a.nomerotski,2/3/2005 1 layer0 status andrei nomerotski 2/3/2005 outline introduction module...
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1A.Nomerotski,2/3/2005
Layer0 Status Andrei Nomerotski 2/3/2005
Outline Introduction Module Production Assembly of Layer0 Electronics System tests Schedule
Mechanical and Installation issues will be covered in Bill Cooper’s talk
2A.Nomerotski,2/3/2005
Overview Layer0 will improve impact parameter resolution
and mitigate degradation of performance caused by radiation damage to the SMT inner layers after 3-4 fb-1
Important for tracking & b-tagging at high luminosity and for Bs mixing measurement
Layer0 uses R&D and experience of the DZero Run2B Silicon Upgrade
Many components prototyped in advance
Contributing institutions : Brown, CINVESTAV,Fermilab, Fresno, UIC, U.Indiana, U.Kansas, Kansas State, Louisiana Tech, U.Mississippi, MSU, Moscow State, NorthWestern, Rice, Stony Brook, U.Washington, Zurich
3A.Nomerotski,2/3/2005
Layout of Layer0
Inside SMT
• 6-fold symmetry, total 48 modules, 96 SVX4 readout chips• 8 module types different in sensor and analog cable length
4A.Nomerotski,2/3/2005
Run2B Silicon Closeout Run2B closeout is complete Results on L2-5 stave and grounding R&D on Layer0 have been presented at
several instrumentation conferences and published in proceedings. NIM paper on the grounding R&D submitted
Though present Layer0 has a different design, the original Run2B Layer 0 allowed to prototype many aspects of the new design
CF support structure Grounding/noise issues Assembly issues
Original Run2B support structure
5A.Nomerotski,2/3/2005
Layer 0 Module : Concept
Sensor connected to hybrid with double-deck analog cable
hybrid
analog cablesensor
6A.Nomerotski,2/3/2005
Module Production We are in production since mid January 2005
Had PRR in Nov 2004 – very useful, implemented many recommendations of the committee
8 types of modules, 6 of each type Total 48 needed
Have parts for ~100 modules, plan to build 64 modules to select best 48
During Sept-Dec 2004 built 14 preproduction modules Most of them used for system tests
Will discuss below Production components Module assembly Status and Production rate Module QC
7A.Nomerotski,2/3/2005
Sensors Pitch 71/81 micron,
intermediate strip, 70/120 mm long: four types
Ordered from HM 120 sensors (4 x 30) in March 2004
Received 112 in July and 8 in November 2004
All IV, CV tested at Fermilab 3 out of spec due to large I/V
- used for prototypes Only one(!) bad strip – pinhole
on one of last 8 sensors Out of 120 x 256 = 30720 strips spec 1%
Four sensors fully probed at Stony Brook
Results consistent with HM Four sensors and test
structures irradiated at KSU Measured at Stony Brook Built two modules, see later
Depletion Curves
0.0E+00
5.0E+17
1.0E+18
1.5E+18
2.0E+18
2.5E+18
3.0E+18
3.5E+18
4.0E+18
4.5E+18
5.0E+18
0 50 100 150 200 250 300 350
Volts
1/C
^2
Layer 0 VI Curves
1.00E-08
1.00E-07
1.00E-06
0 100 200 300 400 500 600 700 800
Voltage
Cu
rren
t
8A.Nomerotski,2/3/2005
Pitch Adapter
Two types of Pitch Adapter Ordered in June 2004,
received in Oct 2004 (Seigert)
Satisfactory bond strength (6.8+/- 0.8 g) and etching quality
Before unsuccessfully tried two other vendors
As backup ordered pitch adapters also from Advanced Thin Film Products
Provided samples with very good pull strengths
Received and evaluating first batches
Building a module with this PA
9A.Nomerotski,2/3/2005
Analog Cable 8 types of cables
required (4 pairs different in length) 128 signal lines per
cable Max length 34 cm
Ordered in March 2004, delivered in July 2004 (Dyconex) Total 200 cables
Testing : visual inspection – no bad channels
10A.Nomerotski,2/3/2005
Hybrid 48 hybrids required Had 267 tested
SVX4.2B chips Received 119 hybrids
in Sept 2004 (Amitron)
70 good, 49 “out of spec”
“out of spec” : cutoff edge off by 200 micron, can be used with modified fixtures
Mechanical tests at Fermilab and KU
Flatness < 80 micron, thickness < 800 micron (both better than spec)
Assembled 101 hybrids at NXGen and 10 at Fermilab
