amf-aut-t0732 sbcs power management solutions for 16- and

TM

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.

AMF-AUT-T0732

SBCs: Power Management Solutions for 16- & 32-bit MCUs in Automotive Applications

November 10, 2010

Designing with Freescale SeminarsToronto

TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.

Introduction

During this session we will review :

• Automotive market overview for:

Power Management

Networking

• Freescale System Basis Chip (SBC) Portfolio with CAN and/or LIN and its combination with MCU (Micro-control Unit) market

• See the latest Freescale solutions for:

Energy Management

Functional Safety

EMC/ESD (Electro-Static Discharge) Immunity

• 45 minutes of Presentation, 15 minutes of Q&As

2


Session Objectives

After completing this session you will be able to:

• Detail the content of a System Basis Chip

• Select the right SBC for your MCU

• Describe how the Freescale Analog Solution can help to improve energy savings

• Describe how the Freescale Analog Solution can help to secure safety application features

• Ask your Freescale representative about the latest tools available to design with our SBCs

3

TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 44

Agenda

Market Challenges and Trends

Automotive Networking and EMC Considerations

Power Management and System Values for MCU Segmentation

System Basis Chip Solutions and Values with CAN/LIN

Easy-to-Use Tools to Encourage Design-ins

Summary


5

SBC Ecosystem

System

Management

Power Management

Physical

Layer

SBC in a Few Words

SBC means System Basis Chip, which combines required design functionality on a

single standard IC:

• Physical Layer

Transmits digital network information across the network via

OEM (Original Equipment Manufacturer) standards

• Power Management (LDOs - Low Drop-Out Regulators)

Supplies MCU, CAN, and other loads

• System Management

Manages Energy savings

Contributes to (Electronic Control Unit) ECU

safety modes

• Easy to Use Ecosystem (Support Community)

Simplifies customer usage

Can provide Electro Magnetic Compatibility (EMC)

compliance reports

Freescale introduced the first SBCs to the market over 10 years ago

Large customer base built a community, a base of system expertise,

and network acceptance

100 Million SBCs (cumulative) were sold into the market before a product family was

launched

TM

Market Challenges and Trends

6


1990s: The Birth of Networking into Cars

Challenges:

• Diversity of Networks

• Proprietary Solutions

• Need for Consistency and Reuse

7

Body Controller

Engine Management

CAN, VAN or J1850 (depending on car makers)

Anti-lockBraking

Instrument Cluster

Airbag

Immobilizer Radio

Lighting

Alarm

Trailer Connection

Air conditioning

Window lift

Proprietary communication, K-line


2000s: CAN and LIN Standards Dominate

Car OEM strategy is oriented to select the best architecture

Distributed and centralized architectures coexist and depend on OEM’s car strategy

LIN provides intelligence closer to the load (reduce EMC, wire harness, lower EMC)

Challenge: to manage the complexity with limited bandwidth and non-determinism

8

RKE and TPMS Rx

Engine Management

CAN (Controller Area Network)

Anti-lockBraking

LIN (Local Interconnect Network)

Instrument Cluster

Airbag

Immobilizer

Infotainment

SJB

Body Controller / Gateway

Seat modules

Door module

DisplayMotors

Motors

Sunroof

HVACFlaps

Lighting

Transmission

Power Steering

Fuel Pump

GlowPlug

OccupantClassification

Radio

Seat BeltPretent.

MotorsMotors

Motors

FlapsFlaps

Flaps Blower

MotorsMotors

MotorsMotors

Steering column

Alarm

InfotainmentDiagnostic CAN

Amplif.

Rear module


2010s: Hierarchical Networks

RKE and TPMS Rx

Engine Management

CAN

Anti-lockBraking

LIN

Instrument Cluster

Immobilizer

Display

Body Controller / Gateway

Seat modules

Door module

VideoMotors

Motors

HVACFlaps

TransmissionPower Steering

Fuel Pump

GlowPlug

OccupantClassification

Radio

Pass. Seat Belt Pretent.Motors

MotorsMotors

FlapsFlaps

Flaps Blower

MotorsMotors

MotorsMotors

St. column

Alarm

MOST/Ethernet

Diagnostic CAN

Amplif.

Rear module

FlexRay

Cooling fan

Integrated Chassis Management

SuspensionSuspension

SuspensionSuspension

VideoVideo

Adaptive Cruise Ctrl

Driver Seat Belt Pretent.

Battery management

Active Steering

SJBLighting L

Door moduleMotorsMotors

MotorsMotors

Nav

Lighting R

Rain sensor

MotorsMotors

Motors

4x4

Temp

Park Assist

Rear Lighting

Blind Spot Det.

