amd roadmap

EMBEDDED ROADMAP UNVEIL ARUN IYENGAR, CORPORATE VP & GM, EMBEDDED, AMD

SEPTEMBER 09, 2013

2 | AMD EMBEDDED SOLUTIONS | SEPTEMBER 09, 2013 | CONFIDENTIAL

CAUTIONARY STATEMENT THIS DECK CONTAINS FORWARD-LOOKING STATEMENTS CONCERNING AMD, ITS EMBEDDED PRODUCT ROADMAP AND STRATEGY AND THE TIMING, FEATURES AND FUNCTIONALITY OF AMD’S FUTURE PRODUCTS, WHICH ARE MADE PURSUANT TO THE SAFE HARBOR PROVISIONS OF THE PRIVATE SECURITIES LITIGATION REFORM ACT OF 1995. FORWARD-LOOKING STATEMENTS ARE COMMONLY IDENTIFIED BY WORDS SUCH AS "BELIEVES, "EXPECTS," "MAY," "WILL," "SHOULD," "SEEKS," "INTENDS," "PRO FORMA," "ESTIMATES," "ANTICIPATES," "PLANS," "PROJECTS," AND OTHER TERMS WITH SIMILAR MEANING. INVESTORS ARE CAUTIONED THAT THE FORWARD-LOOKING STATEMENTS IN THIS RELEASE ARE BASED ON CURRENT BELIEFS, ASSUMPTIONS AND EXPECTATIONS, SPEAK ONLY AS OF THE DATE OF THIS RELEASE AND INVOLVE RISKS AND UNCERTAINTIES THAT COULD CAUSE ACTUAL RESULTS TO DIFFER MATERIALLY FROM CURRENT EXPECTATIONS. RISKS INCLUDE THE POSSIBILITY THAT INTEL CORP.'S PRICING, MARKETING AND REBATING PROGRAMS, PRODUCT BUNDLING, STANDARD SETTING, NEW PRODUCT INTRODUCTIONS OR OTHER ACTIVITIES MAY NEGATIVELY IMPACT THE COMPANY’S PLANS, THAT THE COMPANY WILL REQUIRE ADDITIONAL FUNDING AND MAY BE UNABLE TO RAISE SUFFICIENT CAPITAL ON FAVORABLE TERMS, OR AT ALL; THAT CUSTOMERS STOP BUYING THE COMPANY’S PRODUCTS OR MATERIALLY REDUCE THEIR OPERATIONS OR DEMAND FOR THE COMPANY’S PRODUCTS; THAT THE COMPANY MAY BE UNABLE TO DEVELOP, LAUNCH AND RAMP NEW PRODUCTS AND TECHNOLOGIES IN THE VOLUMES THAT ARE REQUIRED BY THE MARKET AT MATURE YIELDS ON A TIMELY BASIS; THAT THE COMPANY’S THIRD PARTY FOUNDRY SUPPLIERS WILL BE UNABLE TO TRANSITION THE COMPANY’S PRODUCTS TO ADVANCED MANUFACTURING PROCESS TECHNOLOGIES IN A TIMELY AND EFFECTIVE WAY OR TO MANUFACTURE THE COMPANY’S PRODUCTS ON A TIMELY BASIS IN SUFFICIENT QUANTITIES AND USING COMPETITIVE PROCESS TECHNOLOGIES; THAT THE COMPANY WILL BE UNABLE TO OBTAIN SUFFICIENT MANUFACTURING CAPACITY OR COMPONENTS TO MEET DEMAND FOR ITS PRODUCTS OR WILL NOT FULLY UTILIZE ITS PROJECTED MANUFACTURING CAPACITY NEEDS AT GLOBALFOUNDRIES (GF) MICROPROCESSOR MANUFACTURING FACILITIES; THAT THE COMPANY’S REQUIREMENTS FOR WAFERS WILL BE LESS THAN THE FIXED NUMBER OF WAFERS THAT IT AGREED TO PURCHASE FROM GF OR GF ENCOUNTERS PROBLEMS THAT SIGNIFICANTLY REDUCE THE NUMBER OF FUNCTIONAL DIE IT RECEIVES FROM EACH WAFER; THAT THE COMPANY IS UNABLE TO SUCCESSFULLY IMPLEMENT ITS LONG-TERM BUSINESS STRATEGY; THAT THE COMPANY INACCURATELY ESTIMATES THE QUANTITY OR TYPE OF PRODUCTS THAT ITS CUSTOMERS WILL WANT IN THE FUTURE OR WILL ULTIMATELY END UP PURCHASING, RESULTING IN EXCESS OR OBSOLETE INVENTORY; THAT THE COMPANY IS UNABLE TO MANAGE THE RISKS RELATED TO THE USE OF ITS THIRD-PARTY DISTRIBUTORS AND ADD-IN-BOARD (AIB) PARTNERS OR OFFER THE APPROPRIATE INCENTIVES TO FOCUS THEM ON THE SALE OF THE COMPANY’S PRODUCTS; THAT THE COMPANY MAY BE UNABLE TO MAINTAIN THE LEVEL OF INVESTMENT IN RESEARCH AND DEVELOPMENT THAT IS REQUIRED TO REMAIN COMPETITIVE; THAT THERE MAY BE UNEXPECTED VARIATIONS IN MARKET GROWTH AND DEMAND FOR THE COMPANY’S PRODUCTS AND TECHNOLOGIES IN LIGHT OF THE PRODUCT MIX THAT IT MAY HAVE AVAILABLE AT ANY PARTICULAR TIME; THAT GLOBAL BUSINESS AND ECONOMIC CONDITIONS, INCLUDING PC MARKET CONDITIONS, WILL NOT IMPROVE OR WILL WORSEN; THAT DEMAND FOR COMPUTERS WILL BE LOWER THAN CURRENTLY EXPECTED; AND THE EFFECT OF POLITICAL OR ECONOMIC INSTABILITY, DOMESTICALLY OR INTERNATIONALLY, ON THE COMPANY’S SALES OR SUPPLY CHAIN. INVESTORS ARE URGED TO REVIEW IN DETAIL THE RISKS AND UNCERTAINTIES IN THE COMPANY'S SECURITIES AND EXCHANGE COMMISSION FILINGS, INCLUDING BUT NOT LIMITED TO THE QUARTERLY REPORT ON FORM 10-Q FOR THE QUARTER ENDED JUNE 29, 2013.


