3070 coverage

IntroductionIntroduction

In-Circuit Test is Most Versatile Solution

• Missing

• Gross Shorts

• Gross Opens

• Polarity

�Electr ical�Electr ical

�AOI

ICT AXI • Most Versatile Solution• High Volume Global Mfg.• Limited Access Test• On-board Programming• Combo Test

ICT: In-circuit TestAXI: Automated X-ray InspectionAOI: Automated Optical Inspection

• Insufficient

• Poor wetting

• Marginal Joints

• Voids

• Excess

• Dead Part

• Wrong Part

• Bad Part

• PCB Short/Open

• Functionally Bad

• Inverted

• Polar ity

•Missing Socketed Parts

• Excess

•Bridging

• Tombstone

•Misalignment

•Orientation

• Missing Non-Elec.

• Bypass Caps, L’s

• Extra Parts

•Mark Inspection

• Shorts

• Opens

• Invisible parts

In-Circuit Tests in Electronics Manufactur ingIs it worth it ?

Creates key process improvements

With In-Circ uit te s t, y o u c a tc h p ro c e s s fa ults e a rly -whe n the y a re le a s t e x p e ns iv e to fix - a nd c o rre c t p ro c e s s d rifts tha t c a n re d uc e the q ua lity a nd re lia bility o f y o ur p ro duc ts in the fie ld .

At the tim e a bo a rd re a c he s the e nd o f the line , the re a re fe we r fa ults to d e te c t a t func tio na l te s t, a nd fe we r p o te ntia l q ua lity p ro ble m s a fte r y o ur p ro duc ts s hip . S

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ConfidencConfidenceeActionable Actionable Information Information

In-Circuit Tests in Electronics Manufactur ingIs it worth it ?Reduce Product Cost

With In-c irc uit te s t, p ro c e s s e s run m o re e ffic ie ntly , p ro duc ing c o s t s a v ing s tha t rip p le d o wn the line .

Fe we r bo a rd s to re p a ir, s o e x p e ns iv e re wo rk is re duc e d .

The bo ne p ile o f fa ile d bo a rd s is s m a lle r, s o s c ra p is m inim iz e d a nd m a te ria l c o s ts a re lo we r.

Thro ug hp ut a t func tio na l te s t is im p ro v e d , s o fe we r te s t s y s te m s c a n ha nd le hig he r v o lum e s , re duc ing c a p ita l c o s ts tha t d riv e up the p ric e o f bo a rd s .

In-Circuit Tests in Electronics Manufactur ingIs it worth it ?

..The Bottom Line

In-Circ uit m e a ns e ffic ie nt, c o s t-e ffe c tiv e m a nufa c turing , w ith q ua lity p ro duc ts a t the e nd o f the line .

The Real-Life Tester Process

ICT Functional

Repair Repair

Bone Pile

Assumptions

ICT Functional

Repair Repair

Bone Pile

Perfect! Perfect!

No boards

No boards

No boards

What If Test Coverage is 100%-Ideal-

ICT Functional

Repair Repair

Bone Pile

�625,000

�93,750

�2500 boards / day�250 days / year�85% Yield

�28,125

�531,250�+93,750 �625,000

�93,750

What If Test Coverage is 80%

ICT Functional

Repair Repair

Bone Pile

�625,000

�75,000

�2500 boards / day�250 days / year�85% Yield

�18,750

�18,750

�531,250�+75,000

�625,000

�75,000 18,750

�ICT measures manufacturing's 85% yield as 88%

�Functional measures ICT's yield as 97%

What If Test Coverage is 95%

ICT Functional

Repair Repair

Bone Pile

�625,000

�89,062

�2500 boards / day�250 days / year�85% Yield

�4,688

�4,688

�531,250�+89,062

�625,000

�89,062 �4,688

�ICT measures manufacturing's 85% yield as 85.75%

�Functional measures ICT's yield as 99.25%

Yield vs Test Coverage?

�2.25% difference in

yield }

400% difference in faults detected

�A few percentage points increase in in-circuit yield can mean the difference of thousands of bad boards passed on to functional repair.

�{

Cost of Poor Test Coverage?

ICT Functional

Repair Repair

Bone Pile

$1/R

epai

r $6/Repair

How Test Coverage Affects Cost

$0

$50,000

$100,000

$150,000

$200,000

ICT Repair FunctionalRepair

Total

80% Test Coverage 95% Test Coverage

� $70,310�}

Assumptions: Repair Cost at ICT Level: 1.00 USD Repair Cost at Functional Level: 6.00 USD

Additional Cost Savings

Lower Costs•Fewer Boards to repair at Functional Test.•WIP is reduced.•Bonepile of failed boards is smaller.•Scrap is minimized.•Fewer Functional Test Systems reducing capital costs.

Higher Quality •Fewer Potential quality problems at Assembly Plants

Thank you !