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Automation Systems & ITAutomation Systems & IT
within Intelwithin Intel’’s High Volumes High Volume
ManufacturingManufacturing
2006 MIT Manufacturing Summit2006 MIT Manufacturing Summit
Bimal Dey / Anthony MaggiBimal Dey / Anthony Maggi
2
AGENDAAGENDA
IntelIntel’’s Manufacturing Environments Manufacturing Environment
Automation Drivers/DomainsAutomation Drivers/Domains
Focus Topic: Automated Focus Topic: Automated MatMat’’ll Handling Handling
Focus Topic: Process Control SystemsFocus Topic: Process Control Systems
3
IrelandIreland
Fab 14/24Fab 14/24
IsraelIsrael
Fab 8/18/28Fab 8/18/28
OregonOregon
Dev D1C/D1DDev D1C/D1DFab 15/20Fab 15/20
CaliforniaCalifornia
Dev D2Dev D2
ColoradoColorado
Fab 23Fab 23
ArizonaArizona
Fab12/22/32 Fab12/22/32
New MexicoNew Mexico
Fab 7/11/11XFab 7/11/11X
Mass.Mass.
Fab 17Fab 17
Costa RicaCosta Rica
San Jose A/TSan Jose A/T
A/T DevA/T Dev
MalaysiaMalaysia
Penang A/TPenang A/TKulim A/TKulim A/T
ChinaChina
Pudong/ChenduPudong/Chendu A/T A/T
PhilippinesPhilippines
Manila A/TManila A/TCavite A/TCavite A/T
WashingtonWashington
Systems MfgSystems Mfg
Board MfgBoard Mfg
Kulim Board/Module MfgKulim Board/Module MfgBrazilBrazil
Sub-con Mfg.Sub-con Mfg.
ThailandThailand
Sub-con MfgSub-con MfgVietnam-ATVietnam-AT
Sub-con MfgSub-con Mfg
TaiwanTaiwan
Sub-con MfgSub-con Mfg
Sub-con MfgSub-con Mfg
Environment: Highly GlobalEnvironment: Highly Global
Wafer FabWafer Fab
Systems/Sub-conSystems/Sub-con
Assembly/TestAssembly/Test
Challenge: Deploy CE! IT capabilities across the globe
4
Manufacturing Environment VectorsManufacturing Environment Vectors
AutomationAutomation
reliabilityreliability
ComputingComputing
securitysecurity
TechnologiesTechnologies
SupplySupply
chainchain
optimizationoptimization
AffordabilityAffordability
18 month18 month
cyclescycles
GlobalGlobal
dispersiondispersion
QualityQuality
expectationsexpectations
Cost ofCost of
excursionsexcursions
CompetitiveCompetitive
challengeschallenges
Each are drivers as well as opportunities for IT
5
IT Infrastructure Challenges in MfgIT Infrastructure Challenges in Mfg
Environmental vectors are confound by keyEnvironmental vectors are confound by keychallenges includingchallenges including……
ComplexityComplexity
Exploitation of security vulnerabilitiesExploitation of security vulnerabilities
Explosive usage growth of products andExplosive usage growth of products andservicesservices
Equates to continued cost pressures
6
AGENDAAGENDA
IntelIntel’’s Manufacturing Environments Manufacturing Environment
Automation Drivers/DomainsAutomation Drivers/Domains
Focus Topic: Automated Focus Topic: Automated MatMat’’ll Handling Handling
Focus Topic: Process Control SystemsFocus Topic: Process Control Systems
7
WIP Matched
to Current
Needs
Error free
processing
Higher
People
Productivity
Zero set
up time
Rapid New
Product Switch
over
Lot size
reduction
Key Automation Drivers for MfgKey Automation Drivers for Mfg
Rapid
Factory
Cycle Time
Optimized Space
Management
High
Equipment
Availability &
Utilization
8
AGENDAAGENDA
IntelIntel’’s Manufacturing Environments Manufacturing Environment
Automation Drivers/DomainsAutomation Drivers/Domains
Focus Topic: Automated Focus Topic: Automated MatMat’’ll Handling Handling
Focus Topic: Process Control SystemsFocus Topic: Process Control Systems
9
Automation/IT role in 300mm MfgAutomation/IT role in 300mm Mfg
