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16/26/03
© 2003 by Glenn Fishbine
Basic NanotechnologyBasic Nanotechnology
What’s the Technology Landscape?
26/26/03
© 2003 by Glenn Fishbine
State of basic researchState of basic research
36/26/03
© 2003 by Glenn Fishbine
Highlights - MetrologyHighlights - MetrologyHighlights of major accomplishments in past 15-20 years
Metrology: Measurements & images & motion can be controlled to 10 pico-metersWe can see what we’re doing
46/26/03
© 2003 by Glenn Fishbine
Highlights - ModelingHighlights - ModelingHighlights of major accomplishments in past 15-20 years
Modeling: Software can now successfully model the dynamics of most molecularinteractions under numerous static and dynamic conditions.
We can simulate what we want to build
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© 2003 by Glenn Fishbine
Highlights - ManufacturingHighlights - ManufacturingHighlights of major accomplishments in past 15-20 years
Manufacturing: Certain processes exist to actually fabricate nanostructures.We can build some of what what we want to build
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© 2003 by Glenn Fishbine
Highlights - MEMSHighlights - MEMSHighlights of major accomplishments in past 15-20 years
MEMS: Fabrication of micro-meter scale devices is routine.We can build much of what we want at larger scales.
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© 2003 by Glenn Fishbine
Highlights - PolicyHighlights - PolicyHighlights of major accomplishments in past 15-20 years
Policy: There is a growing consensus of what nanotechnology is.We almost know what we’re talking about.
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© 2003 by Glenn Fishbine
Tools & TechniquesTools & TechniquesCurrent foundation of research tools and techniques
• Microscopy• Metrology• Simulation• Crystallography• Interferometry• Chemical Synthesis• Plasma & other regimens• Lithography
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© 2003 by Glenn Fishbine
MicroscopyMicroscopyCurrent foundation of research tools and techniques
• Microscopy
– Acoustic / Ultrasonic– Fluorescent / UV– Laser / Confocal– Polarizing– Portable Field– Scanning Electron Microscope (SEM)– Scanning Probe / Atomic Force (SPM / AFM)– Transmission Electron Microscope (TEM)– Scanning Near-Field Optical Microscope (SNOM)
106/26/03
© 2003 by Glenn Fishbine
MetrologyMetrologyCurrent foundation of research tools and techniques
• Metrology
– Critical Dimension Measurement– Film Thickness Testers– Resistivity/Electromagnetic Testers – Stress Measurement – Wafer Inspection Tools– Quantum measurements
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© 2003 by Glenn Fishbine
SimulationSimulationCurrent foundation of research tools and techniques
• Simulation
– molecular modeling– kinetic modeling– quantum effect modeling– semiconductor effects
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© 2003 by Glenn Fishbine
CrystallographyCrystallographyCurrent foundation of research tools and techniques
• Crystallography
– x-ray
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© 2003 by Glenn Fishbine
InterferometryInterferometryCurrent foundation of research tools and techniques
• Interferometry
– optical– x-ray– quantum (Stern Gerlach)
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© 2003 by Glenn Fishbine
Chemical SynthesisChemical SynthesisCurrent foundation of research tools and techniques
• Chemical Synthesis
– organic– biological– genomic
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© 2003 by Glenn Fishbine
Plasma, et alPlasma, et alCurrent foundation of research tools and techniques
• Plasma & other regimens
– coatings– materials fabrication– surface treatments
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© 2003 by Glenn Fishbine
LithographyLithographyCurrent foundation of research tools and techniques
• Lithography
– manufacturing– prototyping/testing
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© 2003 by Glenn Fishbine
Recent Progress - AFMSRecent Progress - AFMSSample of recent progress - tools - AFM Array
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© 2003 by Glenn Fishbine
Recent Progress - SoftwareRecent Progress - Software
AbM Oxford MolecularADF Scientific Computing and Modeling NV (SCM)AMBER Peter Kollman, UCSFAMPAC A. Holder, Semichem, Inc., 7204 Mullen, Shawnee, KS 66216AMSOL Chris Cramer, D. Truhlar, Univ. of MinnesotaAPEX-3D http://www.dcl.co.il/DCL Systems International, Ltd.AutoDock Garrett M. Morris, David S. Goodsell, Ruth Huey, William E. Hart, Scott
Halliday, Arthur J. OlsonBabel Pat Walters, Univ. of ArizonaCAChe CAChe Scientific, Inc. (Oxford Molecular)Cambridge Structural Database (CSD) Cambridge Crystallographic Data CentreCAVEAT Paul Bartlett, UC BerkleyCHARMm Molecular Simulations, Inc.CHARMM Documentation: Rick Venable, FDA/CBER; WWW site: M. Karplus, Harvard
Univ., Dept. of Chemistry, 12 Oxford Street, Cambridge, MA 02138;Chem-X Chemical Design, Inc., 200 Route 17 South, Ste. 120, Mahwah, NJ 07430ChemDBS-3D Chemical Design, Inc., 200 Route 17 South, Ste. 120, Mahwah, NJ 07430CHIME MDL Information Systems, Inc.ClogP BiobyteCMR BiobyteCLIP Institute of Medicinal Chemistry, Univ. of LausanneComposer Tripos, Inc.CONCORD Tripos, Inc.CS ChemOffice Pro CambridgeSoft Corp.DGEOM 95 QCPE, Indiana Univ.DGII http://www.chem.indiana.edu/qcpe.htm, Indiana Univ.DISCO Tripos, Inc.Discover Molecular Simulations, Inc.