Wipers

Flaps

Flaps

NOX

Sensor cluster

Sunroof

Airbag

Complex architectures tend to make the car maker want to harmonize, resulting in:

• Convergence of Systems (standardization of LIN, CAN)• Improved robustness of in-vehicle networks• Increased bandwidth, with backbone architectures• Each new function cannot generate a new ECU• Car Electrification:

•Higher Voltages•Higher Power Revolutions

• Partitioning by application area and the combining of functions

TM

Automotive Networking and EMC Considerations

10


Standard Physical Layers: the Landscape

J2602 / LIN CAN Low Speed / High Speed

20kBd

Single Wire Bus

Master Slave

125kBaud

DifferentialFault Tolerant

1MBaud

Differentialw Diagnostic

CSMA –Carrier Sense Multiple Access

2.5 / 5.0 / 10MBaud

Differential

TDMA – Time Division Multiple Access

Low Side Half Bridge Full Bridge

Flex Ray

10kBd

Body, PowerTrain All Market Segments Safety, Gateways

High growth Ramp upDecrease Growth

Network Arbitration

Physical Layer

Bandwidth

Hardware

Topology

Market target

Market trend

MotivationsProduction start

Low Cost / Plug & Play

Decision close to loadStarted in 2000

Bandwidth / DeterminismInter-car areasStarted in 2006

Fault TolerantLow BandwidthStarted in 90s

BandwidthIntersystemStarted 80’s

Freescale Analog Portfolio (MC33)

689, 91x, 62x, IDCs 389, 889 742, 989, 90x Flex Ray P/L IP (hold)

700Mu 100M#<100Mu 900MuTAM, in 2014*

200kBd/189kBd

Diff / SinglePower & Signal

Sync. / Bidirect.

Half Bridge

DSI / PSI5

Safety

Ramp up

SafetyReduce wires

Started in 2000

P/L avail.

100Mu

*Source : strategy analytics


Source of Electromagnetic Disturbances

12

IC

RF signals from communication devices

EM waves from electrical devices

ESD from humans or machines

Lightning

Electronic devices inside the car

Inductive loads or motors


Impact of Technology Trends on Electromagnetic Conduction (EMC)

13

Clock frequency10

100

1000

10000

1990 1995 2000 2005 2010

[MHz]

Years

Clock frequency10

100

1000

10000

1990 1995 2000 2005 2010

[MHz]

Clock frequency10

100

1000

10000

1990 1995 2000 2005 2010

[MHz]

Years

Supply Voltage

1

2

3

4

5

Years1990 1995 2000 2005 2010

[V]Supply Voltage

1

2

3

4

5

Years1990 1995 2000 2005 2010

[V]

Years

Channel length

0.4

0.8

1.2

1.6

1990 1995 2000 2005 2010

[µm]

Years

Channel length

0.4

0.8

1.2

1.6

1990 1995 2000 2005 2010

[µm]

Channel length

0.4

0.8

1.2

1.6

1990 1995 2000 2005 2010

[µm]

Higher Integration

Higher Switching and Noise

Higher Frequencies

Higher Frequency Spectrum

Lower Voltage

Lower Noise Margin

Higher Sensitivity

More emission

Less immunity against EMC/ESD

More emission


Vehicle

Electronic Control Unit (ECU)

Printed Circuit Board (PCB)

IC

Stress Propagation


Understanding Standards: the Specification Landscape

15

Target: No External

Protection

²

ISO 10605

ESD

IEC 61000-4-2

ESD

ESD JEDEC

HBM, CDM, MM

IEC 61967

EMC - Emission

ISO7637-2

Electrical disturbance

IEC 62132

EMC - Immunity

ISO 11451 EMC

Emission

Conducted radiated

ISO 11452

EMC - ImmunityISO 10605

ESD

CISPR25

CISPR12

AECQ100

CISPR25

CISPR12

95-54-EC

95-56-EC

SAE J551

SAE J1113

Car OEM specific

requirements

Specific

requirements

2004-104-EC


Design for High ESD and EMC Robustness Example of ESD Stress: System Level vs. IC Level

16

0

5

10

15

20

25

30

35

40

-50E-9 50E-9 150E-9 250E-9

Time (s)

Curr

ent

(A)

IEC61000-4-2150pF/330ohm +8kV

ISO10605330pF/330ohm +8kV

System level

IC level

AECQ100

+2kV (HBM)

+500V (CDM)

+200V (MM)


Physical Layer (P/L) Performance vs. Acceptance Tests

Conformance Conformance

Test (C&S)Test (C&S)

EME (IBEE)EME (IBEE)

EMI (IBEE)EMI (IBEE)

ESD HBM (IBEE)ESD HBM (IBEE)

ESD IEC (IBEE)ESD IEC (IBEE)

150pF, 330 Ohm150pF, 330 Ohm

LIN P/LLIN P/L

LIN 2.0 / 2.1LIN 2.0 / 2.1

J2602J2602

40dB40dBµµV @ 200kHzV @ 200kHz

15dB15dBµµV @ 10MHzV @ 10MHz

Direct Power InjectionDirect Power Injection

& Bulk Current Injection& Bulk Current Injection

>+/>+/--8kV8kV

+/+/--11kV w/o Cap11kV w/o Cap

+/+/--20kV w Cap20kV w Cap

Passes StandardPasses Standard Fails StandardFails Standard

** with choke** with choke

CAN HS P/LCAN HS P/L

GIFT certifiedGIFT certified

ISO11898ISO11898--2 and 2 and --55

55dB55dBµµV @ 250kHz**V @ 250kHz**

25dB25dBµµV @ 10MHz **V @ 10MHz **

Direct Power InjectionDirect Power Injection

& Bulk Current Injection& Bulk Current Injection

>+/>+/--8kV8kV

>+/>+/--8kV8kV

TM

Power Management and System Values for MCU Segmentation

18


Different Standard Solutions for Different System Needs

Low Power Strategies

• Low consumption

• Wake up (W/U) detection & time management

• Periodic scan & consumption events

Functional Safety Level• Watch Dog integration

• Fail safe state machine

• FMEA (Failure Modes

& Effects analysis)

