dirk zwemer 1, manas bajaj 2, russell peak 2, thomas thurman 3, kevin brady 4, sean mccarron 1, alex...
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Dirk Zwemer1, Manas Bajaj2, Russell Peak2, Thomas Thurman3, Kevin Brady4, Sean McCarron1, Alex Spradling1, Michael Dickerson5, Lothar Klein6, Giedrius Liutkis6, and John Messina4
1. AkroMetrix LLC2. Georgia Institute of Technology3. Rockwell Collins, Inc.4. National Institute of Standards and Technology5. InterCAX, LLC6. LKSoftWare Gmbh.
PWB Warpage Analysis and Verification using an AP210 Standards-Based Engineering Framework and Shadow Moiré
AkroMetrix
EuroSimE 2004 www.eurosime.com Brussels, Belgium May 10-12, 2004
© All Rights Reserved. Permission to reproduce and distribute without changes for non-commercial purposes (including internal corporate usage) is hereby granted provided this notice and a proper citation are included.
Web version from http://eislab.gatech.edu/pubs/conferences/2004-eurosime-zwemer/ as of 2004-10-14
2
Warpage – Impact and Trends
Impact Low Manufacturing Yield High Rework of Interconnects Low Reliability More Severe with Higher Temperatures, Finer Pitch
Trends OEMs Enforcing New Warpage
Specifications on Suppliers. Temperature-Dependent Warpage Local and Global Warpage
3
Contents
Design-Analysis Interface within a Multi-Representation Engineering Framework
Experimental Verification using Temperature-Dependent Shadow Moiré
Initial Results and Future Development
4
Tree Structure of Multi-Representation Engineering Framework
MPMBare PWB
APMElectrical
APMMechanical
APMManufacturability
CBAMWarpage
CBAMPTH Fatigue
ABBLayered Shell
Effective Materials Properties
SMMFinite Element
Manufacturing Product Model
AnalyzableProduct Model
Context-BasedAnalysis Model
AnalysisBuilding Blocks
SolutionMethod Model
5
AP210 Standards-based Engineering Framework for Warpage Simulation
Solution Method Model
ABB SMM
Analysis Building Block
Context-Based Analysis Model
SMMABB
APM ABB
CBAM
APM
Manufacturing Product Model(STEP AP210-based)
Solution Tools(ANSYS, …)
Printed Wiring Assembly (PWA)
Solder Joint
Component
PWB
body3body2
body1
body4
T0
Printed Wiring Board (PWB)
SolderJoint
Component
AnalyzableProduct Model
6
Manufacturing Product Model (MPM) in anAP210 Standards-Based Engineering Framework
XaiToolsPWA-B
Eagle
LKSoft, …Gap-FillingTools
XaiToolsPWA-B LKSoft, …
Traditional Tools Mentor
Graphics
Manufacturing Product Model Components• STEP AP210
STEP-Book AP210,SDAI-Edit,
STI AP210 Viewer, ...
Instance Browser/EditorPWB Stackup Tool,…
ElectricalCAD Tools
pgpdm
Core PDM Tool
AP210interface
Doors
Slate
Systems EngineeringTools
- Eurostep AP233 Demonstrator- XaiTools AP233
7
AP210-based Manufacturing Product Model (MPM)cable_db example 2D PCB view and 3D Assembly view
As viewed in LKSoft AP210 STEP-Book
8
Analyzable Product Model (APM)Warpage Analyzable View of PWB
2D geometric structure
Orientation of each layer and associated features
Layer thickness and material properties
PCB outline
Comprised of straight lines and arcs (primitive level)
Mechanical (Tooling / Drilling) Hole
Circuit Traces
land
plated through hole
via
Footprint occurrence
This comprises of four lands, in this case. The component sits atop the lands.
Complete trace curve not shown
1 Oz. Cu
1 Oz. Cu
1 Oz. Cu
1 Oz. Cu
2 Oz. Cu
2 Oz. CuM150P2P11184
M150P1P21184
3 x 1080
3 x 1080
2 x 2116
9
Setting up context for warpage analysisAPM and ABB Creation
Grid (Sieve) Size
Single Layer View
…
Top view of “effective” grid elements in top layer of the PCB
…
Side view of the PCB with “effective” grid elements across
the stratums
thickness
wid
th
length
Given:
• Thermal loading profile
• Boundary Conditions (mostly displacement)
• Idealize PWB stackup as a layered shell
ABB ModelMPM / APM CBAM
Effective Material Property
Computation
CBAM attributes
• Thermal loading profile
• Boundary Conditions (mostly displacement)
• Idealize PWB stackup as a layered shell
10
Stage 1: Chopping the bare PWBCreating the ABB model
…
In this scenario, the plated through holes and vias are neglected (for simplicity).
Only the mechanical tooling holes are accounted for.
…
…
Case 1
Case 2
Case 3
Case 1
Case 2
Case 3
Board Edge Scenario 1
Board Edge Scenario 2
Tooling Hole Scenario 1
N columns
M rows
At the end of stage 1, an M X N grid of shapes (comprised of arcs and lines at the primitive level) would be available.