DMol Molecular Simulations, Inc.DOCK Irwin Kuntz, UCSFDSSP C. Sander, EMBLEGO H. Heller, Ludwig Maximilians Univ., MunichGALAXY AM Technologies, incGAMESS M. Gordon, Iowa State Univ.GASP Tripos, Inc.Gaussian Gaussian, Inc., 4415 Fifth Ave., Pittsburgh, PA 15213 GEMM B.K. Lee, National Cancer Institute, NIHGERM D.E. Walters, Chicago Medical School, Department of Biological Chemistry
3333 Green Bay Road, North Chicago, IL 60064gOpenMol Center for Scientific ComputingGRAMM Ilya A. Vakser, Rockefeller Univ.GRASP A. Nicholls, Columbia Univ.GROMOS Biomos B.V., The NetherlandsGROMACS H.J.C. Berendsen, Univ. of Groningen, The NetherlandsHASL eduSoft, P.O. Box 1811, Ashland, VA 23005HBPLUS I.K. McDonald, University College, LondonHINT eduSoft, P.O. Box 1811, Ashland, VA 23005Homology Molecular Simulations, Inc.HONDO IBM, Neighborhood Road MLMA/428, Kingston, NY 12401HyperChem HyperCube, Inc.ICM MolSoft, LLCIditis Oxford MolecularInsight II Molecular Simulations, Inc.ISIS MDL Information Systems, Inc.Jaguar S chrödinger, Inc.Leapfrog Tripos, Inc.
Sample of recent progress - software techniques - molecular modeling
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© 2003 by Glenn Fishbine
Recent Progress - MaterialsRecent Progress - MaterialsSample of recent progress - materials
• Films– Plastic semiconductors
• Polycrystalline– Low cost photovoltaics
• Nanocomposites– Anti-bacteria soap
• Patterned structures– Nanoscale magnetic dots and wires
• Bulk structures– Cutting tools
206/26/03
© 2003 by Glenn Fishbine
Recent Progress - ElectronicsRecent Progress - Electronics
Sample of recent progress - electronics
• December 4, 2002: Toshiba and SonyAnnounce 65-Nanometer CMOS ProcessTechnology
• January 6, 2003: researchers at the Universityof Toronto have invented a tiny circuit that asingle electron can activate
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© 2003 by Glenn Fishbine
Recent Progress Energy/PowerRecent Progress Energy/Power
ATP motion system– cellular motion power system
Fuel Cells– 10 X capacity of a Lithium Battery
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© 2003 by Glenn Fishbine
Recent Progress – Life SciencesRecent Progress – Life SciencesBiochip
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© 2003 by Glenn Fishbine
Grand ChallengesGrand ChallengesNNI
Nanostructured materials "by design"Nanoelectronics, optoelectronics and magneticsAdvanced healthcare, therapeutics, diagnosticsEnvironmental improvementEfficient energy conversion and storageMicrocraft space exploration and industrializationCBRE Protection and Detection (revised in 2002)Instrumentation and metrologyManufacturing processes
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© 2003 by Glenn Fishbine
Grand ChallengesGrand ChallengesNNI
Shrinking the entire contents of the Library of Congress in a device the size of a sugar cubethrough the expansion of mass storage electronics to multi-terabit memory capacity thatwill increase the memory storage per unit surface a thousand fold
Making materials and products from the bottom-up, that is, by building them up from atoms andmolecules. Bottom-up manufacturing should require less material and pollute less
Developing materials that are 10 times stronger than steel, but a fraction of the weight formaking all kinds of land, sea, air and space vehicles lighter and more fuel efficient
Improving the computer speed and efficiency of minuscule transistors and memory chips byfactors of millions making today's Pentium IIIs seem slow
Using gene and drug delivery to detect cancerous cells by nanoengineered MRI contrast agentsor target organs in the human body
Removing the finest contaminants from water and air to promote a cleaner environment andpotable water
Doubling the energy efficiency of solar cells
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© 2003 by Glenn Fishbine
Pace of ProgressPace of ProgressIn many new technologies, it is common to overestimate what can be
done in five years' time, and to underestimate what can be done in 50years' time.
