode menu (O)" on page 1-17).
This training mode has interactive support.
„ Application Pages: Application-specific parame-
ters. The trained parameters are displayed in
function groups and can be modified (see "1.6
Application Pages menu (A)" on page 1-32).
„ Machine Pages: Device parameters such as
speeds and delays, usually set for all applicati-
ons
(see "1.7 Machine Pages menu (M)" on page 1-
113). As a rule, these parameter settings do not
have to be changed unless modifications are
made to the mechanical or optical subsystems.
„ Service: Access to maintenance, service and
monitoring functions (see "1.8 Service menu
(S)" on page 1-136).
5
1 2
3
4
7 6
The standard screen displays the information of
relevance during the production process:
„ (1) The camera image currently being proces-
sed by the PRU (Pattern Recognition Unit)
„ (2) Processing status of function groups
„ (3) Warning and error messages (hide by
double-clicking on the message)
„ (4) Log documenting the most recent steps
initiated by the user or by the software
„ (5) Control elements, buttons for fast access to
various functions
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1 Bonding
1.3 Background knowledge: software
Software Manual A-1
„ (6) Status and barcode information
„ (7) The name of the bond program currently
loaded is displayed on the left-hand side above
the status line.
Camera image (1)
The bonder has the following cameras:
„ MWC camera: The high-resolution moving wafer
camera images the positions of small chips on
the wafer frame so that the PRU can compute
the exact position
„ DCL camera: The moving DCL camera (die col-
let camera) views the target area on the compo-
nent surface where the chip is to be placed. The
PRU uses this image to compute the exact bond
place
„ MWC camera (low res.): The low-resolution
moving wafer camera images the positions of
large chips on the wafer frame so that the PRU
can compute the exact position
„ Lookup camera (optional): The optional, fixed
lookup camera is used for alignment from
below, generally with the flip-chip unit
When the machine is at a standstill you can view
the image of each camera by clicking the corre-
sponding radio button. When production is in pro-
gress the camera image currently in use is dis-
played automatically.
Operating status (2)
The current processing status and the next status,
plus the number of application parameter records
defined.
Warnings and error messages (3)
Warnings
Warnings are displayed in orange in the centre
field on the right-hand side of the screen. Automa-
tic production does not stop if a warning is dis-
played.
Error messages
Error messages are displayed in red in the centre
field on the right-hand side of the screen (below the
warnings). Automatic production stops if an error
message is displayed.
11
Software Manual A-1 1 Bonding
1.3 Background knowledge: software
Controls (5)
In addition to the radio buttons for camera selec-
tion, you also have on/off switches for machine
functions at your disposal:
Light On/Off
Master switch for switching all the lights off or on
together.
The lights are on if the button is grey and labelled
"Light Off".
The lights are off if the button is grey and labelled
"Light On".
Worklight
Switches the worklight on or off.
Air & Vacuum
Opens or closes the main valve, as applicable.
This applies to all the bonder's compressed-air and
vacuum functions.
Gas On
Switches the forming gas on or off (option for
eutectic bonding)
Next Die ==>
„ Shows the direction of processing on the wafer.
„ Reverses the direction of processing on the
wafer.
DE Block
Raise or lower the die eject block.
Wizard
Direct access to wizards (see "1.8.3 Wizard (S 4)"
on page 1-136)
Status and barcode information (6)
Current production information is displayed in the
line at the bottom of the screen:
„ Program status or mode currently selected.
Possible states:
\ READY: Ready to start production
\ PRODUCTION: Production in progress
\ STEP: Step mode
\ ERROR: Error has occurred
„ The numbers of the current substrate, module,
chip and tool in the DCL unit
„ Current wafer number
„ Barcode information (optional)
„ Status field for the DCL unit of the indexer. The
field is a colour indicator showing the status of
the corresponding station:
Colour Meaning
white undefined
green material available
blue station is ready for indexing
orange warning
red error (system stopped)
12
1 Bonding
1.3 Background knowledge: software
Software Manual A-1
1.3.3 Keyboard functions
You will frequently have to use the function keys on
the keyboard when you program bonding
sequences.
The functions of the keys for controlling production
are as follows:
START
Press "start" to start automatic production. Produc-
tion resumes at the position shown in the status
line.
STOP
Press "stop" to terminate automatic production. A
step in progress is completed.
HOME
Press "home" to reset all axes to their home posi-
tions.
RESTART
Enables a restart
STEP
Press "step" to continue production in step-by-step
mode. Note that the steps do not correspond to full
production cycles (i.e. chip separation, transporta-
tion and placing). In each step, production advan-
ces to a pause point defined in the program.
F1 to F10
The software assigns functions to keys F1 through
F10; these functions vary, depending on which
menu is active and on the input field in which the
cursor is located. Additional functions can be
called for some input fields when you press the "fn"
key. The blue colouring indicates function keys
that have "fn" functions.
1.3.4 Entering coordinates
Broadly speaking, there are two ways of pro-
gramming coordinates:
Teach-in
Use the trackball to move the mechanical units to
the desired position and use the train-in method to
save the corresponding coordinates. This involves
the following steps:
ÆClick to move the cursor into one of the fields
defining the coordinates of the position you want
to train.
Æ<F10> Press the key or touch the "F10: Move"
button to activate the trackball.
ÆUse the trackball to move to the positions. Press
the <+> key to increase the speed of movement
or the <–> key to reduce speed over a range of
10 stages.
Æ<F6> Press the key or touch the "F6: Trace“ but-
ton to accept values in the numeric input fields.
Advantage: There is no risk of collision, because
the current position is saved.
Numeric entry
C A U T I O N
When entering coordinates for the DCL
unit and executing movements to positi-
ons defined by coordinates with the "F1:
Move to" function, make sure that the
DCL tool does not contact the wafer or
collide with other parts. Numeric input of the coordinates via the keyboard: ÆEnter the values in the numeric input fields.
ÆPress "enter" to confirm.
ÆClick the "F1:Move to" button or press <F1> on
the keyboard to move to the point defined by the
coordinates you entered. The input fields
directly related to the active field are also taken
into account. For example, if the cursor is in the
input field of the X component, the movement is
also executed for the corresponding Y compo-
nent and the Z component, if applicable.
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Software Manual A-1 1 Bonding
1.4 File menu (F)
1 . 4 F il e m e nu (F) Commands for managing bonding programs.
1.4.1 Save As ...
Saves active application and machine data to the
database library. Use the keyboard to assign the
program a suitable, characteristic name.
You must comply with the following naming con-
ventions: Maximum 254 characters, no special
characters. File names are shown only to a maxi-
mum length of 16 characters, but you can spool
the name through the field.
ÆEnter the name of the file in the appropriate
field.
ÆPress "enter" (OK): Save the file under this
name.
1.4.2 Load application data...
Loads existing application data from the database
library. The application data comprises all parame-
ter settings entered in the "Application Pages"
menu.
ÆUse the cursor keys to select the bond program
or application data of your choice from the data-
base library.
ÆPress "enter" (OK): Load the application data
you selected.
ÆPress "escape" (Cancel): Exit the menu.
1.4.3 Load machine data...
C A U T I O N
Avoid using this function if possible. The-
re is a risk of a malfunction being caused
by outdated machine data. Loads current machine data from the database
library. The machine data comprises all parameter
settings entered in the "Machine Pages" menu.
ÆUse the cursor keys to select the current
machine data from the database library.
ÆPress "enter" (OK): Load the machine data you
selected.
ÆPress "escape" (Cancel): Exit the menu.
14
1 Bonding
1.4 File menu (F)
Software Manual A-1
1.4.4 Delete File ...
Deletes files saved beforehand. The list of existing
bonding programs is displayed:
ÆUse the cursor keys to select the file of your
choice from the database library.
ÆPress "enter" (OK): Delete the bonding file.
1.4.5 Complete backup to DAT
Save all bonding files on DAT cartridge.
I M P O R T A N T
Only the bonding files are saved, not the sy-
stem program.
ÆInsert the DAT cartridge in the drive.
ÆPress "enter" to start the backup or press
"Ctrl - C" to return to the standard screen wit-
hout creating a backup.
ÆWhen the backup has been successfully crea-
ted, press "Ctrl - C" to return to the user-inter-
face screen.
1.4.6 Complete restore from DAT
Import files from DAT.
ÆInsert the DAT cartridge in the drive.
ÆPress "enter" to start the restore or press
"Ctrl - C" to return to the standard screen wit-
hout restoring.
ÆWhen the restore has been successfully com-
pleted, press "Ctrl - C" to return to the user-
interface screen.
15
Software Manual A-1 1 Bonding
1.4 File menu (F)
1.4.7 Save a Program to Floppy
ÆInsert the floppy disk in the drive.
ÆSelect the name of the file you want to save.
ÆPress "enter" to start the save or press "Ctrl - C"
to return to the standard screen without saving
the file.
ÆWhen the save has been successfully comple-
ted, press "Ctrl - C" to return to the user-inter-
face screen.
1.4.8 Restore a Program from Floppy
Load a file from floppy disk.
ÆInsert the floppy disk in the drive.
ÆPress "enter" to save the bonding file under its
name in the database library, or press "Ctrl - C"
to return to the standard screen without loading
the file.
ÆWhen the load has been successfully comple-
ted, press "Ctrl - C" to return to the user-inter-
face screen.
ÆUse "Save As" to save the bonding file under its
name in the database library.
1.4.9 Import Program from
FTP-Server
Loads an existing program from the local FTP ser-
ver.
ÆUse the cursor keys to select the program of
your choice from the list.
ÆPress "enter" (OK): Load the application data
you selected.
ÆPress "escape" (Cancel): Exit the menu.
1.4.10 Export Program to FTP-Server
Exports an existing program to the local FTP ser-
ver.
ÆUse the cursor keys to select the program of
your choice from the list.
ÆPress "enter" (OK): Load the application data
you selected.
ÆPress "escape" (Cancel): Exit the menu.
16
1 Bonding
1.4 File menu (F)
Software Manual A-1
1.4.11 Quit
Shuts down the program as a preliminary to swit
ching ollthe bonder without lass of data.
You may want to save the file in the bonder's main
memory before you call the Quit command
(see "1.4.1 Save As " on page 1-13)
17
Software Manual A-1 1 Bonding
1.5 Mode menu (O)
1.5 Mode menu (O ) All modes for defining machine data and applica-
tion data. The functions are executed in an interac-
tive dialog.
Machine data
The machine data has to be updated whenever
changes are made to the machine's hardware.
„ DCL camera scale (O 1): Perform this operation if
changes are made to the mechanical or optical
systems of the DCL camera (see "1.5.1 DCL
Camera Scale (O 1)" on page 1-18)
„ DCL Tool Offset (O 2): Perform this operation if
changes are made to the DCL unit (see "1.5.2
DCL Tool Offset (O 2)" on page 1-19)
„ DCL Camera < - > Tool Offset (O 3): Perform this
operation if changes are made to the DCL
camera or DCL unit(see "1.5.3 DCL Camera <–
> Tool Offset (O 3)" on page 1-24)
„ EPO Camera < - > Dispenser Offset
(O 7): Perform this operation if changes are
made to the DCL camera or EPO unit (see
"1.5.4 EPO Camera <–> Dispenser Offset
(O 7)" on page 1-25)
„ Wafer Camera Scale (O 22): No fixed wafer
camera installed
„ Camera-Needle Offset (O 23): Perform this opera-
tion if the needles are changed or changes
made to the wafer camera (see "1.5.8 Camera-
Needle Offset (O 25)" on page 1-27)
„ MWC Camera Scale (O 51): Perform this opera-
tion if changes are made to the mechanical or
optical systems of the moving wafer camera
(see "1.5.11 MWC Camera Scale (O 51)" on
page 1-29)
„ MWC Wafertable < - > DCL Trafo
(O 52): Perform this operation if changes are
made to the wafer table or DCL camera (see
"1.5.12 MWC Wafertable <–> DCL Trafo (O 52)"
on page 1-30)
„ MWC Camera < - > Tool Offset
(O 53): Perform this operation if changes are
made to the moving wafer cameras or DCL unit
(see "1.5.13 MWC Camera <–> Tool Offset
(O 53)" on page 1-31)
„ Lookup Camera Scale (O 60): Perform this opera-
tion if changes are made to the lookup camera
that views the chips from below
(see "1.5.14 Option Lookup Camera Scale
(O 60)" on page 1-31)
Application data
The application data has to be updated whenever
the bonder is reconfigured for a different product.
„ Learn Substrate Positions (O 9): Perform this
operation if changes are made to the indexer or
a different substrate is used (see "1.5.5 Learn
Substrate Positions (O 9)" on page 1-25)
„ Learn Module Positions (O 10): Perform this ope-
ration if the substrate is changed or the arrange-
ment of modules on the substrate is changed
(see "1.5.6 Learn Module Positions ( 10)" on
page 1-26)
„ Learn Wafer Radius (O 21): Perform this opera-
tion if a different wafer is used (see "1.5.7 Learn
Wafer Radius (O 21)" on page 1-26)
„ WFS Learn Chip (O 30): Perform this operation if
a different wafer is used or if the arrangement of
chips on the wafer is changed (see "1.5.9 WFS
Learn Chip (O 30)" on page 1-27)
„ WFS Learn Chip Index (O 31): Perform this ope-
ration if a different wafer is used or if the arran-
gement of chips on the wafer is changed (see
"1.5.10 WFS Learn Chip Index (O 31)" on page
1-28)
18
1 Bonding
1.5 Mode menu (O)
Software Manual A-1
1.5.1 DCL Camera Scale (O 1)
Trains the scaling factor for the DCL camera.
These settings have to be changed if modifications
are made to the mechanical or optical subsystems
of the DCL camera. You can perform scaling
manually or automatically.
When you call up the menu a prompt appears
asking whether you want to determine the scaling
factor automatically:
Automatic scaling
ÆClick on <Yes> if you want to have the scale fac-
tor calculated automatically.
ÆUse the trackball to select an unequivocally
recognisable pattern.
I M P O R T A N T
Observe the automatic scaling procedure, and
make sure that the system positions at this si-
gnificant point in each step. Repeat the proce-
dure if positioning is inaccurate.
ÆUse the trackball to define the size of the refe-
rence pattern window for the search.
ÆClick the left mouse button to confirm.
The program automatically determines the scaling
factors by moving defined distances in X and Y and
then relocating the reference pattern.
The factors previously active are shown along with
the new factors at the bottom right of the screen.
Click the "Yes" button to confirm the new factors or
click the "No" button to cancel the procedure:
Manual scaling
ÆClick on <No> if you want to calculate the scale
factor manually.
I M P O R T A N T
For manual scaling, select a sharply defined
point on the substrate so that positioning is as
accurate as possible.
ÆThe program expects you to move the cros-
shairs at the top left of the screen to a significant
point.
I M P O R T A N T
Always make sure that you position accurately
at the point you select, as otherwise the scaling
factor will not be computed correctly.
ÆClick "enter" to confirm that you have moved the
crosshairs to the point. The program moves the
camera a defined distance and expects that you
will again move the crosshairs (now at the top
right of the screen) to the significant point origi-
nally marked. Click "enter" to confirm that you
have moved the crosshairs to the point.
19
Software Manual A-1 1 Bonding
1.5 Mode menu (O)
ÆRepeat the procedure three times with the same
pattern; the crosshairs will reappear at a diffe-
rent corner for each repeat ÆPress "enter" to confirm (OK).
The factors previously active are shown along with
the new factors at the bottom right of the screen.
ÆClick the "Yes" button to confirm the new factors
or click the "No" button to cancel the procedure.
1.5.2 DCL Tool Offset (O 2)
Trains the P-axis offset (axis of rotation) of the DCL
unit.
When you call up the menu a prompt appears
asking whether you want to start the automatic pro-
cedure: ÆClick "Automatic" to start the procedure.
ÆSelect the appropriate option for a rectangular
or round DCL tool and click OK to confirm.
Rectangular DCL tool.
The procedure for a rectangular DCL unit is descri-
bed below.
1. 0° offset
ÆMove to the position and click the left mouse
button to confirm.
ÆMove to the position and click the left mouse
button to confirm.
20
1 Bonding
1.5 Mode menu (O)
Software Manual A-1
ÆMove to the position and click the left mouse
button to confirm.
ÆMove to the position and click the left mouse
button to confirm.
ÆMove to the position and click the left mouse
button to confirm.
ÆIf the crosshairs are not in the centre, click on
<No> and repeat the 0° offset process.
ÆIf the crosshairs are in the exact centre, click on
<Yes> and move on to the 360° offset process.
2. 360° offset
ÆMove to the position and click the left mouse
button to confirm.
ÆMove to the position and click the left mouse
button to confirm. ÆMove to the position and click the left mouse
button to confirm.
21
Software Manual A-1 1 Bonding
1.5 Mode menu (O)
ÆMove to the position and click the left mouse
button to confirm.
ÆMove to the position and click the left mouse
button to confirm. ÆMove to the position and click the left mouse
button to confirm.
ÆMove to the position and click the left mouse
button to confirm.
ÆMove to the position and click the left mouse
button to confirm.
ÆMove to the position and click the left mouse
button to confirm. ÆMove to the position and click the left mouse
button to confirm.
ÆMove to the position and click the left mouse
button to confirm.
22
1 Bonding
1.5 Mode menu (O)
Software Manual A-1
ÆMove to the position and click the left mouse
button to confirm.
Round DCL tool.
The procedure for a round DCL unit is described
below.
DCL tool offset can be computed with the aid of the
centre of the circle or three points on the circumfe-
rence of the circle.
1. Circle centre (0° offset)
ÆMove to the positions and click the left mouse
button to confirm.
ÆMove to the positions and click the left mouse
button to confirm.
ÆMove to the positions and click the left mouse
button to confirm.
ÆIf the crosshairs are not in the centre, click on
<No> and repeat the DCL tool offset process.
ÆIf the crosshairs are in the exact centre, click on
<Yes> to confirm the DCL tool offset and move
on to the 360° offset process.
2. 360° offset
ÆMove to the position and click the left mouse
button to confirm.
23
Software Manual A-1 1 Bonding
1.5 Mode menu (O)
ÆMove to the position and click the left mouse
button to confirm. ÆMove to the position and click the left mouse
button to confirm.
ÆMove to the position and click the left mouse
button to confirm.
ÆMove to the position and click the left mouse
button to confirm.
ÆMove to the position and click the left mouse
button to confirm. ÆMove to the position and click the left mouse
button to confirm. ÆMove to the position and click the left mouse
button to confirm.
Three points on circumference of circle
ÆMove to the positions and click the left mouse
button to confirm.
24
1 Bonding
1.5 Mode menu (O)
Software Manual A-1
ÆMove to the positions and click the left mouse
button to confirm.
ÆMove to the positions and click the left mouse
button to confirm.
ÆIf the crosshairs are not in the centre, click on
<No> and repeat the DCL tool offset process.
ÆIf the crosshairs are in the exact centre, click on
<Yes> to confirm the DCL tool offset and move
on to the 360° offset process (same as the pro-
cedure using the centre of the circle, See " 2.
360° offset" on page 1-20)
1.5.3 DCL Camera <–> Tool Offset (O 3)
Trains the distance between the optical axis of the
DCL camera and the axis of the DCL unit.
When you select this menu item the program
expects you to move the DCL unit to a significant point.
ÆMove the tool to the positions and click the left
mouse button to confirm.
ÆMove the moving wafer camera (MWC) to the
positions and click the left mouse button to con-
firm.
ÆClick the left mouse button to confirm that you
have selected a point. The new offset is saved.
25
Software Manual A-1 1 Bonding
1.5 Mode menu (O)
Parameter Description /
Value range, unit
Columns Number of columns
Rows Number of rows
Substrates The number of substrate positi-
ons
Modules The number of modules
1.5.4 EPO Camera <–> Dispenser Offset
(O 7)
Trains the distance between the axis of the camera
and the Z-axis of the bond head.
A single spot of epoxy is set so that you can move
the crosshairs to it and the program can compute
the distance.
ÆMove the axes, set a single epoxy spot and click
"OK". The program expects you to move the
crosshairs to a significant point.
ÆClick a mouse button to confirm that you have
selected a point. The new offset is saved.
1.5.5 Learn Substrate Positions (O 9)
Trains the substrate positions. The substrate is the
set of modules on a carrier. A substrate can have
one or more modules of a single type. Substrates
are arranged in rows and columns in a block. The
example below has 2 rows and 3 columns.
+ + +
+ + +
I M P O R T A N T
If there are multiple blocks with the same con-
figuration, you can minimise the work involved
in programming simply by adding blocks. (Use
the "Add Block" function in the "job" dropdown
menu)
Parameter
The parameters refer to the substrate type selec-
ted in the "Substrate Type" dropdown menu.
26
1 Bonding
1.5 Mode menu (O)
Software Manual A-1
Dropdown menu Description
job
Create Block Deletes all the substrates of the
current type and creates a new
substrate with the current num-
ber of rows and columns.
Not implemented until you select
<OK>.
Add Block Adds a new substrate to an exi-
sting substrate
Not implemented until you select
<OK>
Substrate Type Select the substrate type
Dropdown menu 1.5.6 Learn Module Positions ( 10)
The procedure for training module positions is ana-
logous to O 9
(see "1.5.5 Learn Substrate Positions (O 9)" on
page 1-25)
1.5.7 Learn Wafer Radius (O 21)
Trains the radius of the wafers.
When you select this menu item the program
expects you to enter any three distinct points on
the edge of the wafer, which you enter with the aid
of the trackball.
I M P O R T A N T
Select the three points in accordance with the
sketch below, in order to ensure that the wafer
radius is computed correctly.
ÆMove to a significant point of the top left sub-
strate and click the left mouse button to confirm.
ÆMove to the identical point on the top right sub-
strate and click the left mouse button to confirm.
ÆMove to the identical point on the bottom right
substrate and click the left mouse button to con-
firm.
The position of the first substrate is shown in Sub-
strate Position (A1).
1 2
WAFER
3
ÆConfirm each point in turn by clicking the "OK"
button, or click the "Cancel" button to cancel the
operation.
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Software Manual A-1 1 Bonding
1.5 Mode menu (O)
1.5.8 Camera-Needle Offset (O 25)
Determines the offset of the needle position rela-
tive to the centre of the wafer camera. This offset
is used to correct positioning of the wafer table and
the DCL unit. You should compute the offset if
chips are not stamped out correctly or if needles
have been replaced.
ÆCall up mode 13, "Camera Needle Offset".
ÆExtend the needles and adjust the lighting so
that the needles are visible.
When you select this menu item the program
expects you to enter three points on the chip, using
the cursor keys to move to each point in turn:
bottom right, bottom left and top left. 3
DIE
ÆUse the trackball to align the crosshairs with the
needle centre: 2 1
ÆClick the left mouse button to register the offset.
ÆClick on <Ok> to accept the camera needle off-
set.
1.5.9 WFS Learn Chip (O 30)
Train the chip positions. Once you have trained the
chip position, you can continue right away with the
dialog and define the chip index and the position of
the inkdot.
I M P O R T A N T
Precision is essential at this stage, because
the accuracy of the entire pick&place operation
depends on it.
ÆClick the left mouse button to confirm that you
have selected each point in turn.
Once you have trained the third point the program
calculates the centre of the chip and the system
moves to this position.
28
1 Bonding
1.5 Mode menu (O)
Software Manual A-1
1.5.10 WFS Learn Chip Index (O 31)
You can train the chip index (spacing in X and Y
between chips) manually or automatically.
Training the chip position automatically
The starting point for indexing is the chip centre
trained with mode 30 (WFS Learn Chip). The refe-
rence patterns stored in memory are used along
with the chip dimensions to move to each neigh-
bouring chip in turn (in the sequence 1 to 4), so that
the distances in X and Y can be calculated.
1 2
Training the chip position automatically
You must move the crosshairs to significant points
on neighbouring chips, so that the program can
calculate the chip index.
ÆMove the crosshairs to the bottom right edge of
the first chip and click the left mouse button.
ÆMove to the next chip on the left, move the cros-
shairs to the bottom right edge of this chip and
click the left mouse button.
ÆMove to the chip above the second chip, move
the crosshairs to the bottom right edge of this
chip and click the left mouse button. The chip
4 3 index is calculated.
ÆClick "Yes" to save the index pitches as calcula-
ted, or click "Cancel" to repeat the process:
ÆClick "Yes" to save the index pitches as calcula-
ted, or click "Cancel" to repeat the process:
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Software Manual A-1 1 Bonding
1.5 Mode menu (O)
1.5.11 MWC Camera Scale (O 51)
Scaling of the optical system, the moving wafer
camera and the fixed wafer table.
Determines the ratio between the resolution of the
camera and the measuring system of the coordina-
tes table. The correlation between one pixel in the
camera's image and µm of travel is computed.
You can perform scaling manually or automati-
cally.
