fcbga package warpage Øii definition stage project kirk van dreel, plexus hdp user group member...
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FCBGA Package Warpage ØII
Definition Stage Project
Kirk Van Dreel, Plexus
HDP User Group Member MeetingHost: EngentAtlanta, Ga.
September 9, 2015
© HDP User Group International, Inc.
BackgroundPackage/board Warpage increasing trends
•Driven by thinner package substrates and thinner die Package/Board contacts getting smaller and closer
thereby reducing ability to overcome increased Warpage. Solder Joint Quality is Impacted by the increasing
Package Warpage.
With advent of lead free soldering, the assembly temperatures have increased and the Warpage impact has been exacerbated.
© HDP User Group International, Inc. 2
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Goal
© HDP User Group International, Inc.
Establish a limit for dynamic package warpage that can be mitigated during board assembly without impacting solder joint quality
Project Objectives
Phase 1 - Test Method DevelopmentThis phase will establish a test method which will enable the team to compare and contrast the effects of the mitigation techniques.
Phase 2 - Characterization Of Mitigation Methods and Max Package Warp Specifications
This phase will leverage phase 1’s output to establish the maximum warp an optimized process can accommodate and characterize the contribution of the mitigation techniques on the process yield.
© HDP User Group International, Inc. 4
Hot Air Rework Machine Method
Basic Concept of Hot Air Rework Equipment and Process Blowing heated air from the top, down on to the BGA package using a
nozzle The air heats up the package, board and solder joints Air temperature and flow rate is controlled Package is lifted up or down with a vacuum cup Video Camera, can record a few solder joints on the outside row on one
side of the package The basic concept is to lift the component up or down at different
temperatures to simulate dynamic warpage characteristics of the package
Rework Machine SRT Summit 1800
Video camera
© HDP User Group International, Inc. 12
Test Vehicle
Factor LowerPCBA Materials
Size 155 X 60 mmThicness 0.63inSurface Finish ENIGSolder Mask Tayo 4000Pad Size 0.60mmSolder Mask Opening 0.40mmSubstrate Mtrls 370HRCu Weight 1/2 oz CuLayer Count 2
ComponentsSize 10.6mm sqI/O Count 28Thickness 0.063inSolder Alloy SAC305Surface Finish ENIGSolder Mask Tayo 4000Substrate Mtrls 370HRCu Weight 1/2 oz CuLayer Count 2Ball size 0.55mmPad size 0.5Pitch 1.2 mm
Phase II: Test Plan
Factor Lower UpperSolder Materials
Solder Paste Activity L0 H1Solder Paste Tackiness 30gr 50gr
Reflow Profile Cooling rates (Delta T) 10C/sec 30C/secPeak temperatures 2350C 2550CAtmosphere PPM Air 500 ppm
Stencil Stencil Thickness 3.5 mil 5.0 milSolder paste volume 120% of 3.5mil 70% of 5 mil
Factors:
Phase II: Test Plan
Category Response Criteria Measurement Tool
Z-axis Displacement to products
As Placed +/- 12 um flatness Camera Pixel Count
Pre-Liquidus + 12 um above paste Camera Pixel Count
Peak Reflow + 12 um above paste Camera Pixel Count
Failure Rate HoP DPMO
Defect per solder joint Visual Inspection / Die & Pry, Sample X-ray CT
NWO DPMO Defect per solder joint Visual Inspection / Die & Pry, Sample X-ray CT
Responses:Primary Response:
Sample Size:Total Substrates: 620Total Components: 620 8
Phase II Project Activities
Project Activities ProviderFinalize Protocol Team
Provide Laminate for Substrates Panasonic
Fabricate Substrates Sanmina
Substrate Bumping Nihon-Superior
Rework System Programming VJ Technologies*
Stencil Procurement Nihon Superior
Lease Printer HDP
Assemble Substrates Plexus
Die and Pry Analysis Engent
Plexus
Sanmina-Huntsville
Nihon-Superior
VJ Technologies*
Cross Section Analysis Plexus
Data Analysis Plexus
Report Development Team
* Non-Member
© HDP User Group International, Inc. 9
Phase II Proposed Schedule
© HDP User Group International, Inc. 10
Project Plan Owner Est. CompActual
Test Vehicle Design Plexus 08/01/2015 07/16/2015Finalize Protocol TEAM 10/01/2015Substrates FabricationSanmina 10/30/2015 Lease Screener ($8.6K) HDPUG 11/03/2015Order Stencils Nihon-Superior 10/23/2015Rec’v Substrates VJT 11/02/2015Rec’v Stencils Nihon-Superior 10/30/2015Component Bumping Nihon-Sup’r/Micross 10/30/2015Receive Screener HDPUG/VJT 11/06/2015Rework System Programming VJT 11/02/2015Complete Test Vehicles ASM VJT 12/21/2015Die and Pry Analysis Plexus,VJT,Sanmina,
Nihon-Sup’r, et al 02/19/2016Complete Data Analysis Plexus 02/19/2016Sample X-Ray AnalysisPlexus, VJT 04/04/2016Write Report TEAM 05/29/2016
© HDP User Group International, Inc.11
Team Members
• Akrometrix
• Alcatel-Lucent
• Arlon
• Celestica
• Cisco
• Curtiss-Wright
• Engent
• Ericsson
• Flextronics
• Freescale
• Fujitsu
• Hitachi-Chemical
• Huawei
• IBM
• Indium
• Isola
• Juniper
• Keysight
• Kyzen
• Multek
• Nihon-Superior
• NVIDIA
• Oracle
• Panasonic
• Philips
• Plexus - Team Leader
• Sanmina
• TTM Tech
• Viasystems
• VJ Technologies (Non-Member)
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