and safety

19

ECU_A ECU_B ECU_D

RF

ECU_C

LIN_a

CAN_2

LIN-b

Vdd

CAN P/L

Vreg

BUS

INH

Simple low power mode

Mainly used with Vbat disconnect

ECU: A

MCU

Vbat

LIN / CAN

Vreg

Vbat

SBC

Vdd 8/16bitMCU

BUS

ECU: B

Medium complexity

CAN & local wake-up

16/32bitMCU

Vdd

Vbat

RST

INT

SAFE

CAN P/L

SW

LDO

OSC

BUS

SBC

MSDI

LIN RF

ECU: C,D

CAN

High complexity in W/U mechanisms

CAN, LIN wake-up

MC33902 MC3391x, 903 MC33904,5


Power Management Alignment with MCU Solution

MCU Type 8 bit MCUs 16bit MCUs 32bit MCU 32bit MCUs

TAM 2014 (Mu) 950Mu 500Mu 580Mu

Market Segment Freescale MCU Core SO8 S12, S12X Power Arch (z0,1) Power Arch (z3,4,5,7)

PowerTrain

Engine Control S08SG/MP MPC563xM Parts TBA

Transmission MPC563xM Parts TBA

Hybrid S12DG MPC563xM Parts TBA

Body

BCM/Gateway S08SG S12XE MPC560xB (BCM) MPC560xB Gateway

Windows/Doors/Seat S08EL / S08SG S12P, S12XS, S12G MPC560xB

Lighting S08DZ S12XS, S12XE MPC560xB

HVAC S08LG S12XH, S12G MPC560xB

Security S08EL / S08SG S12XS

Safety & Chassis

Braking / VSC S08SG/SL/EL

Suspension S08SG/SL/EL MPC560xP MPC564xL & TBA

Steering S08SG/SL/EL MPC560xP MPC564xL & TBA

ICM MPC560xP MPC564xL & TBA

ADAS MPC560xP MPC564xL & TBA

Airbag S08SG/SL/EL

TPMS

Driver InfotainmentDashboard SPECTRUM

Infotain/Telematics

SBC Market

Seat Belt Pret.

TPMS receiver

ME Dashboards

Fuel pump, Glow Plug, LE EMS

HE Door/SeatLE/ME BCM ME/HE BCM

Junction BoxW/L, Roof

HVAC

LE EMS –Low End Engine ManagementSystemsW/L – Windows/Window LiftLE/ME BCM - Low and Middle End Body Controller ModuleHE – High End Door & Seat ModulesHVAC – Heating, Ventilation, and Air Conditioning Seat Belt Pret.- Seat Belt PretensionerTPMS – Tire Pressure Monitoring System

TM

System Basis Chip Solutions and Values with CAN/LIN

21


LIN Solutions

Wake UpFrom Vsupply

LIN 2.0 / J2602

Hall SensorSupply

SPI & Watch Dog

Low Power Modes

LQFP32

Scalable System Integration

• For space savings, for applications

distributed close to the load, with a

scalable pinto-pin compatible family

solution

High EMC and ESD performance

• Ultra low noise emission through

innovative wave shape management

• Sustain harsh system ESD pulses up to

+/-11kV (gun stress – 150pF/ 330Ohms)

without the need for external protection

• Sustain latest DPI requirements

Low Power Modes

• Minimize battery discharge

Easy to use:

• LIN vehicle OEM acceptance reports

MCU Power ManagementFor 8bit / Low end 16bit MCUs

5V LDO +/-2% 60mA(Vdd)

DC Motor Pre-Driver

DC Motor Current Monitoring

33910

33911

33912


Ballast regulator (Vaux)

Flexible (I/O)Wake/INH

CAN High Speed

Internal CAN Regulator (Vcan)

LIN (1 and 2 options)

SPIAvd W/D

Secured State Machine

Low Power Modes

SOIC Wide Body Package with Exposed Pad

Power Management Scalability

MCU Power Supply (Vdd): 5V or 3.3V / 150mA (Power Split option for scalable needs; up to 300mA)

5V or 3.3V Vreg for Auxiliary loads

Dedicated 5V Vreg for CAN High Speed

Functional Safety

Innovative Cranking Pulse Management during Vdd low.

Fail Safe & configurable State Machine

Extensive protection and diagnostics

Energy Savings

Ultra Low Power Modes (typical:15µA @Vdd = Off)

Innovative Wake Up Management and cyclic sensing

Robust Physical Layers

Certification to LIN2.1 and ISO11898-2-5 standards

Successfully passing stringent EMC, ISO, ESD standards

Easy to use :

Debug Mode saves time during Application development

Ecosystem: can lower development time and simplify access

Flexibility & compatibility:

Selectable parameters (Reset (RST) time, Watch Dog)

1 or 2 LIN options (905S and 905D)

Power sharing (Vdd ballast)

MCU Regulator (Vdd)

33904

33905

33903

CAN & LIN Solutions


Energy Efficiency : Four Functions Contribute to Reduce System Current Consumption