The procedure is the same as that for Mode 1 (see
"1.5.1 DCL Camera Scale (O 1)" on page 1-18)
Select the moving wafer camera
ÆSelect the "High Resolution" option if you want
to use the high-resolution camera.
ÆSelect the "Low Resolution" option if you want to
use the low-resolution camera.
Automatic scaling
ÆClick on "Yes" in the "Automatic camera scale?"
window.
ÆUse the trackball to define the size of the refe-
rence pattern window for the search and click
the left mouse button to confirm.
I M P O R T A N T
For automatic scaling, select a sharply defi-
ned, uniquely identifiable point.
ÆUse the trackball to define the size of the search
window and click the left mouse button to con-
firm.
The program automatically determines the scaling
factors by moving defined distances in X and Y and
then relocating the reference pattern.
The factors previously active are shown along with
the new factors at the bottom right of the screen.
ÆClick the "Yes" button to confirm the new factors
or click the "No" button to cancel the procedure:
Manual scaling
ÆClick on "No" in the "Automatic camera scale?"
window.
I M P O R T A N T
For manual scaling, select a unique, sharply
defined point on the substrate so that posi-
tioning is as accurate as possible.
ÆThe program expects you to move the cros-
shairs at the top left of the screen to the signifi-
cant point.
I M P O R T A N T
Always make sure that you position accurately
at the point you select, as otherwise the scaling
factor will not be computed correctly.
ÆClick "enter" to confirm that you have moved the
crosshairs to the point. The program moves the
camera a defined distance and expects that you
will again move the crosshairs (now at the top
right of the screen) to the significant pattern ori-
ginally marked.
ÆClick "enter" to confirm that you have moved the
crosshairs to the point.
ÆRepeat the procedure three times with the same
pattern; the crosshairs will reappear at a diffe-
rent corner for each repeat.
The program now calculates the scaling factors.
The factors previously active are shown along with
the new factors at the bottom right of the screen.
Æ Click the "Yes" button to confirm the new factors
or click the "No" button to cancel the procedure:
I M P O R T A N T
Observe the automatic scaling procedure, and
make sure that the system positions at this si-
gnificant point in each step. Repeat the proce-
dure if positioning is inaccurate.
30
1 Bonding
1.5 Mode menu (O)
Software Manual A-1
1.5.12 MWC Wafertable <–> DCL Trafo
(O 52)
Scaling of the system by moving the wafer table
with the DCL tool at a standstill.
You must use this method of scaling for wafers and
gel packs, but not for waffle packs, because in the
latter case the wafer table is not used for posi-
tioning the chips.
You can perform scaling manually or automati-
cally.
The procedure is similar to that for Mode 1 (see
"1.5.1 DCL Camera Scale (O 1)" on page 1-18)
Automatic scaling
ÆClick on "Yes" in the "Automatic camera scale?"
window.
ÆUse the trackball to define the size of the refe-
rence pattern window for the search and click
the left mouse button to confirm.
I M P O R T A N T
For automatic scaling, select a sharply defi-
ned, uniquely identifiable point.
ÆUse the trackball to define the size of the search
window and click the left mouse button to con-
firm.
I M P O R T A N T
Observe the automatic scaling procedure, and
make sure that the system positions at this si-
gnificant point in each step. Repeat the proce-
dure if positioning is inaccurate.
The program automatically determines the scaling
factors by moving defined distances in X and Y and
then relocating the reference pattern.
The factors previously active are shown along with
the new factors at the bottom right of the screen.
ÆClick the "Yes" button to confirm the new factors
or click the "No" button to cancel the procedure:
Manual scaling
ÆClick on "No" in the "Automatic camera scale?"
window.
I M P O R T A N T
For manual scaling, select a unique, sharply
defined point on the substrate so that posi-
tioning is as accurate as possible.
ÆThe program expects you to move the cros-
shairs at the top left of the screen to the signifi-
cant point.
I M P O R T A N T
Always make sure that you position accurately
at the point you select, as otherwise the scaling
factor will not be computed correctly.
ÆClick "enter" to confirm that you have moved the
crosshairs to the point. The program moves the
camera a defined distance and expects that you
will again move the crosshairs (now at the top
right of the screen) to the significant pattern ori-
ginally marked.
ÆClick "enter" to confirm that you have moved the
crosshairs to the point.
ÆRepeat the procedure three times; the cros-
shairs will reappear at a different corner for each
repeat.
The program now calculates the scaling factors.
The factors previously active are shown along with
the new factors at the bottom right of the screen.
Æ Click the "Yes" button to confirm the new factors
or click the "No" button to cancel the procedure:
31
Software Manual A-1 1 Bonding
1.5 Mode menu (O)
1.5.13 MWC Camera <–> Tool Offset (O 53)
Trains the distance between the optical axis of one
of the two moving wafer cameras and the axis of
the DCL unit.
When you select this menu item the program
expects you to move the DCL unit to a significant
point.
ÆClick the left mouse button to confirm that you
have selected a point.
The program expects you to move the current
moving wafer camera to a significant point.
ÆClick the left mouse button to confirm that you
have selected a point.
The new offset is saved.
1.5.14 Option Lookup Camera Scale (O 60)
Scaling of the optical system of the optional fixed
lookup camera.
Determines the ratio between the resolution of the
camera and the measuring system of the coordina-
tes table. The correlation between one pixel in the
camera's image and µm of travel is computed.
You must train the base position (see " Lookup
Camera (option)" on page 1-117) and tool centre
(see " Data" on page 1-93) beforehand.
You can perform scaling manually or automati-
cally.
Automatic scaling
ÆUse the trackball to select a point that is as
uniquely identifiable and sharply focused as
possible and click the left mouse button to con-
firm.
ÆUse the trackball to define the size of the refe-
rence pattern window for the search and click
the left mouse button to confirm.
Manual scaling
I M P O R T A N T
For manual scaling, select a sharply defined
point on the substrate so that positioning is as
accurate as possible.
ÆThe program expects you to move the cros-
shairs at the top left of the screen to a significant
point.
I M P O R T A N T
Always make sure that you position accurately
at the point you select, as otherwise the scaling
factor will not be computed correctly.
ÆClick "enter" to confirm that you have moved the
crosshairs to the point. The program moves the
camera a defined distance and expects that you
will again move the crosshairs (now at the top
right of the screen) to the significant point origi-
nally marked. Click "enter" to confirm that you
have moved the crosshairs to the point.
ÆRepeat the procedure three times; the cros-
shairs will reappear at a different corner for each
repeat.
ÆPress "enter" to confirm (OK).
The factors previously active are shown along with
the new factors at the bottom right of the screen.
ÆClick the "Yes" button to confirm the new factors
or click the "No" button to cancel the procedure:
I M P O R T A N T
Observe the automatic scaling procedure, and
make sure that the system positions at this si-
gnificant point in each step. Repeat the proce-
dure if positioning is inaccurate.
The program automatically determines the scaling
factors by moving defined distances in X and Y and
then relocating the reference pattern.
The factors previously active are shown along with
the new factors at the bottom right of the screen.
Click the "Yes" button to confirm the new factors or
click the "No" button to cancel the procedure:
32
1 Bonding
1.6 Application Pages menu (A)
Software Manual A-1
Parameter Description /
Value range, unit
Name of the substrate type
S Index for current
substrate position
M Index for current
module position
1.6 Application Pages menu (A )
The "Application Pages" menu is for accessing
parameters affecting a particular application.
These include, for example, wafer-specific data,
substrate-specific data and the settings for pattern
recognition.
"Substrate Types (A 6)" also provides access to
the first five menu items, which are used creating
and configuring substrates.
"Production Data (A 9)" is for controlling the pro-
duction flow.
1.6.1 Substrate type (A6)
Menu for creating and configuring substrate types.
The register tabs take you to input masks that you
an also access from the "Application Pages" main
menu.
You can use the <PAGE UP> and <PAGE
DOWN> keys to switch from tab to tab.
„ Overview: See “Overview” on page 33.
„ Substrate Positions:
See “Substrate Position (A 1)” on page 35.
„ Module Positions: See “Module Position (A 2)”
on page 36.
„ Bond Positions:
See “Bond Position (A 3)” on page 37.
„ Epoxy Positions:
See “Epo Position (A 4)” on page 38.
„ Alignment:
See “Alignment (A 5)” on page 52.
Example for clarification of terms
Substrate type 1 Substrate type 2
Substrate type 1 consists of 4 substrates. The sub-
strate position is always the top left corner, marked
"°". Each pair of alignment points are marked "+".
Each substrate has 2 modules. The module posi-
tion is always the top left corner of the module.
Each module has 2 bond/EPO positions (indicated
by the black squares).
Substrate type 2 consists of 2 substrates. The sub-
strate position is always the top left corner, marked
"°". Each pair of alignment points are marked "+".
Each substrate has 1 module. The module position
is always the top left corner of the module. Each
module has 3 bond/EPO positions (indicated by
the black squares).
Parameters above the register tab
33
Software Manual A-1 1 Bonding
1.6 Application Pages menu (A)
Button Description
F5: Cancel Adj. Cancels adjustment
F9: MWC L. Off Switches off the light of the
moving wafer camera
fn+F7: Ins./Del.
insert: Insert the new data
record at the position of the cur-
rent data record
append: Append the new data
record after the current data
record
delete: Delete the current data
record
Parameter Description /
Value range, unit
B Index for current
bond position
E Index for current
epoxy position
A Index for current
alignment
Overview
Use the <PREVIOUS> and <NEXT> keys to
browse between substrate types.
Parameter
Parameter Description /
Value range, unit
Substrate type Name of the currently selected
name: substrate type
Number: Number of the currently selected
substrate type
Substrate Substrate
positions:
max: Number
current: Current index
Module positions: Modules on a substrate
max: Number
current: Current index
Bond positions: Bond positions
max: Number
current: Current index
Epo positions: Epoxy positions
max: Number
current: Current index
Alignments: Substrate alignments
max: Number
current: Current index
Checkbuttons
Checkbutton Description
Use Pickup Activates the pickup option for
transporting the substrate to/
from the oven
Buttons
Button Description
Pickup Data Accesses the parameters for
pickup (active only if the "Use
Pickup" check box is activated)
F4: Adjust Perform adjustment: scan and
centre the chip and save the
directional information.
34
1 Bonding
1.6 Application Pages menu (A)
Software Manual A-1
Parameter Description /
Value range, unit
Pickup Data
Pickup pos: X Coordinates of the pickup posi-
tion
µm
Y
Z
P Rotation of the pickup position
0,10 °
Pickup rampheight: Height as of which the speed of
Z the DCL unit is reduced as it
moves in the Z direction.
µm
Speeds Speeds
Ramp up speed Speed of the Z-axis for upward
ramp (ramp: range in which only
the Z-axis moves).
% of normal speed of the Z-axis
Ramp down speed Speed of the Z-axis for down-
ward ramp (ramp: range in
which only the Z-axis moves).
% of normal speed of the Z-axis.
Pickup delay Delay between pickup and the
start of the Z movement of the
DCL unit.
ms
Substrate Pickup Settings
Substrate types settings (A6) > Overview > Pickup
Parameter Description /
Value range, unit
Data
Parameters for pickup of the substrate, e.g. for
transport to/from the oven or from the indexer.
DCL (after pickup
delay)
Maximum time allowed for appli-
cation of DCL vacuum after the
"pickup delay". If overshot: Error
message
0: Function is inactive.
ms
Pickup
Dropdown menu Description
Pickup DCL Tool
Select
Parameter
Chip Control
Define how control is implemented for whether the
tool is carrying a chip.
C A U T I O N
In order to avoid malfunctions, chip con-
trol should be implemented with at least
the infrared sensor and/or a vacuum sen-
sor.
Checkbutton Description
Use IR Use the infrared sensor
Dropdown menu Description
No vac. check No check with vacuum sensor
Use Vacuum 1 Use vacuum level 1
Use Vacuum 2 Use vacuum level 2
Alignment
Checkbutton Description
Use Alignment Decision as to whether align-
ment is used for pickup
35
Software Manual A-1 1 Bonding
1.6 Application Pages menu (A)
Button Description
Bond Data Call up bond parameters.
F5: DCL Vacuum Switch the vacuum at the DCL
unit on or off.
F7: Pickup Pos Move to the pickup position
F9: ChipCntrl Move the DCL unit to the chip
control position.
F10: Move DCL Switch to trackball control for
moving the DCL unit using the
trackball. Press the "+" key to
increase the speed of move-
ment, or press the "–" key to
reduce the speed. Press "Shift"
to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
Buttons 1.6.2 Substrate Position (A 1)
View and modify the position of a substrate.
Use the <PREVIOUS> and <NEXT> keys to
browse between substrates.
Parameter
Parameter Description /
Value range, unit
Substrate number Number of the currently selected
substrate
Position X View the position trained for the
selected substrate.
µm
Y
DCL bondpos.
offset: dX
Offset for all bond positions for
this particular substrate (calibra-
tion) dY
Checkbuttons
Checkbutton Description
Skip If the check box for the selected
substrate is activated the sub-
strate in question is not proces-
sed, in other words epoxy
adhesive is not applied and no
chip is inserted.
fn+F1: Move To Move to the position
36
1 Bonding
1.6 Application Pages menu (A)
Software Manual A-1
Buttons 1.6.3 Module Position (A 2)
Button Description
fn+F7: Ins./Del.
insert: Insert the new data
record at the position of the cur-
rent data record
append: Append the new data
record after the current data
record
delete: Delete the current data
record
A substrate can consist of multiple modules. The
position is defined for each module.
Use the <PREVIOUS> and <NEXT> keys to
browse between modules.
Parameter
Parameter Description /
Value range, unit
Module number Number of the currently selected
module.
Position X Position of the selected module.
µm Y
Checkbuttons
Checkbutton Description
Skip If the checkbutton for the selec-
ted module is activated the
module in question is not pro-
cessed, in other words epoxy
adhesive is not applied and no
chip is inserted.
Buttons
Button Description
F2: Next Sub. Select next substrate, respec-
tively, and show values.
F3: Prev. Sub. Select previous substrate,
respectively, and show values.
37
Software Manual A-1 1 Bonding
1.6 Application Pages menu (A)
Button Description
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12).
fn+F1: Move To Move to the position
fn+F7: Ins./Del.
insert: Insert the new data
record at the position of the cur-
rent data record
append: Append the new data
record after the current data
record
delete: Delete the current data
record
1.6.4 Bond Position (A 3)
Bond parameters are displayed and can be modi-
fied.
Use the <PREVIOUS> and <NEXT> keys to
browse between bond positions.
Parameter
Parameter Description /
Value range, unit
Bond pos Number of the currently selected
number bond position.
Component Select the number of the wafer/
component that carries the
requisite chips.
Position X The X and Y coordinates of the
selected bond position.
µm
Y
Rotation° The P coordinate (rotation) of
the selected bond position.
°
Bond height Z The Z coordinate (height) of the
selected bond position.
µm
Ramp height Z Height above the touchdown
point (bond position), as of
which speed of the Z axis is
reduced.
µm
38
1 Bonding
1.6 Application Pages menu (A)
Software Manual A-1
Button Description
Adjust Perform adjustment: scan and
centre the chip and save the
directional information.
F1: Move To. Move to the selected position.
F2: Next Sub. Select next substrate , respec-
tively, and show values.
F3: Prev. Sub. Select previous substrate,
respectively, and show values.
F4: Next Mod. Select next module, respec-
tively, and show values.
F5: Prev. Mod. Select revious module, respec-
tively, and show values.
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12).
fn+F1: Move To Move to the position
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
fn+F7: Ins./Del.
insert: Insert the new data
record at the position of the cur-
rent data record
append Append the new data
record after the current data
record
delete Delete the current data
record
Buttons 1.6.5 Epo Position (A 4)
Define parameters for epoxy application.
Use the <PREVIOUS> and <NEXT> keys to
browse between EPO positions.
Parameter
Parameter Description /
Value range, unit
Epo pos number Number of the chip position cur-
rently selected for epoxy dispen-
sing.
Combined to DCL not active
pos
Offset to DCL pos
dX
Offset in X and Y of the pattern
for epoxy dispensing relative to
the DCL position
µm
dY
Ramp settings:
Ramp height up: Z Height above the point at which
the stamp dips into the squee-
gee unit, as of which the upward
speed of the Z axis is increased.
µm
Ramp height down: Height above the point at which
Z the stamp dips into the squee-
gee unit, as of which the down-
ward speed of the Z axis is
reduced.
µm
Ramp speed up Speed of the stamp from the
V [%] immersion point to the "Ramp
height up".
% of normal speed.
39
Software Manual A-1 1 Bonding
1.6 Application Pages menu (A)
Button Description
Adjust Perform adjustment: scan and
centre the chip and save the
directional information.
Stamp Parameter for epoxy application
with stamp
Dispense Parameter for epoxy application
with dispenser
F1: Move To. Move to the selected position.
F2: Next Sub. Select next substrate, respec-
tively, and show values.
F3: Prev. Sub. Select previous substrate and
show values.
F4: Next Mod. Select next module and show
values.
F5: Prev. Mod. Select previous module and
show values.
F8: Squeegee Switch squeegee on and off.
fn+F1: Move To Move dispenser or tool, as appli-
cable, to the position.
fn+F7: Ins./Del.
insert: Insert the new data
record at the position of the cur-
rent data record
append: Append the new data
record after the current data
record
delete: Delete the current data
record
Parameter Description /
Value range, unit
Stamp Parameters
Epo Position (A4) > Stamp
Ramp speed down
V [%]:
Buttons
Speed of the stamp from the
"Ramp height down" to the
immersion point.
% of normal speed.
Parameters for epoxy application with stamp
Use the <NEXT> button on the keyboard module
to select the next epoxy position or the
<PREVIOUS> button to select the previous posi-
tion.
The sketch illustrates the epoxy process in sche-
matic form.
Workheight
Ramp down Ramp up
Speed
ramp down
Position Z
Speed ramp up
Substrate
Delay
Parameter
Parameter Description /
Value range, unit
Stamp settings
Position: Z Height of the stamp position
µm
Rotation: P Defined rotation of the pattern to
be stamped
0,01°
Delays
40
1 Bonding
1.6 Application Pages menu (A)
Software Manual A-1
Parameter Description /
Value range, unit
Stamp delay Dwell time of the stamp on the
pattern
Ramp up delay Delay between arrival at the
"Ramp height up" position and
resumption of stamp movement.
The "Ramp up delay" prevents
strings of adhesive forming.
ms
Squeegee settings
Offset: Z Offset from squeegee position Z
in EPO Mach Data
µm
Button Description
F1: Cam. Pos Move crosshairs to the epoxy
position.
F2: Next Sub. Select next substrate, respec-
tively, and show values.
F3: Prev. Sub. Select previous substrate and
show values.
F4: Next Mod. Select next module and show
values.
F5: Prev. Mod. Select previous module and
show values.
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F8: Squeegee Switch squeegee on and off.
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
Dispenser Parameters
Epo Position (A4) > Dispenser
Parameters for epoxy application with dispenser
Buttons
Use the <NEXT> button on the keyboard module
to select the next epoxy position or the
<PREVIOUS> button to select the previous posi-
tion.
The sketch illustrates the epoxy process in sche-
matic form.
Workheight delay
Epoxy work height
Epoxy ramp down
Speed ramp down
Epoxy position Z
Substrate
Speed to workheight
Steps after dispensing
Epoxy ramp up
Speed ramp up
1 Dispenser steps
at start 2 Start delay 3 Dispense start
Point o line I line -
1 Dispense end 2 Dispenser steps
at end 3 End delay
Parameter
Parameter Description /
Value range, unit
Dispenser
settings
Position: Z Height of the dispenser position
µm
41
Software Manual A-1 1 Bonding
1.6 Application Pages menu (A)
Parameter Description /
Value range, unit
Workheight
settings
Epoxy Workheight: Height above the epoxy position,
Z as of which speed of the Z axis is
reduced on the downward
stroke.
µm
Workheight speed Speed on the upward stroke
until the „Ramp height up“ to
„Epoxy Workheight“
% of normal speed
Workheight delay Delay on the „Epoxy Work-
height“ position and resumption
of stamp movement.
The "Workheight delay" pre-
vents strings of adhesive for-
ming.
ms
Button Description
Type settings Parameters that are dependent
on the type of dispenser
Pattern settings Parameters for defining a dis-
pensing pattern (see " Pattern
settings" on page 1-45)
F1: Cam. Pos Move crosshairs to the epoxy
position.
F2: Next Sub. Select next substrate, respec-
tively, and show values.
F3: Prev. Sub. Select previous substrate and
show values.
F4: Next Mod. Select next module and show
values.
F5: Prev. Mod. Select previous module and
show values.
Button Description
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
Dropdown menu
Dropdown menu Description
Dispense time Definition of the type of dispen-
ser used (see " Type settings" on
page 1-41)
Dispense pattern Select a dispense pattern (see "
Pattern settings" on page 1-45)
Buttons
Type settings
Epo Position (A4) > Dispenser > Type settings
Parameters that are dependent on the "Dispenser
Type" dropdown menu
Possible dispenser types are
„ Spindle (see " Settings for the "Spindle" dispen-
ser type" on page 1-42)
„ Spindle (Air) (see " Settings for the "Spindle
(Air)" dispenser type" on page 1-43)
„ Needle Valve (see " Dispenser type "Needle
Valve" settings" on page 1-43)
„ Air Pressure (see " Settings for the "Air Pres-
sure" dispenser type" on page 1-44)
„ GL2A (see " Settings for the "GL2A" dispenser
type" on page 1-45)
42
1 Bonding
1.6 Application Pages menu (A)
Software Manual A-1
Button Description
Adjust Initiates an adjustment.
F1:Move Disp. Move the dispenser to its origi-
nal position.
F2: Next Sub. Select next substrate and show
values.
F3: Prev. Sub. Select previous substrate and
show values.
F4: Next Mod. Select next module and show
values.
F5: Prev. Mod. Select previous module and
show values.
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
fn+F1: Real Pos Move dispenser to the epoxy
position
fn+F7: Dispense Perform a dispensing cycle.
Settings for the "Spindle" dispenser type
Epo Position (A4) > Dispenser > Type settings
Parameters that are dependent on the "Dispenser
Type" dropdown menu
Parameter
Parameter Description /
Value range, unit
Middle delay Shutdown time for the compres-
sed after travel through the
"Steps at start".
ms
End delay Shutdown time for the compres-
sed air at the end of the row,
before travel through the "Steps
at end" commences.
ms
Buttons
Parameter Description /
Value range, unit
Steps Number of steps through which
the spindle is rotated during dis-
pensing.
Steps at start / end Number of steps through which
the spindle is rotated at the start
and end, respectively, to apply
more epoxy adhesive at the cor-
responding positions.
Air-Spindle delay Delay for start of spindle move-
ment after the compressed air is
applied.
ms
Tear off steps Number of steps through which
the spindle is rotated back at the
end of each row, in order to keep
thin adhesives from dripping.
Tear off offset Distance travelled back at the
end of the row.
% of the distance travelled along
the row
Delays
Start delay Delay preceding application of
the compressed air at the start of
the row, before travel through
the "Steps at start" commences.
ms
43
Software Manual A-1 1 Bonding
1.6 Application Pages menu (A)
Button Description
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
fn+F1: Real Pos Move dispenser to the epoxy
position
fn+F7: Dispense Perform a dispensing cycle.
Settings for the "Spindle (Air)" dispenser type
Epo Position (A4) > Dispenser > Type settings
Parameters that are dependent on the "Dispenser
Type" dropdown menu
Parameter
Parameter Description /
Value range, unit
Steps with air Number of steps with compres-
sed air ON through which the
spindle is rotated during dispen-
sing.
Steps without air Number of steps with compres-
sed air OFF through which the
spindle is rotated during dispen-
sing.
Air-Spindle delay Delay for start of spindle move-
ment after the compressed air is
applied.
ms
Buttons
Dispenser type "Needle Valve" settings
Similar to the dispenser type "Air Pressure" set-
tings.
This dispenser type has only one valve. The adhe-
sive is continuously under the pressure of the com-
pressed air.
Button Description
Adjust Initiates an adjustment.
F1:Move Disp. Move the dispenser to its origi-
nal position.
F2: Next Sub. Select next substrate and show
values.
F3: Prev. Sub. Select previous substrate and
show values.
F4: Next Mod. Select next module and show
values.
F5: Prev. Mod. Select previous module and
show values.
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Button Description
Adjust Initiates an adjustment.
F1:Move Disp. Move the dispenser to its origi-
nal position.
F2: Next Sub. Select next substrate and show
values.
F3: Prev. Sub. Select previous substrate and
show values.
F4: Next Mod. Select next module and show
values.
F5: Prev. Mod. Select previous module and
show values.
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
fn+F1: Real Pos Move dispenser to the epoxy
position
fn+F7: Dispense Perform a dispensing cycle.
