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ALTIUMLIVEDIGITAL STANDARDS AND DIGITAL SAMPLES FORRIGID-FLEX TECHNOLOGY
Andreas SchilppJürgen WolfWürth Elektronik CBT
MunichJanuary 17th 2019
Flex-Rigid Layer Stack Design
1
Design rules – Design for Manufacturing
Summary
Flex-Rigid Standards and options
Training design „WECube“
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Outline
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The Advatages of Flex-RigidFlex-Rigid Standards and options
Miniaturisation
Signal Integrity
Reliability dynamicalBending
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 3
USB3 Camera – Miniaturization at it´s best!Flex-Rigid Standards and options
Features USB connector on separate rigid part impedance matched connected with flex part Avoiding connectors, saving Footprint areas Design uses Microvias excellent Assembly excellent Performance excellent Testability excellent Robustness
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 4
Important steps prior to Layer Stack Design:Flex-Rigid Standards and options
Design-to-Cost 1: system
! Flex-Rigid is mechatronic
= Mechanic + Electronic !
all electrical and mechanical interfaces must be taken into consideration during the conceptual phase
An optimization could cut costs remarkably
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 5
Important steps prior to Layer Stack Design:Flex-Rigid Standards and options
Design-to-Cost 2: interfaces Expensive flexible tails due to weak mechanical design− nesting not possible− optimisation of needed area− combination of interfaces− Option of folding
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 6
Important steps prior to Layer Stack Design:Flex-Rigid Standards and options
Design-to-Cost 3: Folding
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 7
Flex-Rigid 1F-5Ri / HDI 1-4-1 Flex-Rigid 2Ri-2F-2Ri / HDI 1-4b-1
Important steps prior to Layer Stack Design:Flex-Rigid Standards and options
Design-to-Cost 4: flex-rigid variants
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 8
Options for interface designFlex-Rigid Standards and options
ZIF contact with flex flex outside:
Tipp for flex inside:
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 9
Options for mechanical design of flexible layersFlex-Rigid Standards and options
„lift-off“- design
no vias allowed in lift-off area no copper design next to flex
layers, ok on all other layers specification in drawing:
„lift-off area, not laminated“
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 10
Standard Stack-up Flex-Rigid 1
Standard 1F-xRi stack-up− Rigid: FR4 Tg ≥150°C, halogen free, filled− Flex: Polyimide Tg > 200°C, typ. 50µm thick− soldermask, flexible soldermask partially in bending area− Inner layer copper thickness: 18µm
Flex-Rigid Standards and options
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 11
Standard Stack-up Flex-Rigid 2
Standard xRi-2F-xRi stack-up− Rigid: FR4 Tg ≥150°C, halogen free, filled− Flex: Polyimide Tg > 200°C, typ. 50µm thick− soldermask, Polyimide Coverlay partially in bending area (BIKINI)− Inner layer copper thickness: 18µm
Flex-Rigid Standards and options
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 12
Advanced Stack-ups: NON - Standard
Airgap constructions− 2F + 2F + 2F + ….. not glued− up to 70µm copper on flex material− bending becomes easier− requires a long flex area!
Recommendation: H ≥ 50mm
Flex-Rigid Standards and options
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 13
Advanced Stack-ups: NON - Standard
Airgap constructions− 2F + 2F + 2F + ….. not glued− up to 70µm copper on flex material− bending becomes easier− requires a long flex area!− Recommendation: H ≥ 50mm
Multilayer Flex constructions− 4F / 6F / … flex stack glued− for short bending areas− for impedance matching
Flex-Rigid Standards and options
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 14
Flex-Rigid Layer Stack Design
1
Design rules – Design for Manufacturing
Summary
Flex-Rigid Standards and options
Training design „WECube“
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3
4
5
Outline
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Creation of a flex-rigid Stackup 3Ri-2F-3RiFlex-Rigid Layer Stack Design
EDA Tool: Altium Designer 18Layer Stack Manager - one possible way:
Load „Presets“: Eight Layer Adapt the order of Cores / Prepregs Adapt thickness of copper, dielectric „Add Stack“ in Window „Advanced“ Deselect not used layers in substack „Flex“ „Add Layer“: „Add Flex Coverlays“
Now this becomes much easier!
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 16
Digital standard stackupsFlex-Rigid Layer Stack Design
Data formats− Altium AD18 (AD19 will follow soon)− Cadence (OrCAD PCB Designer Professional 17.2)− IPC-2581
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 17
Digital standard stackupsFlex-Rigid Layer Stack Design
Benefits of digital layer stackups Error avoidance & productivity increase− Avoid errors and increase productivity by importing proven stackups into
your EDA tool− always up-to-date on our website
Reliability− Proven stackups ensure the manufacturability and reliability of your
printed circuit board
Safety and security− Use of market-standard and cost-optimized standards− Avoidance of exotic and expensive special constructions and materials− Standards with stocked materials and standardized production processes
enable high quality and cost-effective production with shorter delivery times.
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 18
Digital standard stackupsFlex-Rigid Layer Stack Design
Start layouts faster – thanks to our digital layer stackups
LINK: Internet
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 19
Flex-Rigid Layer Stack Design
1
Design rules – Design for Manufacturing
Summary
Flex-Rigid Standards and options
Training design „WECube“
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5
Outline
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Samples and ExamplesTraining design „WECube“
Feeling and understanding with hands-on samples 1F-xRi / Semiflex combination 2F-xRi xRi-2F-xRi Semiflex Flex / TWINflex
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 21
Samples and ExamplesTraining design „WECube“
Our Service becomes digital digital exercise sample WECube Altium AD18 data format Request for this sample data via
QR code or internet
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 22
Training design in Altium18Training design „WECube“
Special features Combination of different variants− Flex-rigid 1F-3Ri− Flex-rigid 1Ri-2F-1Ri− Semiflex 1Ri-3Ri
Lift-off areas Slot and key construction Rigid part as fixing bracket
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 23
WebinarTraining design „WECube“
For more information about „WECube“− visit our Webinar Archive
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 24
Flex-Rigid Layer Stack Design
1
Design rules – Design for Manufacturing
Summary
Flex-Rigid Standards and options
Training design „WECube“
2
3
4
5
Outline
25
different rules for for all rigid-flex variantsDesign rules
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 26
Flex-Rigid Design Guide
Special rules for flex-rigid most important are:− THT via pads− and also SMD pads, if flex is outside
Design rules
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 27
Clearance for THT Via padsDesign rules
General parameter definition
Clearance measurement:related to pad outline!
NOT center of drilling orvia barrel!
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 28
Clearance for SMD and THT Via padsDesign rules
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 29
Altium parameter setting:
PCB Rules− Board Outline Clearance
• Split Barrier• SMD Pad and TH Pad
Flex-Rigid Layer Stack Design
1
Design rules – Design for Manufacturing
Summary
Flex-Rigid Standards and options
Training design „WECube“
2
3
4
5
Outline
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QR codesSummary
Summary of documents for download or important linksDesign rulesfor flex-rigid
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 31
Table Top exibitionSummary
AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG Page 32
Please visit our Table Top exibition get your 50€ coupen get a WE fidget spinner out of pcbs see the WECube as a real sample!
Thank you very much for your attention!
Any questions?
Andreas Schilpp
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