ansys workbench for electronics workbench enhances electronics design flows with cad integration and...

ANSYS Workbench enhances electronics design flows with CAD integration and simulation automation

SIwave and Icepak two-way coupling provides electrical and thermal co-design

for PCB design

HFSS one-way coupling with Mechanical for medical device MRI compliance

DesignXplorer integration with Ansoft Designer enables comprehensive design space exploration for a complete system

Thermal-stress analysis of a computer graphics card, temperatures imported to ANSYS

Mechanical from ANSYS Icepak

Workbench CAD Integration for HFSS, Maxwell, and Q3D ExtractorNew

ANSYS Workbench for Electronics Jim DeLap and Steve Scampoli

PCB Board Model

Pad Ball

PCIConnectorPackage 1 Socket

TlineVias Vias

TLines

Package 2PCIBoard

PCIe Gen 3 DOE Channel Simulation

TX

RX

0 0 0 0 0 0 0 0

P2_Pad1_p P2_Pad1_n

P2_Pad2_p2

P2_Pad2_n2

P2_Pad3_n P2_Pad3_p

Pad3_n

Pad3_p

Pad2_p

Pad2_n

Pad1_n

Pad1_p

Ball1_n

Ball1_p

Ball2_n

Ball2_p

Ball3_n

Ball3_p

Pin1

Pin2

Pin3

Pin4

Pin5

Pin6

Pin7

Pin8

Pin9

Pin10

Pin11

Pin12

p1

p3

p5

p7

p9

p11

Die_1n

Die_1p

Die_2n

Die_2p

Die_3n

Die_3p

Pin1

Pin3

Pin5

Pin7

Pin9

Pin11

Pin2

Pin4

Pin6

Pin8

Pin10

Pin12

Pin1

Pin2

Pin3

Pin4

Pin1

Pin2

Pin3

Pin4

Pin1

Pin2

Pin3

Pin4

1

2

3

4

5

6

W103

Pin1

Pin2

Pin3

Pin4

Pin1

Pin2

Pin3

Pin4

Pin1

Pin2

Pin3

Pin4

p1

p3

p5

p7

p9

p11

Die_1n

Die_1p

Die_2n

Die_2p

Die_3n

Die_3p

ID=156

ID=157

ID=158

ID=164

ID=165

1

2

3

4

5

6

W176

1

2

3

4

5

6

W177

Pad3_n

Pad3_p

Pad2_p

Pad2_n

Pad1_n

Pad1_p

Ball1_n

Ball1_p

Ball2_n

Ball2_p

Ball3_n

Ball3_p

ID=187

1

2

3

4

5

6

W190

Multi-Domain Coupling – SIwave and HFSS one-way coupling exchange field data to

simulate the system level EMI/EMC of a PCB mounted in a case

IcePak: Thermal

SIwave as EMI Source

3D HFSS

SIwave Hybrid Field Solver Full PCB/Package S-Parameters Fields

HFSS

Arbitrary 3D FEM Solver Adaptive Meshing Industry Standard Advanced High Performance Computing

Icepak Mechanical

Power Map

Temperature

SIwave Icepak

CATIA

Parameterized HFSS Geometry HFSS MRI Cage

Steady-State and Transient Thermal

Temperature vs. Position

ANSYS DesignModeler for geometry simplification

Icepak: Avionics Case

B Field

Magnetic Forces

Displacements of mesh nodes

Stress Calculation Field Calculation

Force Distribution

Displacements Updated Mesh

Maxwell two-way coupling with Mechanical enables structural displacements to update

the mesh in Magnetostatic simulations

GbX model courtesy of

RF Power Temperature Deformation

HFSS and Mechanical two-way coupling