Settings for the "Air Pressure" dispenser type
Epo Position (A4) > Dispenser > Type settings
Parameters that are dependent on the "Dispenser
Type" dropdown menu
Dispenser with compressed air valve upstream of
the adhesive and a valve that opens and closes the
dispenser.
The meanings of the parameters vary, depending
on whether "Rectangle" was selected in the "Dis-
pense pattern" dropdown menu.
Parameters (rectangle selected)
Parameter Description /
Value range, unit
Delays
Start delay Idle time with valve ON at the
start
ms
End delay Idle time with valve OFF at the
end
ms
Edge delay Time for travelling along one
edge of the rectangle
ms
Parameters (rectangle not selected)
Buttons
Parameter Description /
Value range, unit
Delays
Start delay Compressed-air time
ms
End delay Idle time with valve OFF at the
end
ms
Edge delay No meaning
ms
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Button Description
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
fn+F1: Real Pos Move dispenser to the epoxy
position
fn+F7: Dispense Perform a dispensing cycle.
Button Description
Adjust Initiates an adjustment.
F1:Move Disp. Move the dispenser to its origi-
nal position.
F2: Next Sub. Select next substrate and show
values.
F3: Prev. Sub. Select previous substrate and
show values.
F4: Next Mod. Select next module and show
values.
F5: Prev. Mod. Select previous module and
show values.
Settings for the "GL2A" dispenser type
Epo Position (A4) > Dispenser > Type settings
Parameters that are dependent on the "Dispenser
Type" dropdown menu
This dispenser can dispense only spots with a uni-
form quantity of adhesive. The adhesive is conti-
nuously under the pressure of the compressed air.
A metering chamber is alternately filled with adhe-
sive and emptied in the metered application pro-
cess.
Parameter
Parameter Description /
Value range, unit
Delays
Start delay time
ms
Middle delay Not yet used
ms
End delay Idle time
ms
Buttons
Pattern settings
Epo Position (A4) > Dispenser > Pattern settings
Parameters that are dependent on the "Dispense
Pattern" selected
„ Point: Single spot (see " Dispenser Pattern
Point Settings" on page 1-46)
„ Point Matrix: Spots arranged in a matrix (see "
Settings for the "Point Matrix" dispenser pattern"
on page 1-46)
„ Horizontal Line: Dispense along a line parallel to
the X-axis (see " Settings for the "Horizontal/
Vertical Line" dispenser pattern" on page 1-47)
„ Vertical Line: Dispense along a line parallel to
the Y-axis (see " Settings for the "Horizontal/
Vertical Line" dispenser pattern" on page 1-47)
„ General Lines: Dispense a freely selectable
number of lines with any angle of rotation (see "
Settings for the "General Lines" dispenser pat-
tern" on page 1-48)
„ Cross: Dispense in two lines intersecting to form
a cross (see " Settings for the "Cross Settings"
dispenser pattern" on page 1-49)
„ 5 points: Dispense 5 spots arranged like the
spots on the face of a die (see " Settings for the
"5Dots (GL2A" dispenser pattern" on page 1-50)
„ Circle: Dispense along the arc of a circle (see "
Settings for the "Circle" dispenser pattern" on
page 1-51)
„ Rectangle: Dispense along a rectangle (see "
Settings for the "Rectangle" dispenser pattern"
on page 1-52)
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Software Manual A-1
Parameter Description /
Value range, unit
Length / Width Length in X and width in Y of the
dispensing pattern
µm
Angle Rotational angle of the pattern
0,01°
Lines / Columns Number of and columns
Speed Speed
% of normal speed
Acceleration Acceleration
% of normal acceleration
Button Description
Adjust Initiates an adjustment.
F1: Cam. Pos Move crosshairs to the epoxy
position
F2: Next Sub. Select next substrate and show
values.
F3: Prev. Sub. Select previous substrate and
show values.
F4: Next Mod. Select next module and show
values.
F5: Prev. Mod. Select previous module and
show values.
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
fn+F1: Real Pos Move dispenser to the epoxy
position
fn+F7: Dispense Perform a dispensing cycle.
Dispenser Pattern Point Settings
Epo Position (A4) > Dispenser > Pattern settings
Parameters for dispensing a point
Parameter
Parameter Description /
Value range, unit
Speed Speed
set this value to 100%
% of normal speed
Acceleration Acceleration
set this value to 100%.
% of normal acceleration
Settings for the "Point Matrix" dispenser pat-
tern
Epo Position (A4) > Dispenser > Pattern settings
Parameters for dispensing points in a matrix pat-
tern
Parameter
Buttons
Buttons
Button Description
Adjust Perform adjustment
F1: Cam. Pos Move crosshairs to the epoxy
position
F2: Next Sub. Select next substrate and show
values.
F3: Prev. Sub. Select previous substrate and
show values.
F4: Next Mod. Select next module and show
values.
F5: Prev. Mod. Select previous module and
show values.
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1.6 Application Pages menu (A)
Button Description
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
fn+F1: Real Pos Move dispenser to the epoxy
position
fn+F7: Dispense Perform a dispensing cycle.
Settings for the "Horizontal/Vertical Line" dis-
penser pattern
Epo Position (A4) > Dispenser > Pattern settings
Parameters for dispensing along a horizontal or
vertical line.
Parameter
Parameter Description /
Value range, unit
Length / Width Length and height of the dispen-
sing pattern
µm
Speed Speed
set this value to 100%.
% of normal speed
Acceleration Acceleration
set this value to 100%.
% of normal acceleration
Buttons
Button Description
Adjust Initiates an adjustment.
F1: Cam. Pos Move crosshairs to the epoxy
position
F2: Next Sub. Select next substrate and show
values.
F3: Prev. Sub. Select previous substrate and
show values.
F4: Next Mod. Select next module and show
values.
F5: Prev. Mod. Select previous module and
show values.
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Software Manual A-1
Button Description
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
fn+F1: Real Pos Move dispenser to the epoxy
position
fn+F7: Dispense Perform a dispensing cycle.
Button Description
Adjust Initiates an adjustment.
F1: Cam. Pos Move crosshairs to the epoxy
position
F2: Next Sub. Select next substrate and show
values.
F3: Prev. Sub. Select previous substrate and
show values.
F4: Next Mod. Select next module and show
values.
F5: Prev. Mod. Select previous module and
show values.
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
fn+F1: Real Pos Move dispenser to the epoxy
position
fn+F7: Dispense Perform a dispensing cycle.
Buttons
Settings for the "General Lines" dispenser pat-
tern
Epo Position (A4) > Dispenser > Pattern settings
Parameters for dispensing a freely selectable
number of lines with any angle of rotation
Parameter
Parameter Description /
Value range, unit
Length / Width Length in X and width in Y of the
dispensing pattern
µm
Angle Rotational angle of the dispen-
sing pattern
0,01°
Lines Number of lines
Speed Speed
set this value to 100%.
% of normal speed
Acceleration Acceleration
set this value to 100%.
% of normal acceleration
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1.6 Application Pages menu (A)
Button Description
F3: Prev. Sub. Select previous substrate and
show values.
F4: Next Mod. Select next module and show
values.
F5: Prev. Mod. Select previous module and
show values.
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
fn+F1: Real Pos Move dispenser to the epoxy
position
fn+F7: Dispense Perform a dispensing cycle.
Settings for the "Cross Settings" dispenser
pattern
Epo Position (A4) > Dispenser > Pattern settings
Parameters for dispensing in two lines intersecting
to form a cross.
Parameter
Parameter Description /
Value range, unit
Length / Width Length in X and width in Y of the
dispensing pattern
µm
Angle Rotational angle of the dispen-
sing pattern
0,01°
Diameter Diameter of the centre that
remains clear of adhesive.
µm
Speed Speed
set this value to 100%.
% of normal speed
Acceleration Acceleration
set this value to 100%.
% of normal acceleration
Dropdown menu
Dropdown menu Description
Dispense pattern Broken: The lines are interrup-
ted in the middle
Solid: Unbroken lines
Buttons
Button Description
Adjust Perform adjustment
F1: Cam. Pos Move crosshairs to the epoxy
position
F2: Next Sub. Select next substrate and show
values.
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Software Manual A-1
Button Description
F2: Next Sub. Select next substrate and show
values.
F3: Prev. Sub. Select previous substrate and
show values.
F4: Next Mod. Select next module and show
values.
F5: Prev. Mod. Select previous module and
show values.
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
fn+F1: Real Pos Move dispenser to the epoxy
position
fn+F7: Dispense Perform a dispensing cycle.
Settings for the "5Dots (GL2A" dispenser pat-
tern
Epo Position (A4) > Dispenser > Pattern settings
Parameters for dispensing 5 spots arranged like
the spots on the face of a die
Parameter
Parameter Description /
Value range, unit
Length / Width Length in X and width in Y of the
dispensing pattern.
µm
Angle Rotational angle of the dispen-
sing pattern.
0,01°
Repetitions Repeats of the central point
(GL2A only)
Offset Z moves this offset further from
the substrate for each repeat
(GL2A only)
Factor Use a start delay multiplied by
this factor instead of the ordinary
start delay (GL2A only)
%
Speed Speed
set this value to 100%.
% of normal speed
Acceleration Acceleration
set this value to 100%.
% of normal acceleration
Buttons
Button Description
Adjust Perform adjustment
F1: Cam. Pos Move crosshairs to the epoxy
position
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Software Manual A-1 1 Bonding
1.6 Application Pages menu (A)
Button Description
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
fn+F1: Real Pos Move dispenser to the epoxy
position
fn+F7: Dispense Perform a dispensing cycle.
Settings for the "Circle" dispenser pattern
Epo Position (A4) > Dispenser > Pattern settings
Parameters for dispensing a circle
Parameter
Parameter Description /
Value range, unit
Radius Radius of the circle
µm
Start Angle Starting angle of the dispensing
pattern
0,01°
Curve Angle Angle of movement
0,01°
Speed Speed
Set this value to 100%.
% of normal speed
Acceleration Acceleration
Set this value to 100%.
% of normal acceleration
Buttons
Button Description
F1: Cam. Pos Move crosshairs to the epoxy
position
F2: Next Sub. Select next substrate and show
values.
F3: Prev. Sub. Select previous substrate and
show values.
F4: Next Mod. Select next module and show
values.
F5: Prev. Mod. Select previous module and
show values.
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Software Manual A-1
Parameter Description /
Value range, unit
Length / Width Length in X and width in Y of the
dispensing pattern.
µm
Duration horiz. / Duration of the horizontal or ver-
vert. tical movement.
ms
Acceleration Duration of acceleration
duration ms
Settings for the "Rectangle" dispenser pattern
Epo Position (A4) > Dispenser > Pattern settings
Parameters for dispensing a rectangle
Parameter
1.6.6 Alignment (A 5)
Settings for substrate adjustment.
Use the <PREVIOUS> and <NEXT> keys to
browse between alignments.
Adjustment at two substrate positions is necessary
in order to achieve unambiguous definition of the
substrate's position and orientation.
You can use any combination of the four possible
search modes. Use the Dropdown-Menüs behind
"Characteristic 1" and "Characteristic 2" to select any
of the following search modes:
„ Ordinary Alignment: structure search, see
page 1-56
„ Edge Search: edge search, see page 1-59
„ Circle Center Finder: find circle center using
three user-defined points, see page 1-66
„ Hole Finder: find hole, see page 1-70
„ No Operation: Characteristic is not active
Use the Dropdown-Menü behind "Transformation"
to select one of the following transformations:
„ Standard: standard transformation
„ Shift+Rotate (1st): An offset is calculated from
the position of the first point. The position of the
second point is obtained as a rotational offset
described around the first point as the centre.
„ Shift+Rotate (2nd): An offset is calculated from
the position of the second point. The position of
the first point is obtained as a rotational offset
described around the second point as the cen-
tre.
„ Single Edge Search: Transformation with only
one adjust point for the edge search.
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1.6 Application Pages menu (A)
Button Description
Align Data 1/2 Parameters for substrate align-
ment characteristic 1/2 see
page 1-55
Ink Dot Parameters for inkdot searchsee
page 1-53
Focus/Light/Skip/ The parameters defined in the
Pos.transfer Global Data apply to alignment
and the inkdot search only if the
"Global Focus / Light" checkbut-
ton is activated in the configura-
tion settings (basic setting, see
page 1-140). If this precondition
is not satisfied alignment is sub-
ject to the focus and light set-
tings defined in the submenus of
the applicable search mode.
Irrespective of the configuration
settings, the settings defined
here are always active for
viewing the bond points with the
EPO or DCL camera see
page 1-54.
fn+F7: Ins./Del.
insert: Insert the new data
record at the position of the cur-
rent data record
append: Append the new data
record after the current data
record
delete: Delete the current data
record
Parameter
Parameter Description /
Value range, unit
Alignment The number of the alignment
Buttons
Substrate Adjustment Ink Dot
Alignment (A 5) > Ink Dot
Parameters for inkdot search.
Parameter
Parameter Description /
Value range, unit
Ink Date
Task Id The number of the task
Position X Coordinates of the position
pixels Y
Window size DX Size of the area for the search to
locate the inkdot on the sub-
strate.
pixels
DY
Threshold Greyscale threshold as of which
a pixel is identified as white or
black. The lower the value, the
more dark pixels will be assi-
gned to the white range.
0..255 (black..white)
Limit Limit for the proportion of white
pixels in the ink window. A value
lower than this threshold is inter-
preted as indicating that the chip
is inked. A value higher than this
threshold is interpreted as indi-
cating that the chip is OK.
0..100 % white.
Focus Height DCL Focusing height of the DCL unit.
µm
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1.6 Application Pages menu (A)
Software Manual A-1
Button Description
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12)
F4: Search Perform pattern recognition for
substrate recognition. You can
use this function to check whe-
ther the parameter settings per-
mit correct pattern recognition.
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F8: Show ink Show the inkdot
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
Parameter Description /
Value range, unit
Light DCL 1 Brightness of the vertical direct
light for illuminating the sub-
strate at the DCL unit.
0..255
Light DCL 2 Brightness of the LED ring obli-
que light for illuminating the sub-
strate at the DCL unit.
0..255
Checkbuttons
Checkbutton Description
Inkpoint color If this checkbutton is activated
the search is for a white instead
of a black inkdot.
Use module ink If this checkbutton is activated
an inkdot search can be used.
Buttons
Global Data:
Alignment (A 5) > Global Data
The parameters defined for focus height and light
in the Global Data apply to alignment and the
inkdot search only if the "Global Focus / Light"
checkbutton is activated in the configuration set-
tings ((Service 5, PRU Settings), See "1.8.4 Confi-
guration (S 5)" on page 1-140). If this precondition
is not satisfied alignment is subject to the focus
and light settings defined in the submenus of the
applicable search mode. Irrespective of the confi-
guration settings, the settings defined here are
always active for viewing the bond points with the
DCL camera.
Parameter
Parameter Description /
Value range, unit
Focus Height DCL Focusing height of the DCL unit.
µm
Light DCL 1 Brightness of the vertical direct
light for illuminating the sub-
strate at the DCL unit.
0..255
Light DCL 2 Brightness of the LED ring obli-
que light for illuminating the sub-
strate at the DCL unit.
0..255
Position
Transfer Data
Substrate Number
Point 1
Numbers of the three substrates
whose characteristic 1 will be
used for coordinate transfer from
the EPO unit to the DCL unit.
Select substrates that come as
close as possible to forming a
right-angled Isosceles triangle.
Point 2
Point 3
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Software Manual A-1 1 Bonding
1.6 Application Pages menu (A)
Button Description
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12)
F5: Cancel Adj. Discard the alignment data
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F7: Adjust Perform adjustment: scan and
centre the chip and save the
directional information.
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
Parameter Description /
Value range, unit
Align Data 1/2
Alignment (A5) > Align Data 1/2
Auto skip counter
consecutive/total
Buttons
Number of maximum permitted/
consecutive failed alignment
attempts. An error message is
issued if this limit is overshot.
0: Function is inactive
The input mask displayed varies, depending on
which search mode is selected.
„ Ordinary Alignment,
See " Alignment data for the Ordinary Alignment
search mode" on page 1-56
„ Single Edge Search,
See " Alignment data for Edge Search search
mode" on page 1-59
„ Circle Center Finder,
See " Alignment data for the Circle Center Fin-
der search mode" on page 1-66
„ Hole Finder,
See " Alignment data for the Hole Finder search
mode" on page 1-70
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Software Manual A-1
Parameter Description /
Value range, unit
Search area
width / height DX
Width and height of the area for
the search to locate the pattern.
Always make sure that the ent-
ries are higher than those for
"Search model width / height".
pixels
DY
Acceptance DCL Quality of the search.
Defines the accuracy of the
match required for acceptance
of the search outcome.
[0..999] = 0..99.9 %
Confusion DCL If the acceptance requirements
are satisfied by more than one
search result, the match repre-
sented by the value entered
here must be achieved or bette-
red for the pattern to be identi-
fied. Always make sure that the
entry is higher than that for
"Acceptance".
[0..999] = 0..99.9 %
Focus Height DCL Focusing height of the DCL unit.
Effective only when the "Global
Focus / Light" checkbutton is not
activated in the configuration
settings (See "1.8.4 Configura-
tion (S 5)" on page 1-140).
µm
Light DCL 1 Brightness of the vertical direct
light for illuminating the sub-
strate at the DCL unit. Effective
only when the "Global Focus /
Light" checkbutton is not activa-
ted in the configuration settings
(See "1.8.4 Configuration (S 5)"
on page 1-140).
0..255
Light DCL 2 Brightness of the LED ring obli-
que light for illuminating the sub-
strate at the DCL unit. Effective
only when the "Global Focus /
Light" checkbutton is not activa-
ted in the configuration settings
(See "1.8.4 Configuration (S 5)"
on page 1-140).
0..255
Alignment data for the Ordinary Alignment
search mode
Alignment (A5) > Align Data 1/2
Parameters for structure search.
You can use the <PAGE UP>/
<PAGE DOWN>buttons to toggle between cha-
racteristics.
Parameter
Parameter Description /
Value range, unit
Adjustment charac-
teristics:
No.: The number of the characteristic
1..2
Task Id The number of the task
Alignment point X X and Y coordinates for the
search for the position moved to.
To train:
-Click in the X field
-<F10> to activate the trackball
for moving the wafer camera
-Move to the point
-<F10> -<F6>
µm
Y
Search model
width / height DX
Area in X and Y in which the
search for the hole edges will
take place. Size the area in such
a way that the edges of the hole
are just inside it.
pixels
DY
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1.6 Application Pages menu (A)
Buttons
Button Description
DCL parameters Call up DCL parameters for the
alignment point in question.
EPO parameters Call up EPO parameters for the
alignment point in question.
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12)
F3: Train Train the selected search pat-
terns.
F4: Search Perform pattern recognition for
substrate recognition. You can
use this function to check whe-
ther the parameter settings per-
mit correct pattern recognition.
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
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1.6 Application Pages menu (A)
Software Manual A-1
Button Description
F7: Show Model Show ordinary alignment model
("Optional search feature" must
be activated in "Flags").
F8: Small Model Show the search model in the
size originally trained.
F9: Cleanup Show the original image.
F10: Adj. Value Change the position or size of
the area marks on the screen,
using the trackball or the cursor
keys.
Press "F10" again to toggle back
to the mouse function.
DCL parameters for "Ordinary Alignment"
search mode
Alignment (A5) > Align Data 1/2 > DCL-Parameter
Parameter
Parameter Description /
Value range, unit
General:
Angle range: Permissible rotation of the
search models by comparison
with the reference image.
0.1 °, 0 = deactivated.
Angle increment: Distance between two search
models within Angle range.
0,1 °
Freemask area X Position and size of a range,
which is excluded from the
search
µm
Y
Dx
Dy
Checkbuttons
Checkbutton Description
Rotation Should always be activated.
Permits search models to be
rotated for the structure search
Invers If this checkbox is marked, the
structure search takes place
inside the mask.
Buttons
Checkbutton Description
Mask edges: Multiple marks are possible.
None No masking
North Top half of the screen.
East Right half of the screen.
South Bottom half of the screen.
West Left half of the screen.
Freemask The mask is defined by coordi-
nates (freemask area).
Mask options
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Parameter Description /
Value range, unit
Confusion If the acceptance requirements
are satisfied by more than one
search result, the match repre-
sented by the value entered
here must be achieved or bette-
red for the pattern to be identi-
fied. Always make sure that the
entry is higher than that for
"Acceptance".
[0..999] = 0..99.9 %
Focus Height DCL Focusing height of the DCL/EPO
unit. Effective only when the
"Global Focus / Light" checkbut-
ton is not activated in the confi-
guration settings (See "1.8.4
Configuration (S 5)" on page 1-
140).
µm
Light DCL 1 Brightness of the vertical direct
light for illuminating the sub-
strate at the DCL unit. Effective
only when the "Global Focus /
Light" checkbutton is not activa-
ted in the configuration settings
(See "1.8.4 Configuration (S 5)"
on page 1-140)
0..255
Light DCL 2 Brightness of the LED ring obli-
que light for illuminating the sub-
strate at the DCL unit. Effective
only when the "Global Focus /
Light" checkbutton is not activa-
ted in the configuration settings
(See "1.8.4 Configuration (S 5)"
on page 1-140)
0..255
Parameter Description /
Value range, unit
Adjustment charac-
teristics:
No.: The number of the characteristic
1..2
Task Id: DCL The number of the task
Alignment point X X and Y coordinates for the
search for the position moved to.
To train:
-Click in the X field
-<F10> to activate the trackball
for moving the wafer camera
-Move to the point
-<F10> -<F6>
µm
Y
Acceptance Quality of the search.
Defines the accuracy of the
match required for acceptance
of the search outcome.
[0..999] = 0..99.9 %
Alignment data for Edge Search search mode
Alignment (A5) > Align Data 1/2
An edge search is performed in two steps:
„ Structure search for approximate positioning
„ Edge search
Parameters for edge search
Parameter
Buttons
Button Description
DCL parameters Call up DCL parameters for the
alignment point in question.
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12).
F3: Train Train the selected search pat-
terns.
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Button Description
F4: Search Perform pattern recognition for
substrate recognition. You can
use this function to check whe-
ther the parameter settings per-
mit correct pattern recognition.
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
Edge search parameters for the alignment point
Alignment (A5) > Align Data 1/2 > DCL-Parameter
Parameter
Parameter Description /
Value range, unit
Edge window:
Upper left corner
X0
Top left corner of the search win-
dow for the edge search.
pixels Y0
width / height DX Size (width/height) of the search
window for the edge search.
pixels
DY
Angle P Skew of the search window for
the edge search.
Search Model: Used for approximating the posi-
tions of the edges.
Upper left corner
X0
Top left corner of the search
area for the initial search.
pixels Y0
width / height DX Size (width/height) of the search
area for the initial search.
pixels
DY
Search Area:
Upper left corner
X0
Top left corner of the search
area for the initial search.
pixels Y0
width / height DX Size (width/height) of the search
area for the initial search.
pixels
DY
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Parameter Description /
Value range, unit
Trained Point
X Coordinates of a trained point.
(Display only)
µm/ °
Y
P
Reference Point
X Coordinates of a reference
point. (Display only)
µm
Y
Free Point
X Coordinates of a freely selecta-
ble point inside or on the edges
(only if, in the "Flags for Edge
Search" window, "Result type"
"Free Point" is activated).
µm
Y
Button Description
Flags Show the window for defining
the edge search (see " Flags for
edge search" on page 1-61)
Caliper Call up caliper parameters see
page 1-64
Mask Settings Call up mask parameters for
hiding error sources see page 1-
65
F3: Train Train the selected search pat-
terns.
F4: Search Perform pattern recognition for
substrate recognition. You can
use this function to check whe-
ther the parameter settings per-
mit correct pattern recognition.
F7: Show Model Show the model (zoomed to
camera-image size).
F8: Small Model Show a small model.
F9: Cleanup Clear the screen.
F10: Adj. Value Change the position or size of
the area marks on the screen,
using the trackball or the cursor
keys.
Press "F10" again to toggle back
to the mouse function.
Buttons
Flags for edge search
Alignment (A5) > Align Data 1/2 > DCL-Parameter
> Flags
Checkbuttons
Checkbutton Description
Calipers type
Search from inside The direction of the edge search
to outside along the caliper is from the
inside to the outside (otherwise,
the search is from the outside
toward the inside).
Testable edges
Top Position of the edge to be detec-
Right ted. If, for example, the top left
Bottom corner is to be detected, mark
Left the Top and Left checkbuttons.
Edge type Expected contrast transition.
dark to light Dark-to-light edge transition.
light to dark Light-to-dark edge transition.
don’t care Any edge transition
Score criteria:
Contrast edge Use the strongest edge transi-
tion for edge identification.