Co
mm
un
ica
tio
n B
us
OHT
Process Equipment
Process Equipment
Litho Etch Films
Thermal Planar Metrology
Remote Command Centers
100% AMHS
Automated
Dispatching
Factory Wide User
Interfaces
Yield Analysis
CYBER SECURITY
Remote Diagnostics
Wafer/Unit Trace
New MES
Pervasive
FDC / SPC
Run to Run Control
with APC
Framework
Tool Reliability Tracking
Real Time
Tool View
Scheduler /
Dispatcher
Information Bus
Reticle
TrackingManufacturing Execution
System (MES)
Execution
Control (EC)
AMHS ComponentsAMHS Components
Process Equipment
I/F’s
E-5-SECS II
E-30-GEM
E-37 HSMS
E-87 Carrier Mgmt
E-90 Substrate Tracking
E-40 Process Job Mgmt
E-84 Parallel I/O for
OHV
E-94 Control Job Mgmt
Process or
Metrology
Equipment
Tool
Embedded
Controller
OHV
FOUP
Station
Controllers
Interbay
transport
AMHS Equipment I/F’s
E5 SECS II
E30 GEM
E37 HSMS
Stocker
Equipment
Interbay
controller
Intrabay
controller
Material Control
System (MCS)
E82 IBSEM
E84 Parallel I/O
E88 Stocker SEM
Key Points:
1. Production Equipment standards and capabilities
were Critical to achieving 100% Intrabay
Automation
2. AMHS Standards enable mix and match of supplier
tools to get Best In Class equipment
3. Major time focus was spent integrating software
capabilities with Production and AMHS Equipment
4. All in-line process and metrology equipment must
be [and has been] connected to the AMHS
11
Goal: Direct Tool to Tool WIPGoal: Direct Tool to Tool WIP
Movement without humanMovement without human
interventionintervention
300mm Automation 300mm Automation –– Fully Integrated Fully Integrated
F11x F11x 2.6miles of track 2.6miles of track
12
Remote Operations Center in F11xRemote Operations Center in F11x
AMHS SummaryAMHS Summary
Intel has achieved 100% Integrated IntrabayIntel has achieved 100% Integrated IntrabayAMHS in its 300mm FabsAMHS in its 300mm Fabs
100% integrated intrabay could not have been100% integrated intrabay could not have beenachieved in the same timeframe without openachieved in the same timeframe without openindustry standardsindustry standards
Rapid throughput AMHS transport systems areRapid throughput AMHS transport systems areneeded to meet demanding lot cycle times, fastneeded to meet demanding lot cycle times, fastrun rate production equipment, and complexrun rate production equipment, and complexprocess technology scenariosprocess technology scenarios
Future capabilities are planned to extend theFuture capabilities are planned to extend thecurrent technology to fully (near 100%)current technology to fully (near 100%)automated decision making for intrabayautomated decision making for intrabayscheduling and dispatchingscheduling and dispatching
14
Process Control SystemsProcess Control Systems
Automated Process Control (On Line)Automated Process Control (On Line)
Fault Detection Systems (On Line)Fault Detection Systems (On Line)
Statistical Process Control Systems (OffStatistical Process Control Systems (Off
Line)Line)
15
Overview of Process Control SystemsOverview of Process Control Systems
Metrology
Equipment
UI
Process
Equipment
UI
Metrology
Equipment
Step N-1 Step N+1Step N
Run to Run APC - Use feedback and feed forward
metrology and sensor data to adjust processing at the lot
and wafer level. Drive for multi-step control.
Various % - Decision is based on problem being solved
UI
FDC – Monitor equipment
event and time series data.
