bare die 101 - what is bare die?
Post on 17-Feb-2017
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ES Components978-422-7641
www.escomponents.com
What TheHeck Is
Bare Die?A technical explanation of Bare Die, itsbenefits, and how it must be handled to
ensure long-term reliability. It answers thequestion: What is Bare Die?
Buyers &EngineersFind Out
Now!
Use Bare Die Where?Aerospace
MilitaryAvionics
Medical ImplantAutomotive
High-end Industrial
Smaller Size & WeightOperating Temperature Size
RuggednessLighter Weight
ReliabilityElectrical Performance
Hermetically Sealing
Build A HybridMicrocircuit
The ManufacturerProduces A Wafer
That YieldsThe Bare Die
ManufacturerShips
To ADistributor
TheDistributor Will
FindA Distributor
CanTrust
YouInspect
The Bare Die
A SampleYou Request
Build The BreadboardRun Characterization Data
Create A Hybrid Or Multi-Chip Module
And...
SendBOM
Bill Of MaterialTo
Distributor DistributorReviews Specifications
&Asks Questions
Questions
You
Is The Device Suitable For Wire Bonding?Are You Soldering To The Top Contact Or Wire Bonding?
How Are You Planning To Attach The Die?How Will You Want This Bare Die Packaged For Delivery?
By Answering These
Assembly OptionsFor HybridPackaging
Die Bonding
Die BondingMethods
EutecticSolder
AdhesiveGlass or Silver-Glass
EutecticDie Bonding
Good Thermal ConductivityElectrically Conductive
Good Fatigue/Creep ResistanceLow Contamination
AdhesiveDie Bonding
Ease Of AutomationLow Curing Temperatures
Reduced Die StressesLow Cost
Wide Range Of Die SizesSpecial Plated Surfaces Are Not Required
Rework Is Possible
Glass Die Bonding
Relatively Insensitive To MetallizationLow Void Content
Good Thermal & Electrical Conductivity Limited Stress Relaxation
Low ContaminationHigh Process/Operating Temperature
Resistance
How Bare Die isHandled to Ensure
Long-term Reliability
Bare Die Is Delivered InDifferent Forms
HandlingConsideration To...
Ensure Long-Term Reliability
Electric Fields & Over VoltagesMechanical Damage
Surface Contamination
HandlingConsideration For...
Electric Fields & Over Voltages
Handle Bare Die In AnElectrostatic Environment
HandlingConsideration For...
MechanicalDamage
Bare Die Damaged By StaticElectricity
HandlingConsideration For...
SurfaceContamination
Interconnections & Molding StepsSensitive To Microscopic &Macroscopic Contaminated
Surfaces
Workplace RequirementsClean RoomElectrical GroundingSpecial Working BehaviorBare Die HandlingToolsPackagingTransportationStorageShelf-Life
Clean Room Requirements
Environment Of At Least Class 1000 (ISO 6) Or Better
The External and InternalAir For The Clean RoomIs Filtered Through HighEfficient Filter Systems
All Equipment Used In AClean Room Has To Be
Designed To AvoidEmissions
ElectricalGrounding
Requirements
Devices Which Could Be InContact With The Die MustBe On The Same Electrical
PotentialGrounded Workbench Surface
Conductive CarpetsGrounded Chairs
Low Impedance Place MatsGrounding Wrist Straps
ESD Safe Shoes, Coats, Gloves
Dedicated Equipment
Clean Room Areas Limited To Necessary Persons
Eating, Drinking, and Smoking Not Allowed
Nervous mannerisms such as scratching the head,rubbing hands or parts of the body, are to beavoided.
All material can only be moved from one cleanroom to another in the same or lower clean roomclass, but never in the other direction.
Special Working Behavior
Clean Room Areas Limited To Necessary Persons
Eating, Drinking, and Smoking Not Allowed
Nervous mannerisms such as scratching the head,rubbing hands or parts of the body, are to beavoided.
All material can only be moved from one cleanroom to another in the same or lower clean roomclass, but never in the other direction.
Bare DieHandling
Never Handle By Bare FingersActive Side Never TouchedMechanical Pressure Limited
Store & Transport In Protective Bags, Tubes Or BoxesWork Only Safe Clean Room Environments
Tools Used ToSafely Move Die
Without Damage
PackagingDie Stored In An Aluminum (Anti-Static)
Vacuum Bag Injected With Nitrogen(Inert Gas)
Protect Against Extreme Temperatures, Humidity, DirectSunlight, and Mechanical ForcesTemperature Has To Be Between 8 °C to 60 °CConditioned Cargo Rooms Are Mandatory For Air TransportTemperature Has To Be Between 8 °C to 45 °C
StorageTemperature Between 8-45 Degrees CentigradeHumidity Between 25% - 75%, No CondensationNo Exposure To Direct Sunlight
Shelf LifeBare Die In Tray - 3 yearsWafer On FFC - 0.5 yearsUnsawn Wafer - 3 years
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