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© 2003 by Glenn Fishbine
BreakBreak
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© 2003 by Glenn Fishbine
Basic NanotechnologyBasic Nanotechnology
Primer on manufacturing processes
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© 2003 by Glenn Fishbine
Primer on manufacturing processesPrimer on manufacturing processes• — Bottom-up self assembly (wet chemistry)
– intrinsic, autonomous– biomimetic, controlled
• — Top-down assembly (lithography and derivatives)– dip-pen lithography– soft lithography and nanoscale printing– e-beam and deep UV lithography
• — Other production processes– vapor deposition– evaporation– combustion– thermal plasma– milling– cavitation– coating (spin or dip)– thermal spray– electrodeposition
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© 2003 by Glenn Fishbine
Bottom-up self assemblyBottom-up self assemblyUnderstand and control the intramolecular
quantum behavior of specifically designed andsynthesized molecules
Using a surface to localize and stabilize them
To interconnect, assemble and test nano-devicesand nano-machines starting from atomic ormolecular parts
306/26/03
© 2003 by Glenn Fishbine
Self AssemblySelf AssemblyVon Neumann's universal constructor ~500,000Internet worm (Robert Morris, Jr., 1988) ~500,000Mycoplasma genitalium 1,160,140E. Coli 9,278,442Drexler's assembler ~100,000,000Human ~6,400,000,000NASA Lunar Manufacturing Facility over 100,000,000,000
-Ralph C. Merkle
main(){char *c="main(){char *c =%c%s%c;printf(c,34,c,34);}";printf(c,34,c,34);}
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© 2003 by Glenn Fishbine
intrinsic, autonomousintrinsic, autonomousSelf assembly mechanisms are inherent
within the structures
Self assembly occurs without any externalforces or controls
i.e. crystals
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© 2003 by Glenn Fishbine
biomimetic, controlledbiomimetic, controlledUsing organic like processes, or organisms, to
create new structures as a controlledmanufacturing process
“biomimetic carpentry”
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© 2003 by Glenn Fishbine
Top-down assemblyTop-down assemblyImposes a structure on the system
through the definition of patterns andtheir creation from larger parts
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© 2003 by Glenn Fishbine
LithographyLithography
356/26/03
© 2003 by Glenn Fishbine
LithographyLithography
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© 2003 by Glenn Fishbine
LithographyLithography
Resolution to 65 nm(10 nm with x-rays)
Vacuum environment
Multiple layer writing
Current standard for semiconductor industry
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© 2003 by Glenn Fishbine
LithographyLithography
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© 2003 by Glenn Fishbine
dip-pen lithographydip-pen lithography
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© 2003 by Glenn Fishbine
dip-pen lithographydip-pen lithography
Resolution 10-15 nm
Liquid environment
Multiple layer writing
Multiple pen writing
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© 2003 by Glenn Fishbine
soft lithography & nanoscale printingsoft lithography & nanoscale printing
416/26/03
© 2003 by Glenn Fishbine
soft lithography & nanoscale printingsoft lithography & nanoscale printing
Resolution 100 nm
Liquid environment
Multiple layer writing
Wide areas & rapidproduction rates
A stamp wasmolded off themaster and usedfor printingalkanethiols onto agold layer, followedby a selective etchto develop thepattern.
IBM Zurich
426/26/03
© 2003 by Glenn Fishbine
e-beam and deep UV lithographye-beam and deep UV lithography
436/26/03
© 2003 by Glenn Fishbine
e-beam and deep UV lithographye-beam and deep UV lithography
Resolution 20 nm
Vacuum environment
Slow writing speed
Multiple beam technologiesin development
Direct write & directexposure
446/26/03
© 2003 by Glenn Fishbine
Electromagnetic SpectrumElectromagnetic Spectrum
456/26/03
© 2003 by Glenn Fishbine
Other production processesOther production processes
466/26/03
© 2003 by Glenn Fishbine
vapor depositionvapor depositionDeposition of material transferred from its source to the substrate
without changing its chemical composition
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© 2003 by Glenn Fishbine
vapor depositionvapor depositionPrimarily a coating process
As low as 3 nm/minute
Can be used for surface chemistry
Can coat almost anything
Used extensively in semi- conductor fabrication
486/26/03
© 2003 by Glenn Fishbine
evaporationevaporationHeating a material in a vacuum until it melts and evaporates
condensing on a cooler surface
496/26/03
© 2003 by Glenn Fishbine
evaporationevaporationPrimarily a coating process for materials that can withstand high
temperature and vacuum
Minimum rate or thickness is atomic
Can coat almost anything
Used extensively in semi- conductor fabrication
'The Sounds of Earth' copper with goldplating placed on Voyager. Two hours ofsound and movie plus some digital data:pictures and a message from JimmyCarter.