Stop tool when ranges or
profiles are exceeded
Pervasive Implementation
SPC – Monitor statistical
data and stop the tool if
trending to OOC
100% of the Fab
Essential Datastandards include SEMIE40, E94, E90 for waferlevel control & tracking
Typical Usage of Process Control at a Process ToolTypical Usage of Process Control at a Process Tool
Sensors – Use 3rd
party and embedded
sensors to provide
FDC & R2R APC data
Various % - Decision
is based on problem
being solved
16
Evolution of Intel Process ControlEvolution of Intel Process Control
200mm
Gen 1
200mm Wafers
1st Generation
(1993)
Cap
ab
ilit
y a
nd
Eff
icie
ncy
Time axis
200mm
Gen 3
• Factory wide systems &usage of SPC & FDC
• Point Solutions for Runto Run APC
• Basic FDC & APCControl & Yield Analysis
300mm
Gen 4
200mm Wafers
3rd Generation
(1999)
300mm Wafers
4th Generation
(2007)
300mm Wafers
2nd Generation
(2006)
• Point solutions for SPCspread across the factory
• Ad hoc and limited FDCand Run to Run APCControl Systems
• Rudimentary ControlAnalytics
300mm
Gen 2
• Factory wide systems &usage of SPC & FDC
• Maturing FDC & APCControl Analytics
• Reusable Run to RunAPC Framework withlitho coverage
• Advanced YieldAnalysis and Analytics
• Factory wide systemsand usage of PCS (SPC+ FDC + APC)
• Advanced FDC & APCControl Analytics
• Advanced YieldAnalysis and Analyticsmoving towardpredictive models
17
SUMMARYSUMMARYHigh Volume manufacturing in SemiHigh Volume manufacturing in Semi
industry presents many uniqueindustry presents many unique
challengeschallenges
Advances in AMHS and PCS has beenAdvances in AMHS and PCS has been
key to addressing some of thesekey to addressing some of these
challengeschallenges
Continued advances needed in theseContinued advances needed in these
two areas to keep pace with thetwo areas to keep pace with the
““MooreMoore’’s laws law”” and rapid pace of the and rapid pace of the
Semi technologySemi technology
18
QuestionsQuestions
ReferencesReferences
J. Wu, O. Rozmarin and B. Li, J. Wu, O. Rozmarin and B. Li, ““A Flexible Execution Control Framework forA Flexible Execution Control Framework for300mm Factory Automation300mm Factory Automation”” in Semiconductor Manufacturing, 2003 in Semiconductor Manufacturing, 2003
Nimish Shah , Nimish Shah , ““ASMC Keynote Presentation 2005 ASMC Keynote Presentation 2005 ““
E. Bass, D. Pillai, J. Dempsey, E. Bass, D. Pillai, J. Dempsey, ““300mm Full-Factory Simulations for 90nm300mm Full-Factory Simulations for 90nmand 65nm IC Manufacturingand 65nm IC Manufacturing”” in Proceedings of the International Symposium in Proceedings of the International Symposiumof Semiconductor Manufacturing (ISSM), 2003of Semiconductor Manufacturing (ISSM), 2003
B. Li and J. Wu, B. Li and J. Wu, ““Factory Throughput Improvement Through IntelligentFactory Throughput Improvement Through IntelligentIntegrated Delivery in 300mm Wafer ManufacturingIntegrated Delivery in 300mm Wafer Manufacturing”” in Proceedings of the in Proceedings of theInternational Symposium of Semiconductor Manufacturing (ISSM), 2003International Symposium of Semiconductor Manufacturing (ISSM), 2003
J. Wu and R. Madson, J. Wu and R. Madson, ““APF in IntelAPF in Intel’’s 300mm Execution Control Strategys 300mm Execution Control Strategy”” in inBrooks Worldwide Automation and Performance Symposium, 2002Brooks Worldwide Automation and Performance Symposium, 2002
J. Pettinato and M. Honma, J. Pettinato and M. Honma, ““Factory Integration RoadmapFactory Integration Roadmap”” at the at theInternational Technology Roadmap for Semiconductors (ITRS) Conference,International Technology Roadmap for Semiconductors (ITRS) Conference,20022002
B. Sohn, D. Pillai, N. Acker, B. Sohn, D. Pillai, N. Acker, ““300mm Factory Design for Operational300mm Factory Design for OperationalEffectivenessEffectiveness””, IEEE/ASMC Conference, SEMICON , IEEE/ASMC Conference, SEMICON EuropaEuropa, Munich,, Munich,Germany, April 2000eGermany, April 2000e
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