Yield (before burn-in) ~90%
7 hybrids left unstuffed, 1 broken
>50% of hybrids are burnt-in (KU)
A.Nomerotski,2/3/2005
sensor
top cable
bottom cable
pahybrid
SVX
glue joints
ceramic spacers
2
3
4
5
66
7
1
1
Module Assembly Overview
1) Sensor and spacer are glued to kapton wrap-around circuit; Spacers are glued to top cable
2) Bottom cable is glued to hybrid and pitch adapter3) SVX chip is wire bonded to the bottom cable4) Top cable is glued to bottom cable. Wrapping of sensor
is completed5) Pitch adapter is glued to the sensor6) Cables are wire bonded to the pitch adapter and SVX
chip7) Sensor is bonded to pitch adapter
Day 1
Day 2
Day 3
Day 4
12A.Nomerotski,2/3/2005
Stage 4
Stage 4
A number of fixtures is required for all steps Typically have double quantity of fixtures
Example below : Gluing of analog cable
Module Assembly Fixtures
Bond profiles for analog cable
analog cable
hybrid
pitch adapter
13A.Nomerotski,2/3/2005
Assembled Layer0 Module
analog cable
hybrid
pitch adapter
SVX4
sensor
14A.Nomerotski,2/3/2005
Current status : 10 production modules assembled since Jan 13
Current rate : 4 modules per week Have all fixtures to boost production to 8 modules per week
Module QC Mechanical inspections I-V curve Burn-in : 72 hours with 200V bias Encapsulation of HV and GND bonds Another short burn-in before storage
Results analyzed and put into the module database So far three modules with 0 defects, two with 1 defect, one with
many, others still need to be tested Additional module testing (done for a few modules)
Several modules underwent long-term tests in April-July 2004 Built and tested two modules with irradiated sensors (~10 fb-1
equivalent) Thermocycling Laser tests
Production Rate and Module QC
15A.Nomerotski,2/3/2005
V-I plots Range 0-300V, typically current ~ 50-150 nA,
correlates well with sensor current
16A.Nomerotski,2/3/2005
Examples of plots from hybrid burn-ins : pedestals
L0 - 202
17A.Nomerotski,2/3/2005
Differential Noise vs. Strip Current
20
22
24
26
28
30
32
34
36
0 100 200 300 400 500 600
Current, mkA
no
ise,
AD
C c
ou
nts
*10
396 nsec
132 nsec
Tests of Irradiated Modules : Shot Noise
Good opportunity to check that we understand irradiated modules
Normally stored in the freezer - warmed up to increase current Current vs. Temperature dependence is in agreement with
expectations Minimal increase of noise wrt non-irradiated module at
operational T Observed rising contribution from shot noise with rising T
Shot noise scales as sqrt(Integration time x Current) ~1400 e for 396 ns integration time at T=+10oC : agrees with
calculations
18A.Nomerotski,2/3/2005
Support Structure Assembly Fixture
Base Plate90”x20”
CF Support Structure
Support Mount South
Support Mount North
Middle Support
South Modules Holders
North Modules HoldersCF Support Structure
Rotation Control
Collar North
Collar South
The fixture will be mounted on CMM TableLab C at SiDET
19A.Nomerotski,2/3/2005
Sensor & Hybrid Holders
Each module after mounting is tested electrically
20A.Nomerotski,2/3/2005
Layer0 Electronics Layer0 will use 48 readout channels now used by
Outer H-disks Readout chain needs to be interfaced to Run2A
SMT electronics New wrt Run2A : Hybrid-Jumper Cable-Junction Card-
Twisted Pair Cable-Adapter Card Adapter Card isolates Layer0 ground and detector
ground Needed because South is shorted to North by the support
structure SVX4 needs to coexist with SVX2
Status of Cables Digital Jumper Cables (KSU & KU)
Production cables ordered from Compunetics in Jan 2005 Have reduced thickness to 0.15 mm
Twisted Pair Cable (KU) – ready
21A.Nomerotski,2/3/2005
Junction Card Two channels per card Cable routing and dressing prototyped with mockup Design finalized, will be ordered in Feb
22A.Nomerotski,2/3/2005
Adapter Card Four channel per card Ground isolation tests done in Sept-Oct 2004
Had good results with and without isolation Plan to reproduce them with the prototype
support structure
Design finalized, will be ordered in Feb
23A.Nomerotski,2/3/2005
System Tests Effects of possible interference with support