24

RUN modeAll ECU functions

running

STOP mode

T-stop

STOPmode

T-stopT-awake

Timer wake up

C – Reduce awake time

•Optimise SPI structure& commands

•Optimize stop mode over current detection

C

D – Increase stop mode

•Increase timer duration

•A few RAM cells are included in SBC

D

B - Reduce “low power mode”consumption

B

Awakestate

A - Reduce “run mode”current consumption

A

Wake up

RUN modeAll ECU functions

running

Current consumption

All Four Act to Reduce System Current Consumption


Automotive Commitment to Reduce Low Power Modes (LPM)

25

Stop mode currentLPM ACTIVE VDD

Sleep mode currentLPM ACTIVE VDD

0

10

20

30

40

50

60

70

80

90

MC33742 UJA1065 TLE7263 MC3390x

Innovative Design Architectures LowerCurrent Consumption in Stop and Sleep Modes

SYSTEM INNOVATIONS FOR LPM

•Reduce system awake time

•Improve SPI data management (saves

time)

•Use SBC memory to save data when the

MCU is in sleep mode

•Inhibit wake-up in specific conditions

µA

compet1 compet2 MC3390xMC33742


Manage Battery Cranking Situations

Vdd

Vsup

Dro

p

~200m

V> 3.8V (typ)

<=5V

5V

11.3V13V

4.8V

RSTb

RSTb

INTb

Vbat

4.5V

~5V

12V13.5V

4.6V

3.2V

Regulator Vdrop

Maskable INT on Vbat < 9VVsup <7V and Vdd low.

3 Vdd under voltage thresholds:

4.6V => Reset or INT (SPI selectable)

3.2V = > Reset

Vbat

8.6V

6V

VSUP1 VDD

Vbat

D

Control

Csup Cvdd

SBC

ECU

MCU

RST

INTVsense

INT

INT

6V

INT

Vse

nse_

low

Vdd

_low

Vsu

p_hi

gh

Example of INT capabilities & a possible strategy

New

Reset at Vdd < 4.6V

Vsu

p_lo

w

Dio

de d

rop

INT Dro

p

>200m

V

Vbat Capacitor Reduction:

•Cost Savings•Space Savings


Functional Safety - MCU/SBC Integrity

SBC secured MCU

Benefits•Contribute to application safety improvements•Definition of the IC to address functional safety situations•HW innovations and documentation to ease safety assessment process

SBC Diagnostic• CAN /LIN

• I/O

• VREGs

• Wake up event monitoring

• RST/INT source identification

• Critical pin monitoring (RST/SPI)

• Fail safe output

SAFE & ROBUST STATE MACHINE CRITICAL CHANGE

• Random and unpredictable protocol to change critical SBC behavior

SPI Data Integrity • Read back SPI data

• Optional parity check

• SPI clock check

• EMC disturbance-proof

ECU Bill of Material Traceability• P/N & product revision is register-encoded to

guarantee traceability


Functional Safety - MCU/SBC Integrity FMEDA of the SBC Safety Related Subsystem

Three abstraction levels:

• SBC IC level

• ECU level

• Vehicle level

Analyze each failure in the FMEDA (Failure Modes, Effects, & Diagnostic Analysis) and try to assign FIT (Failure In Time ) data for each failure

28

5V Auxiliary regulator

VDD regulator

Fail safePower management

State machine

OscillatorSPI

Analog monitoring

Signal conditioning & Analog mux

Configurable

input-output

5V-CAN

regulator

Enhanced

High-speed CAN

physical interface

LIN 2.0 interface #1

LIN 2.0 interface - #2

SBC 33905

MCU

5V

RST

INT

ATD

TXD (CAN)

TXD (CAN)

TXD (SCI) LIN #2

RXD (SCI) LIN #2

RXD (SCI) LIN #1

TXD (SCI) LIN #1

RST

INT

5V

MOSI

MISO

SCLK

CS

MOSI

MISO

SCLK

CS

MUXOUT

5V CAN

TXD

RXD

CANH

Split

CANL

TXD_L1

RXD_L1

VS2-Int

VS2-Int

LIN_Term1

LIN_1

LIN_Term2

LIN_2

IO_1

Vsense

GND

Dbg

SAFE

VSup2

IO_0

VBAUX VCAUX VAUX VSUP1 VE VB

Failsafe

circuitry

ESD

ESD

VBatt

ESD

ESD

ECU level

Vehicle level

LIN1

LIN2

CANL CANH

GND

Switch input

Ext. 5V supply

2

1

4

10

3

9

11

12

1413

15 17

16

7

8

3 15 4

5

7

6

19

17

2021

22

23

24

25

11

10

13

12

8

16

1

7

1

2

1

3

4

5 6

9

2

56

5b

18

14 14

26


Monitoring of Critical Environment Conditions

29

D1

VBAT

VSUP S_in

IO-1

IO-0

Multiplexer

VDD-I_COPY

RM(*)

(*)Optional

A/D in

MCU

S_iddc

MUX-OUT

S_g3.3

Temp

VSENSE

S_g5

RSENSE 1k

RMI

S_ir

S_in

S_in

S_in

Vref: 2.5V

5V-CAN5V-CAN

VSUP Monitoring

• Monitor battery voltage after rev. battery

• Protection diode

VSENSE

• Detect sudden voltage

drops on VBAT

• Compare against VSUP

voltage

I/Os

• Monitor direct input voltage

•Identify short circuits

Temp

• Identify temperature variations on the IC (to highlight a possible failure). Temp coeff 9.6mV/°C