506/26/03
© 2003 by Glenn Fishbine
combustioncombustion
Combustion wire process
Combustion powder process
Burning a material such that the products of its combustioncondense on a cooler surface.
516/26/03
© 2003 by Glenn Fishbine
combustioncombustionPrimarily a coating process for materials that can have unique
properties after burning, or to coat materials that cannot becoated in other ways
Also used to create nano-scale materials in bulk
Relatively limited use. High promise for production of bulknanomaterials
526/26/03
© 2003 by Glenn Fishbine
thermal plasmathermal plasmaPlasma is frequently referred to as the 4th state of matter-
solid, liquid, gas, and plasma
A plasma is an ionized gas comprised of molecules, atoms, ions (in theirground or in various excited states), electrons, and photons.
Overall, a plasma is electrically neutral.
A thermal plasma is a plasma in Local Thermodynamic Equilibrium:
(Te = Th), > 104 Kelvinswhere Te : electron temperature
Th : heavy particle temperature)
Typically operated in high pressure oratmospheric pressure
536/26/03
© 2003 by Glenn Fishbine
thermal plasmathermal plasmacreating chemical reactions in a high-purity atmosphere
creating rapid large area nano-scale coatings
creating nano-scale particles
creating nano-materials in large quantities
546/26/03
© 2003 by Glenn Fishbine
millingmillingAtomic Sand Blaster
submicrometer particles are accelerated to bombard thesurface of a substrate.
They remove any material not protected by a resistmaterial
556/26/03
© 2003 by Glenn Fishbine
millingmillingPrimarily an etching process, but can
be used to create new materials
Feature resolution around 50 nm
Can be used for surface chemistry
Can operate faster than e-beam insome processes, especially highatomic # substrates
Has little backscatter, unlike e-beam(increases contrast)
566/26/03
© 2003 by Glenn Fishbine
cavitationcavitation the formation, growth, and implosive collapse
of vapor bubbles in a liquid created byfluctuations in fluid pressure
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© 2003 by Glenn Fishbine
cavitationcavitationA highly controllable tool for the
synthesis of nanostructuredcatalysts, ceramics, andpiezoelectrics in high phasepurities
Resolution of ~ 130 nanometers
Can be used to initiate production ofspecialized nanomaterials
May operate faster than e-beam orion-beam
586/26/03
© 2003 by Glenn Fishbine
coating (spin or dip)coating (spin or dip)A means of inexpensively applying a thin film to a
surface with high precision.
Material must be liquid.
Does not require vacuum, heat or other processes thatcan destroy material chemistry
596/26/03
© 2003 by Glenn Fishbine
coating (spin or dip)coating (spin or dip)Routinely used to disperse photo-resist for
semiconductor manufacturing.
Can produce well dispersed mix of nanostructureswithin coatings
Nanostructures can be uniformly grown during the spinprocess
606/26/03
© 2003 by Glenn Fishbine
thermal spraythermal sprayTakes the source of energy such as inflammable and ionized gas,
explosive gas, electric energy
Heats the powder of the thermal spray coating material (metal,nonmetal, ceramics, ceramicmetal, plastic)
Melts it or strongly blows the particles
Types:PlasmaHVOF (high velocity oxygen fuel)Wire FlamePowder FlameElectric Arc Spray
616/26/03
© 2003 by Glenn Fishbine
thermal spraythermal spraycreating chemical reactions in an arbitrary atmosphere
creating rapid large area nano-scale coatings
creating nano-scale particles
creating nano-materials in large quantities
626/26/03
© 2003 by Glenn Fishbine
electrodepositionelectrodeposition
the deposition of a substance on anelectrode by the action of electricity
636/26/03
© 2003 by Glenn Fishbine
electrodepositionelectrodepositionPrimarily a coating process for materials that can withstand liquids andcan be electrically charged temperature and vacuum
Minimum rate or thickness is highly controllable
Can deposit complex chemistries
Used extensively in semiconductor fabrication
646/26/03
© 2003 by Glenn Fishbine
BreakBreak
656/26/03
© 2003 by Glenn Fishbine
Basic NanotechnologyBasic Nanotechnology
Commercial Activity
666/26/03
© 2003 by Glenn Fishbine
Small Dreams?Small Dreams?