AGENDA

THE EMBEDDED MARKET

FOCUS AREAS

PRODUCT ROADMAP


RESET & RESTRUCTURE Q3’12 - Q1’13

ACCELERATE & EXECUTE PLAN 2013

TRANSFORM TO WIN 2014 & BEYOND

~$450M OPEX target in Q3 2013

Reduce headcount by ~14%

Manage cash and Inventory

Execute 2013 roadmap

Deliver 2013 financial commitments

Return to profitability at the net income level based on mid-point of Q3’13 revenue guidance

Achieve positive free cash flow in 2H 2013

Build leadership IP:

– Low power

– Server: x86 & ARM

– Graphics

Transition 40-50% of our business to high growth adjacent markets

– Ultra low power client

– Embedded

– Semi-custom

– Professional graphics

– Dense server

AMD EMBEDDED SOLUTIONS THREE STEPS TO TRANSFORMATION


0

1,000

2,000

3,000

4,000

5,000

6,000

7,000

8,000

2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016

Traditional embedded systems* Intelligent systems* Personal computers Servers Cellular phones(M)

Source: IDC Press Release, Intelligent Systems Transforming the Embedded Industry and Driving the Value Among M2M and the Internet of Everything, May 2013

THE INTERNET OF THINGS, SURROUND COMPUTING AND NEXT GENERATION EMBEDDED SYSTEMS WILL BE A STRONG DRIVER FOR THE NEXT LEG OF SUBSTANTIAL GROWTH IN THE COMPUTING INDUSTRY

AMD EMBEDDED SOLUTIONS THE EMBEDDED MARKET


AMD EMBEDDED SOLUTIONS THE EMBEDDED MARKET

VDC Research - Strategic Insights 2012: Embedded Processing Technologies *Excludes mobile phones