Vref

• Have a fixed reference voltage level, to compare against other voltages (i.e. Vdd supply, VCan, Vaux)

Vdd-I_copy

• Identify variations on the MCU load current to identify potential failures (short circuits, internal failures on the MCU)

New

Benefits• Integrate key voltage monitoring to save discrete components

• Solution: manage cranking pulse with low cost design (no SMPS)• Cost savings on buffer capacitors• Space savings on buffer capacitors

TM

Easy-to-Use Tools to Encourage Design-ins

30


SBC Evaluation Board – KITMC33905SEVME

Quickly evaluate the performance of SBC Gen2 with CAN & LIN

Comprehensive technical documentation

Easy-to-use tools such as thermal predictions and hands-on training

31


USB to SPI and SBC Gen2 Setup Interface

USB link

Graphical interface USB to SPI board (s)

Set up HW & SW:• SBCGen2 User Software (.exe)• KIT: USB to SPI

• Part number: KITUSBSPIDGLEVME

• Evaluation board (EVB) for the MC3390x•Part number: KIT33905D5EKEVBE


MC33904 and MC33905S/D Development Tools and Support

Fast Evaluate the Performance of SBC Gen2 with CAN & LIN

• Easy-to-Use EVB - Evaluation Platform kit including MC33905D EVB Evaluation Board (Standard EVB):

• USB to SPI Board KITUSBSPIDGLEVME

• User-Friendly graphical interface

• Standard EVB – basic evaluation board

Technical Documentation:

• Datasheets

• Technical reports (EMC & ESD) and OEM’s release status

• Application notes

• Official reports from external laboratories: IBEE-Zwickau,

• ISO11989-2-5 CT C&S, LIN2.1CT C&S, J2602 C&S

• EVB contents

Easy-to-Use solutions: Support Design Development

• Thermal prediction tool & Iq calculator (tools)

• Technical Training and hands-on training on demand

33

TM

Summary

34


S12XS faimily60-128k

Perf

orm

an

ce

S08 family16-60k

551x, 561x families256k – 2.0M

S12X family128k – 1M

Summary – Range of MCU Companion (Attach) Solutions

8-bit 16-bit 32-bit (low end)

MC3391x

MC33902/903

Current between 20 to

60mA

Cost driven solutions

Simple system

requirements

Currents between 60 - 120mA

Safety System requirements

Low power modes

Pinout & Power Management Scalability

MC33904 w/o Power Sharing

MC33905 w/o Power Sharing

MC33742

Currents between 100 up to 200mA, external ballast required

Improved Safety requirements

Advanced Low Power Modes

Companion chip of Power Architecture MCU solutions for Body and some Safety & Power Train

MC33904 with Power Sharing

MC33905 with Power Sharing


Freescale SBCs for Automotive

Freescale’s next generation of SBCs addresses the needs of OEMs for in-vehicle networks in cars that have increasing electrical content

Freescale SBCs integrate an energy management module to power the system MCU. The transceiver interfaces to connect with in-vehicle networks and connection to low-power modes conserves battery life

The new SBCs integrate fully certified CAN and LIN according to the latest electrical/ESD/EMC market requirements

Freescale is the No. 1 supplier of automotive semiconductors and has been at the forefront of the automotive industry for more than 30 years

36

31 2

Functional SafetyEnergy Efficient High EMC Robustness


Market Problems

Problem Description Implications

Pollution and cost of car ownership

CO2 emissions too high

Fuel price generates need for higher energy efficiency

Reduce weight of ECUs

•improve fuel efficiency

•save money (plastic vs metal)

•but reduce Power dissipation (1W=1€)

Reduce power losses on ECU (20% reduction)

Use appropriate Power: harmonize Low Power Mode

Network sensitivity to harsh EMC and ESD

constraints

Higher number of connected applications per car in harsh car environment

Evolution to system behavior vsIC breakdown in the past

Standardization of specification for Physical Layers.

Increased EMC and ESD robustness criteria to improve system quality

New trend of ESD Class A robustness (no reset allowed)

Large car recalls highlight the need for

fail safe

Failure is not an option, when a failing application needs to predict the failure state

Safety related product definition is expected

Safety documentation application guide

Long waits for car maintenance at garage

Several decades of hours to

reprogram a full car at garage

Network complexity

Centralization of electronics controls per car area

(Chassis, Power Train, Body, Info)

Complementary strategy with LIN distributed nodes

Diagnostic protocol under investigations to save time (objective less than 1 hour to reprogram full car)

Influence of emerging markets

Complex solutions and time constraints can be a barrier to the sales process

Need simple and cost driven solutions


3390333902 33904

Vreg MCU (3.3V/5.0V)

Vreg MCU w/Power Sharing

Vreg CAN

Vaux ballast (3.3V/5.0V)

eCAN HS (ISO11898-5)

eLIN

I/O (config. Input/Output)

SPI (16-bit)

Analog MUX

Low Power (Voff/Von µA)

Fail safe

Package

3

MCU companionAutonomous

CAN HS node 8 / 16 bit MCUs S12XE / BOLERO

PICTUS, MONACO

100mA 150mA 150mA

41

Adv W/DStandard

15/25 (+10 osc.)15/2515

Pseudo SPI

Features

1 Input

Adv.Adv.Std.Std.

