amphenol the pcb manufacturer delivering tomorrow…
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Amphenol THE PCB MANUFACTURERDELIVERING TOMORROW’S
TECHNOLOGY TODAY
www.amphenol-invotec.com
Our Business Strategy
Our MarketsWe have a diverse European customer base encompassing key growth. Regardless of application, our customers rely on Invotec to provide a total solution to their business needs. Key markets include:
Amphenol Invotec Ltd
Operating from facilities in the UK, we are one of Europe’s leading manufacturers of time critical, advanced technology and high reliability printed circuit boards.
The company manufactures a wide range of multilayer, HDI, sequential lamination, fl ex and fl ex-rigid PCBs using a variety of advanced materials, fi nishes and technologies to meet exacting customer specifi cations.
• Customer satisfaction - central to everything we do• Business & Manufacturing Excellence underpinned by Lean Manufacturing & Continuous Improvement• HDI, Flex & Flex-Rigid, advanced substrates and materials• Thermal management solutions• Signifi cant QTA Capability• High mix – Mid Volume • NPI support• DFM best practice and applications support• Engagement in customer/supplier development programs
Military Civil Aviation Industrial Space Oil & Gas
Automotive Communication Security/Encryption Power/Energy Rail/Transportation
30% 18% 14% 9% 7%
5% 5% 3% 3% 2%
Sales %
www.amphenol-invotec.com 3
Services
Research and Technological Development
We work in partnership and share knowledge with customers at the earliest opportunity.We add value through our expertise, experience, flair and ingenuity, enabling customers to convert their visions into viable products.
Design for Manufacture
Our DFM team proactively assesses customer designs to ensure optimum performance and value.Through this methodology, we deliver robust design solutions leading to enhanced quality and an accelerated time to market
New Product Introduction
Our strength is rooted in flexibility.While we have the manufacturing capabilities and scale to ensure the rapid delivery of high volume orders, we also work as a development partner with many customers.We produce prototypes and pilot batches, which are proven for manufacturability prior to batch launch.
Quick Turnaround (QTA)
We offer a broad range of technologies on accelerated lead-times:- IMS – 24 hrs- PTH – 2 days- Multi-Layer (Including HDI) – 3 days- Sequential lamination – 5 days- Flex-Rigid – 5 days
Knowing Our Customers
Local Account Managers backed by our Customer Service team work with you to provide a customised service program.
The Value of Knowledge
Our technical resource on site and in field applications provides you with answers you want when and wherever you need them.
Relationship Management
Successful commercial relationships are built on being open, honest and fair.
16% Flex & Flex Rigid
31% HDI
38% Rigid M/L
49% Sequential Lamination
15% Thermal Management
10% RF
Sales Mix
TechnologyProduct Profi le
For advice on any of these topics please contact us and we will be happy to provide you with the necessary support to all your questions.
5
Capability
Inner layer
Outer layer
Laser via pads
Mechanical via pads
Aspect ratio
Solder resistSolder mask clearance
Copper thickness
Min Dielectric thickness
HDI
Max panel sizeStandard
Max panel thickness
Max layer count
Min mechanical holeBuried pair mechanicalMin diameter laser viaBuried pair laser
Mechanical depth control
Control impedance
Tracks
External PadsInternal Pads
External PadsInternal Pads
MinMax
MinMax
MinMax
MinMinMinMin
+/-
%
Current
50 micron - 2 mils50 micron - 2 mils
75 micron - 3 mils75 micron - 3 mils
0.250 mm - 10 mils300 micron - 12 mils
450 micron - 18 mils500 micron - 20 mils
10:1
40 micron
12 micron210 micron
25 micron
1+N+15+N+5
24x2124x18
5.00mm
40
0.250 mm - 10 mils0.150 mm - 6 mils0.10 mm - 4 mils0.070 mm - 2.8 mils
+/- 25 microns
+/- 10%
Advanced
38 microns - 1.5 mils 38 microns - 1.5 mils
63 micron - 2.2 mils63 micron - 2.2 mils
200 micron - 8 mils225 micron - 9 mils
350 micron - 14 mils450 micron - 18 mils
11:1
38 micron
9 Micron 210 micron
25 micron
1+N+16+N+6
24x2124x18
5.3mm
50
0.200 mm - 8 mils0.150 mm - 6 mils0.075 mm - 3 mils<0.070 mm - 2.8 mils
+/- 15 microns
+/- 7%
Road Map
25 microns - 0.8 mils 25 microns - 0.8 mils
50 micron - 2 mils50 micron - 2 mils
150 micron - 6 mils200 micron - 8 mils
350 micron - 12 mils425 micron - 16 mils
12:1
20 micron
5 Micron >210 micron
<25 micron
1+N+1>6+N+6
>24x21>24x18
>5.3mm
>50
0.150 - 6 mils0.150 mm - 6 mils0.050 mm - 2 mils<0.070 mm - 2.8 mils
+/- 10 microns
+/- 7%
www.amphenol-invotec.com
Products
New applications are often developed in partnership with customers to deliver optimum performance under extreme conditions.
Unrivalled technical capabilities coupled with innovation and close customer/supplier relationships ensure a comprehensive and competitive service-backed offering.