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Checkbutton Description
Position Use the contrast transition that is
nearest to the defined point and
crosses the contour threshold.
Absolute position Use the contrast transition that is
furthest from the start of the cali-
per and crosses the contour
threshold.
Calc line by
extreme value:
None The extreme value to be used to
Top calculate an edge.
Right
Bottom
Left
General search
mode
Optional search Initial structure search (should
feature always be activated)
old style line impro- Cease usage as of now
vement (compatibility)
Result type Possible results
(corner)
Upper left The corresponding corners
Upper right
Lower right
Lower left
Center Middle point
Free point Freely definable point on the
boundary or inside the edges
Free point at corner If an edge is not found, the result
is interpolated from the edges
found.
Result options
90° corners The corners found must be 90°
corners, or they will be rejected
(set permissible deviation in the
"Calipers for Edge Search" win-
dow with the "90° Error" parame-
ter).
Calc missing If at least two edges are found,
corners all corners are extrapolated from
these edges.
Use max. extreme
value:
Upper Left Use the maximum extreme
Upper Right value
Lower Right
Lower Left
Buttons Button Description
Optional
Parameters
Call up optional parameters for
vertical corners
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Checkbutton Description
Search from inside Perform edge search from the
to outside inside toward the outside.
Edge type
dark to light Detect dark-to-light edge transi-
tion.
light to dark Detect light-to-dark edge transi-
tion.
don’t care Detect any transition.
Score criteria:
Contrast edge If there are two or more edge
transitions, use the strongest for
edge identification.
Position Use the contrast transition that is
nearest to the defined point and
crosses the contour threshold.
Absolute position Use the contrast transition that is
furthest from the start of the cali-
per and crosses the contour
threshold.
Optional Parameters
Alignment (A5) > Align Data 1/2 > DCL-Parameter
> Flags > Optional Parameters
Separate the properties of the two horizontal
edges from the properties of the two vertical
edges.
Parameter
Parameter Description /
Value range, unit
Settings:
Found pt: The minimum percentage of
points that has to be found
before an edge is accepted as
valid.
%
Error dist.: If the distance from the point to
the line found in the search is
greater than this, the point is
marked as not found.
Cntr.threshold: Difference in contrast with the
surrounding area at which an
edge is recognised.
The higher the value, the more
unequivocal the result.
%
Checkbuttons
Checkbutton Description
Flags:
Calipers type: Two or more checkbuttons can
be activated
Use optional para- The parameters defined in this
meter screen will be used.
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Parameter Description /
Value range, unit
Filtersize X Width of the filter in X/Y direc-
tion. Points further away from
the centre of the filter are taken
into consideration to a lesser
extent. The wider the filter the
less sensitive it is to noise, but
the edge search, too, becomes
progressively less sensitive.
[0..5] pixel
Y
Filtercenter X Width of the centre of the filter.
[0..2] pixels Y
Found pt: The minimum percentage of
points that has to be found
before an edge is accepted as
valid.
%
Error dist.: If the distance from the point to
the line found in the search is
greater than this, the point is
marked as not found.
Cntr.threshold: Threshold as of which a diffe-
rence in contrast along a caliper
becomes a candidate for the
edge.
The higher the value the smaller
the number of candidates per
caliper for an edge.
see page 1-61 "Score criteria"
90° Error: Permissible deviation for a 90°
corner (only if the "90° Corner"
parameter is activated in the
"Flags for Edge Search" win-
dow).
0,1°
Calipers for edge search
Alignment (A5) > Align Data 1/2 > DCL-Parameter
> Flags > Calipers
Calipers (search lines) are lines normal to an edge
along which a search is conducted for a significant
brightness transition in order to identify the position
of the edge.
The entire measuring area is divided up uniformly
by the number of calipers defined in the "total"
field.
The entries in the "start" and "end" fields restrict
the measuring area. If the value of "start" is lower
than the value of "end", the area between the two
is the restricted measuring area. If the value of
"start" is greater than the value of "end", the two
outside areas are used as the restricted measuring
area.
Parameter
Parameter Description /
Value range, unit
Calipers Ranges:
Left Line: Restrict the measuring area for
the left edge
Upper Line: Restrict the measuring area for
the top edge
Right Line: Restrict the measuring area for
the right edge
Lower Line: Restrict the measuring area for
the bottom edge
Settings:
Length X Length of the caliper in X/Y
direction.
pixels
Y
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Button Description
F7: Show Model Show the model (zoomed to
camera-image size).
F8: Small Model Show a small model.
F9: Cleanup Clear the screen.
F10: Adj. Value Change the position or size of
the area marks on the screen,
using the trackball or the cursor
keys.
Press "F10" again to toggle back
to the mouse function.
Masks for edge search
Alignment (A5) > Align Data 1/2 > DCL-Parameter
> Mask Settings
Mask used to exclude ranges within the search
model in which errors could occur from the search.
Checkbutton Description
Freemask The mask is defined by coordi-
nates (mask area).
Circular The mask is circular.
Parameter
Parameter Description /
Value range, unit
Mask area:
Upper left corner
X0
Top left corner of the mask.
pixels Y0
Width / Height DX Size (width/height) of the mask.
pixels DY
Checkbuttons
Buttons
Checkbutton Description
Mask options
Rotation Should always be activated.
Permits search models to be
rotated for the structure search.
Invers If this checkbox is marked, the
structure search takes place
inside the mask.
Mask edges: Multiple marks are possible.
North The top half of the screen is
masked.
East The right half of the screen is
masked.
South The bottom half of the screen is
masked.
West The left half of the screen is
masked.
Angle Masking of the edges produced
by rotation of the search model.
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Parameter Description /
Value range, unit
Light DCL 2 Brightness of the LED ring obli-
que light for illuminating the sub-
strate at the DCL unit. Effective
only when the "Global Focus /
Light" checkbutton is not activa-
ted in the configuration settings
(See "1.8.4 Configuration (S 5)"
on page 1-140)
0..255
Trained
middlepoint
X Coordinates of the trained
circle's centre. Value is calcula-
ted and displayed only when the
"Train Middlepoint" button is
pressed.
µm
Y
Button Description
Train Middlepoint Calculate centre of circle using
the three defined alignment
points. The X and Y coordinates
of the centre calculated in this
way are shown after "Train
Middlepoint".
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12)
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
Alignment data for the Circle Center Finder
search mode
Alignment (A5) > Align Data 1/2 > General
Parameters for calculating the centre of the circle
In the"Circle Center Finder" mode the system
attempts to find the edge of a circle along two hori-
Checkbuttons
Checkbutton Description
zontal and vertical search lines, in order to com-
pute the centre of the circle.
Parameter
Buttons
Multipoint approach
Multiple points are used to define the edge of the circle,
instead of only two points.
Parameter Description /
Value range, unit
Adjustment charac-
teristics:
No.: The number of the characteristic
1..2
Focus Height DCL Focusing height of the DCL unit.
Effective only when the "Global
Focus / Light" checkbutton is not
activated in the configuration
settings (See "1.8.4 Configura-
tion (S 5)" on page 1-140)
µm
Light DCL 1 Brightness of the vertical direct
light for illuminating the sub-
strate at the DCL unit. Effective
only when the "Global Focus /
Light" checkbutton is not activa-
ted in the configuration settings
(See "1.8.4 Configuration (S 5)"
on page 1-140)
0..255
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Button Description
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
Alignment Point 1/2/3
Alignment (A5) > Align Data 1/2 > Point 1/2/3
Parameter
Parameter Description /
Value range, unit
Adjustment charac-
teristics:
No.: The number of the characteristic
1..2
Task Id The number of the task
Alignment point 1/
2/3
X X and Y coordinates of the cen-
tre of the window in which the
search for the circle edge will
take place.
µm
Y
Test area
width / height DX
Area in X and Y in which the
search for the circle edge will
take place.
pixels
DY
Buttons
Button Description
DCL parameters Call up DCL parameters for the
alignment point in question.
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12)
F3: Train Train the selected search pat-
terns.
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Button Description
F4: Search Perform pattern recognition for
substrate recognition. You can
use this function to check whe-
ther the parameter settings per-
mit correct pattern recognition.
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
DCL Parameter for Alignment Point 1/2/3
Alignment (A5) > Align Data 1/2 > Point 1/2/3 >
DCL-Parameter
Parameter
Parameter Description /
Value range, unit
General
parameters
Contrast Threshold Difference in contrast with the
surrounding area at which an
edge is recognised.
The higher the value, the more
unequivocal the result.
%
Filter Side Size Size of the left and right parts of
the filter for determining a con-
trast transition.
High values reduce sensitivity to
noise.
pixels
Filter Center Size of the filter centre for deter-
mining a contrast transition. The
area of the centre is not taken
into account in computing con-
trast.
pixels
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Checkbutton Description
Search Direction
Right to Left If this checkbutton is activated
the horizontal search for the
circle edge proceeds from right
to left; otherwise, the direction is
from left to right.
Bottom up If this checkbutton is activated
the vertical search for the circle
edge proceeds from the bottom
to the top; otherwise, the direc-
tion is from top to bottom.
Contrast Change
Dark to Light If this checkbutton is activated
the search is for a change in
contrast from dark to light.
Light to Dark If this checkbutton is activated
the search is for a change in
contrast from light to dark.
Don’t Care If this checkbutton is activated
the search is for any change in
contrast.
Optional Ordinary Activate the "Use" checkbutton if
Alignment you want to use pattern search
as well. The most important
parameters for a pattern search
are displayed. (see "Alignment
data for the Ordinary Alignment
search mode")
Score criteria Preference for an edge if the
result is not unequivocal
Contrast If this checkbox is activated the
edge with the strongest contrast
transition is used.
Prefer Center If this checkbox is activated the
edge closest to the point at
which the search started is used.
Prefer End If this checkbox is activated the
edge closest to the end of the
search area is used.
Checkbuttons Multipoint Approach
Multiple points are used instead of only two to
define the circle edge (see checkbutton A 5 > Align
Data 1/2 > General).
The checkbuttons behind "Flags" are used to
define whether the calipers will be created with
additional points for the horizontal and/or vertical
directions.
Parameter Description /
Value range, unit
Point counter Number of additional points
used to define the edge of the
circle.
1..5
Buttons
Button Description
F1: Show Model Show the model (zoomed to
camera-image size).
F2: Small Model Show a small model.
F4: Cleanup Clear the screen.
F10: Adj. Value Change the position or size of
the area marks on the screen,
using the trackball or the cursor
keys.
Press "F10" again to toggle back
to the mouse function.
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Parameter Description /
Value range, unit
Acceptance DCL Quality of the search.
Defines the accuracy of the
match with the trained pattern
required for acceptance of the
search outcome.
[0..999] = 0..99.9 %
Confusion DCL If the acceptance requirements
are satisfied by more than one
search result, the match with the
trained pattern represented by
the value entered here must be
achieved or bettered for the pat-
tern to be identified unequivoca-
lly. Always make sure that the
entry is higher than that for
"Acceptance".
[0..999] = 0..99.9 %
Focus Height DCL Focusing height of the DCL unit.
Effective only when the "Global
Focus / Light" checkbutton is not
activated in the configuration
settings (See "1.8.4 Configura-
tion (S 5)" on page 1-140)
µm
Light DCL 1 Brightness of the vertical direct
light for illuminating the sub-
strate at the DCL unit. Effective
only when the "Global Focus /
Light" checkbutton is not activa-
ted in the configuration settings
(See "1.8.4 Configuration (S 5)"
on page 1-140)
0..255
Light DCL 2 Brightness of the LED ring obli-
que light for illuminating the sub-
strate at the DCL unit. Effective
only when the "Global Focus /
Light" checkbutton is not activa-
ted in the configuration settings
(See "1.8.4 Configuration (S 5)"
on page 1-140)
0..255
Parameter Description /
Value range, unit
Adjustment charac-
teristics:
No.: The number of the characteristic
1..2
Task Id The number of the task
Alignment Point
X X and Y coordinates of the cen-
tre of the search area for the
hole.
µm
Y
Search model
width / height DX
Area in X and Y in which the
search for the hole edges will
take place. Size the area in such
a way that the edges of the hole
are just inside it.
pixels
DY
Search area
width / height DX
Size of the area in which the
system searches for the hole.
pixels DY
Alignment data for the Hole Finder search mode
Alignment (A5) > Align Data 1/2
Parameters for the "Hole Finder" search mode:
This mode is suitable for small circles (holes or
pins) that can be shown in their entirety on the
screen:
Parameter
Buttons Button Description
DCL parameters Call up DCL parameters for the
alignment point.
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12).
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Button Description
F3: Train Train the selected search pat-
terns.
F4: Search Perform pattern recognition for
substrate recognition. You can
use this function to check whe-
ther the parameter settings per-
mit correct pattern recognition.
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
Hole Finder DCL Parameters
Alignment (A5) > Align Data 1/2 > DCL-Parameter
Parameters for edge detection at the DCL unit
A "Hole Finder" search is performed in two steps:
„ Structure search or circle contour search for
approximate positioning
„ Search for pin or hole
Parameter
Parameter Description /
Value range, unit
Caliper number maximum number of points at
which – distributed over the
circle – the search for edge tran-
sitions takes place. (Effective
only when the "No caliper limit"
checkbutton is activated.)
Caliper length Length of the caliper
pixels
Filtersize Width of the filter. Points further
away from the centre of the filter
are taken into consideration to a
lesser extent. The wider the filter
the less sensitive it is to noise,
but the edge search, too, beco-
mes progressively less sensi-
tive.
[0..5] pixel
Filtercenter Width of the centre of the filter.
[0..2] pixels
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Checkbutton Description
Initial Search Use ordinary alignment for
approximate positioning If this
option is not selected a simpler
search (circle contour) is used.
Edge type
dark to light Detect dark-to-light edge transi-
tion.
light to dark Detect light-to-dark edge transi-
tion.
don’t care Detect any transition.
Score criteria:
Contrast edge If there are two or more edge
transitions, use the strongest for
edge identification
Position Use the contrast transition that is
nearest to the defined point and
crosses the contour threshold.
Absolute position Use the contrast transition that is
furthest from the start of the cali-
per and crosses the contour
threshold.
Parameter Description /
Value range, unit
Cntr.threshold: Difference in contrast with the
surrounding area at which an
edge is recognised.
The higher the value, the more
unequivocal the result.
Checkbuttons
Checkbutton Description
Use Caliper If this checkbox is activated the
search is for the number of edge
transitions defined by the "Cali-
per" parameter.
Always activate this checkbox
Search Mode
Search active Use initial search for approxi-
mate positioning
4 Quarter Fluctuations in the size of circles
are compensated by averaging
(slight loss in precision)
Initial Search Use ordinary alignment for
approximate positioning If this
option is not selected a simpler
search (circle contour) is used.
Use Ellipse Ellipsis can be trained, other-
wise circle only
No size test No plausibility test for circle size
No caliper limit Use all calipers, otherwise only
as many as fit on the circumfe-
rence of the circle without over-
lapping.
Caliper to inside From the outside toward the
inside.
Train Mode
Train active Enable training
Circle Mask An initial search to determine the
position of the hole precedes the
edge search as such. If this
checkbutton is activated the
search is for a pattern in which
the inside part of the hole is hid-
den.
Dark Center Activate this checkbox if the
inside of the hole is darker than
the surrounding area.
4 Quarter Fluctuations in size are compen-
sated by averaging (slight loss in
precision)
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Parameter Description /
Value range, unit
Production over-
view
Substrate Types: Substrate types
Maximum: Number
current: Current position
Wafers: Different wafer types
Maximum: Number
current: Current position
Oven profiles: Number of profiles created for
Maximum: the "Oven" option
Production Defined production flow
sequences:
Maximum: Number
current: Current position
1.6.7 Production Data (A 9)
Overview
Parameter
Production Sequence
You can use this mask to build up a production flow
by combining sequences. Click on "Insert" to add a
new sequence step at the appropriate position.
Click on "Delete" to remove the sequence step.
Parameter
Parameter Description /
Value range, unit
Seq.no. The number of the sequence
Checkbuttons
Checkbutton Description
done Checkbuttons that show green
have already been completed.
Deactivating a checkbutton
means that the corresponding
sequence step is skipped.
Dropdown menu
Dropdown menu Description
Sequence step Step in the production sequence
The available modes are:
Substrate Align
Pick&Place
Epoxy process
Height measure
Calculate substrate shift
Oven load
Oven unload
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1.6 Application Pages menu (A)
Software Manual A-1
Dropdown menu Description 1.6.8 Wafer Data (A 20)
Destination/
Substrate type
Select the substrate type (desti-
nation) to be processed in the
current production-sequence
step.
To create a new substrate type:
go to Substrate type settings >
Overview (see " Overview" on
page 1-33)
To define substrate positions: go
to Mode > Learn Substrate Posi-
tion (see "1.5.5 Learn Substrate
Positions (O 9)" on page 1-25)
Parameters of the wafer-handling system.
What Alignment or position used for
the substrate type
Buttons
Button Description
Insert Create a sequence line.
Delete Clear the sequence.
Parameter
Parameter Description /
Value range, unit
Wafer number
Act. Show the current wafer number.
Next Number of the next wafer of the
same type.
0: not used
Slot No. Slot number of the wafer cas-
sette that contains the wafer.
Wafer Pos.
Center: X Coordinates of the wafer centre.
µm Y
Start: X Position that the bonder moves
to after a change to a wafer that
has not yet been used, so that it
can start processing the wafer. If
no "Last found Chip" position is
known, the system moves to the
start position.
µm
Y
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Parameter Description /
Value range, unit
Last found chip: X Coordinates of the most recently
found chip. This value is reset if
you move the bonder manually
to the start position.
µm
Y
Needle Pos.
Start Lowest position of the ejector
needle during the ejection cycle
(safe position).
µm
Middle Position at which the ejector
speed changes from "Needle up
start" to "Needle up".
Allows a slower rate of move-
ment at the start of the ejection
process, so that the chip deta-
ches more efficiently from the
wafer film.
µm
End Highest position of the ejector
needle during the ejection cycle
(at pickup position).
µm
Focus Height: Z Focusing height of the wafer
camera.
µm
Dimensions
Radius: r Radius of the wafer.
µm
Angle: p The wafer's angular offset
This angle is determined auto-
matically in the "First Chip"
search.
0,01°
Wafflepack size: X If a wafflepack or gel pack is
used instead of a wafer, enter
the size in X and Y here.
µm
Y
Parameter Description /
Value range, unit
Chip index: X Distance of the chip from the
Y next (adjacent) chip in the same
row.
These values are computed
automatically in an interactive
training session under "Mode >
Learn Chip Index" and they are
shown here for information only
(see "1.5.10 WFS Learn Chip
Index (O 31)" on page 1-28).
µm
Linefeed: X Distance of the chip from the
Y next (adjacent) chip in the next
row.
These values are computed
automatically in an interactive
training session under "Mode >
Learn Chip Index" and they are
shown here for information only
(see "1.5.10 WFS Learn Chip
Index (O 31)" on page 1-28).
µm
End Counter EOS If consecutive chips are not
found in an EOS row, the system
switches to the next row.
End Counter EOW If consecutive chips are not
found in EOW rows, a wafer
change takes place.
No. of Chips in X Defines the layout of the rectan-
Y gular wafer. Number of columns (X direction) and rows
(Y direction) on the wafer or the
wafflepack. If you enter 0, the
"Chip Count X / Y" parameter is
inactive.
Chip count X Show the column number (X)
and row number (Y) of the chip Y
Delays [ms]
currently being picked from the
wafer. Not used unless "No. of
Chips in X / Y" in A 20 is not
equal to 0 (see "1.6.8 Wafer
Data (A 20)" on page 1-74).
De air: ON Pulse of compressed air to
break the ejector vacuum before
each movement of the wafer
table.
ms
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Software Manual A-1
Parameter Description /
Value range, unit
Speed Settings
Chip index Speed of the wafer table when
moving to the next chip while
production is in progress.
% of normal speed
WaferChange Positioning speed of the wafer
table. This speed is used for
movements that involve longer
distances as in indexing, for
instance (e.g. for wafer chan-
ges).
% of normal speed
Workholder Speed of the workholder con-
veyor system.
% of normal speed
Needle up start Needle speed between the
lowest needle position and the
midway position.
% of normal speed
Needle up Needle speed between the mid-
way position and the topmost
needle position.
% of normal speed
Button Description
Wafer Flags Call up flags for wafers
Pickup Data Call up parameters for the pik-
kup system see page 1-78
Bond Data Call up bond parameters.
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12)
F2: DE Block Raise or lower the chip ejector.
F3: FirstChip Starts a search for the first chip
(manual search), for example
following a wafer change.
F4: DE/GP Switch the vacuum at the chip
Vacuum ejector on or off.
F5: DCL Vacuum Switch the vacuum at the DCL
unit on or off.
F6: Search Run pattern recognition.
F7: Alignment Perform pattern recognition and
correct to the pickup position.
F8: Chip Index Move to the next chip.
F9: ChipCntrl Move the DCL unit to the chip
control position.
F10: Move WT Switch to trackball control for
moving the x-y table using the
trackball. Press the "+" key to
increase the speed of move-
ment, or press the "–" key to
reduce the speed. Press "Shift"
to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
fn+F2: Delete Delete all the data of the current
Wafer wafer.
fn+F3: Measure- Measure the distance between
ChipIndex chips (distance between the
adjacent chip and the trained
chip).
The measured values are auto-
matically entered in the corre-
sponding fields of this menu.
fn+F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
Buttons
Dropdown menu
Dropdown menu Description
Wafer type Defines the type of wafer used
Standard Wafer Round wafer
Rectangular Wafer Rectangular wafer
Waffle Pack: Chips in waffle packs
Gelpack Gel pack
Search mode Defines the wafer-recognition
mode
Moving Wafer Always select Moving Wafer
Camera Camera.
Search Corner Do not use with MWC.
Upper Left: The result is relative to the top
left corner.
Upper Right: The result is relative to the top
right corner.
Lower Left: The result is relative to the bot-
tom left corner.
Lower Right: The result is relative to the bot-
tom right corner.
Middlepoint: The result is relative to the chip
centre.
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Button Description
fn+F7: Copy Wafer Copy all wafer data of the cur-
rent wafer number to a new
wafer number.
fn+F8: DCC open Open the die carrier clamp.
fn+F9: DCC close Close the die carrier clamp.
Wafer Flags
Wafer Data > Wafer Flags
Checkbuttons
Checkbutton Description
Alignment
Ink search Search for inkdots
Pickup Inked Die Pick up the marked chip.
Use InkRef for Do not use with MWC.
Angle
Vacuum for Wafer-table vacuum is switched
Alignment on before the search.
Black windows Reverse video display mode for
highly reflective chips.
Search next chip Search for the next chip.
Correction Move
WaferXY Correction by table (on) or DCL
Correction unit (off) to allow for difference
between trained and actual
wafer positions.
Chip Index
Use Edge Do not use with MWC.
Correction
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Parameter Description /
Value range, unit
DCL V-check time-
out
WT: Maximum time allowed for appli-
cation of wafer-table vacuum for
pickup. If overshot: Error mes-
sage. (0: Function is inactive)
ms
DCL (before ns Maximum time allowed for appli-
up): cation of DCL vacuum for pik-
kup, before the ejector needles
extend. If overshot: Error mes-
sage.
0: Function is inactive.
ms
DCL (after pickup Maximum time allowed for appli-
delay): cation of DCL vacuum after the
"pickup delay". If overshot: Error
message. (0: Function is inac-
tive)
ms
Clean die at pickup
Clean delay: Time spent by the DCL unit at
the pickup ramp position with
compressed air on for cleaning
the wafer. (0: Function is inac-
tive)
ms
Parameter Description /
Value range, unit
General Data
Offset X Offset in X, Y and Z from the pik-
kup position.
µm
Y
Z
P 0.01°
Ramp up speed Speed of the Z-axis for upward
stroke to ramp (ramp: time
during which only the Z-axis
moves).
% of normal speed
Ramp down speed Speed of the Z-axis for down-
ward stroke to ramp.
% of normal speed
Pickupdelay Delay between end of ejection
and the start of the Z movement
of the DCL unit; allows the wafer
foil to detach completely from
the chip.
ms
Pickup Data
Wafer Data (A20) > Pickup Data
Parameter
Chip control
Define the sensor for chip control:
„ "Use IR" (infrared sensor) checkbutton
„ Dropdown menu for selecting a vacuum sensor
C A U T I O N
In order to avoid malfunctions, use at
least one sensor for chip control.
Dropdown menu
Dropdown menu Description
DCL Tool DCL tool used.
EPO Tool EPO tool /
dispenser used
Die Ejector Tool Chip-ejector tool used
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Checkbuttons
Checkbutton Description
Use wafer angle If this checkbox is activated the
rotational offset of the wafer is
taken into account.