33905S

SOIC32ePSOIC32ePSO14

Adv W/D

2

150mA

Adv.

33905D

Adv W/D

21

SOIC54eP

+ 300mA + 300mA + 300mA

SOIC32eP

S12XE / BOLEROPICTUS, MONACO

S12XE / BOLEROPICTUS, MONACO

new

MC MC MCMC

Freescale SBC CAN LIN Gen2 Portfolio Segmentation


Wide Range of SBC Applications

High-Performance Automotive Applications

• Body control modules

• Lighting modules

• Door/seat modules

• Seatbelt pretensioners

• Central TPMS

• Fuel/water pumps

• Glow plugs

• Low-end engine management systems


0

200

400

600

800

1000

1200

1400

1600

1800

2000

M U

nits

Proprietary 17 15 12 9 5 3 1 1 1 1

Multimedia 6 9 12 17 19 28 39 49 70 84

Flexray 0 0 0 1 2 5 13 23 37 51

Safety Bus 8 13 18 24 27 37 50 64 80 103

LIN/J2602 34 76 135 180 197 271 371 463 555 647

J1850 102 84 64 40 12 1 0 0 0 0

CAN 406 467 531 560 503 607 741 831 917 1003

Total Nodes 573 664 773 831 764 952 1215 1431 1660 1889

2005 2006 2007 2008 2009 2010 2011 2012 2013 2014

Source: Strategy Analytics

13% CAAGR

Includes NAFTA, Europe, Japan, S.Korea, China, India

BODY CAN HS,

353.7, 33%

INFOTAINMENT -

CAN HS, 126.0,

12%

BODY CAN SW,

23.6, 2%

CHASSIS - CAN

HS, 121.8, 11%

BODY CAN LS,

94.3, 9%

SAFETY - CAN HS,

163.4, 15%

PWT - CAN HS,

192.1, 18%

BODY CAN SW,

61.7, 9%

BODY CAN HS,

61.7, 9%

INFOTAINMENT -

CAN HS, 80.6, 12%

PWT - CAN HS,

119.5, 18%

SAFETY - CAN HS,

93.0, 14%BODY CAN LS,

185.2, 27%

CHASSIS - CAN

HS, 75.7, 11%

CAN Market OverviewTotal Available Market (TAM)

of 1000 Mu CAN Nodes in 2014

CAN Network Topology: CARRIER SENSE MULTIPLE ACCESS (CSMA)

TARGET MARKET : All Automotive Segments• Body : Gateway, BCM, Door, Lighting, Column, …• Infotainment : Dashboard, • Safety & Chassis : Break, Suspension, Steering, Airbag, …• Power Train : EMS, Transmission

CAN market & segmentation (Market,Mu,%)

2009

2014

Legend : Market, Volume (Million units), Market share

Automotive Physical Layer Market

Source : strategy analytics


0

200

400

600

800

1000

1200

1400

1600

1800

2000

M U

nits

Proprietary 17 15 12 9 5 3 1 1 1 1

Multimedia 6 9 12 17 19 28 39 49 70 84

Flexray 0 0 0 1 2 5 13 23 37 51

Safety Bus 8 13 18 24 27 37 50 64 80 103

LIN/J2602 34 76 135 180 197 271 371 463 555 647

J1850 102 84 64 40 12 1 0 0 0 0

CAN 406 467 531 560 503 607 741 831 917 1003

Total Nodes 573 664 773 831 764 952 1215 1431 1660 1889

2005 2006 2007 2008 2009 2010 2011 2012 2013 2014

Source: Strategy Analytics

13% CAAGR

Includes NAFTA, Europe, Japan, S.Korea, China, India

BODY, 618.2, 90%

CHASSIS, 0.0, 0%INFOTAINMENT,

27.6, 4%

SAFETY, 16.9, 2%

PWT, 30.8, 4%

Physical Layer MarketTAM of 700Mu LIN Nodes in 2014

LIN NETWORK TOPOLOGY : MASTER – SLAVE

TARGET MARKET : LIN Slave Nodes Window Lift, Roof, HVAC, Camera Control, Siren, Compass, Rear Wiper, Rear Climate control, Auxiliary Alarm, Remote, Interior Mirror, Column position sensor, Universal Door opener, Vbat monitor, Accessory switch monitor, Seat memory, Rain sensor …

BODY, 240.2, 90%

CHASSIS, 0.0, 0%

INFOTAINMENT,

9.3, 4% SAFETY, 5.0, 2%

PWT, 10.9, 4%

LIN Market & Segmentation (Market, Mu, %)

2009

2014

Legend : Market, Volume (Mu), market share

Automotive Phys. Layer Market

Source : strategy analytics


LINSBC2.5G Market Positioning

Benefits Differentiation on low power management

Saves EMC /ESD circuits

Do more than SBC- Relay control- PWM motor- LED dimming

Saves hall sensor supply Saves external calibration

Differentiation on fail-safe mode and save external circuits

Key features- 50mA 5V low dropout voltage regulator with Low-

Voltage-Reset (LVR) - Windowing watch-dog with prescaler- Sleep and Stop low-power modes- Cyclic wakeup and sense (20ms-1120ms)