Products
Single & double sided Rigid
Single & Double sided flex
Rigid Multi layer
Multi layer Flexible
Multi layer Flexi-rigid
Mixed composite multilayer
Mixed composite Flex rigid multilayer
IMS (Insulated metal substrates)
Bonded External heat sinks
Product Technology
Blind via
Micro via
Buried via
Copper filled vias
Stacked micro via
Stepped micro via
Controlled Impedance
Embedded Resistors
Embedded devices
CTE- CIC / Carbon / Aramid / Molybdenum
Resin filled through vias
Resin filled buried vias
Resin filled blind vias
Plugged vias
Thermal Management: up to 400 Microns of CU
External heat sinks: Copper / Aluminium
Heat exchangers
Metal backed substrates
Products
Single & double sided Rigid
Single & Double sided flex
Rigid Multi layer
Multi layer Flexible
Multi layer Flexi-rigid
Mixed composite multilayer
Mixed composite Flex rigid multilayer
IMS (Insulated metal substrates)
Bonded External heat sinks
Product Technology
Blind via
Micro via
Buried via
Copper filled vias
Stacked micro via
Stepped micro via
Controlled Impedance
Embedded Resistors
Embedded devices
CTE- CIC / Carbon / Aramid / Molybdenum
Resin filled through vias
Resin filled buried vias
Resin filled blind vias
Plugged vias
Thermal Management: up to 400 Microns of CU
External heat sinks: Copper / Aluminium
Heat exchangers
Metal backed substrates
7
We continue to set ourselves ever more demanding targets for excellence as we pursue an overall company objective of zero defects.
This commitment is fully embedded throughout the company; it is our passion to continually satisfy stringent customer requirements and satisfaction.
In this pursuit we also need to meet the expectations of all relevant industry and regulatory standards. Our quality management system adapts to meet all such changes; regulatory and contractual requirements are assessed, audited and incorporated on an ongoing basis.
Quality
• AS9100 Rev C
• ISO 9001
• NADCAP (Electronics) flex-rigid multi-layers and microvia technologies
• ESA approved according to ECSS-Q-ST-70-10C in accordance with: PID SM18T iss. 02 - sequential rigid polyimide PID SM19T iss. 02 - sequential rigid-flex polyimide
• SC21 Silver Award
• IECQ / CECC (BS EN / 123000, 100, 200, 300, 400, 500, 600, 700, 800)
• Underwriters Laboratories (UL 796 / UL94 / Group UL file number E72693(M)
Group Approvals
www.amphenol-invotec.com
Tamworth
Hedging Lane, Dosthill, Tamworth,Staffordshire, England, B77 5HH
T +44 (0) 1827 263000F +44 (0) 1827 263250
Sales Enquiries:sales@amphenol-invotec.com
General Enquiries:info@amphenol-invotec.com
RFQ:design@amphenol-invotec.com
Telford
Halesfield 4, Telford, Shropshire, England,TF7 4AP
T +44 (0) 1827 263000F +44 (0) 1827 263250
Sales Enquiries:sales@amphenol-invotec.com
General Enquiries:info@amphenol-invotec.com
RFQ:telford.design@amphenol-invotec.com
UK Sales
Matthew Bowman - Sales Director
M +44 (0)7774 788279E matthew.bowman@amphenol-invotec.com
Jeremy BrookM +44 (0)7710 145672E jeremy.brook@amphenol-invotec.com
Terry DowlingM +44 (0)7909 535247E terry.dowling@amphenol-invotec.com
Mark SykesM +44 (0) 7534 909762E mark.sykes@amphenol-invotec.com
Technical Support
Howard SwarbrickM +44 (0)7810 317589E howard.swarbrick@amphenol-invotec.com
Ram PallM +44 (0)7770 698201E ram.pall@amphenol-invotec.com
European Sales
Monique Berckvens - Benelux - European Sales Support
M +32 496 28 82 41E monique.berckvens@@amphenol-invotec.com
Thomas Witt - Germany
T +49 7452 8 444 192M +49 160 94 90 95 08F +49 7452 8 444 193E thomas.witt@amphenol-invotec.com
Monika Braun - Germany
T +49 7452 8 444 192F +49 7452 8 444 193E monika.braun@amphenol-invotec.com
Frédéric Dupont - France
T +33 6 07 08 60 68F +33 1 69 94 05 17M +33 6 0708 60 68E frédéric.dupont@amphenol-invotec.com
Fabio Visaggio - Italy
T +39 02 93254 208F +39 02 93254 444M +39 34 08213 852E f.visaggio@amphenol-roe.eu
Giuliano Iguera - Italy
T +39 02 93254 209F +39 02 93254 444 M +39 34 99045 682E g.iguera@amphenol-roe.eu
Nordic Region - Elmatica
NorwayTorger EdlandCountry Manager - Norway
M +47 91 84 73 00E torger.edland@elmatica.com
DenmarkTorben HajslundCountry Manager
M +4532161826E torben.hajslund@elmatica.com
FinlandMika KupiainenCountry Manager
M +358-44-3204588E mika@elmatica.com
SwedenJan PerssonCountry Manager
M +46 705819616E Janne.persson@elmatica.com
Keyhani Bendix, Esmail - Spain
T +34 91 6407 302F +34 91 6407 307M +34 62 9054 629E e.bendix@amphenol-roe.eu
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