USE FlipChip for Use the optional flip-chip unit to
pickup pick up chips
Use lookup camera Use the optional lookup camera
Bond Data
Wafer Data (A20) > Bond Data
There are register tabs for the following masks:
„ Bond delay & bond ramp speeds
„ Scrub settings (see " Scrub settings" on page 1-
80)
„ Option: Oven Settings (see " Oven settings
(option)" on page 1-81)
Bond delay & bond ramp speeds
Wafer Data (A20) > Bond Data
This is where the parameters for the timing of the
bonding process are managed.
Parameter
Parameter Description /
Value range, unit
Bond delay
Bond delay Dwell time of the DCL tool at the
bond position.
Allows uniform, cavity-free
spread of the epoxy adhesive
underneath the chip
ms
Vacuum time Time during which the vacuum is
sustained at the DCL tool after
the bond position has been rea-
ched.
ms
Air time Duration of the pulse of com-
pressed air to break the ejector
vacuum.
ms
No of pulses Number of pulses
On time Duration of one compressed-air
pulse
ms
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Parameter Description /
Value range, unit
Off time Time between two successive
compressed-air pulses
ms
Bond ramp speeds
Up Percentage speed upward
%
Down Percentage speed downward
%
Checkbutton Description
Bond delay
Standard One pulse of compressed air to
break the vacuum (see the "Air
time" parameter).
Pulsed Multiple pulses of compressed
air to break the vacuum (see the
parameter below "Air time").
Checkbuttons
Scrub settings
Wafer Data (A20) > Bond Data
This is where you can define scrub movements
(high-frequency movements) to facilitate sprea-
ding of the adhesive.
Use the checkbutton under "Scrub settings" to
define whether or not scrub movements are execu-
ted.
Parameter
Parameter Description /
Value range, unit
Amplitude: X Amplitude of the scrub move-
ment
µm
Y
Z
P 0.01°
Cycles settings
No cycles Number of repetitions
Acc Acceleration
0,01 mm/s2
Vel Speed
0,01 mm/s
Delays
Start Delay preceding start of scrub
movement
ms
Move Delay at the points of reversal of
scrub movement
ms
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Parameter Description /
Value range, unit
Wafer The number of the current wafer.
You can use the <PREVIOUS>/
<NEXT> buttons to find the
wafer you want.
Chip definitions
Chip Size: X Chip size. You enter these
values in an interactive training
session under "Mode > Learn
Chip" and they are shown here
for information only (see "1.5.9
WFS Learn Chip (O 30)" on
page 1-27).
µm
Y
Ref. Offset X Coordinates referenced to the
centre of the screen and defining
the point at which the structure
search starts. Default: (0,0)
µm
Y
Parameter Description /
Value range, unit
End Delay at end of scrub movement
ms
Oven settings (option)
Wafer Data (A20) > Bond Data
This is where the temperature profiles for the optio-
nal oven are managed.
ÆActivate the "Use oven " checkbutton if you want
to use a eutectic oven.
ÆIf scrub movement is not planned, set the delay
time in the "delay" field.
ÆUse the checkbuttons to define whether the pro-
cess will use constant temperatures (Use temp)
or temperature profiles (Use Profile) for heating
(Heat up) and cooling (cool down).
ÆSelect the profile for a standard oven (Oven) or
for an oven with forming gas (Forming gas
mixer) or enter the constant temperatures, as
applicable.
Oven profiles are created in A 60.
1.6.9 Wafer Recognition (A 21)
Settings in this mask: Moving Wafer Camera
recognition for pattern recognition on the wafer
Adjustment at up to three positions is necessary in
order to achieve unambiguous definition of the
wafer's position and orientation.
You can use any combination of the three possible
search modes. Characteristic 3 also includes the
possibility of using an ink search.
Parameter
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Parameter Description /
Value range, unit
Needle Pos. X On-screen position of the need-
les in X and Y.
pixels
Y
Global Data:
Camera Delay Delay between arrival at the
camera position and the start of
imaging.
ms
Camera Speed The speed of camera move-
ment.
1...150 % of normal speed
Light switch delay Time until the light reaches the
preset intensity.
ms
Checkbutton Description
Use Global Data Normally active, so that Global
Setting Parameters can be
used.
Align Chip Normally active, so that align-
ment can be performed. If this
checkbutton is deactivated ali-
gnment does not take place.
Single Adjust Search for all characteristics
from a single camera position.
Buttons
Button Description
Align Data 1 Call up parameters for substrate
2 alignment. The input mask
3 varies, depending on which
search mode is selected.
High Resolution Global camera data for the high-
resolution camera (see "
Camera resolution" on page 1-
83)
Low Resolution Global camera data for the low-
resolution camera (see "
Camera resolution" on page 1-
83)
Checkbuttons
Dropdown menu
Dropdown menu Description
Camera Select one of the two available
wafer cameras
High Resolution Use the high-resolution camera
for small chips
Low Resolution Use the low-resolution camera
for large chips
Characteristic 1 Select the search mode for up to
2 three characteristics
3
Ordinary Structure search
Alignment
Edge search Edge search
Hole finder Find hole
Ink search Characteristic 3 only
Trafo Select the coordinate transfor-
mation
Standard Standard transformation
Single Edge Edge search at only one adjust
Search point.
Laser Chip Special transformation
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Button Description
Light
Compute Scale Change the scaling factor for the
DCL camera.
Reset Scale Reset the scaling factor for the
DCL camera.
Compute Trafo Define the coordinate transfor-
mation
Reset Trafo Reset the coordinate transfor-
mation
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12).
F2: Move PCP Move the camera to the pickup
position.
F5: Cancel Adj. Discard the alignment data.
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
Camera resolution
Wafer Recognition (A21) > High Resolution/Low
Resolution
A camera with either low resolution or high resolu-
tion is used, depending on the size of the chips.
„ Use the high-resolution camera for small chips
„ Use the low-resolution camera for large chips
The structure of the "Low Resolution" mask is ana-
logous.
Parameter
Buttons
Parameter Description /
Value range, unit
Global Data
Focus Height Focusing height
µm
Camera Scale X Scaling factor for the DCL
camera (display only); use the
Compute Scale button to
change.
µm
Y
P °
WT-DCL Trafo X Coordinate transformation
µm Y
P °
Camera Offset X Camera offset in X and Y direc-
tions between the search pattern
and the pickup position.
(Display only)
µm
Y
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Align Data 1/2/3
Wafer Recognition (A21) > Align Data 1/2/3
The input mask displayed varies, depending on
which search mode is selected.
„ Ordinary Alignment,
(see " Alignment data for Ordinary Alignment
search mode (pattern recognition)" on page 1-
84)
„ Edge Search,
(see " Alignment data for Edge Search search
mode" on page 1-86)
„ Ink Search,
(see " Alignment data for Ink Search search
mode" on page 1-92)
Alignment data for Ordinary Alignment search
mode (pattern recognition)
Wafer Recognition (A21) > Align Data 1/2/3
Parameters for "Ordinary Alignment" search
mode.
Parameter
Parameter Description /
Value range, unit
Adjustment charac-
teristics:
No. The number of the characteristic
1..3
Alignment point: X X and Y coordinates for the
search for the position moved to.
To train:
-Click in the X field
-<F10> to activate the trackball
for moving the wafer camera
-Move to the point
-<F10> -<F6>
µm
Y
Focus Height Focusing height.
Effective only when the "Global
Focus / Light" checkbutton is not
activated in the configuration
settings (See "1.8.4 Configura-
tion (S 5)" on page 1-140).
µm
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Parameter Description /
Value range, unit
Task Id No The number of the task
Camera No. The number of the camera
Search model
Upper left corner Top left corner of the pattern to
be found.
pixels
Width / Height DX Size (width/height) of the search
area for the initial search.
pixels
DY
Angle Angular offset of the search
model
0,10 °, 0 = deactivated.
Depth Default 16:
Number of greyscales
Angle range Permissible rotation of the
search models by comparison
with the reference image.
0.1 °, 0 = deactivated.
Angle increment Distance between two search
models within Angle range.
0.1 °
Search area
Upper left corner
X0
Top left corner of the search
area for the initial search.
pixels Y0
Width / height DX Size (width/height) of the search
area for the initial search.
pixels
Acceptance Quality of the search.
Defines the accuracy of the
match required for acceptance
of the search outcome.
[0..999] = 0..99.9 %
Confusion If the acceptance requirements
are satisfied by more than one
search result, the match repre-
sented by the value entered
here must be achieved or bette-
red for the pattern to be identi-
fied. Always make sure that the
entry is higher than that for
"Acceptance".
(e.g. 700)
[0..999] = 0..99.9 %
Parameter Description /
Value range, unit
Trained Point X The coordinates of a trained
point
µm/°
Buttons
Button Description
Light
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12).
F2: Move PCP Move the camera to the pickup
position.
F3: Train Train the selected search pat-
terns.
F4: Search Perform pattern recognition for
substrate recognition. You can
use this function to check whe-
ther the parameter settings per-
mit correct pattern recognition.
F5: Cancel Adj. Discard the alignment data
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
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Parameter Description /
Value range, unit
Adjustment charac-
teristics:
No.: The number of the characteristic
1..3
Alignment point X X and Y coordinates for the
search for the position moved to.
To train:
-Click in the X field
-<F10> to activate the trackball
for moving the wafer camera
-Move to the point
-<F10> -<F6>
µm
Y
Alignment data for Edge Search search mode
Wafer Recognition (A21) > Bond Data 1/2/3
The Edge Search" is performed in two steps:
„ Structure search for approximate positioning
„ Edge search
Parameters for edge search.
Parameter Description /
Value range, unit
Focus Height Focusing height.
Effective only when the "Global
Focus / Light" checkbutton is not
activated in the configuration
settings (See "1.8.4 Configura-
tion (S 5)" on page 1-140).
µm
Task No. The number of the task
Camera No. The number of the camera
Edge window
Upper left corner
X0
Y0
Top left corner of the search win-
dow for the edge search.
pixels
Width / height DX Size (width/height) of the search
DY window for the edge search.
pixels
Angle: P Skew of the search window for
the edge search.
°
Search Model Used for approximating the posi-
tions of the edges.
Upper left corner
X0
Y0
Op left corner of the search
model.
pixels
Width / height DX Size (width/height) of the search Parameter
DY model.
pixels
Angle: P Skew of the search window for
the edge search.
0.1 °
Search Area
Upper left corner
X0
Y0
Top left corner of the search
area for the initial search.
pixels
Width / height DX Size (width/height) of the search
area for the initial search. DY
Initial Search
pixels
Acceptance Quality of the search.
Defines the accuracy of the
match required for acceptance
of the search outcome.
[0..999] = 0..99.9 %
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Button Description
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12).
F2: Move PCP Move the camera to the pickup
position.
F3: Train Train the selected search pat-
terns.
F4: Search Perform pattern recognition for
substrate recognition. You can
use this function to check whe-
ther the parameter settings per-
mit correct pattern recognition.
F5: Cancel Adj. Discard the alignment data
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
Parameter Description /
Value range, unit
Confusion If the acceptance requirements
are satisfied by more than one
search result, the match repre-
sented by the value entered
here must be achieved or bette-
red for the pattern to be identi-
fied. Always make sure that the
entry is higher than that for
"Acceptance".
[0..999] = 0..99.9 %
Model depth Default 16: Number of greysca-
les
Trained Point
X Coordinates of a trained point.
(Display only)
µm/ °
Y
P
Reference Point
X Coordinates of a reference
point. (Display only)
µm
Y
Free Point
X Coordinates of a freely selecta-
ble point inside or on the edges
(only if, in the "Flags for Edge
Search" window, "Result type"
"Free Point" is activated).
µm
Y
Buttons
Button Description
Light
Flags (see " Flags for edge search" on
page 1-88)
Calipers (see " Calipers for edge search"
on page 1-90)
Mask Settings
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Checkbutton Description
Absolute position Use the contrast transition that is
furthest from the start of the cali-
per and crosses the contour
threshold.
General search
mode
Optional search Initial structure search (should
feature always be activated)
old style line impro- Cease usage as of now
vement (compatibility)
Result type Possible results
(corner)
Upper left The corresponding corners
Upper right
Lower right
Lower left
Center Middle point
Free point Freely definable point on the
boundary or inside the edges
Free point at corner If an edge is not found, the result
is interpolated from the edges
found.
Result options
90° corners The corners found must be 90°
corners, or they will be rejected
(set permissible deviation in the
"Calipers for Edge Search" win-
dow with the "90° Error" parame-
ter).
Calc missing If at least two edges are found,
corners all corners are extrapolated from
these edges.
Calc line by
extreme value:
None The extreme value to be used to
Top calculate an edge.
Right
Bottom
Left
Use max. extreme
value:
Upper Left Use the maximum extreme
Upper Right value
Lower Right
Lower Left
Checkbutton Description
Calipers type
Search from inside The direction of the edge search
to outside along the caliper is from the
inside to the outside (otherwise,
the search is from the outside
toward the inside).
Testable edges
Top Position of the edge to be detec-
Right ted. If, for example, the top left
Bottom corner is to be detected, mark
Left the Top and Left checkbuttons.
Edge type Expected contrast transition.
dark to light Dark-to-light edge transition.
light to dark Light-to-dark edge transition.
don’t care Any edge transition
Score criteria:
Contrast edge Use the strongest contrast tran-
sitions for edge identification.
Position Use the contrast transition that is
nearest to the defined point and
crosses the contour threshold.
Flags for edge search
Wafer Recognition (A21) > Bond Data 1/2/3 >
Flags
Checkbuttons
Buttons
Description Button
Optional
parameters
Call up optional parameters for
vertical corners
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Checkbutton Description
Flags:
Calipers type: Two or more checkbuttons can
be activated
Use optional para- The parameters defined in this
meter screen will be used.
Search from inside Perform edge search from the
to outside inside toward the outside.
Edge type
dark to light Detect dark-to-light edge transi-
tion.
light to dark Detect light-to-dark edge transi-
tion.
don’t care Detect any transition.
Score criteria:
Contrast edge If there are two or more edge
transitions, use the strongest for
edge identification.
Position Use the contrast transition that is
nearest to the defined point and
crosses the contour threshold.
Absolute position Use the contrast transition that is
furthest from the start of the cali-
per and crosses the contour
threshold.
Optional Parameters
Wafer Recognition (A21) > Bond Data 1/2/3 >
Flags > Optional Parameters
Separate the properties of the two horizontal
edges from the properties of the two vertical
edges.
Parameter
Checkbuttons
Parameter Description /
Value range, unit
Settings:
Found pt: The minimum percentage of
points that has to be found
before an edge is accepted as
valid.
%
Error dist.: If the distance from the point to
the line found in the search is
greater than this, the point is
marked as not found.
Cntr.threshold: Difference in contrast with the
surrounding area at which an
edge is recognised.
The higher the value, the more
unequivocal the result.
%
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Software Manual A-1
Parameter Description /
Value range, unit
Filtersize X Width of the filter in X/Y direc-
tion. Points further away from
the centre of the filter are taken
into consideration to a lesser
extent. The wider the filter the
less sensitive it is to noise, but
the edge search, too, becomes
progressively less sensitive.
[0..5] pixels
Y
Filtercenter X Width of the centre of the filter.
[0..2] pixels Y
Found pt: The minimum percentage of
points that has to be found
before an edge is accepted as
valid.
%
Error dist.: If the distance from the point to
the line found in the search is
greater than this, the point is
marked as not found.
Cntr.threshold: Threshold as of which a diffe-
rence in contrast along a caliper
becomes a candidate for the
edge.
The higher the value the smaller
the number of candidates per
caliper for an edge.
90° Error: Permissible deviation for a 90°
corner (only if the "90° Corner"
parameter is activated in the
"Flags for Edge Search" win-
dow).
0,1°
Calipers for edge search
Wafer Recognition (A21) > Bond Data 1/2/3 > Cali-
pers
Calipers (search lines) are lines normal to an edge
along which a search is conducted for a significant
brightness transition in order to identify the position
of the edge.
The theoretical measuring area is divided up uni-
formly by the number of calipers defined in the
"total" field.
The entries in the "start" and "end" fields restrict
the measuring area. If the value of "start" is lower
than the value of "end", the area between the two
is the restricted measuring area. If the value of
"start" is greater than the value of "end", the two
outside areas are defined as the restricted measu-
ring area.
Parameter
Parameter Description /
Value range, unit
Calipers Ranges:
Left Line: Restrict the measuring area for
the left edge
Upper Line: Restrict the measuring area for
the top edge
Right Line: Restrict the measuring area for
the right edge
Lower Line: Restrict the measuring area for
the bottom edge
Settings:
Length X Length of the caliper in X/Y
direction.
pixels
Y
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Button Description
F7: Show Model Show the model (zoomed to
camera-image size).
F8: Small Model Show a small model.
F9: Cleanup Clear the screen.
F10: Adj. Value Change the position or size of
the area marks on the screen,
using the trackball or the cursor
keys.
Press "F10" again to toggle back
to the mouse function.
Masks for edge search
Wafer Recognition (A21) > Bond Data 1/2/3 >
Mask Settings
Mask used to exclude ranges within the search
model in which errors could occur from the search.
Checkbutton Description
Freemask The mask is defined by coordi-
nates (mask area).
Circular The mask is circular.
Parameter
Parameter Description /
Value range, unit
Mask area:
Upper left corner
X0
Top left corner of the mask.
pixels Y0
Width / Height DX Size (width/height) of the mask.
pixels DY
Checkbuttons
Buttons
Checkbutton Description
Mask options
Rotation Should always be activated.
Permits search models to be
rotated for the structure search.
Invers If this checkbox is marked, the
structure search takes place
inside the mask.
Mask edges: Multiple marks are possible.
North The top half of the screen is
masked.
East The right half of the screen is
masked.
South The bottom half of the screen is
masked.
West The left half of the screen is
masked.
Angle Masking of the edges produced
by rotation of the search model.
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Parameter Description /
Value range, unit
Ink data
Upper left corner
X0
Top left corner of the area for the
search to locate the inkdot on
the substrate.
pixels
Y0
Width / height DX Size (width/height) of the area
for the search to locate the
inkdot on the substrate.
pixels
DY
Threshold Greyscale threshold as of which
a pixel is identified as white or
black. The lower the value, the
more dark pixels will be assi-
gned to the white range.
0..255 (black..white)
Limit Limit for the proportion of white
pixels in the ink window. A value
lower than this threshold is inter-
preted as indicating that the chip
is inked. A value higher than this
threshold is interpreted as indi-
cating that the chip is OK.
0..100 % white
Parameter Description /
Value range, unit
Adjustment charac-
teristics:
No.: The number of the characteristic
1..3
Alignment point X X and Y coordinates for the
search for the position moved to.
To train:
-Click in the X field
-<F10> to activate the trackball
for moving the wafer camera
-Move to the point
-<F10> to deactivate the track-
ball
-<F6> to accept the point
µm
Y
Focus Height Focusing height.
Effective only when the "Global
Focus / Light" checkbutton is not
activated in the configuration
settings (See "1.8.4 Configura-
tion (S 5)" on page 1-140).
µm
Task Id No The number of the task
Camera No. The number of the camera
Alignment data for Ink Search search mode
Wafer Recognition (A21) > Bond Data 3
As an option, an inkspot can be applied to identify
substandard chips.
These substandard chips can be detected again
only in Characteristic 3.
Parameter
Checkbuttons
Checkbutton Description
Inkpoint color If this checkbutton is activated
the search is for a white instead
of a black inkdot.
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Parameter Description /
Value range, unit
Startpos X Position that the bonder moves
to after a wafer change, so that it
can start processing the wafer.
µm
Y
Chip count X Show the column number (X)
and row number (Y) of the chip
currently being picked from the
wafer. Used only when "No. of
Chips in X / Y" in A 20 is not
equal to 0 (see "1.6.8 Wafer
Data (A 20)" on page 1-74).
Y
Chip index: X Distance of the chip from the
next (adjacent) chip in the same
row.
µm
Y
Line feed: X Distance of the chip from the
next (adjacent) chip in the next
row.
µm
Y
Wafer angle: P The wafer's angular offset.
This angle is determined auto-
matically in the "First Chip"
search.
0,01°
1.6.10 Option: Wafer Magazine (A 25)
Parameters for administration of the wafer maga-
zine.
Dropdown menu
Dropdown menu Description
Number of used The number of slots needed.
slots
Slots Selection of a wafer type for
which the slot is reserved
Status of the slot
Full The slot is full and has not been
processed as yet
In Use A wafer in the slot is now being
processed
Empty The slot has been fully proces-
sed
Checkbuttons
Checkbutton Description
Use Data Use individual wafer data for the
slot.
Otherwise the data from the
Wafer Data page is used.
Data
Wafer Magazine (A 25) > Data
Individual wafer data for the slot in question.
Parameter
Buttons
Button Description
Data Call up the parameters for slot-
specific wafer data
Buttons
Button Description
==> Next Chip Change of direction in proces-
sing of the wafer.
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Software Manual A-1
Button Description
Copy from Wafer Copy data from selected wafer
to this location.
Copy to Wafer Copy data from this location to
selected wafer.
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12)
F2: DE Block Raises or lowers the chip ejec-
tor.
F4: DE Vacuum Switch the vacuum at the chip
ejector on or off.
F6: Search Run pattern recognition
F7: Alignment Perform pattern recognition and
correct to the pickup position
F8: Chip Index Move to the next chip.
F10: Move WT Switch to trackball control for
moving the x-y table using the
trackball.
"+" key: increase speed,
"–" key: reduce speed.
"shift" key: activate a higher
speed directly.
Press "F10" again to toggle back
to the mouse function.
1.6.11 Lookup camera (A 40)
Parameters for an optional camera that performs
alignment from below after pickup.
You can use any combination of the four possible
search modes. Use the Dropdown-Menüs behind
"Characteristic 1" and "Characteristic 2" to select any
of the following search modes:
„ No Operation: characteristic 1/2 not active
„ Ordinary Alignment: Structure search
„ Edge Search: Edge search
„ Hole Finder: find hole
Use the Dropdown-Menü behind "Trafo" to select
one of the following transformations:
„ Standard: standard transformation
„ Single Edge Search: transformation with only an
adjust point for the edge search.
Checkbuttons
Checkbutton Description
Configuration Two or more checkbuttons can
be activated
Align Chip Must be activated as otherwise
alignment from below for the
chip will not take place. If this
checkbutton is deactivated ali-
gnment from below does not
take place.
Use Global Data Activate this checkbutton so that
Global Setting parameters can
be used.
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Checkbutton Description
Auto Skip If this checkbutton is activated
chips for which at least one of
the characteristics is not found
are rejected.
Otherwise: Manual Adjust
Single Adjust Activate this checkbutton to
search for all characteristics
from a single camera position.
Black windows Activate this checkbutton if
structures are so bright that
white graphics cannot be identi-
fied in the video image.
Button Description
Align Data 1 Call up parameters for substrate
alignment 1
Align Data 2 Call up parameters for substrate
alignment 1
Additional Data
Data Call up additional parameters.
F2: Base Pos. Move to the camera's idle posi-
tion.
F5: Cancel Adj. Discard the alignment data
F7: Align Die Alignment for Die
Parameter Description /
Value range, unit
Camera Delay Delay between arrival at the
camera position and the start of
imaging.
ms
Speed The speed of camera move-
ment.
1...150 % of normal speed
Buttons
Parameter
Parameter Description /
Value range, unit
Global Setting
Single Adjust X Camera position from which all
characteristics are searched for
(precondition: Single Adjust
checkbutton activated).
µm
Y
Focus height Z Focusing height of the unit.
Effective when the "Global
Focus / Light" checkbutton is not
activated in the configuration
settings (See "1.8.4 Configura-
tion (S 5)" on page 1-140).
µm
P Focusing angle of the unit.
0.01°
Incident Brightness of the vertical direct
light for illuminating the sub-
strate at the DCL unit. Effective
only when the "Global Focus /
Light" checkbutton is not activa-
ted in the configuration settings
(See "1.8.4 Configuration (S 5)"
on page 1-140).
0..255
Oblique Brightness of the LED ring light
for illuminating the substrate at
the DCL unit. Effective only
when the "Global Focus / Light"
checkbutton is not activated in
the configuration settings (See
"1.8.4 Configuration (S 5)" on
page 1-140).
0..255
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Parameter Description /
Value range, unit
Adjustment charac-
teristics
Index The index of the characteristic
1, 2
No. The number of the characteristic
1, 2
Alignment point: X X and Y coordinates for the
search for the position moved to.
To train:
-Click in the X field
-<F10> to activate the trackball
for moving the wafer camera
-Move to the point
-<F10> -<F6>
µm
Y
Data
Lookup camera (A 40) > Data
Mask for defining the tool centrepoint and the
scaling factors.
Buttons
Button Description
Axis Center
Teach Center The four corners of the tool are
approached one after the other
in clockwise sequence (starting
at the bottom right). A centre is
then calculated and displayed.
