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NI AWR DesignEnvironment
AWR
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AWRDESIGNFORUM
Ankara - 25 February
©2016 National Instruments. All rights reserved. A National Instruments Company, Analog Offi ce, AWR, Microwave Offi ce, AXIEM, National Instruments, NI, and ni.com are trademarks of National Instruments. Other product and company names listed are trademarks or trade names of their respective companies.
Time Topic
09:00 – 09:30 Welcome, Registration, and Coffee
09:30 – 10:30 NI AWR Design Environment Overview: New Technologies of
V12 Release and Complete Bits to Beams Radar Simulation
10:30 – 11:15 Integrating Antennas With Linear and Nonlinear Circuits
11:15 – 11:30 Coffee Break
11:30 – 12:15 Phased Arrays and Communications Systems Analysis
With Visual System Simulator
12:15 – 13:00 Using NI AWR Design Environment for Miniaturizing RF Circuits
With LTCC/Laminate Technologies and for BAW/SAW Filter Design
13:00 – 14:00 Lunch
14:00 – 14:30 Mikro-tasarim, Onur Memioglu: A Methodology for Designing
Cell Phone RF Switch MMICs Using NI AWR Software
14:30 – 15:00 Design and Simulation of MIMO Systems
15:00 – 15:15 Coffee Break
15:15 – 16:15 RFIC Design Flow With Analog Offi ce
16:15 – 16:45 National Instruments Presentation: TBA
16:45 – 17:15 Q&A, Conclusion, and Lucky Draw
Media Partner:Registrationhttp://bit.ly/1aOwfZe
Event Partners:Aktif Neser Elektronik
Presentation Abstracts
NI AWR Design Environment Overview: New Technologies ofV12 Release and Complete Bits to Beams Radar Simulation
This presentation begins with an overview of NI AWR Design Environment™ for printed circuit board (PCB),
microwave monolithic integrated circuit (MMIC), low temperature co-fi red ceramic (LTCC), and RFIC designs and
a review of the powerful, innovative technologies contained within the recent V12 release. It will also highlight
how NI AWR Design Environment can be used to simulate and optimize the performance, as well as the cost, of
a complete ISM band radar system based on commercial off the shelf components (COTS). Simulation
examples using NI AWR software will include system, circuit, and antenna analysis.
Integrating Antennas With Linear and Nonlinear Circuits
Analyst™ 3D FEM-based EM solver is integrated into Microwave Offi ce circuit design software along with the
3D planar analysis tool AXIEM, allowing engineers to couple antennas with linear and nonlinear components.
This presentation will begin with an introduction to Analyst, the unique parametrized cells (PCells) approach for
components such as connectors, waveguides, chip packages, and more.
The introduction will be followed by an overview of in-situ antenna measurements, one of the new enhance-
ments in NI AWR Design Environment V12. This unique capability enables engineers to simulate driving circuits
with nonlinear amplifi ers as well as feed networks with antennas in a single simulation.
Phased Arrays and Communications Systems Analysis With Visual System Simulator
This presentation provides a basic overview of the new Visual System Simulator™ (VSS) features in V12, illus-
trating system-level simulation using various real world examples. A transceiver example showing the new VSS
bi-directional simulation capability will be presented, which highlights several new enhancements for complex
system simulations of radars and T/R modules.
Examples during this presentation will include enhanced phased-array simulation capabilities for hundreds and
thousands of elements and new and unique VSS system simulation models, including support for LTE downlink
test models per TS36.141 specifi cations.
ni.com/awr
Venue
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AWRDESIGNFORUM
AnkaraRamada Hotel Ankara66 Tunali Hilmi CaddesiAnkara, 6680 TR
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Presentation Abstracts
Using NI AWR Design Environment for Miniaturizing RF Circuits with LTCC/Laminate Technologies and for BAW/SAW Filter Design
This presentation will overview the LTCC design process within NI AWR Design Environment V12. LTCC technology
is a multi-layer ceramic process that can be used to fabricate low cost, high performance RF and microwave
components. It is an extremely versatile technology that can be used to realize a wide range of components, from
simple passive fi lter structures and packages to complex subsystem assemblies containing discrete SMT
components, bare die, and printed passives. Topics such as creation of a custom LTCC PDK for passive components
and use of planar and 3D EM for modelling of LTCC components and more will be presented. This talk also includes
a design example of packaged SAW chip, including all electromagnetic details of the test board, as well as SAW
package and SAW layout contributing to the distortion of the ideal fi lter performance, enabling proper redesign of
the fi lter resonators to meet the design goals.
Mikro-tasarim, Onur Memioglu: A Methodology for Designing Cell Phone RF Switch MMICs Using NI AWR Software
RF switches are a key part of cellular phones. They connect antennas to all RF components in the phone in order
to toggle between transmitting a signal and receiving voice/data. Since all signals go through one or multiple
switches before going to the antenna, they must have a low insertion loss, acceptable return loss, and high
port-to-port isolation. This presentation describes the simulation of these parameters for optimizing the switch
performance. This is a challenging task since die-level and package-level electromagnetic (EM) simulations must
be carried out together, in order to accurately predict the switch performance. NI AWR software, specifi cally
Microwave Offi ce, offers powerful, seamlessly integrated circuit and EM simulation tools that streamline design
time and enable designers to achieve RF switch MMIC design goals quickly and accurately.
Design and Simulation of MIMO Systems
The compelling reason why modern day communications systems need to utilize a multiple input multiple output
(MIMO) system as opposed to the traditional single input single output (SISO) confi guration will be explained
and the basic concepts of MIMO will be discussed in detail. The fundamentals of spatial diversity and spatial
multiplexing will also be addressed. Different fl avors of MIMO such as signal input multiple output (SIMO) and
multiple input single output (MISO) will be discussed and two receiver structures for SIMO will be illustrated. The
remainder of the presentation will concentrate on the details of a true MIMO 2x2 system. The Alamouti code, a
space time block code, will be discussed. The assumption used for the simulation purposes of a true 2x2 MIMO
will be clearly explained. Finally, simulations of a 2x2 MIMO system will be shown in Visual System Simulator
system simulation software.
RFIC Design Flow With Analog Offi ce
The complexity of today’s new technologies renders traditional design methods inadequate in terms of accuracy,
effi ciency and cost. Analog offi ce ensures complete design closure between IC, package, module, and PCB
design phases. This presentation will highlight the complete RFIC design fl ow. With the help of circuit design
examples, it will cover all the design steps involved in the RFIC design process: schematic simulation, layout,
parasitic and EM extraction, and process corner simulations, as well as well as DRC and LVS to ensure the
manufacturability of the chip layout.
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