Get your facts first,
and then you can distort them as much as you please.
-Mark Twain
686/26/03
© 2003 by Glenn Fishbine
Labs - NNI fundedLabs - NNI fundedInstitution Partners Title Topics Funding 1st
YR $MFunding5 Yrs $M
NorthwesternUniversity
Argonne National Lab; HaroldWashington College; U. Illinois,Urbana-Champaign; U. Chicago;Chicago Museum of Science andIndustry; Lawrence Livermore; NASA;Dupont; Exxon Mobil; Rohm and Hass;Motorola; IBM; Unilever
NSEC: IntegratedNanopatterning andDetectionTechnologies
chem-bio recognition,polymers, DNA / RNAdetection methods; surfacedirected assembly; sensors
2.303 11.102
CornellUniversity-Endowed
Brigham Young U.; Colgate U.; U.New Mexico; Pomona College
NSEC: NanoscaleSystems in InformationTechnologies
Nano-electronics, -photonics, -magnetics, enabling science
2.390 11.590
HarvardUniversity
MIT; Princeton; UC Santa Barbara;Boston Museum of Science;Brookhaven National Lab; Oak RidgeNational Lab; Sandia National Lab;Delft U., The Netherlands; U. Tokyo
NSEC: Science ofNanoscale Systems andtheir DeviceApplications
scanning probes, coherentelectronics, heterostructures
2.368 10.798
ColumbiaUniversity
Barnard College; CUNY City College;Rowan U.; Lucent; IBM
NSEC: ElectronicTransport in MolecularNanostructures
charge transport in molecules,carbon nanotubes interfaces,assembly
2.245 10.845
WilliamMarsh RiceUniv
Oak Ridge National Lab; TDAResearch Inc.; GeosciencesEnvironmental Lab, France
NSEC: Nanoscience inBiological andEnvironmentalEngineering
fullerines, nanomaterials incells, bioengineering,environmental applications
2.108 10.540
RensselaerPolytech Inst
U. Illinois, Urbana-Champaign; LosAlamos National Lab; Colleges:Morehouse, Mount Holyoke, Smith,Spelman, Wiliams; Industry:ABB,Albany International, IBM,Eastman Kodak, Philip Morris; State ofNew York
NSEC: DirectedAssembly ofNanostructures
gels amd polymernanocomposites;nanostructured biomolecularmaterials; theory
2.000 10.000
13.414 64.875
696/26/03
© 2003 by Glenn Fishbine
Labs - National Nanofabrication Users NetworkLabs - National Nanofabrication Users NetworkCornell Nanofabrication Facility Prof. Sandip Tiwari, Director Cornell University, Knight Laboratory Ithaca, New York 14853-5403 Voice: (607) 255-2329 Fax: (607) 255-8601 URL: http://www.cnf.cornell.edu/
Materials Science Center for Excellence Prof. Gary Harris, Director Howard University School of Engineering 2300 Sixth St, NW Washington, D.C. 20059 Voice: (202) 806-6618 Fax: (202) 806-5367 URL: http://www.msrce.howard.edu/~nanonet/NNUN.HTM
PSU Nanofabrication Facility Prof. Stephen Fonash, Director 189 Materials Research Institute The Pennsylvania State University University Park, PA 16802 Voice: (814) 865-4931 Fax: (814) 865-3018 URL: http://www.nanofab.psu.edu
Stanford Nanofabrication Facility Dr. Yoshio Nishi, Director Stanford University CIS 103, Via Ortega St Stanford, CA 94305 Voice: (650) 723-9508 Fax: (650) 725-0991 URL: http://www-snf.stanford.edu/
UCSB Nanofabrication Facility Prof. Mark Rodwell, Director University of California at Santa Barbara Department of Electrical & Computer Engineering 5153 Engineering I Santa Barbara, CA 93106 Voice: (805) 893-3244 Fax: (805) 893-3262 URL: http://www.nanotech.ucsb.edu/
Provides users with access to some of the mostsophisticated nanofabrication technologies in theworld with facilities open to all users fromacademia, government, and industry.
