amd radeon vega frontier edition - system plus consulting€¦ · company profile 7 o 2.5d & 3d...

©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

AMD Radeon Vega Frontier Edition

2.5D & 3D Packaging – SPIL CoW last – Samsung HBM2

Adv. Packaging report by Romain FRAUXNovember 2017 – Version 1

mailto:[email protected]


http://www.systemplus.fr/



Table of Contents

Overview / Introduction 3

o Executive Summary

o Reverse Costing Methodology

Company Profile 7

o 2.5D & 3D Packaging Market

o AMD Company Profile

o AMD Radeon Vega Frontier Edition Characteristics

o Vega GPU Supply Chain

o Globalfoundries

o SPIL 2.5D Process Flow

o Samsung HBM2

Physical Analysis 20

o Summary of the Physical Analysis

o Physical Analysis Methodology

o AMD Radeon Frontier Edition Teardown

o Package

Views & Dimensions

Passives Assembly

o DRAM Die

View, Dimensions & Marking

µBumps & TSVs

o Package Cross-Section

Laminate & Frame Cross-Section

Interposer Cross-Section

GPU Cross-Section

8-Hi HBM2 Stack Cross-Section

o Comparison with AMD Fury X including SK-Hynix HBM1

o Comparison with NVIDIA Tesla P100 including Samsung 4-Hi HBM2

Manufacturing Process Flow 72o Global Overviewo GPU Process Description & Foundryo Interposer Process Flow & Foundryo HBM2 Stack Process Flow & Foundryo CoW Process Flow & Foundry

Cost Analysis 97o Summary of the cost analysiso Yields Explanation & Hypotheses

o GPU Front-End & Die Cost

o HBM2 Stack

TSV Manufacturing Cost

Micro-Bumping Manufacturing Cost

Dies Cost (DRAM + Logic)

8-Hi HBM2 Stack Cost

o Interposer

TSV Manufacturing Cost

Microbumping Cost

Interposer Cost

o CoW & Final Assembly Manufacturing Cost

o Final Component Cost

Estimated Price Analysis 118

o Manufacturer Financial Ratios

o Component Manufacturer Price

Company services 121


O V E R V I E WMETHODOLOGY


Overview / Introductiono Executive Summaryo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Executive Summary

• 2 years after the release of the Radeon fury X using the world’s first HBM integrated on chip, AMD presented at CES2017 the Radeon Vega GPU featuring second generation of HBM. The analyzed version of the graphic card is theRadeon Vega Frontier Edition, exhibiting 13/25 TFLOPS and 16GB High Bandwidth Cache assembled in two 8-HiHBM2 stacks.

• Packaged in a smaller, 47x47mm 10-layer fcBGA, the component uses more than 2,800mm² of silicon area,highlighting an impressive silicon / package ratio.

• Compared to NVIDIA which uses only one major source (TSMC) for the manufacturing of the Pascal GPU, AMDchoose to use multiple sources for the production of the Vega GPU. Indeed, the GPU die is made by Globalfoudries,featuring a 14nm FinFET process and 12.5 billion transistors. The interposer, with via-middle TSV, is provided byUMC which was also the provider for the Radeon Fury X. Regarding the 2.5D assembly of the component, twosources has been identified, with SPIL estimated to be the major one. The process used is supposed to be SPIL's Chipon Wafer after TSI backside process (CoW last).

• Regarding the HBM2, only two stacks of 8GB are used to obtain the 16GB capacity. As for NVIDIA, Samsung is theprovider of the HBM2 stacks, whereas SK-Hynix was the supplier for previous Radeon Fury X. The 8GB HBM2consists of eight 1GB HBM2 dies and a buffer die at the bottom of the stack, which are all vertically interconnectedby TSVs and microbumps.

• The report includes a complete physical analysis of the packaging process, with details on all technical choicesregarding process, equipment and materials. Also, the complete manufacturing supply chain is described andmanufacturing costs are calculated.

• The report compares the Radeon Vega solution with NVIDIA Tesla P100, highlighting the choices made by bothcompanies in term of integration. Also, the report features a comparison with AMD’s Fury X, which uses HBM1 and2.5D assembly, to explain the interest in evolution through the HBM2 and CoW 2.5D platforms.


Overview / Introductiono Executive Summaryo Reverse Costing

Methodologyo Glossary


Physical Analysis


Cost Analysis


About System Plus

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price

The reverse costing analysis is conducted in 3 phases:

Reverse Costing Methodology


Overview / Introduction

Company Profile & Supply Chain o 2.5D & 3D Packaging Marketo AMD Profileo AMD Radeon Vega

Characteristicso Vega GPU Supply Chaino Globalfoundrieso SPIL 2.5D Processo Samsung HBM2

Physical Analysis


Cost Analysis


About System Plus

AMD Radeon Vega Frontier Edition Characteristics

AMD Radeon Vega Frontier Edition with Vega 10 GPU

Vega architecture with 16GB of HBM2

AMD Radeon Vega Frontier Edition SpecsSource: AMD




Physical Analysis o Summaryo Graphic Card Teardowno Packageo Dies Sizeo DRAM Dieso Cross-Section – Substrate o Cross-Section – Interposero Cross-Section – GPU o Cross-Section – HBM Stacko Comparison


Cost Analysis


About System Plus

GPU Die

BGA Package Substrate

Logic Die

DRAM Die

DRAM Die

DRAM Die

DRAM Die

DRAM Die

DRAM Die

DRAM Die

DRAM Die

Interposer

PACKAGE STRUCTURE:

• 3D Packaging: 9 stacked dies with TSV & µBumps (HBM stack).