Move To Center Move to the centre of the tool.
Camera Scale
Compute Scale Calculate camera resolution
(1 pixel corresponds to the
scaling factor in µm
Reset Scale Reset the scaling factor.
F2: Base Pos. Move DCL head to the base
position.
F5: Cancel Adj. Discard the alignment data
Align Data 1/2
Lookup camera (A 40) > Align Data
The input mask displayed varies, depending on
which search mode is selected.
„ Ordinary Alignment,
See " Alignment data for Ordinary Alignment
search mode" on page 1-96
„ Edge Search,
See " Alignment data for Edge Search search
mode" on page 1-98
„ Hole Finder,
See " Alignment data for Hole Finder search
mode" on page 1-105
Alignment data for Ordinary Alignment search
mode
Lookup camera (A 40) > Align Data
Parameters for structure search.
Parameter
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Parameter Description /
Value range, unit
Focus Height Focusing height of the unit.
Effective when the "Global
Focus / Light" checkbutton is not
activated in the configuration
settings (See "1.8.4 Configura-
tion (S 5)" on page 1-140).
µm
Light Incident Brightness of the vertical direct
light for illuminating the sub-
strate at the DCL unit. Effective
only when the "Global Focus /
Light" checkbutton is not activa-
ted in the configuration settings
(See "1.8.4 Configuration (S 5)"
on page 1-140).
0..255
Light Oblique Brightness of the LED ring light
for illuminating the substrate at
the DCL unit. Effective only
when the "Global Focus / Light"
checkbutton is not activated in
the configuration settings (See
"1.8.4 Configuration (S 5)" on
page 1-140).
0..255
Camera Delay Delay between arrival at the
camera position and the start of
imaging.
ms
Speed The speed of camera move-
ment.
1...150 % of normal speed
Task Id No The number of the task
Camera No. The number of the camera
Search Model
Upper left corner X Top left corner of the pattern to
be found.
pixels
Y
Width / height DX Size (width/height) of the search
area for the initial search.
pixels
DY
Search Area Search model for approximating
the position.
Upper left corner X Top left corner of the search
model to be found.
pixels
Y
Parameter Description /
Value range, unit
Width / height DX Size (width/height) of the search
area for the initial search.
pixels
DY
Angle range Permissible rotation of the
search models by comparison
with the reference image.
0.1 °, 0 = deactivated.
Angle increment Distance between two search
models within Angle range.
0,1 °
Acceptance Quality of the search.
Defines the accuracy of the
match required for acceptance
of the search outcome.
[0..999] = 0..99.9 %
Confusion If the acceptance requirements
are satisfied by more than one
search result, the match repre-
sented by the value entered
here must be achieved or bette-
red for the pattern to be identi-
fied. Always make sure that the
entry is higher than that for
"Acceptance".
[0..999] = 0..99.9 %
Trained Point X The coordinates of a trained
point
µm/°
Y
P
Checkbuttons
Checkbutton Description
Black windows Activate this checkbutton if
structures are so bright that
white graphics cannot be identi-
fied in the video image.
Buttons
Button Description
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field
F2: Base Pos. Move DCL head to the base
position.
F3: Train Train the selected search pat-
terns.
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Button Description
F4: Search Perform pattern recognition for
substrate recognition. You can
use this function to check whe-
ther the parameter settings per-
mit correct pattern recognition.
F5: Cancel Adj. Discard the alignment data
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
Alignment data for Edge Search search mode
Lookup camera (A 40) > Align Data
Parameters for edge search.
Parameter
Parameter Description /
Value range, unit
Adjustment charac-
teristics
Index The index of the characteristic
1, 2
No. The number of the characteristic
1, 2
Alignment point: X X and Y coordinates for the
search for the position moved to.
To train:
-Click in the X field
-<F10> to activate the trackball
for moving the wafer camera
-Move to the point
-<F10> -<F6>
µm
Y
Focus Height Focusing height of the unit.
Effective when the "Global
Focus / Light" checkbutton is not
activated in the configuration
settings (See "1.8.4 Configura-
tion (S 5)" on page 1-140).
µm
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Parameter Description /
Value range, unit
Light Incident Brightness of the vertical direct
light for illuminating the sub-
strate at the DCL unit. Effective
only when the "Global Focus /
Light" checkbutton is not activa-
ted in the configuration settings
(See "1.8.4 Configuration (S 5)"
on page 1-140).
0..255
Light Oblique Brightness of the LED ring light
for illuminating the substrate at
the DCL unit. Effective only
when the "Global Focus / Light"
checkbutton is not activated in
the configuration settings (See
"1.8.4 Configuration (S 5)" on
page 1-140).
0..255
Camera Delay Delay between arrival at the
camera position and the start of
imaging.
ms
Speed The speed of camera move-
ment.
1...150 % of normal speed
PRU Data
Task Id No The number of the task
Camera No. The number of the camera
Acceptance Quality of the search.
Defines the accuracy of the
match required for acceptance
of the search outcome.
[0..999] = 0..99.9 %
Confusion If the acceptance requirements
are satisfied by more than one
search result, the match repre-
sented by the value entered
here must be achieved or bette-
red for the pattern to be identi-
fied. Always make sure that the
entry is higher than that for
"Acceptance".
[0..999] = 0..99.9 %
Angle range Permissible rotation of the
search models by comparison
with the reference image.
0.1 °, 0 = deactivated.
Checkbuttons
Checkbutton Description
Black windows Activate this checkbutton if
structures are so bright that
white graphics cannot be identi-
fied in the video image.
Buttons
Button Description
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field
F2: Base Pos. Move DCL head to the base
position.
F3: Train Train the selected search pat-
terns.
F4: Search Perform pattern recognition for
substrate recognition. You can
use this function to check whe-
ther the parameter settings per-
mit correct pattern recognition.
F5: Cancel Adj. Discard the alignment data
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
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100
Parameter Description /
Value range, unit
Trained Point
X Coordinates of a trained point.
(Display only)
µm/ °
Y
P
Reference Point
X Coordinates of a reference
point. (Display only)
µm
Y
Free Point
X Coordinates of a freely selecta-
ble point inside or on the edges
(only if, in the "Flags for Edge
Search" window, "Result type"
"Free Point" is activated).
µm
Y
Description Button
Flags Show the window for defining
the edge search see page 1-61.
Calipers Call up caliper parameters see
page 1-64
Mask Settings Call up mask parameters for
hiding error sources see page 1-
65
F2: Base Pos. Move DCL head to the base
position.
F3: Train Train the selected search pat-
terns.
F4: Search Perform pattern recognition for
substrate recognition. You can
use this function to check whe-
ther the parameter settings per-
mit correct pattern recognition.
F5: Cancel Adj. Discard the alignment data
F7: Show Model Show the model (zoomed to
camera-image size).
F8: Small Model Show a small model.
F9: Cleanup Clear the screen.
F10: Adj. Value Change the position or size of
the area marks on the screen,
using the trackball or the cursor
keys.
Press "F10" again to toggle back
to the mouse function.
EDC Parameters
Lookup camera (A 40) > Align Data > EDC -Para-
meter
Parameter Buttons
Parameter Description /
Value range, unit
Edge window:
Upper left corner
X0
Top left corner of the search win-
dow for the edge search.
pixels Y0
Width / height DX Size (width/height) of the search
window for the edge search.
pixels
DY
Angle Skew of the search window for
the edge search.
Search Model:
Upper left corner
X0
Op left corner of the search
model.
pixels Y0
Width / height DX Size (width/height) of the search
model.
pixels
DY
Search Area:
Upper left corner
X0
Top left corner of the search
area for the initial search.
pixels Y0
Width / height DX Size (width/height) of the search
area for the initial search.
pixels
DY
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101
Checkbutton Description
Position Use the contrast transition that is
nearest to the defined point and
crosses the contour threshold.
Absolute position Use the contrast transition that is
furthest from the start of the cali-
per and crosses the contour
threshold.
General search
mode
Optional search Initial structure search (should
feature always be activated)
old style line impro- Cease usage as of now
vement (compatibility)
Result type Possible results
(corner)
Upper left The corresponding corners
Upper right
Lower right
Lower left
Center Middle point
Free point Freely definable point on the
boundary or inside the edges
Free point at corner If an edge is not found, the result
is interpolated from the edges
found
Result options
90° corners The corners found must be 90°
corners, or they will be rejected
(set permissible deviation in the
"Calipers for Edge Search" win-
dow with the "90° Error" parame-
ter).
Calc missing If at least two edges are found,
corners all corners are extrapolated from
these edges.
Calc line by
extreme value:
None The extreme value to be used to
Top calculate an edge.
Right
Bottom
Left
Use max. extreme
value:
Upper Left Use the maximum extreme
Upper Right value
Lower Right
Lower Left
Flags for edge search
Lookup camera (A 40) > Align Data > EDC -Para-
meter > Flags
Checkbuttons
Checkbutton Description
Calipers type
Search from inside The direction of the edge search
to outside along the caliper is from the
inside to the outside (otherwise,
the search is from the outside
toward the inside).
Testable edges
Top Position of the edge to be detec-
Right ted. If, for example, the top left
Bottom corner is to be detected, mark
Left the Top and Left checkbuttons.
Edge type Expected contrast transition.
dark to light Dark-to-light edge transition.
light to dark Light-to-dark edge transition.
don’t care Any edge transition
Score criteria:
Contrast edge Use the strongest contrast tran-
sitions for edge identification.
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102
Buttons Optional Parameters
Description Button Alignment (A5) > Align Data 1/2 >EDC-Parameter
Optional
parameters
Call up optional parameters for
vertical corners
> Flags > Optional Parameters
Separate the properties of the two horizontal
edges from the properties of the two vertical
edges.
Parameter
Parameter Description /
Value range, unit
Settings:
Found pt: The minimum percentage of
points that has to be found
before an edge is accepted as
valid.
%
Error dist.: If the distance from the point to
the line found in the search is
greater than this, the point is
marked as not found.
Cntr.threshold: Difference in contrast with the
surrounding area at which an
edge is recognised.
The higher the value, the more
unequivocal the result.
%
Checkbuttons
Checkbutton Description
Calipers type: Two or more checkbuttons can
be activated
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103
Checkbutton Description
Use optional para- The parameters defined in this
meter screen will be used.
Search from inside Perform edge search from the
to outside inside toward the outside.
Edge type
dark to light Detect dark-to-light edge transi-
tion.
light to dark Detect light-to-dark edge transi-
tion.
don’t care Detect any transition.
Score criteria:
Contrast edge If there are two or more edge
transitions, use the strongest for
edge identification
Position Use the contrast transition that is
nearest to the defined point and
crosses the contour threshold.
Absolute position Use the contrast transition that is
furthest from the start of the cali-
per and crosses the contour
threshold.
Calipers for edge search
Lookup camera (A 40) > Align Data 1/2 > EDC -
Parameter > Calipers
Calipers (search lines) are lines normal to an edge
along which a search is conducted for a significant
brightness transition in order to identify the position
of the edge.
The theoretical measuring area is divided up uni-
formly by the number of calipers defined in the
"total" field.
The entries in the "start" and "end" fields restrict
the measuring area. If the value of "start" is lower
than the value of "end", the area between the two
is the restricted measuring area. If the value of
"start" is greater than the value of "end", the two
outside areas are defined as the restricted measu-
ring area.
Parameter
Parameter Description /
Value range, unit
Calipers Ranges:
Left Line: Restrict the measuring area for
the left edge
Upper Line: Restrict the measuring area for
the top edge
Right Line: Restrict the measuring area for
the right edge
Lower Line: Restrict the measuring area for
the bottom edge
Settings:
Length X Length of the caliper in X/Y
direction.
pixels
Y
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Parameter Description /
Value range, unit
Filtersize X Width of the filter in X/Y direc-
tion. Points further away from
the centre of the filter are taken
into consideration to a lesser
extent. The wider the filter the
less sensitive it is to noise, but
the edge search, too, becomes
progressively less sensitive.
[0..5] pixels
Y
Filtercenter X Width of the centre of the filter.
[0..2] pixels Y
Found pt: The minimum percentage of
points that has to be found
before an edge is accepted as
valid.
%
Error dist.: If the distance from the point to
the line found in the search is
greater than this, the point is
marked as not found.
Cntr.threshold: Threshold as of which a diffe-
rence in contrast along a caliper
becomes a candidate for the
edge.
The higher the value the smaller
the number of candidates per
caliper for an edge.
90° Error: Permissible deviation for a 90°
corner (only if the "90° Corner"
parameter is activated in the
"Flags for Edge Search" win-
dow).
0,1°
Masks for edge search
Lookup camera (A 40) > Align Data 1/2 > EDC -
Parameter > Mask Settings
Mask used to exclude ranges within the search
model in which errors could occur from the search.
Parameter
Parameter Description /
Value range, unit
Mask area:
Upper left corner
X0
Top left corner of the mask.
pixels Y0
Width / Height DX Size (width/height) of the mask.
pixels DY
Checkbuttons
Checkbutton Description
Mask options
Rotation Should always be activated.
Permits search models to be
rotated for the structure search.
Invers If this checkbox is marked, the
structure search takes place
inside the mask.
Mask edges: Multiple marks are possible.
North The top half of the screen is
masked.
East The right half of the screen is
masked.
South The bottom half of the screen is
masked.
West The left half of the screen is
masked.
Angle Masking of the edges produced
by rotation of the search model.
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105
Button Description
F7: Show Model Show the model (zoomed to
camera-image size).
F8: Small Model Show a small model.
F9: Cleanup Clear the screen.
F10: Adj. Value Change the position or size of
the area marks on the screen,
using the trackball or the cursor
keys.
Press "F10" again to toggle back
to the mouse function.
Checkbutton Description
Freemask The mask is defined by coordi-
nates (mask area).
Circular The mask is circular.
Buttons
Alignment data for Hole Finder search mode
Lookup camera (A 40) > Align Data
Parameters for hole search.
Parameter
Parameter Description /
Value range, unit
Adjustment charac-
teristics
Index The index of the characteristic
1, 2
No. The number of the characteristic
1, 2
Alignment point: X X and Y coordinates for the
search for the position moved to.
To train:
-Click in the X field
-<F10> to activate the trackball
for moving the wafer camera
-Move to the point
-<F10> -<F6>
µm
Y
Focus height Z Focusing height of the unit.
Effective when the "Global
Focus / Light" checkbutton is not
activated in the configuration
settings (See "1.8.4 Configura-
tion (S 5)" on page 1-140).
µm
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Parameter Description /
Value range, unit
Angle range Permissible rotation of the
search models by comparison
with the reference image.
0.1 °, 0 = deactivated.
Angle increment Distance between two search
models within Angle range.
0,1 °
Acceptance Quality of the search.
Defines the accuracy of the
match required for acceptance
of the search outcome.
[0..999] = 0..99.9 %
Confusion If the acceptance requirements
are satisfied by more than one
search result, the match repre-
sented by the value entered
here must be achieved or bette-
red for the pattern to be identi-
fied. Always make sure that the
entry is higher than that for
"Acceptance".
[0..999] = 0..99.9 %
Trained Point
X
The coordinates of a trained
point
µm
°
Y
P
Button Description
Parameter Call up parameters for the align-
ment point in question.
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field
F2: Base Pos. Move DCL head to the base
position.
F3: Train Train the selected search pat-
terns.
Parameter Description /
Value range, unit
P Focusing angle of the unit.
0.01°
Light Incident Brightness of the vertical direct
light for illuminating the sub-
strate at the DCL unit. Effective
only when the "Global Focus /
Light" checkbutton is not activa-
ted in the configuration settings
(See "1.8.4 Configuration (S 5)"
on page 1-140).
0..255
Light Oblique Brightness of the LED ring light
for illuminating the substrate at
the DCL unit. Effective only
when the "Global Focus / Light"
checkbutton is not activated in
the configuration settings (See
"1.8.4 Configuration (S 5)" on
page 1-140).
0..255
Camera Delay Delay between arrival at the
camera position and the start of
imaging.
ms
Speed The speed of camera move-
ment.
1...150 % of normal speed
Task ID /
Camera
Task Id No The number of the task
Camera No. The number of the camera
Search Model
Upper left corner X Top left corner of the pattern to
Y be found.
pixels
Checkbuttons
Checkbutton Description
Black windows Activate this checkbutton if
structures are so bright that
white graphics cannot be identi-
fied in the video image.
Buttons
Width / height DX Size (width/height) of the search
DY area for the initial search.
pixels
Search Area Search model for approximating
the position.
Upper left corner
X0
Y0
Top left corner of the search
area for the initial search.
pixels
Width / height DX Size (width/height) of the search
DY area for the initial search.
pixels
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107
Button Description
F4: Search Perform pattern recognition for
substrate recognition. You can
use this function to check whe-
ther the parameter settings per-
mit correct pattern recognition.
F5: Cancel Adj. Discard the alignment data
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
DCL parameters
Lookup camera (A 40) > Align Data > Parameter
Parameter
Parameter Description /
Value range, unit
Caliper number Maximum number of points at
which – distributed over the
circle – the search for edge tran-
sitions takes place. (Effective
only when the "No caliper limit"
checkbutton is activated.)
Caliper length Length of the caliper
pixels
Filtersize Width of the filter. Points further
away from the centre of the filter
are taken into consideration to a
lesser extent. The wider the filter
the less sensitive it is to noise,
but the edge search, too, beco-
mes progressively less sensi-
tive.
[0..5] pixels
Filtercenter Width of the centre of the filter.
[0..2] pixels
Cntr.threshold: Difference in contrast with the
surrounding area at which an
edge is recognised.
The higher the value, the more
unequivocal the result.
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108
Checkbutton Description
Score criteria:
Contrast edge If there are two or more edge
transitions, use the strongest for
edge identification.
Prefer Center Use the contrast transition that is
nearest to the defined point and
crosses the contour threshold.
Prefer End Use the contrast transition that is
furthest from the start of the cali-
per and crosses the contour
threshold.
Checkbuttons
Checkbutton Description
Use Caliper If this checkbox is activated the
search is for the number of edge
transitions defined by the "Cali-
per" parameter.
Always activate this checkbox
Search mode
Search active Use initial search for approxi-
mate positioning
4 Quarter Fluctuations in size are compen-
sated by averaging (slight loss in
precision)
Initial Search Use ordinary alignment for
approximate positioning If this
option is not selected a simpler
search (circle contour) is used.
Use Ellipse Ellipsis can be trained, other-
wise circle only
No size test No plausibility test for circle size
No caliper limit Use all calipers, otherwise only
as many as fit on the circumfe-
rence of the circle without over-
lapping.
Caliper to inside From the outside toward the
inside.
Train Mode
Train active Enable training
Circle Mask An initial search to determine the
position of the hole precedes the
edge search as such. If this
checkbutton is activated the
search is for a pattern in which
the inside part of the hole is hid-
den.
Dark Center Activate this checkbox if the
inside of the hole is darker than
the surrounding area.
4 Quarter Fluctuations in size are compen-
sated by averaging (slight loss in
precision)
Initial Search Use ordinary alignment for
approximate positioning If this
option is not selected a simpler
search (circle contour) is used.
Edge type
dark to light Detect dark-to-light edge transi-
tion.
light to dark Detect light-to-dark edge transi-
tion.
don’t care Detect any transition.
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109
Parameter Description /
Value range, unit
No of Points Number of nodes
Nodes table
Point No. Consecutively numbered rows
Duration Time between two nodes
ms
Set Point Temperature at the node
(specified temperature)
°C
Band Width Temperature bandwidth as crite-
rion that the setpoint tempera-
ture has been achieved (not
effective unless the "Band Setup
Active" checkbutton is activated,
see "Band Setup Active")
°C
Lower
Upper
Band Scan Number of scans within as crite-
Number rion for acceptance that the set-
point temperature has been
achieved (not effective unless
the "Band Setup Active" check-
button is activated, see "Band
Setup Active")
Band Scan Interval Interval between two consecut-
ive measurements (not effective
unless the "Band Setup Active"
checkbutton is activated, see
"Band Setup Active")
Display Settings Scaling of the display
Out of range values are highligh-
ted by a yellow background in
the table.
Duration Limit Maximum displayed value on
the time axis
ms
Profile Temp. Displayed temperature range
°C
1.6.12 Oven Profile (A 60)
Temperature profiles for the oven.
Use the <PREVIOUS> and <NEXT> keys to
browse between temperature profiles.
The temperature/time diagram consists of nodes
interconnected by lines.
A yellow background for a parameter is a warning
that the reading is outside the maximum values
shown on the screen.
A red background is a warning that the controller
failed to achieve the value within the specified
time.
Inserting a node
Click the middle mouse button in the zone between
two nodes to create a new node; "No of Points" is
incremented by one and a new row is added to the
nodes table.
Moving a node
Press and hold down the left mouse button and
drag the node to any point between its neighbou-
ring nodes or place it elsewhere in the temperature
range. The values in the nodes table change
accordingly.
Deleting a node
Click the middle mouse button on a node to open
a shortcut menu to delete the node, or else move
the cursor to the corresponding row.
Parameter
Parameter Description /
Value range, unit
Profil ID Number of the temperature pro-
file.
Name of the temperature profile
Checkbuttons
Checkbutton Description
Profile Setup Two or more checkbuttons can
be activated
Time Controlled Activate: Temperature is not
checked until the end of the pro-
file.
Otherwise the system pauses at
each node until the setpoint tem-
perature is achieved.
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110
Checkbutton Description
Band Setup Active If this checkbutton is deactivated
the defaults from "Oven Settings
(M 9)" are used for achievement
of the setpoint temperature.
Ramp If possible, leave "Manual Con-
trol" and "Error Override" deacti-
vated.
Additional functionality for ramps
if the regulator is too slow. Abor-
tion of a profile can be preven-
ted. It is a better idea, however,
to interpolate nodes to ease the
ramp.
Manual Control If this function is activated set-
point jumps are used instead of
ramps. Additional functionality
for ramps if the regulator is too
slow. Abortion of a profile can be
prevented. It is a better idea,
however, to interpolate nodes to
ease the ramp.
Error Override If this checkbutton is activated
temperature criteria are not
checked before nodes for
ramps.
Parameter Description /
Value range, unit
Profil ID The number of the temperature
profile
Select the heating regulator
used to run the profile.
Curr. Temp Current actual value
°C
Setpoint Current setpoint value
°C
Checkbutton Description
Time Controlled Shows the values set in the
Oven Profile menu (A60).
Set Startup Temp. Abort the profile or the startup
Timed temperature approach after 30
seconds.
Cont. Curve The actual curve continues after
Update the end of the profile. The target
profile slides to the left and off
the screen.
Manual Control Shows the values set in the
Oven Profile menu (A60).
Oven Profile (Execution)
Oven Profile (A 60) > F1: Exec Profile
The profile you select is shown green.
The derivative controller setpoint values are shown
in red at the start of the profile.
The current temperature values (actual values)
have a blue background.
Older curves are still shown in grey.
Parameter
Buttons
Button Description
F1: Exec Profile Show the actual-value profile
fn+F7: Ins./Del.
insert: Insert the new data
record at the position of the cur-
rent data record
append: Append the new data
record after the current data
record
delete: Delete the current data
record
Checkbuttons
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111
Button Description
Execute Profile Execute the profile when the
actual temperature is in the tem-
perature bandwidth of the star-
tup temperature.
Set Startup Temp. Go to the profile's startup tempe-
rature.
Abort Profile/Temp Abort the profile or the startup
temperature approach.
Edit Parameter Call up the Profile Control para-
meters.
Clear Display Reset the profile display.
Checkbutton Description
Error Override Shows the values set in the
Oven Profile menu (A60).
Buttons
Profile Control parameters
Oven Profile (A 60) > F1: Exec Profile > Edit Para-
meter
Calls the same parameters as in M 9. The parame-
ters displayed vary, depending on which controller
is used.
Parameter
Parameter Description /
Value range, unit
Heating These are control-related para-
meters and the settings should
be changed by service engi-
neers only.
Proportional (Pb1) P parameter of the controller
°C
Integr. Action Time I parameter (integral time) of the
(ti1) controller
0.1 s
Deriv. Action Time D parameter (derivative time) of
(td1) the controller
0.1 s
Min. Cycle Time Minimum duration of a period
(ti1) 0.1 s
Output Limits
Lower Output Limit Lower limit of manipulated varia-
(Y.Lo) ble
%
Upper Output Limit Upper limit of manipulated varia-
(Y.Hi) ble
%
Lim. Mean Val Limitation of the mean value
(Ym.H) %
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112
Parameter Description /
Value range, unit
Temp. Offset Temperature compensation to
allow for discrepancy between
location of sensor and bond
position
°C
Cooling Air Offset Temperature differential as of
which cooling with compressed
air is activated
°C
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1.7 Machine Pages menu (M)
Parameter Description /
Value range, unit
PnP Loop
Pickup pos
X
Position of the DCL unit during
the eject process.
