advanced electronic packaging - 3d active silicon multi chip module (mcm)
Post on 18-Nov-2014
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DESCRIPTION
An advanced electronic packaging project utilizing a 3D silicon substrate. The substrate itself was made from a 5" static memory wafer. Onto this Application Specific Integrated Circuits (ASICs) were then placed using wire bonding. The assembly was then housed in a custom ceramic package and tested as a Multi-Chip Module (MCM). The project produced a x3 improvement in packaging density.
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