- LIN 2.1 physical layer interface 11kV ESD, 36dBm DPI immunity, adaptive to bus impedance

-2x low-side relay drivers including:-PWM capability up to 10kHz-Load disconnection detection/Current limitation/Thermal shutdown

-2x 50mA high-side switch:-PWM capability up to 10kHz-Load disconnection detection/Current limitation/Thermal shutdown

- 4x wake-up/high voltage analog/digital inputs- Switchable 5V HALL sensor supply- Precision differential-amplifier with selectable gain for current sensing- Battery voltage, wake-up pins, voltage monitor, and die temp monitor

Target applications

• Anti-pinch window lifter

• Sunroof

• LIN switches / keypad

• Multifunction steering wheel

• LIN wiper

• LIN diagnostics


ESD Contact

From P. Besse


Product / Application / MCU Companion

Products to Address Power, System, and Network Management with LIN

44

Products Analog P/N Order part number Package Applications MCU companion chip

SBC LIN Gen2.5 with Motor Control and I sense

MC33912G5 MC33912G5AC

MC34912G5AC

LQFP32

Window Lift, Roof, Water pump, … with current recopy

8Bit

Low end 16Bit

SBC LIN Gen2.5 w Motor Control

MC33911G5 MC33911G5AC

MC34911G5AC

LQFP32

Window Lift, Roof, Water pump, …

8Bit

Low End 16Bit

SBC LIN Gen2.5 with HSD

MC33910G5 MC33910G5AC

MC34910G5AC

LQFP32

General Purpose LIN Slave nodes

8Bit

Low end 16Bit

MC33xxx : is used for -40°C / +125°C temperature rangeMC34xxx : is used for -40°C / +85°C temperature range


Product Numbering

45

MCZ 33 905 S 5 EK / R2

QUALIFICATION STATUS:PC PRE-QUALIFICATION,

ENGINEERING SAMPLES

MC FULLY QUALIFIED

xxZ ENVIRONMENTAL PKG

(SOIC only)

TEMPERATURE RANGE:

33 Ta = -40°C to 125°C

34 Ta = -40°C to 85°C

VARIATION:

5 5.0V VDD output Regulation Voltage

3 3.3V VDD output Regulation Voltage

TAPE AND REEL DESIGNATOR:

R2 TAPE AND REEL

PACKAGING DESIGNATOR:

EK SOICeP LEAD FREE

DEVICE DESIGNATOR904 = CAN only905 = CAN and LIN

VARIATION:

A No LIN (used on 904 only)

S Single LIN

D Dual LIN


Product / Application / MCU Companion

Five products to address Power, System, and Network Management

46

Products Analog P/N Order part number Package Applications MCU companion chip

SBC Gen2 CAN HS & 2 LIN

MC33905D - 2 LIN

3.3V Vdd option

5.0V Vdd option

PCZ33905D3EK

MCZ33905D5EK

SOIC54EP

BCM, SJB , Door, Gateways …

MPC5516

S12XE

V850

SBC Gen2 CAN HS & 1 LIN

MC33905S - 1 LIN

3.3V Vdd option

5.0V Vdd option

PCZ33905S3EK

PCZ33905S5EK

SOIC32EP

BCM, Door, Gateways …

MPC5516

S12XE

V850

SBC Gen2CAN HS

MC33904

3.3V Vdd option

5.0V Vdd option

PCZ33904A3EK

PCZ33904A5EK

SOIC32EP

BCM, Doors,EPB, Seat Belt, Fuel Pump ...

MPC5516

S12XE or S12

SBC Gen2 LightCAN HS

MC33903

PCZ33903A3EG

PCZ33903A5EG

SO20

RadioHVAC…

S08,S12 (low end)

Microchip

AutonomousCAN HS

MC33902 PCZ33902EG SO14 Power TrainGateways …

Low end SO8 in very specific cases


IBEE – Zwickau – MC333905Final Test Report

47

IBEE Zwickau front pages test report


Test Report Adder for LIN2 (MC33905D)

48


CAN High Speed Conformance Test

CAN conformance front page test report


J2602 front page test report

LIN-J2602 and LIN 2.1 Conformance Test Reports


54 SOIC eP

FeaturesLDO Linear Power Supply 5.0V or 3.3V, up to

300mA through external transistor.

LDO Auxiliary Regulator with Ballast (5.0 / 3.3V configurable)

Under Voltage management for cranking

Internal 5V regulator for CAN driver supply

Low current consumption in sleep mode

Fail safe state machine linked with SAFE pin

Secured SPI with Watch dog capability

High precision Vsup sense monitoring

Multiple Analog sensing to 1 MUX output

CAN, ISO11898-2 and 11898-5 compliant

Dual configurable I/O with W/U feature

2 LIN transceiver 2.0, 2.1 compliant

Compatible with SAE J2602

Key CharacteristicsMCU Linear Vreg (LDO)

Current (w / wo ballast)

Bus Output

Data Rate

Stop/Sleep current

ESD (CAN/LIN) **

Operating voltage

Operating temp.

5.0 / 3.3V Conf.