µm Y
Z
P 0,01°
Pickup rampheight Height above the touchdown
point (pickup position), as of
which speed of the Z-axis is
reduced.
µm
Chip control pos X Position at which chip control by
the LED array takes place.
µm
Y
Z
1.7 Machine Pages menu (M) The "Machine Pages" menu is for accessing most
Parameter Description /
Value range, unit
of the software-definable parameters affecting
general machine settings. They relate primarily to
positional and dynamic values (speed and accele-
ration).
Wafer Camera free
Y
The Y coordinate of the position
at which the wafer camera has
an unobstructed view of the
wafer.
µm 1.7.1 DCL Machine Data (M 1)
Machine-specific parameters of the DCL unit.
Rad height: Z Height of the arc described by
the DCL unit between the pickup
position and the bond position.
Do not attempt to change these
values.
µm
Correction ramp: Z Height above the bond position
adopted immediately after ima-
ging (see also M1 > Speed set-
tings > Correction move).
µm
Pickup retries # Number of pickup retries
attempted before an error mes-
sage is issued on account of a
vacuum fault.
Miscellaneous
Indexer free
positions: X
Y
Z
Safety position of the DCL unit at
which no collision can occur bet-
ween DCL unit and the indexer
during indexing (required for
manual indexing only)
µm
Clean position: X The position of the DCL unit for
Parameter
Y
Z
Tool offset
chip ejection above the trash-
can.
µm
Camera <–> Tool X Offset between the camera and
Y the DCL unit
You enter these values in an
interactive training session
under "Mode > DCL camera -
Tool Offset" and they are shown
here for information only (see
"1.5.3 DCL Camera <–> Tool
Offset (O 3)" on page 1-24).
Note, however, that the values
can also be changed in this
page.
µm
Offset position: X Significant point for defining off-
Y set
µm
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1.7 Machine Pages menu (M)
Software Manual A-1
Button Description
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F8: NextChip Move to the next chip.
F9: ChipCntrl Move the DCL unit to the chip
control position.
F10: Move DCL Switches to trackball control for
moving along the X- and Y-axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
Parameter Description /
Value range, unit
Focus & imprint Height for focusing and imprin-
height: Z ting
µm
Imprint delay Time for imprint
ms
Light 1/2 Brightness
0 .. 255
Camera settings
Scale X Scaling factor for the DCL
camera.
You enter these values in an
interactive training session
under "Mode > DCL Camera
Scale" and they are shown here
for information only (see "1.5.1
DCL Camera Scale (O 1)" on
page 1-18).
µm
Y
Camera Delay Delay between arrival at the
camera position and the start of
imaging.
ms
cts for 360° Scaling of the P-axis (rotation) of
the DCL unit. Number of steps
for 360° rotation
Buttons
Button Description
Speed setting Opens the window for entering
speed settings (see below)
HML settings Call the window for touchdown
search (see " DCL HML Set-
tings" on page 1-116)
Lookup camera Use the lookup camera to train
the base position.
Flip Chip Parameters for the "Flip Chip"
option
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12)
F3: DE Block Raises or lowers the chip ejec-
tor.
F4: DE Vacuum Switches the vacuum at the chip
ejector on or off.
F5: DCL Vacuum Switch the vacuum at the DCL
unit on or off.
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Software Manual A-1 1 Bonding
1.7 Machine Pages menu (M)
DCL Speed Settings
DCL Machine Data (M 1) > Speed Settings
When you press the "Speed settings" button you
have access to the window for setting speeds for
the pick&place process:
Parameter Description /
Value range, unit
Toolchanger: v[%] Speed of movement for chan-
ging the DCL unit.
1...150 % of normal speed
Parameters
Correction move
[%]:
Speed of movement from "Cor-
rection ramp Z" to "Bond ramp
Z". Effective only when single
chip/single placement optimiza-
tion is configured.
1...150 % of normal speed
Parameter Description /
Value range, unit
Speed Settings
Production: v[%] Speed during production.
Flip chip: v[%] Speed of the flip-chip unit.
Segment factors Speed of movement for the seg-
ment in question, as a percen-
tage of the value set in the
"Production: v[%]" parameter.
10...100 %
PRU Speed for PRU recognition.
1...150 % of normal speed
IX: v[%] Speed of movement for moving
to the "indexer free" position
1...150 % of normal speed
Init: v[%] Speed of movement for initial
movements prior to start of pro-
duction.
1...150 % of normal speed
Clean: v[%] Speed of movement for moving
to cleaning position above the
trashcan.
1...150 % of normal speed
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1.7 Machine Pages menu (M)
Software Manual A-1
Parameter Description /
Value range, unit
X Tool offset in X/Y direction rela-
tive to the DCL/EPO position
when measurement takes place
µm
Y
Save position:
X
Safe position above the sub-
strate (move to this position after
manual search/train, for
example)
µm
Y
Z
P 0,01°
Ref. position:
Search start Z Height at which the search for
the reference position starts
µm
X Coordinates of the reference
position
µm
Y
Z
Parameter Description /
Value range, unit
General settings
V start [ %] Speed during rapid approach.
0...100 %
A TD Delay for approach.
µm/ms2
V search Speed for slow approach.
µm/ms
Unknown height
Search max Z Maximum height/depth for the
search in train mode.
µm
Search area Search area for locating the sub-
strate height.
µm
Height already trai-
ned
Search offset Offset of the search above the
trained height. The search for
the height at slow speed (VTD/
ATD) starts as of this height in
production mode.
Tool settings
Tool number: Number of the height measure-
ment tool.
Sensor position: P: P offset of the HML tool relative
to the sensor
[0,01°]
Tool offset:
DCL HML Settings
DCL Machine Data (M 1) > HML settings
The positions moved to are the DCL positions:
Parameters
Buttons
Button Description
F2: TD search cur- Search for the height of the cur-
rent rent DCL/EPO position.
<fn> F2: TD train Train/retrain the current height.
current
F3: HML search Search for all heights on the
ALL substrate.
<fn> F3: HML train Train/retrain all heights.
all
F7: Reset found Reset heights found before-
heights hand.
F8: Reset data file Delete the file that contains the
heights.
F9: Put HML tool Put the HML unit in the toolchan-
ger.
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1.7 Machine Pages menu (M)
Lookup Camera (option)
DCL Machine Data (M 1) > Lookup Camera
When you press the "Lookup Camera" button you
have access to the window for the parameters for
the lookup camera, which images from below.
ÆYou can either enter the coordinates of the base
position above the lookup camera directly, or
train them as described below.
ÆClick <F10> (Move).
ÆUse the trackball to move the DCL head to any
position above the lookup camera (base posi-
tion).
ÆClick <F6> (Trace) to accept the coordinates.
Use <F1> (Move To) to move to the base position
(to test a numeric input, for example).
Parameters
Button Description
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
Parameter Description /
Value range, unit
Base Position
X The camera's idle position.
µm Y
Z
P 0.01°
Buttons
Button Description
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields
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Software Manual A-1
Parameter Description /
Value range, unit
Transfer pos:
X
Coordinates of the DCL tool for
transfer from the flip-chip tool
µm Y
Z
P 0,001°
Transfer ramp: Z Height as of which only the
Z-axis moves and only at redu-
ced speed.
µm
Transfer save pos.
Y
Collision-free waiting position
µm Z
Transfer vac. Delay after an error message is
timeout issued.
ms
Ramp speed: up/ Speed of the DCL Z-axis for
down ramping up or down (ramp: time
during which only the Z-axis
moves).
% of normal speed of the Z-axis.
Parameter Description /
Value range, unit
Flip Chip Pickup
Pickup pos Height of the flip-chip unit during
pickup from the wafer
counts
Z
Pickup rampheight Height above the touchdown
point (pickup position), as of
which speed of the Z-axis is
reduced.
counts
Flip chip
transfer
Transfer pos: Z Z position of the flip-chip tool for
transfer to the DCL unit.
counts
Transfer ramp: Z Z height before the transfer posi-
tion as of which the speed of
approach to the transfer position
is reduced.
counts
R Speed of the flip-chip Z-axis
during movement from "Transfer
ramp" to "Transfer pos"
%
Transfer delay: Time for transfer from the flip-
chip tool to the DCL unit.
ms
FC vacuum off Time in which both the DCL
delay: vacuum and the flip-chip
vacuum are ON.
ms
DCL settings:
Flip Chip (option)
DCL Machine Data (M 1) > Flip Chip
Parameter
Buttons
Button Description
F1: FC Move To Move to the coordinates corre-
sponding to the values in the
input field
F2: Needle up Extend the needles.
F3: Needle down Retract the needles.
F4: DE-vacuum Switch the vacuum at the chip
ejector on or off.
F5: DCL vacuum Switch DCL vacuum on and off.
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields
F7: FC vacuum Switch the vacuum at the flip-
chip unit on or off.
F9: Chip Cntrl Move to the chip-control posi-
tion.
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Button Description
F10: Move FC Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
fn+F1: FC to pickup Move the flipchip to the pickup
position
fn+F2: FC to pick Move the flipchip to the "Pickup
ramp rampheight" position
fn+F3: FC to Move the flipchip to the transfer
transfer position
fn+F5: DCL to Move the DCL tool to the trans-
transfer fer position
fn+F6: DCL to tr. Move the DCL tool to the "Trans-
ramp fer ramp" position
fn+F7: DCL to tr. Move the DCL tool to the colli-
save sion-free waiting position
fn+F8: DCL to CC Move the DCL tool to the chip-
control position
fn+F9: FC pickup The flip-chip unit picks up the
chip.
fn+F10: FC => Transfer of the chip from the flip-
chip tool to the DCL tool
1.7.2 EPO Machine Data (M 2)
Machine-specific parameters of the EPO unit.
Two squeegee units can be used, so that two dif-
ferent adhesives can be applied. In this way a con- ductive and a nonconductive adhesive can be app-
lied.
General
Parameter
Parameter Description /
Value range, unit
Squeegee
Rotation on/off time Intervals after machine switch-
on in which the squeegee is
rotating or stopped.
Active only if the "Timed squee-
gee" checkbutton in the Bonder
Configuration page is activated.
If the "Timed squeegee" check-
button is not activated, the
squeegee is in constant rotation.
ms
Refill on/off time Times after machine switch-on
when the squeegee is being fil-
led with adhesive or when the
supply of adhesive is interrup-
ted.
Filling takes place only when the
squeegee is rotating: Set "Refill
on time" to a lower value than
"Rotation on time".
ms
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Button Description
Speed setting Opens the window for entering
speed settings (see below)
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12).
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F8: Squeegee Switch squeegee on and off.
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
Parameter Description /
Value range, unit
Maximal refills The maximum number (pulsed)
or maximum time for filling,
before the "No adhesive" error
message is issued.
Speed Settings
EPO Machine Data (M 2) > General > Speed Set-
tings
When you press the "Speed settings" button you
have access to the window for setting speeds for
the EPO unit:
Buttons
Parameters
Parameter Description /
Value range, unit
Speed Settings
Production Speed during production.
1...150 % of normal speed
Segment factors Speed of movement for the seg-
ment in question, as a percen-
tage of the value set in the
"Production: v[%]" parameter.
10...100 %
PRU Speed for PRU recognition.
1...150 % of normal speed
IX Speed of movement for moving
to the "indexer free" position
1...150 % of normal speed
Init Speed of movement for initial
movements prior to start of pro-
duction.
1...150 % of normal speed
Clean Speed of movement for moving
to the cleaning position.
1...150 % of normal speed
Toolchanger Speed of movement for chan-
ging the stamp unit.
1...150 % of normal speed
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Parameter Description /
Value range, unit
Correction move Speed of movement from "Cor-
rection ramp Z" to "Bond ramp
Z". Effective only when single
chip/single placement optimiza-
tion is configured.
1...150 % of normal speed
EPO Machine Data > Dispenser
EPO Machine Data (M 2) > Dispenser
Parameter
Parameter Description /
Value range, unit
Dispenser
settings
Purge pos X The position for cleaning the dis-
penser needle
µm
Y
Z
Interval Time for the cleaning process
s
Amount Quantity dispensed at the purge
position
Dispenser
Offsets
Camera <–> Dis-
penser X
Offset between camera and dis-
penser.
You enter these values in an
interactive training session
under "Mode > EPO camera -
tool offset" and they are shown
here for information only.
µm
Y
Buttons
Button Description
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12).
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Button Description
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F8: Squeegee Switch squeegee on and off.
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
Squeegee 1/2
EPO Machine Data (M 2) > Squeegee 1/2
Parameters for a squeegee unit for preparation of
the adhesive.
Parameter
Parameter Description /
Value range, unit
Stamp settings
Squeegee position
X
Position for picking up epoxy
adhesive in the squeegee unit (P
= axis of rotation)
µm
Y
Z
P 0.01°
Ramp height up Height above the point at which
the stamp dips into the squee-
gee unit, as of which the upward
speed of the Z-axis is increased.
µm
Ramp height down Height above the point at which
the stamp dips into the squee-
gee unit, as of which the down-
ward speed of the Z-axis is
reduced.
µm
Ramp speed v up Speed of the stamp from the
immersion point to the "Ramp
height up".
% of operating speed
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Parameter Description /
Value range, unit
Ramp speed v Speed of the stamp from the
down "Ramp height down" to the
immersion point.
% of operating speed
Squeegee delay Time during which the stamp is
dipped into the adhesive
ms
Ramp up delay Delay between arrival at the
"Ramp height up" position and
resumption of stamp movement.
The "Ramp up delay" prevents
strings of adhesive forming.
ms
Button Description
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12).
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F8: Squeegee Switch squeegee on and off.
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
Buttons
Tool Assign
EPO Machine Data (M 2) > Tool Assign
Dropdown menus enable you to assign each
stamp tool a squeegee unit. This ensures that a
stamp cannot become contaminated with the
wrong adhesive.
Buttons
Button Description
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12).
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F8: Squeegee Switch squeegee on and off.
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
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Button Description
Corridor: 1..6 Open the window in which the
change positions for the corre-
sponding corridor are defined.
F1: Move to Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12).
F2: Change tool Change the DCL unit.
F3: Toolchanger Move the toolchanger to the
change position/idle position.
F5: Manual Pos. Position for the manual tool
change.
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F9: Chip Cntrl Move to the chip-control posi-
tion.
F10: Move DCL Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
1.7.3 DCL Toolholder Positions (M 3)
Machine-specific parameters of the DCL toolchan-
ger.
Parameter
Parameter Description /
Value range, unit
Change Position: X X/Y coordinates of the position
at which the manual toolchange
is performed.
µm
Y
Buttons
Parameter Description /
Value range, unit
General Data
Change free Y Y position of the DCL unit at
which there is no possibility of
collision with the extended
toolchanger
µm
Move height: Z Height of the DCL unit in Z at
which the change is performed.
µm
Change speed Speed of movement for chan-
ging the DCL unit.
1...150 %
Change delay Delay after the change position
in the toolchanger is reached
ms
Tear Off
Offset: Z Height in Z that the DCL unit
rises when the DCL unit is pla-
ced in the toolchanger.
µm
Speed Upward speed of the DCL unit
for setdown movement
1...150 % of normal speed
Delay Delay after the DCL unit is set
down in the toolchanger.
ms
Manual change:
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Parameter Description /
Value range, unit
Corridor
number
No. For rapid changes between the
six corridors.
1..6
Entry 1 position
X Position of the DCL unit before it
enters the corridor
µm
Y
Z
P 0.01°
Positions in front of
Slot
Slot 1/2 X Position of the DCL unit before it
enters the slot
µm
Y
Z
P 0.01°
Positions in Slot
Slot 1/2 X Position of the DCL unit in the
slot at which the DCL unit is set
down or picked up.
µm
Y
Z
P 0.01°
1.7.4 Corridor Settings
DCL Toolholder Positions (M 3) > Corridor Settings
Machine-specific parameters of the DCL toolchan-
ger. The settings are identical for all six magazine
corridors.
Parameter
Buttons
Button Description
F1: Move to Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12)
F2: Change tool Change the DCL unit.
F3: Toolchanger Move the toolchanger to the
change position/idle position
F5: Manual Pos. Position for the manual tool
change.
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F10: Move DCL Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
1.7.5 DCL Tool Offset (M 5)
P-axis offset (rotational axis) of the DCL tool, as
trained in the Mode menu. The values are shown
here for information only; they cannot be changed.
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Parameter Description /
Value range, unit
Pickup area
min/ max X
Range for the pickup position in
X, Y, Z and P.
µm Y
Z
P 0.01°
Clean area
min/max X
Range for the cleaning position
in X, Y, Z and P.
µm Y
Z
P 0.01°
Tool change area
min/max X
Range for the tool-change posi-
tion of the DCL unit
µm Y
Z
P 0.01°
Lookup camera
area min/max X
Range for the lookup camera.
µm Y
Z
P 0.01°
FC => DCL transfer
area (DLC head)
min/max X
Range for transfer from the flip-
chip unit to the DCL unit
µm Y
Z
P 0.01°
Button Description
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F8: Deinit De-energise the motors to faci-
litate training by moving the
table manually.
F9: Init Re-initialise the motors.
F10: Default set- Restore the factory defaults for
tings the DCL unit.
1.7.6 DCL Limits (M 7)
Limit settings for the DCL positions.
Parameter
Parameter Description /
Value range, unit
Work area
min/max X
Y
PRU area
min/max X
Y
.
µm
Range in X and Y in which the
DCL unit must be located for
imaging.
µm
Focus height min Z Z range for focusing height of
max Z the DCL camera.
µm
Rad height min Z Z range of the highest point on
max Z
Flip-chip unit
the arc described on the way to
the substrate.
µm
Buttons
FC pickup min Z Z range for the flip-chip pickup
max Z position
FC transfer min Z Z range for the flip-chip transfer
max Z
Bond area
min/max X
Y
Z
position
Range for the bond position in X,
Y, Z and P.
µm
P 0.01°
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Parameter Description /
Value range, unit
Stamp area min/
max X
Range for the stamp position in
X, Y, Z and P.
µm Y
Z
P 0.01°
Stamp area max X Maximum coordinates for the
epoxy position in X, Y, Z and P.
µm
Y
Z
P 0.01°
Squeegee area
min/max X
Range for pickup of the adhe-
sive from the squeegee unit in X,
Y, Z and P.
µm (0.01° for P-axis)
Y
Z
P 0.01°
Parameter Description /
Value range, unit
General limits
Work area:
min/max X
Working range for the EPO unit
in X and Y
µm Y
PRU area:
min/ max X
Range for EPO unit for imaging
µm Y
Focus height min Z Z range for focusing height of
the EPO camera.
µm
max Z
Rad height
min/max Z
Z range of the highest point on
the arc described on the way to
the substrate.
µm
Limits for dispenser
Dispense area min/
max X
Range for the dispensing posi-
tion in X, Y, Z and P.
µm Y
Z
P 0.01°
Purge area min/
max X
Range for the purging position
for the dispenser needle in X, Y,
Z and P.
µm
Y
Z
P 0,01°
Limits for stamp
tools
1.7.7 EPO Limits (M 8)
Limit settings for the EPO positions.
Parameter
Buttons
Description Button
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F8: Deinit De-energise the motors to faci-
litate training by moving the
table manually.
F9: Init Re-initialise the motors.
F10: Default set- Restore the factory defaults for
tings the EPO unit.
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Parameter Description /
Value range, unit
Default band width Temperature bandwidth as
check criterion for achievement
of the specified temperature.
°C
Upper
Lower
Default band scans
Interval Time between two measure-
ments
Number Number of consecutive intervals
with a measured temperature
inside the temperature band-
width as a criterion for accep-
tance.
Heating These are control-related para-
meters and the settings should
be changed by service engi-
neers only.
Proportional (Pb1) P parameter of the controller
°C
Integr. Action Time I parameter (integral time) of the
(ti1) controller
0.1 s
Deriv. Action Time D parameter (derivative time) of
(td1) the controller
0.1 s
Min. Cycle Time Minimum duration of a period
(ti1) 0.1 s
Output Limits
Lower Output Limit Lower limit of manipulated varia-
(Y.Lo) ble
%
Upper Output Limit Upper limit of manipulated varia-
(Y.Hi) ble
%
Lim. Mean Val Limitation of the mean value
(Ym.H) %
Temp. Offset Temperature compensation to
allow for discrepancy between
location of sensor and bond
position
°C
Cooling Air Offset Temperature differential as of
which cooling with compressed
air is activated
°C
1.7.8 Oven Settings (M 9)
Parameters for five oven controllers.
Oven Heating
Parameters for the KS 40-1 temperature controller
Checkbuttons
Checkbutton Description
In use Use controller
Startup
behaviour
Room temp. Startup temperature 15°C wit-
hout cooling
Work temp. Startup temperature as set by
means of the "Work" parameter.
Standby temp Startup temperature as set by
means of the "Standby" parame-
ter.
Parameter
Parameter Description /
Value range, unit
Default temps.
Work Working temperature selectable
under "Startup behaviour"
°C
Standby Standby temperature selectable
under "Startup behaviour"
°C
Temp. Range The permissible temperature
range
°C
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Parameter Description /
Value range, unit
Standby Standby temperature selectable
under "Startup behaviour"
°C
Temp. Range The permissible temperature
range
°C
Default band width Temperature bandwidth as
check criterion for achievement
of the specified temperature.
°C
Default band scans
Number Number of consecutive intervals
with a measured temperature
inside the temperature band-
width as a criterion for accep-
tance.
Interval Time between two measure-
ments
Control These are control-related para-
Parameters meters and the settings should
be changed by service engi-
neers only.
Proportional (PB1) P parameter of the controller
°C
Integral (TI1) I parameter (integral time) of the
controller
0.1 s
Differential (TD1) D parameter (derivative time) of
the controller
0.1 s
Dead Band (DB) Practical starting value: -15
Parameters for optimising coo-
ling
Cooling
Parameters
Proportional (CPB) Proportional range for cooling as
% of proportional (PB1)
Power Limits
Output 1 Voltage limit
100 % = 10 V
%
Output 2 Voltage limit
100 % = 10 V
%
Buttons
Description Button
F1: Work Temp Heat oven to working tempera-
ture.
F2: Standby Temp Heat oven to standby tempera-
ture
Gas Heating
Parameters for the KS 20 forming-gas temperature
controller
Checkbuttons
Checkbutton Description
In use Use controller
Startup
behaviour
Room temp. Startup temperature 15°C wit-
hout cooling
Work temp. Startup temperature as set by
means of the "Work" parameter.
Standby temp Startup temperature as set by
means of the "Standby" parame-
ter.
Parameter
Parameter Description /
Value range, unit
Default temps.
Work Working temperature selectable
under "Startup behaviour"
°C
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Parameter Description /
Value range, unit
Offset (SHIF) Temperature compensation to
allow for discrepancy between
location of sensor and bond
position
°C
Buttons
Description Button
F1: Work Temp Heat oven to working tempera-
ture.
F2: Standby Temp Heat oven to standby tempera-
ture
Gas Mixer
Parameters for the KS 40-1 temperature controller
Checkbuttons
Checkbutton Description
In use Use controller
Startup
behaviour
Room temp. Startup temperature 15°C wit-
hout cooling
Work temp. Startup temperature as set by
means of the "Work" parameter.
Standby temp Startup temperature as set by
means of the "Standby" parame-
ter.
Parameter
Parameter Description /
Value range, unit
Default temps.
Work Working temperature selectable
under "Startup behaviour"
°C
Standby Standby temperature selectable
under "Startup behaviour"
°C
Temp. Range The permissible temperature
range
°C
Default band width Temperature bandwidth as
check criterion for achievement
of the specified temperature.
°C
Default band scans
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Parameter Description /
Value range, unit
Interval Time between two measure-
ments
Number Number of consecutive intervals
with a measured temperature
inside the temperature band-
width as a criterion for accep-
tance.
Heating These are control-related para-
meters and the settings should
be changed by service engi-
neers only.
Proportional (Pb1) P parameter of the controller
°C
Integr. Action Time I parameter (integral time) of the
(ti1) controller
0.1 s
Deriv. Action Time D parameter (derivative time) of
(td1) the controller
0.1 s
Min. Cycle Time Minimum duration of a period
(ti1) 0.1 s
Output Limits
Lower Output Limit Lower limit of manipulated varia-
(Y.Lo) ble
%
Upper Output Limit Upper limit of manipulated varia-
(Y.Hi) ble
%
Lim. Mean Val Limitation of the mean value
(Ym.H) %
Temp. Offset Temperature compensation to
allow for discrepancy between
location of sensor and bond
position
°C
Cooling Air Offset Temperature differential as of
which cooling with compressed
air is activated
°C
Description Button
F2: Standby Temp Heat oven to standby tempera-
ture
Mass Flow
Parameters for the KS 20 forming-gas mass-flow
controller
Checkbuttons
Checkbutton Description
In use Use controller
Parameter
Parameter Description /
Value range, unit
Mass Flow
Settings.