4.0%

5.0%

6.0%

7.0%

8.0%

9.0%

10.0%

11.0%

12.0%

13.0%

14.0%

15.0%

0.0% 4.0% 8.0% 12.0% 16.0%

CA

GR

% of Embedded Market

CPU GROWTH IN EMBEDDED APPLICATIONS BY 2016

Communications & Networking Industrial

Tablets

Consumer Electronics

Industrial Control & Automation

Gaming

Retail Automation

Storage

Gateway Equipment

Thin Clients

Military/Aerospace/Defense

Energy/Power

Automotive

Office/Business Automation

Digital Surveillance/Security

Infotainment

Transportation Digital Signage

Medical


AMD EMBEDDED SOLUTIONS FOCUS AREAS

INDUSTRIAL CONTROLS & AUTOMATION

GAMING MACHINES

THIN CLIENT

DIGITAL SIGNAGE

COMMUNICATIONS INFRASTRUCTURE

THEN NOW


x86 44%

ARM 36%

MIPS 7%

Power 6%

Other 7%

2013 TAM $11.3B

x86 45%

ARM 37%

MIPS 6%

Power 6%

Other 6%

2016 TAM $15.5B

AMD EMBEDDED SOLUTIONS FOCUS AREAS

VDC Research - Strategic Insights 2012: Embedded Processing Technologies

X86 & ARM ACCOUNT FOR 82% OF $15.5B TAM BY 2016


AMD EMBEDDED SOLUTIONS PRODUCTS & TECHNOLOGY

A FIRST LOOK

GCN “Adelaar” Discrete GPU

x86 “Steppe Eagle” APU SOC

x86 “Bald Eagle” APU/CPU

ARM “Hierofalcon” CPU SOC



2013 2014

High-performance

Low-power

Discrete graphics

AMD Embedded R-Series APU/CPU

2/4 “Piledriver” cores AMD Radeon™ HD 7000 Series GPU

17W-35W TDP 32nm

AMD Embedded G-Series APU SOC

2/4 “Jaguar” cores AMD Radeon™ HD 8000 Series GPU

6W-25W TDP 28nm

AMD Radeon™ E6460 / E6760 GPU

512MB 1GB GDDR5

“Adelaar” GPU

Graphics Core Next architecture 2GB GDDR5

72GB/s Memory Throughput 40nm 28nm

“Bald Eagle” APU/CPU

2/4 “Steamroller” cores AMD Radeon™ HD 9000 Series GPU

17W-35W TDP

“Steppe Eagle” APU SOC

2/4 enhanced “Jaguar” cores AMD Radeon™ HD 8000 Series GPU

5W-25W TDP 28nm

28nm

“Hierofalcon” CPU SOC

4/8 ARM Cortex-A57 cores 10 Gigabit Ethernet

15W-30W TDP 28nm



A FIRST LOOK: “ADELAAR”

Discrete GCN-based GPU

2GBs integrated memory

Pre-qualified

MCM, MXM or PCIe® Add-on Board

FIRST EMBEDDED DISCRETE GPU BASED ON GCN



A FIRST LOOK: “STEPPE EAGLE”

Low-power x86 APU SOC

Enhanced “Jaguar” CPU core

CPU & GPU frequency boosts

Superior performance/watt

EXCEPTIONAL PERFORMANCE/WATT AT LOWER TDP



A FIRST LOOK: “BALD EAGLE”

High-performance X86 APU & CPU

New “Steamroller” CPU cores

Enhanced GCN based GPU

New power management features

Error-correcting code (ECC) memory

HSA ENHANCEMENTS FOR NEXT-GENERATION EMBEDDED HETEROGENEOUS COMPUTE



A FIRST LOOK: “HIEROFALCON”

High-performance 64-bit ARM CPU SOC

Up to 8 ARM Cortex™-A57 CPUs

10Gb KR Ethernet

PCI-Express Gen 3

Enhanced security with ARM TrustZone™

FIRST ARM SOLUTION FROM AMD FOR EMBEDDED MARKETS

Charlene Marini

VP of Marketing, Embedded Segments, ARM


AMD. ONLY COMPANY TO OFFER 64-BIT X86 & ARM FOR EMBEDDED APPLICATIONS.


INDUSTRY-LEADING IP

UNMATCHED GRAPHICS

ULTIMATE SCALABILITY

COMPLETE ECOSYSTEM


NOVEMBER 11-13, 2013 | SAN JOSE CONVENTION CENTER

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DISCLAIMER & ATTRIBUTION The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors.

The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to product and roadmap changes, component and motherboard version changes, new model and/or product releases, product differences between differing manufacturers, software changes, BIOS flashes, firmware upgrades, or the like. AMD assumes no obligation to update or otherwise correct or revise this information. However, AMD reserves the right to revise this information and to make changes from time to time to the content hereof without obligation of AMD to notify any person of such revisions or changes.

AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION.

AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

ATTRIBUTION

© 2013 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, Radeon and PCIe and combinations thereof are trademarks of Advanced Micro Devices, Inc. in the United States and/or other jurisdictions. Other names are for informational purposes only and may be trademarks of their respective owners.

DISCLAIMER

*Intelligent systems normally include personal computers, servers, and the smartphone segment of cellular phones. Traditional embedded systems normally include the non-smartphone cellular phones.

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