706/26/03
© 2003 by Glenn Fishbine
Lab EquipmentLab Equipment
• Fabrication examples– semiconductor– CNT
• Microscopy examples• nanopositioning examples• software examples
716/26/03
© 2003 by Glenn Fishbine
Semiconductor - Industry ElementsSemiconductor - Industry Elements
• $42 Billion/year (equipment & materials)• over 1,000 U.S. companies
726/26/03
© 2003 by Glenn Fishbine
Semiconductor - Equipment TypesSemiconductor - Equipment Types300-mm ComponentsAsherAutomation/RobboticsbearingsBlow-Off GunsBrushes,Pads,RollersCarbon Dioxide Cleaning
SystemsCeramic AccessoriesChemical Vapor DepositionChemical-Mechanical
PolishingChillerCleaning AccessoriesCleaning
Systems,Batch/SingleCleanroom OvensCluster ToolsCMP ConsumablesDepositionDI Water Heaters
Diffusion/Oxidation/AnnealingDry EtchDry-Clean Systems(gas-phase,etc)ElectropolishingEpitaxyFurnacesHeat ExchangersIn Situ CleanersIn Situ MonitorsIon BeamIon ImplantationlaserLithography, DUV/g/i-lineMegasonic/Ultrasonic SystemsMinienvironment,Automated/ManualMonitoring/Analysis ToolsNon-CFC Cleaning SystemsOrganic SolventsPellicles/Mounting EquipmentPhotomask Equipment/MaterialsPhotoresist ProcessingPhotoresist StrippingPhysical Vapor DepositionPiping/Tubing,Stainless Steel/OtherPlasma Cleaning Systems
Post-CMP Cleaning SystemsPower Supplies,Accessoriespressure gagesPumpsQuartzwareRapid Thermal ProcessorsRecycling,Reprocessing SystemsreticleRinsers/DryersSoftware(Operating,Simulatings,etc)Spin ProcessorsSpray-Clean SystemsSputterersSputtering TargetsStepperstransducersUV Ozone Cleaning SystemsVacuumComponents/Gages/Seals(O-rings,metal,etc.)Valves/ControllersWafer IdentificationWafer-Transport SystemsWet EtchWet Process Stations
736/26/03
© 2003 by Glenn Fishbine
THE INTERNATIONAL TECHNOLOGY ROADMAP FORTHE INTERNATIONAL TECHNOLOGY ROADMAP FORSEMICONDUCTORSSEMICONDUCTORS
The International Technology Roadmap for Semiconductors (ITRS) is an assessment of the semiconductortechnology requirements. The objective of the ITRS s to ensure advancements in the performance ofintegrated circuits. This assessment, called roadmapping, is a cooperative effort of the global industrymanufacturers and suppliers, government organizations, consortia, and universities.
The ITRS identifies the technological challenges and needs facing the semiconductor industry over the next15 years. It is sponsored by the Semiconductor Industry Association (SIA), the European ElectronicComponent Association (EECA), the Japan Electronics & Information Technology Industries Association(JEITA), the Korean Semiconductor Industry Association (KSIA), and Taiwan Semiconductor IndustryAssociation (TSIA) .
746/26/03
© 2003 by Glenn Fishbine
Semiconductor - Focus - MetrologySemiconductor - Focus - MetrologyYEAR OF PRODUCTION 2002 2003 2004 2005 2006 2007DRAM ½ PITCH (nm) 115 100 90 80 70 65
ProblemsInline, nondestructive microscopyresolution (nm) 0.53 0.45 0.37 0.32 0.3 0.25
Materials and Contamination CharacterizationReal particle detection limit (nm) 53 45 37 32 30 25
Minimum particle size for compositionalanalysis (dense lines on patterned wafers) 35 30 24 21 20 17
Solution in hand Solution known Solution unknown
756/26/03
© 2003 by Glenn Fishbine
Semiconductor - Focus - MetrologySemiconductor - Focus - MetrologyYEAR OF PRODUCTION 2010 2013 2016DRAM ½ PITCH (nm) 45 32 22
Problems
Inline, nondestructive microscopy resolution(nm) 0.18 0.13 0.09
Materials and Contamination CharacterizationReal particle detection limit (nm) 18 13 9
Minimum particle size for compositionalanalysis (dense lines on patterned wafers) 12 9 6
Solution in hand Solution known Solution unknown
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© 2003 by Glenn Fishbine
Semiconductor - Focus - OtherSemiconductor - Focus - Other
• Lithography
• Interconnect
• Assembly & Packaging
• Modeling & Simulation
• et al
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© 2003 by Glenn Fishbine
Semiconductor - Leading FirmsSemiconductor - Leading FirmsRank Company 2001 Semiconductor Sales1 Intel $23,8502 Toshiba $6,7813 STMicroelectronics $6,3594 Texas Instruments $6,1005 Samsung $5,8146 NEC $5,3097 Hitachi $5,0378 Motorola $4,8289 Infineon $4,55810 Philips $4,23511 IBM $3,89812 AMD $3,89113 Mitsubishi $3,47314 Matsushita $3,17615 Fujitsu $3,08416 Agere Systems [Lucent] $3,05117 Sanyo $2,67518 Hynix $2,45019 Micron $2,41120 Sony $2,10021 Analog Devices $1,89722 Sharp $1,85823 Agilent Technologies $1,67124 National Semiconductor $1,62625 LSI Logic $1,597
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© 2003 by Glenn Fishbine
CNT - FabricationCNT - FabricationCNT - Carbon NanoTube
796/26/03
© 2003 by Glenn Fishbine
CNT - FabricationCNT - FabricationSWCNT - Single Wall Carbon NanoTube
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© 2003 by Glenn Fishbine
CNT - FabricationCNT - FabricationMWCNT - Multi-Wall Carbon Nanotube
816/26/03
© 2003 by Glenn Fishbine
CNT - Fabrication - how toCNT - Fabrication - how to
A vacuum chamber is pumpeddown and back filled with somebuffer gas, typically neon or Arto 500 torr. A graphite cathode and anodeare placed in close proximity toeach other. The anode may befilled with metal catalystparticles if growth of single wallnanotubes is required. A voltage is placed across theelectrodes, (20 – 40 V). The anode is vaporized whilethe cathode evaporates. Carbon nanotubes form on thecathode in the sheath region.