Flow Flow rate per hour
l/h
Buttons
Description Button
F1: Work Temp Heat oven to working tempera-
ture.
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Display settings
Parameter for viewing the controller profiles
Checkbuttons
Checkbutton Description
Oven Heating Controller for oven temperature
Gas Mixer Controller for gas temperature
Live display Online display of temperature
transient
Heat & cool Two separate views for heating
and cooling
Parameter
Parameter Description /
Value range, unit
Profile Temp. Displayed temperature range
°C
Parameter Description /
Value range, unit
Live display Display scaling
settings
Duration Limit Maximum displayed value on
the time axis
ms
Profile Temp. Displayed temperature range
°C
Heat up settings Display scaling for heating
Duration Limit Maximum displayed value on
the time axis
ms
Profile Temp. Displayed temperature range
°C
Cool down settings Display scaling for cooling
Duration Limit Maximum displayed value on
the time axis
ms
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Parameter Description /
Value range, unit
Change position
X
Position of the wafer x-y table for
wafer changes.
This position must be specified
only during setup.
In the X direction, the position
should be as close as possible
to the transport wheel. Leave a
margin of safety of
1 - 2 mm.
µm
Y
Offset dy Offset of the workholder in Y
direction before moving into the
clamp
Distance of the workholder from
the transport roll in the X direc-
tion while the input pusher
opens or closes
µm
Magazine lift
Slot positions
first slot
Position of the magazine lift on
transfer of a wafer from the first
or last slot, respectively.
µm
last slot
Slot definitions Number of slots per magazine.
No of slots
Slot definitions Number of the slot currently in
Active slot use.
You have the option of selecting
a slot manually. Enter the slot
number of your choice in the
input field, press "Enter" to con-
firm your choice and click the
"F1: Move To" button to move to
the slot.
There is no check to ensure that
the slot actually contains a
wafer.
Transport clamp
Change pos X Position of the clamps for wafer
changes in X.
µm
Upper Z Position of the upper clamp for
wafer changes in Z.
µm
Lower Z Position of the lower clamp for
wafer changes in Z.
µm
1.7.9 Wafer Machine Data (M 22)
Machine-specific parameters of the wafer-handling
system.
Parameter
Parameter Description /
Value range, unit
Wafer Number
Act. Number of the wafer currently on
the x-y table.
Wafer table
Center position X Centre of the wafer x-y table
This position is a factory setting:
Do not change this setting
unless mechanical changes
affecting it have been performed
at the wafer x-y table.
µm
Y
Radius r Radius of the wafer carrier.
This is a factory setting: do not
change this setting unless
mechanical changes affecting it
have been performed at the
wafer carrier.
µm
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Button Description
F5: Close LTC Close the lower clamp.
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
F7: ChangeWafer Perform a complete wafer-
change cycle.
F8: NextSlot Move the wafer lift down one
slot.
F9: ChipCntrl Move the DCL unit to the chip
control position.
F10: Move WT Toggle trackball function bet-
ween mouse function and move-
ment of the axes.
fn+F6: DE Block Raise or lower the chip ejector.
fn+F8: DCC open Open the die carrier clamp.
fn+F9: DCC close Close the die carrier clamp.
Parameter Description /
Value range, unit
Work Z Position of clamps in Z at which
there is no possibility of collision
with the x-y table.
µm
Lift positions Position of the workholder con-
Pos1 X veyor system in X, when the
wafer in the wafer magazine is
picked up or set down.
µm
Lift Positions Collision-free position of the
Pos 2 X workholder conveyor system
with reference to the wafer lift
µm
Delays
Camera Delay between arrival at the
camera position and the start of
imaging.
ms
Timeouts for wafer
change
Transportation Time within which transport
must be completed. An error
message is issued if this timeout
is overshot.
ms
Clamping Time within which the workhol-
der clamp must close. An error
message is issued if this timeout
is overshot.
ms
WH Start Slow Pos Position, pos 1 x and pos 2 x, at
which the wafer frame is not yet
in the magazine. Slow approach
as of this position.
µm
WH Start Slow Reduced speed
Speed
Buttons
Button Description
Lift Home Move the magazine lift to the
home position.
TC home Move the workholder transport
system to the home position.
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field.
Software Manual A-1 1 Bonding
1.7 Machine Pages menu (M)
135
1.7.10 Die Ejector Rotor Position (M 24)
Definition of the positions of the chip ejector
toolchanger when each chip ejector is changed.
Parameter
Parameter Description /
Value range, unit
DieEjector Tool Number of the chip ejector unit
number for which you want to set the
position.
Toolpostion P Position of the toolchanger when
the chip ejector unit you selected
is changed.
0,01°
DieEjektorBlock Delay
delay ms
counts for 360° Number of steps into which 360°
rotation rotation is subdivided
Buttons
Button Description
F10: Move Switch to trackball control for
moving along the X and Y axes
using the trackball. Press the "+"
key to increase the speed of
movement, or press the "–" key
to reduce the speed. Press
"Shift" to activate a higher speed
directly.
Press "F10" again to toggle back
to the mouse function.
<fn> F2: Defaults Once the first position has been
trained, the other seven positi-
ons are distributed equidistantly
around the circle.
Button Description
F1: Move To Move to the coordinates corre-
sponding to the values in the
input field (see "1.3.4 Entering
coordinates" on page 1-12).
F2: DE Block Raise or lower the chip ejector.
F3: Change Tool Perform a chip ejector change.
F6: Trace Automatic transfer to the pro-
gram of the position to which the
system has moved and repre-
sented by the coordinates in the
input field which contains the
cursor and the linked fields (see
"1.3.4 Entering coordinates" on
page 1-12)
136
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1.8 Service menu (S)
Software Manual A-1
Button Description
Switch to DCL Switch to the DCL wizard
wizard
Switch to WFS Switch to the WFS wizard
wizard
General
Positions
Epo pos. Move to the epoxy position
Next epo pos. Move to next epoxy position
Prev.epo pos. Move to previous epoxy posi-
tion.
Next subst. Move to next substrate position.
Previous subst. Move to previous substrate posi-
tion.
Next module Move to next module position.
1 . 8 Se rvi c e m en u (S)
The "Service" menu permits access to certain
basic functions of the motor controller card and the
I/O cards. This pull-down menu is for service and/
or update purposes and some of its functions are
not accessible to ordinary users.
1.8.1 Reinit motors (S 1)
Re-energise all motors driven by the motor control-
ler card. List of motors: (see "1.8.2 Deinit motors
(S 2)" on page 1-136).
1.8.2 Deinit motors (S 2)
De-energise all motors driven by the motor control-
ler card. The corresponding axes can be moved
freely by hand. List of motors:
„ Wafer x-y table X-axis
„ Wafer x-y table Y-axis
„ Chip ejector (ejector system)
„ Wafer lift
„ DCL unit X-axis
„ DCL unit Y-axis
„ DCL unit Z-axis
„ DCL unit P-axis
„ Chip-ejector tool holder
„ Workholder transport clamp X
„ Workholder transport clamp Z
1.8.3 Wizard (S 4)
Direct access to a wind range of machine move-
ments and functions, without having to open the
appropriate pages. The following wizards are
available:
„ Wizard for the EPO tool
„ Wizard for the DCL tool
„ Wizard for the wafer handling system
„ Wizard for the oven
You can use the buttons to switch from one wizard
to another. The screens shown below might differ
from those on your machine, because the range of
functions available depends on the machine confi-
guration.
EPO wizard
Buttons
137
Software Manual A-1 1 Bonding
1.8 Service menu (S)
Button Description
Previous module Move to previous module posi-
tion.
EPO head
Trackball move Activate the trackball in order to
move the EPO unit
Move EPO HOME Move to EPO home position.
Dispenser
Purge pos. Move to the purging position
Purge Clean dispensing needle
Squeegee
Squeegee pos. Move to position for picking up
epoxy adhesive in the squeegee
unit
Squeegee ON/Off Switch squeegee for adhesive
on and off.
Reset Squeegee Reset the squeegee.
Tools
Put tool Set down the EPO tool.
Get tool Pick up the EPO tool.
Manual Manual tool change
Toolchange
Toolchanger home Move to the toolchanger's home
position.
Toolchanger for- Move to the toolchanger's work
ward position.
Bond info
Cancel Adjust Discard all adjustment data
Cancel bond info Discard all statistics on proces-
sed and rejected chips
DCL wizard
Buttons
Button Description
Switch to EPO Switch to the EPO wizard
wizard
Switch to WFS Switch to the WFS wizard
wizard
General
positions
Dcl pos. Move to the bond position
Next Dcl pos. Move to next bond position
Prev.Dcl pos. Move to previous bond position.
Next subst. Move to next substrate position.
Previous subst. Move to previous substrate posi-
tion.
Next module Move to next module position.
Previous module Move to previous module posi-
tion.
Pickup pos. Move to the pickup position
Camera free pos. Move to the position at which the
wafer camera has an unobstruc-
ted view of the wafer
Clean pos. Move to the position above the
trashcan
Chip control pos. Move to the position above the
chip-control LED
DCL head
Trackball move Activate the trackball in order to
move the DCL unit.
Move DCL HOME Move DCL to the home position
138
1 Bonding
1.8 Service menu (S)
Software Manual A-1
Button Description
Tool
Put tool Set down the EPO tool.
Get tool Pick up the EPO tool.
Manual Manual tool change
Toolchange
Toolchanger home Move to the toolchanger's home
position.
Toolchanger for- Move to the toolchanger's work
ward position.
Vacuum ON Switch on the vacuum.
Air ON Switch on the supply of com-
pressed air.
Medium OFF Switch off vacuum/compressed
air.
Bond info
Cancel Adjust Discard all adjustment data
Cancel bond info Discard all statistics on proces-
sed and rejected chips
WFS wizard
Buttons
Button Description
Switch to EPO Switch to the EPO wizard.
wizard
Switch to DCL Switch to the DCL wizard.
wizard
General
Positions
Start pos. Move to the position at which
processing of a new wafer
starts.
Center pos. Move to the centre of the wafer.
Change pos. Move to the position at which the
wafer camera has an unobstruc-
ted view of the wafer.
Wafer table
Trackball move Activate the trackball in order to
move the wafer table.
Move WT HOME Move the wafer table to the
home position.
Wafer align
Search Search for chip.
Align Search for chip and move to the
pickup position.
Change Wafer Perform a manual wafer change.
139
Software Manual A-1 1 Bonding
1.8 Service menu (S)
Button Description
Change
Components
If the bonder is restarted in an
undefined state after a disrup-
tion, this mask can be used to
achieve a defined state without
the necessity of removing sub-
strates and wafers from the
machine
Button Description
Empty Machine All wafers still in the machine are
returned to the wafer-magazine
lift.
First chip Move to the first chip on the
wafer.
Measure chip index Automatically compute spaces
between chips in X and Y.
Die handling
DCC open Open the die carrier clamp.
DCC close Close the die carrier clamp.
Open UTC Open the upper clamp.
Close UTC Close the upper clamp.
Open LTC Open the lower clamp.
Close LTC Close the lower clamp.
TC ==> Move the workholder transport
system to the change position at
the wafer cassette.
TC <== Move the workholder transport
system to the change position.
UTC/LTC to work Move top/bottom clamp to work
high height
UTC to DCC height Move top clamp to the height for
die carrier clamping
LTC to DCC height Move top clamp to the height for
die carrier clamping
Move TC HOME Move the workholder transport
system to the home position.
DE block
UP Move the chip ejector up.
Down Move the chip ejector down.
Get DE tool Function is inactive.
Needle up Extend the needles.
Needle down Retract the needles.
Vacuum ON Switch on the vacuum.
Medium OFF Switch off the vacuum.
Magazine lift
First slot Move the magazine lift into posi-
tion at the first slot.
Last slot Move the magazine lift into posi-
tion at the last slot.
Next slot Move the magazine lift into posi-
tion at the next slot.
Active Compon-
ents
1 Bonding
1.8 Service menu (S)
Software Manual A-1
140
Button Description
Set Heat or cool, as applicable, to
the setpoint temperature as
shown.
Abort Abort heating or cool, as appli-
cable, to the setpoint tempera-
ture.
Standby Temp Heat or cool, as applicable, to
the standby temperature.
Work Temp Heat or cool, as applicable, to
the working temperature.
Oven wizard
The measured temperature (actual value) is
shown in green in the top line, along with the cur-
rent setpoint temperature.
The permitted temperature range is shown in
green in the second line.
Parameter
Parameter Description /
Value range, unit
temp New setpoint value
°C
timeout Time after which heating or coo-
ling, as applicable, to the set-
point temperature is aborted
0.01°
Buttons
1.8.4 Configuration (S 5)
Basic bonder settings. Activate or deactivate indi-
vidual components or modules for servicing and
testing.
The screen might not necessarily be as shown
here: the layout varies in accordance with the con-
figuration of the machine.
The following functions and modules can be acti-
vated and deactivated:
DCL unit
„ Entire DCL unit
„ Substrate alignment
„ Individual adjustment movements
„ Inkdot check
„ Pickup
„ Chip-eject system
„ Vacuum check
„ Infrared chip check
„ Provision for wafer angle
„ Indexer
„ Height measurement
Wafer station
„ Entire wafer x-y table
„ Chip alignment
„ Wafer change
Software Manual A-1 1 Bonding
1.8 Service menu (S)
141
1.8.5 Machine Counter (S 6)
Displays various counters. The first column con-
tains overall counters of the objects in question,
and cannot be reset. You can reset the counter in
the second column ("Actual Values") by clicking
the appropriate button.
Machine Counter > Properties WY
The wafer yield figure can be adjusted to suit con-
ditions. Yield can be calculated separately for each
wafer or from reset to reset.
1.8.6 Change Epoxy (S 7)
The epoxy adhesive has to be applied within a defi-
ned time. You enter the data for the epoxy adhe-
sive in this menu.
Parameter
Parameter Description /
Value range, unit
Epoxy Age Current age of the epoxy adhe-
(HH:MM) sive. Updated automatically by
the program.
Hours: Minutes
Epoxy Lifetime (H) Maximum life of the epoxy adhe-
sive. The program interrupts
bonding and issues an error
message when this time has
elapsed.
0: Function is inactive.
Hours
Warning time (MIN) Time until the life of the adhesive
expires. The program issues a
warning to the effect that the
adhesive has to be changed.
Minutes
Buttons
Button Description
Epoxy Changed Resets the counter for Epoxy
Lifetime.
1 Bonding
1.8 Service menu (S)
Software Manual A-1
142
1.8.7 Cycle Times (S 8)
Show the last cycle times.
Parameter
Parameter Description /
Value range, unit
EPO Cycle Time Last cycle time of the EPO unit.
ms
DCL Cycle Time Last cycle time of the DCL unit
ms
WFS Cycle Time Last cycle time of the wafer
system
ms
INX Cycle Time Last cycle time of the indexer
ms
1.8.8 Tool hits (S 9)
Resettable counters for EPO and DCL
1.8.9 Diebonder I/O page (S 10)
All bonder inputs and outputs which do not belong
to the indexer are listed on this page. This page
enables the outputs to be activated and the sensor
inputs checked for service purposes and for fixing
faults during production.
A T T E N T I O N
R I S K O F C O L L I S I O N
No safety check
1.8.10 Indexer IO page (S 11)
All bonder inputs and outputs which belong to the
indexer are listed on this page. This page enables
the outputs to be activated and the sensor inputs
checked for service purposes and for fixing faults
during production. You will find more information in
the user guide for the indexer.
1.8.11 Indexer Settings (S 12)
Settings for the indexer You will find more informa-
tion in the user guide for the indexer.
1.8.12 Inputlift Page (S 13)
Settings for the input lift. You will find more infor-
mation in the user guide for the lifts.
1.8.13 Outputlift Page (S 14)
Settings for the output lift. You will find more infor-
mation in the user guide for the lifts.
Software Manual A-1 1 Bonding
1.8 Service menu (S)
143
1.8.14 Motor Service (S 15)
Help functions for troubleshooting and monitoring
the measuring systems and drives.
A T T E N T I O N
R I S K O F C O L L I S I O N
No safety check
1.8.15 Get Versions (S 20)
Overview of version numbers of all software modu-
les installed.
1.8.16 User Administration (S 90)
Each user group has its own, specific scope of
access to machine functions and parameter set-
tings. A user group is defined by its password.
There are three user groups:
„ Technician
„ Engineer
„ Supervisor
Changing the password for a user group:
ÆEnter the supervisor password.
ÆUse Switchbox to select the user group whose
password you want to change.
ÆEnter the new password twice.
ÆClick the "CHANGE PASSWORD" button.
Changing user rights:
ÆEnter the supervisor password.
I M P O R T A N T
Level Editor closes automatically if 30 seconds
pass without a user input. Changes that have
not been saved are lost when this happens.
ÆLevel Editor button: Press "Edit".
The menu closes.
ÆSelect the input field in a menu for which you
want to assign new rights.
ÆClick the right mouse button to start the dialog.
Menu with checkbuttons appears on the screen.
1 Bonding
1.8 Service menu (S)
Software Manual A-1
144
Checkbuttons
Checkbutton Description
enabled Editable input field
selectable Entries not possible, but field
can be selected so that function
buttons can be used.
disabled View only, no access
ÆAssign the user right or rights.
ÆRepeat the procedure for other input fields as
necessary.
To define a user right on a permanent basis: ÆReselect User Administration (S 90).
ÆEnter the supervisor password.
ÆActivate by pressing the "Save changed set-
tings" button.
The menu closes and the changes are saved.
1.8.17 Change User Level (S 91)
Changes the user group.
ÆMark the user group you want to change.
ÆEnter the appropriate password.
ÆPress "enter" to confirm.
ÆClick "Escape" to change the user group and
exit the menu.
145
Software Manual A-1
1 Bonding
1.9 Preparations
1.8.18 Show Logfiles (Service 98)
There are register tabs for the following logfiles:
„ Console: Log of all keyboard entries
„ DCL Heights: Log of all defined heights
„ Modem: Log of all information about connection
setup and data transfer by modem
„ Syslog: Log of all machine actions
1.8.19 Set Printer Format (S 99)
Set the parameters according to whether you want
to print to a file or use a postscript-compatible or
HP PCL-compatible printer.
1. 9 Preparations This section outlines the procedure for starting pro-
duction with the bonder.
1.9.1 Switching on the bonder
ÆPress and hold down the green button on the
main-switch module until all three contactors of
the power supply unit pull up with an audible
click (approx. 3 seconds).
ÆWait until the bonder software is fully loaded.
The following message appears on the screen:
ÆClick "OK" to start the startup procedure.
ÆClick "Yes" to move all axes to their home posi-
tions, or click "No" to cancel.
ÆClick "Yes" to position the wafer x-y table in the
centre, or click "No" to cancel.
ÆClick "Yes" to raise the chip ejector block, or
click "No" to cancel.
ÆClick "Yes" to reset the indexer, or click "No" to
cancel.
146
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1.9 Preparations
Software Manual A-1
Initialisation is now complete.
ÆInstall the DCL toolholder in the toolholder
attachment.
1.9.2 Train the machine-specific parame-
ters
Changes to the machine hardware components
listed in this subsection necessitate the retraining
of the parameters cross-referenced below.
DCL camera
Parameters that have to be changed if modificati-
ons are made to the mechanical or optical subsy-
stems of the DCL camera.
„ See "1.5.1 DCL Camera Scale (O 1)" on page 1-
18
„ See "1.5.3 DCL Camera <–> Tool Offset (O 3)"
on page 1-24
„ See "1.5.12 MWC Wafertable <–> DCL Trafo
(O 52)" on page 1-30
DCL Tool
Parameters that have to be changed if modificati-
ons are made to the DCL tool.
„ See "1.5.2 DCL Tool Offset (O 2)" on page 1-19
„ See "1.5.3 DCL Camera <–> Tool Offset (O 3)"
on page 1-24
„ See "1.5.13 MWC Camera <–> Tool Offset
(O 53)" on page 1-31
Needle
Parameters that have to be changed if needles are
changed.
„ See "1.5.8 Camera-Needle Offset (O 25)" on
page 1-27
Wafer camera
Parameters that have to be changed if modificati-
ons are made to the wafer camera.
„ See "1.5.8 Camera-Needle Offset (O 25)" on
page 1-27
„ See "1.5.11 MWC Camera Scale (O 51)" on
page 1-29
„ See "1.5.13 MWC Camera <–> Tool Offset
(O 53)" on page 1-31
Wafer table
Parameters that have to be changed if modificati-
ons are made to the wafer table.
„ See "1.5.12 MWC Wafertable <–> DCL Trafo
(O 52)" on page 1-30
147
Software Manual A-1
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1.9 Preparations
Lookup camera
Parameters that have to be changed if modificati-
ons are made to the optional lookup camera.
„ See "1.5.14 Option Lookup Camera Scale
(O 60)" on page 1-31
1.9.3 Setting up an application
When the program starts the "File > Load" com-
mand is called automatically and the applications
stored in memory are listed.
ÆUse "File > Load" to select an application similar
to the new application.
The advantage of this approach is that it minimises
the number of new parameters to be programmed.
The following routines have to be executed in the
"Mode" menu:
„ Train the substrate positions: (see "1.5.5 Learn
Substrate Positions (O 9)" on page 1-25)
„ Train the module positions: (see "1.5.6 Learn
Module Positions ( 10)" on page 1-26)
„ Train the wafer radius: (see "1.5.7 Learn Wafer
Radius (O 21)" on page 1-26)
„ Train the chip positions: (see "1.5.9 WFS Learn
Chip (O 30)" on page 1-27)
„ Train the spacing between the chips: (see
"1.5.10 WFS Learn Chip Index (O 31)" on page
1-28)
1.9.4 Indexer
The bonder can operate with various types of sub-
strate: it may be necessary to reset the indexer for
each new type. The indexer is the subject of a
separate User Guide.
148
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1.9 Preparations
Software Manual A-1
149
Software Manual A-1
Index
Index
A
administrate user groups 143
Air & Vacuum 11
Application Pages menu 32
B
background knowledge 6
backup
bond data 14 C
calculate centre of circle 66
Calipers 64, 103
calipers 64, 90, 103
cardiac pacemakers 5
Change Epoxy 141
chip ejector toolchanger 135
Circle Center Finder 66
Configuration 140
counter 141
Cycle Times 142
D
DCL
adjusting speeds 115
setting limits 126
Tool Offset 125
toolchanger 124
wizard 137
DCL Camera - Tool Offset 24
DCL Camera Scale 18
DCL Machine Data 113
DCL tool offset 19
deinit motors 136
Delete File 14
Diebonder I/O page 142
DieEject Block 11
E
EBP 6
Edge Search 86
edge search 59, 71
EMERGENCY STOP 5
EPO
adjusting speeds 120
change adhesive 141
setting limits 127, 128
wizard 136
EPO Camera - Dispenser Offset 25
EPO Machine Data 119
F
file menu 13
G
grounding 6
H
hazards when bonding 5
height measure settings 116
HML 116
Hole Finder
holes 70
HOME 12
I
Indexer IO page 142
inkdot search 53
K
keyboard functions 12
Index Software Manual A-1
150
L
learn module positions 26
Learn Substrate Positions 25
Learn Wafer Radius 26
load application data 13
load machine data 13
Load Program from FTP-Server 15
Load Program to FTP-Server 15
M
Machine Counter 141
Machine Pages 113
masks 65, 91, 104
mode 71
mode menu 17
N
notes on safety 5
O
offset, needle position 27
Optional Parameters 63, 102
Ordinary Alignment 56
Oven
wizard 140
oven
temperature profiles 109
S
safety 5
safety device 5
safety instructions 5
Save As 13
save bond files to floppy disc 15
screen layout 9
search lines 64, 90, 103
search mode 86
service menu 136
setting up a new application 147
software version 143
START 12
status and barcode information 11
STEP 12
STOP 12
substrate adjustment
Circle Center Finder 66
Hole Finder 70
switching off the bonder 16
switching on 145
switching on the bonder 145
T
touchdown search 116
transformations 52, 94
U
User Administration 143
P
pattern recognition 56
preparations 145
Production Data 73
V
version numbers 143
R
reinit motors 136
RESTART 12
restore
complete 14
single bonding file 15
Software Manual A-1
Index
151
W
Wafer
wizard 138
Wafer Data 74
Pickup Data 78
wafer data
pickup data 34
WFS learn chip 27
WFS learn chip index 28
wizard 136
Index Software Manual A-1
152
Geringer Halbleitertechnik GmbH & Co KG Subject to change without prior notice
2012 All rights reserved
To be ordered from:
Geringer Halbleitertechnik GmbH &Co KG
Liebigstr. 1
93092 Barbing
Germany
Printed by Geringer
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