150mA / 300mA

CAN

60kB/s – 1MB/s

15/25µA

±8000V

5.2V-27V

-40°C<Ta<125°C

Pinout compatible with MC33905S and MC33904

MC Qualified

MCU Companion chip :S12X, MPC5516

MPC560x

MC33905D – SBC CAN High Speed & 2 LIN Gen2


MC Qualified

32 SOIC eP




Under voltage management for cranking




Secured SPI with Watchdog capability




Dual configurable I/O with W/U feature

1 LIN transceiver 2.0, 2.1 compliant

Compatible with SAE J2602


MPC560x



Bus Output

Data Rate

Stop/Sleep current

ESD (CAN/LIN) **

Operating voltage

Operating temp.

5.0 / 3.3V Conf.

150mA / 300mA

CAN

60kB/s – 1MB/s

15/25µA

±8000V

5.2V-27V

-40°C<Ta<125°C

Pinout compatible with MC33905D and MC33904

MC33905S – SBC CAN High Speed & 1 LIN Gen2





Under voltage management for cranking




Secured SPI with Watchdog capability




CAN wake up & failure detection / mngnt

Quad configurable I/O with W/U feature



Bus Output

Data Rate

Stop/Sleep current

ESD (CAN) **

Operating voltage

Operating temp.

5.0 / 3.3V Conf.

150mA / 300mA

CAN

60kB/s – 1MB/s

15/25µA

±8000V

5.2V-27V

-40°C<Ta<125°C

Pinout compatible with MC33905S and MC33905D

32 SOIC eP

MC Qualified


MPC560x

MC33904 – SBC CAN High Speed Gen2


IC Level IEC Standards (150kHz to 1GHz)

54

Immunity Emission

RadiatedConducted

IEC 62132 IEC 61967

TEM Cell and wideband TEM cell

Bulk Current Injection

Direct RF Power Injection

Work Bench Faraday Cage

Radiated

Conducted

TEM Cell and wideband TEM cell

Surface Scan

1Ω/150Ω direct coupling

Work Bench Faraday Cage

Magnetic probe


Emission Measurement

55

IEC 61967-4: 1Ω/150Ω Method E

mis

sio

n [

dB

µV

]

-1001020304050607080

1 10 100 1000

f (MHz)

0.1

Specification for emission

Em

issi

on

[d

Bµ

V]

-1001020304050607080

1 10 100 1000

f (MHz)

0.1

Specification for emission


Immunity Measurement [1]

IEC62132-4 Bulk Current Injection (BCI)

• Injection in one or more wires

• Immunity to conducted current induced by

radiated disturbances

56

PASS

FAIL

Current monitoring

Power injection

Injection probe

Measurement

probe

GND

VSS

DUT

Idisturbance

DUT

monitor

Z DC


BCI Test Bench

57

ISO11452-4

Bulk Current Injection for

system immunity test 1MHz to

400MHz

IEC 62132-3

Common test method for

characterizing communication bus

(CAN, LIN, Flexray) and power supply

Injection

clamp

System Level

Current probe

DUTPower

Supply

Wire

IC Level up to 400mA


Immunity Measurement [2]

IEC62132-4 Direct Power Injection (DPI)

• Conducting RF resulting from radiated

• High degree of repeatability

• Up to 36dBm 4 Watts +40V / -40V !

58

PASS

FAIL

Amplifier

DC bloc

DC

RF

Generator

DUT

monitor

150kHz – 1GHz


Immunity Measurement (DPI)

59

Imm

un

ity

leve

l [d

Bm

]Current injection limit

15

25

30

35

40

1 10 100 1000f (MHz)

20

PASS

Specification

FAIL

10

Imm

un

ity

leve

l [d

Bm

]Current injection limit

15

25

30

35

40

1 10 100 1000f (MHz)

20

PASS

Specification

FAIL

10


ESD Standards and Test Procedure

ESD System Level Standards

• ISO 10605 (Jul. 2008)

“Road vehicles – test methods for electrical disturbances from electrostatic

discharge”

• IEC 61000-4-2 (Dec. 2008)

“Part 4: Testing and measurements techniques, Section 2: Electrostatic

discharge immunity test – Basic EMC publication”

ESD/EMC Test Methods At The IC Level (not standard)

• Specific OEMs Requirements

“Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive

Application”, Audi, BMW, Daimler, Porsche, Volkswagen

“LIN Conformance Test Specification Package for LIN2.1”

• ESDA Human Metal Model (HMM)

“Workgroup 5.6 of the ESD Association has developed a test method for

applying IEC61000-4-2 at the IC level”

60 /HMM09/


ISO10605 vs IEC61000-4-2

61

ESD STANDARDS ISO 10605:2008 IEC 61000-4-2:2008

ParametersContact

(Conductive Surface)

Air

(Non-Conductive Surface)

Contact Air

Output Voltage 2-15kV 2-25kV 2-8kV 2-15kV

Delay between zaps Minimum 1s Minimum 1s

Polarity at each stress voltage level

Positive and Negative Positive and Negative

Network Capacitance150pF (outside vehicle)330pF (inside vehicle)

150pF

Network Resistance 330Ω/2000Ω 330Ω

Number of Zaps ≥ 3 ≥ 10

ESD Generator ground reference

Battery ground Earth

Test conditionsUnpowered/Powered

with batteryUnpowered / Powered

amf-aut-t0732 sbcs power management solutions for 16- and

Documents