Operation during this stage is common across all stratums (as it deals with board outlines and tooling holes only – vias are disregarded)
11
Stage 2: Computing metallization ratio Creating the ABB Model
Consider a snapshot of metallization (traces and lands on stratum K)
…
…
…
…
J
I
Percentage metallization in the IJ th cell of stratum K is of interest. Let this percentage be
Effective material property IJK for cell IJ on stratum K is then computed as:
(1) IJK = ( / 100 ) * metal + ( 1 - / 100) * air for copper layers
(2) IJK = dielectric for dielectric layers
air and hence the second term can be neglected in (1) above
For the case of warpage, is:
-- Co-efficient of thermal expansion
-- Young’s modulus of elasticity
Cell IJ on stratum K has effective material
properties IJK
At the end of Stage 2, we have the effective material properties for each cell (MN cells)
in each stratum (P stratums)
1 <= I <= M
1 <= J <= N
1 <= K <= P
…
Side view of the PWB with “effective” grid elements across
the stratums
thickness
12
View of Analysis Building Block systemChopped (e.g. 4X4 grid) PWB Material properties
13
View of Analysis Building Block systemPWB Stackup Material properties
14
View of Solution Method ModelLayered shell mesh Geometric constraints
all 6 degrees of freedom locked at midpoint – boundary condition
Currently this model is tool-specific (ANSYS).
Future possibility of AP209-based implementation exists.
15
Contents
Design-Analysis Interface within a Multi-Representation Engineering Framework
Experimental Verification using Temperature-Dependent Shadow Moiré
Initial Results and Future Development
>>
16
Principles of Shadow Moiré
WhiteLight In
Diffusely ScatteredLight Out
Grating
Shadow Grating Sample
Example Fringe Intensity Images
VideoCamera
17
Specifications
Specifications• Sample Size: up to 400 x 400 mm
• Vertical Resolution: ± 1 µm
• Lateral Resolution: 640 x 480 pixels
• Temperature Range: -55 C to 300 C (continuous), 350 C peak
• Time per Measurement: 1 second (data acquisition), 2-10 seconds total
Shadow Moiré Verification - TherMoiré®
18
Design 1 Video Image
Design 1 High ResolutionShadow Moiré Phase Image
Shadow Moiré Data
19
25 C Absolute Coplanarity = 261 mils 150 C Absolute Coplanarity = 234 mils
Coplanarity = 25.4 mils 150 C relative to 25 C Coplanarity = 7.4 mils
20
-100
-50
0
50
100
150
200
Tem
per
atu
re (
C)
0
5
10
15
20
25
Model Exp't
Sca
le (
mil
s)
-50 C
21
-100
-50
0
50
100
150
200
Tem
per
atu
re (
C)
0
5
10
15
20
25
Model Exp't
Sca
le (
mil
s)
-25 C
22
-100
-50
0
50
100
150
200
Te
mp
era
ture
(C
)
0
5
10
15
20
25
Model Exp't
Sca
le (
mil
s)
0 C
23
-100
-50
0
50
100
150
200
Te
mp
era
ture
(C
)
25 C
24
-100
-50
0
50
100
150
200
Te
mp
era
ture
(C
)
0
5
10
15
20
25
Model Exp't
Sca
le (
mil
s)
50 C
25
-100
-50
0
50
100
150
200
Te
mp
era
ture
(C
)
0
5
10
15
20
25
Model Exp't
Sca
le (
mil
s)
75 C
26
-100
-50
0
50
100
150
200
Te
mp
era
ture
(C
)
0
5
10
15
20
25
Model Exp't
Sca
le (
mil
s)
100 C
27
-100
-50
0
50
100
150
200
Te
mp
era
ture
(C
)
0
5
10
15
20
25
Model Exp't
Sca
le (
mil
s)
125 C
28
-100
-50
0
50
100
150
200
Te
mp
era
ture
(C
)
0
5
10
15
20
25
Model Exp't
Sca
le (
mil
s)
150 C
29
Future DevelopmentsCurrent Status
Generated Warpage Analysis Model from PWB Design Data using AP210-based Engineering Framework
Compared Results with Temperature-Dependent Shadow Moiré Experiments
Future Developments (Analysis) Level of Idealization – Grid Dimensions, Vias,… Controlled Meshing (non-tool specific) Display Options
Future Developments (Validation) Initial Conditions and Panelization Boundary Conditions and Reference Plane Temperature Uniformity and Sample Variation
30
Acknowledgements Georgia Institute of Technology
– Robert Fulton– Injoong Kim– Miyako Wilson
LKSoftWare Gmbh– Viktoras Kovaliovas– Kasparus Rudokas– Tomas Baltramaitas
Rockwell Collins, Inc.– Michael J. Benda– David D. Sullivan– William W. Bauer– Mark H. Carlson– Floyd D. Fischer
PDES Inc.Electromechanical Pilot team
– Greg Smith (Boeing)– Craig Lanning (Northrup Grumman)– Steve Waterbury (NASA)
* Certain commercial equipment, instruments, or materials are identified in this paper in order to specify the experimental procedure adequately Such identification is not intended to imply recommendation or endorsement by the National Institute of Standards and Technology, nor is it intended to imply that the materials or equipment identified are necessarily the best available for the purpose.
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