Carbon Arc or Arc Discharge
826/26/03
© 2003 by Glenn Fishbine
CNT - Fabrication - how toCNT - Fabrication - how toLaser Ablation or Pulsed Laser Vaporization (PLV)
© American Scientist 1997
A laser is aimed at a block of graphite, vaporizing thegraphite.
Contact with a cooled cooper collector causes thecarbon atoms to be deposited in the form ofnanotubes.
The nanotube "felt" can then be harvested
836/26/03
© 2003 by Glenn Fishbine
CNT - Fabrication - how toCNT - Fabrication - how toChemical Vapor Deposition (CVD)
Single-wall nanotubes are produced in agas-phase process by catalyticdisproportionation of CO on ironparticles. Iron is in the form of ironpentacarbonyl. Adding 25% hydrogenincreases the SWNT yield. The synthesisis performed at 1100 C at atmosphericpressure.
Multi-wall nanotubes are grown in thesame apparatus where the catalyticmetal particles are supported on asubstrate (Si wafers or the quartzfurnace tube). Iron is deposited fromiron pentacarbonyl or by electron beamsputtering while nanotube growth isachieved by catalytic CVD fromhydrocarbon molecules (acetylene,methane) or fullerenes at temperaturesbetween 750 and 1100 C.
846/26/03
© 2003 by Glenn Fishbine
CNT - Fabrication - how toCNT - Fabrication - how toHigh-pressure CO conversion(HiPCO)
Method is similar to CVDCarbon source is carbon monoxideCatalytic particles are generated in-situ
Thermal decomposition of ironpentacarbonyl in a reactor heated to 800- 1200°C
High pressure to speed up the growth(~10 atm)
Bulk production of SWNTs
856/26/03
© 2003 by Glenn Fishbine
CNT - Sample CompaniesCNT - Sample CompaniesMetrotube - Located at the Tokyo Metropolitan University, supplies single-walled carbon nanotubes for research andcollaboration
Applied Nanotechnologies - ANI fabricates carbon nanotubes(CNTs) and produces carbon nanotube based devices such asx-ray tubes, microwave amplifiers, gas discharge tubes and field emission cathodes.
Nanostructured and Amorphous Materials - Manufacturer and supplier of nanoscale metal oxides, nitrides, carbides,diamond, Carbon nanotubes / Particles for research and industries
Carbon Solutions Inc. - Research, development and commercialization of single-walled carbon nanotubes, its chemistry andapplication to carbon based nanotechnology
Carbon Nanotechnologies Inc. - CNI intends to be a leader in carbon nanotechnology, beginning with its first product,Bucky(TM)tubes, which are single-wall carbon nanotubes made by the HiPco(TM) process.
NanoLab Inc. - Produces carbon nanotubes using the CVD growth process. The process produces arrays of aligned carbonnanotubes on substrates.
CarboLex, Inc. - Manufacturer of single-walled carbon nanotube fibers. Products are sold to composite manufacturers,display technology researchers, government researchers and universities.
Hyperion Catalysis International - Producer of graphite nanotubes. Based in Cambridge, Massachusetts.
Skeleton Technologies Group - Provides research and development of advanced materials and their applications, includingnanotubes, shaped diamond composites, supercapacitors, and metal-ceramic composites.
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© 2003 by Glenn Fishbine
CNT - Market FundamentalsCNT - Market FundamentalsGlobal market for nanotubes in 2002 was ~ $12 million
About 20 producers of carbon nanotubes, half of which are inthe United States.