• 2.5D Packaging: HBM stack and GPU stacked with µBumps on a silicon interposer holding TSV.

• Flip-chip BGA: silicon interposer flip-chipped to a 10-layers PCB substrate

Summary of the Physical Analysis

TSV Diam. µm Pitch µm

µBumps Diam. µm Pitch µm

µBumps Diam. µm Pitch µm

Flip-chip Bump Diam. µm Pitch µm

BGA Bump Diam. µm Pitch mm

TSV Diam. m Pitch µm






Cost Analysis


About System Plus

Package Views & Dimensions






Cost Analysis


About System Plus

Package Cross-Section – Laminate Substrate






Cost Analysis


About System Plus

Package Cross-Section – Interposer






Cost Analysis


About System Plus

Package Cross-Section – HBM2 Stack






Cost Analysis


About System Plus

AMD Radeon Vega vs AMD Radeon Fury X – Structure

Laminate substrate

(10 layers PCB)

HBM

4 x 4 stacked memory dies4GB Memory

GPU 28nm(xxxmm²)

Silicon Interposer

(xxxmm²)

47 mm x 47 mmBGA Package

55 mm x 55 mmBGA Package

GPU 14nm FinFET(xxxmm²)

HBM2

2 x 8 stacked memory dies

16GB Memory

Silicon Interposer

(xxxmm²)

Laminate substrate

(10 layers PCB)

AMD Radeon Fury X GPU & HBM Integration©2017 by System Plus Consulting

AMD Radeon Vega GPU & HBM2 Integration©2017 by System Plus Consulting

Comparison with AMD Radeon Fury X

3x more throughput (FP16 Teraflops)

4x more memory, 8x capacity/stack

HBM Stack: 4 stacked dies of 256KB = 1GB

HBM2 Stack: 8 stacked dies of 1GB = 8GB




Physical Analysis

Manufacturing Process Flowo Global Overviewo GPU Processo GPU Wafer Fab Unito HBM Processo HBM Wafer Fab Unito Interposer Processo Interposer Wafer Fab Unito CoW Process o CoW Assembly Unito Final Assembly Processo Final Assembly Unit

Cost Analysis


About System Plus

Global Overview

• SPIL CoW last Process Steps:




Physical Analysis

Manufacturing Process Flowo Global Overviewo GPU Processo GPU Wafer Fab Unito HBM Processo HBM Wafer Fab Unito Interposer Processo Interposer Wafer Fab Unito CoW Process o CoW Assembly Unito Final Assembly Processo Final Assembly Unit

Cost Analysis


About System Plus

Interposer – TSV Process Flow (1/2)

drawing not to scale

Interposer

• Si 300mm wafer

Interposer

• TSV etch: DRIE

Interposer

• Oxide liner deposition: SiO2 PECVD

Oxide Liner

C4F8 / SF6

Interposer

Interposer

Interposer




Physical Analysis


Cost Analysiso Summaryo Supply Chaino Yieldso GPU Costo HBM Stack Costo Interposer Costo CoW Assembly Costo Component Cost


About System Plus

Main Steps of Economic Analysis




Physical Analysis




About System Plus

HBM TSV Manufacturing Cost




Physical Analysis




About System Plus

DRAM Microbumping Cost




Physical Analysis




About System Plus

DRAM Wafer & Die Cost




Physical Analysis




About System Plus

HBM Stack Cost




Physical Analysis




About System Plus

Total Interposer Wafer Cost (TSV + µBump)




Physical Analysis




About System Plus

Chip-on-Wafer (CoW) Stack Wafer Cost




Physical Analysis


Cost Analysis


About System Pluso Company serviceso Related Reportso Feedbackso Contacto Legal

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

ADVANCED PACKAGING• 3D TSV and 2.5D Business Update - Market and Technology Trends 2017• Equipment and Materials for 3D TSV Applications 2017

PATENT ANALYSIS - KNOWMADE

ADVANCED PACKAGING• TSV Stacked Memory Patent Landscape Analysis

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

PACKAGING• NVIDIA Tesla P100 GPU with HBM2• Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM and DSP• NXP SCM-i.MX6 Quad High Density Fan-Out Wafer-Level System-in-Package• TSMC Integrated Fan-Out Package• AMD High-Bandwidth Memory• Samsung 3D TSV – Stacked DDR4 DRAM

Related Reports

https://www.i-micronews.com/advanced-packaging-report/product/p3d-tsv-and-2-5d-business-update-market-and-technology-trends-2017.html

https://www.i-micronews.com/advanced-packaging-report/product/equipment-and-materials-for-3d-tsv-applications-2017.html

http://www.knowmade.com/downloads/tsv-stacked-memory-patent-landscape/

http://www.systemplus.fr/reverse-costing-reports/nvidia-tesla-p100-gpu-with-hbm2/

http://www.systemplus.fr/reverse-costing-reports/sony-imx400-tri-layer-stacked-cmos-image-sensor-cis-with-integrated-dram-and-dsp/

http://www.systemplus.fr/reverse-costing-reports/nxp-scm-i-mx6-quad-high-density-fan-out-wafer-level-system-in-package/

http://www.systemplus.fr/reverse-costing-reports/tsmc-integrated-fan-out-package/

http://www.systemplus.fr/reverse-costing-reports/amd-radeon-r9-fury-x/

http://www.systemplus.fr/reverse-costing-reports/samsung-3d-tsv-stacked-ddr4-dram/


COMPANYSERVICES




Physical Analysis


Cost Analysis



Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings




Physical Analysis


Cost Analysis



Contact

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NANTESHeadquarter

FRANKFURT/MAINEuropa Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

PHOENIXYOLE Inc.

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