structure and between modules – addressed with setups at Sidet
Readout of modules installed on the support structure
Readout of large number of channels, in the limit full Layer0
Testing at conditions similar to operations – addressed with setups at DZero
Use real DAQ with Trigger Framework Preparation and exercising of online software
Cooling system / Thermocycling
24A.Nomerotski,2/3/2005
Prototype Support Structure
modules installed on the support structure
CF support structure for Layer0 implements new grounding approach: laminated ground mesh covering all surface – crucial design feature ensuring low inductance path for GND and hence low noise
Prototype is electrically and mechanically the same as final structure
Have 8 L0 modules mounted on the prototype support structure since Nov 2004
Simultaneous readout through simplified chain
25A.Nomerotski,2/3/2005
Results with Prototype Structure Low total and random noise (no Faraday
cage) the grounding scheme works well
Observe pedestal shapes at fast SVX4 settings Caused by digital-to-analog couplings between
hybrid and analog cable below the hybrid
Noise ~ 1500 eS(MIP) / N ~ 15:1 Coherent noise very small Noise for 4 modules
cablesensorhybrid
26A.Nomerotski,2/3/2005
Pedestal Shapes Pedestal peak-to-peak
difference At fast preamp settings :
6-7 ADC counts At slow settings : 2 ADC
counts - acceptable
Other remedies It looks that most of
pickup comes from clock signals – will have provisions to regulate clock amplitude at AC
Have a spacer between hybrid and analog cable
0.2 mm spacer significantly reduces effect
More testing in progress
fast preamp settings
slow preamp settings
Pedestals for 4 modules
10 ADC counts
10 ADC counts
27A.Nomerotski,2/3/2005
Plans for system tests at Sidet
Feb 2005 : Read out 10 modules on the support structure through Junction Card-Twisted Pair Cable-Adapter Card Use prototype JumperCable-JC-TPC-AC
Mar 2005 : Read out the 10 modules though full chain (above + Sequencer + VRB)
May 2005 : Expand full readout to 48 channels
June 2005 : Read out full Layer0 Use production JC-JC-TPC-AC
Also : thermocycle prototype support structure with 10 modules (Feb 2005)
28A.Nomerotski,2/3/2005
System tests at DZero Installed two L0 modules, two hybrids, WIENER LV PS
and power distribution during the 2004 shutdown Successfully read out in special runs
Data is being analyzed, noise looks reasonable However these SVX4 strings are not yet in operations,
waiting for acceptable SEQC firmware Have a stand at DZero with IB, SEQ and VRB crates connected to
Trigger Framework to debug firmware
4 ch. Adapter Card at HorseShoe
These SVX4 strings will be used
To develop all slow control and monitoring online software
Exercise offline software
Measure S/N from real particles in the modules
29A.Nomerotski,2/3/2005
Other Integration Issues Some remapping choreography of Layer0/Inner H-
disks/Outer H-disk readout and HV channels will be required during 2005 shutdown
Isolated LV Supply (WIENER) Provides SVX4 power PS and heavy power cabling installed during 2004
shutdown Power distribution to Adapter Cards will be installed
during 2005 shutdown High Voltage Supplies
Located outside of Collision Hall (in MCH2) Install more channels of Bira supplies Install new fanout box rated to 700 V
Integrate new components to Slow Controls Interlock Online GUIs
30A.Nomerotski,2/3/2005
Schedule Hybrid production essentially done
(1/25/2005) Junction/Adapter Cards production ends on
3/18/2005 Module production ends on 4/22/2005 Start module installation 4/1/2005 Layer0 ready for system tests at Sidet on
5/11/2005 Layer0 ready to go to DZero on 7/19/2005
Main schedule risks are in 1) Design and preparation of assembly
fixturing 2) Full system tests
31A.Nomerotski,2/3/2005
Summary Good progress on all fronts All parts in hand - started module
production in January 2005 Layer0 assembly to start in April 2005 Detector should be ready to go to
DZero in July 2005
Paying attention to system tests – so far all looks under control
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