Other producers in Japan, Korea, China and France
Global CNT production capacity is over 2.5 tons per day
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Lab EquipmentLab Equipment
nanopositioning examples
$5-$50 million/year - depending on definition
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© 2003 by Glenn Fishbine
Nano-positioningNano-positioning
nanopositioning is the ability to preciselyposition a device with a precisionmeasured in nanometers
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© 2003 by Glenn Fishbine
Nano-positioningNano-positioningFlexure stage
A translation stage that uses flexures (stiff flat springs) to constrain themotion of the stage.
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© 2003 by Glenn Fishbine
Nano-positioningNano-positioning
Roller-bearingHigh precision roller-bearing stages, with glass scale count encoders used in a
closed-loop system to create the necessary stability for maintaining the position.
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© 2003 by Glenn Fishbine
Nano-positioningNano-positioning
Piezo-assistedPiezo-assisted fine-displacement combined with control circuitry and conventional
roller-bearing or flexure technology.
The piezoelectric effect is:
1. the production of avoltage when a crystal plateis subjected to mechanicalpressure or when it isphysically deformed bybending.
2. The physical deformationof the crystal plate (bending)when it is subjected to avoltage.
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© 2003 by Glenn Fishbine
Nano-positioningNano-positioningCombinations
Any combination of technologies using ultraprecise methods for moving very smallincrements, such as linear motors.
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Nano-positioningNano-positioningSample companies
Burleigh Instruments, Inc.Danaher Precision SystemsETEL, Inc.Hysitron Inc.LUMINOS IndustriesMad City Labs, Inc.Melles Griot OpticsPhysik Instrumente GmbH & Co.Piezomax Technologies, Inc.Piezosystem Jena, Inc.Polytec PI, Inc.PrimaticsSDL Queensgate Ltd
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© 2003 by Glenn Fishbine
Nano-positioningNano-positioning
manufacturers frequently confuse– encoder resolution– controller resolution– amplifier noise– D/A resolution and– stability
with the overall precision of the motion system
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© 2003 by Glenn Fishbine
Lab Equipment – MicroscopyLab Equipment – Microscopy
microscopy examplesacoustic
atomic forceelectric forcelateral force
magnetic forcescanning electron
scanning near field opticalscanning probe
scanning tunnelingtransmission electron
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© 2003 by Glenn Fishbine
MicroscopeMicroscopeThe resolution of an optical microscope is about a third of a wavelength
in diameter, which is about 200 nm.
Acoustic, 30 micrometers at 50Mhz, 200 Mhz to maybe 20 nm Theresolution of a SEM is about 10 nanometers (nm).
The resolution of a TEM is about 0.2 nanometers (nm). This is the typicalseparation between two atoms in a solid.
The optical resolution limit for SNOM is governed by the light intensitypassing through the aperture. A practical limit is usually found withaperture diameters between 80 nm and 200 nm, but in ideal caseseven down to < 20 nm.
Some of the best values for AFM imaging are 3.0 nm. Sub-nanometer ispossible
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© 2003 by Glenn Fishbine
Microscopy MarketMicroscopy Market
MME President Barbara Foster cited microscopyas the worst reported of all analyticalinstrumentation markets
$25 Million or more/year…Maybe
> 1,000 microscopy companies
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© 2003 by Glenn Fishbine
Lab EquipmentLab Equipment
Software Examples
Considering the cost of prototype fabrication
If you build it,
will they come?
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© 2003 by Glenn Fishbine
Software – Molecular ModelingSoftware – Molecular ModelingMolecular modeling is techniques used to build, display,
manipulate, simulate and analyze molecularstructures, and to calculate properties
Molecular mechanics methods take a classical approach to calculatingthe energy of a structure.
Molecular dynamics can be used to simulate the thermal motion of astructure as a function of time, using the forces acting on the atoms todrive the motion
Quantum mechanics takes account of conjugation (quantum electronorbital effects)
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© 2003 by Glenn Fishbine
Software - AtomsSoftware - Atoms
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Software - AtomsSoftware - Atoms
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© 2003 by Glenn Fishbine
Software - AtomsSoftware - Atoms
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Software - MoleculesSoftware - Molecules
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© 2003 by Glenn Fishbine
Software - MarketSoftware - MarketGlobal Market in excess of $800 million
including informaticsLeading Company - Accelrys (subsidiary of
Pharmacopeia which includes Molecular Simulations,Synopsys, Scientific Systems, Oxford Molecular,Genetics Computer Group, and Synomics)
Revenue > $120 Million
> 100 companies, large body of open sourcesoftware
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© 2003 by Glenn Fishbine
End of Part 2End of Part 2
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