Alexander Markov 1 | P a g e

ALEXANDER MARKOV

Email: alex.markov@asm.com Mobile Phone: (480) 381-9803

PROFESSIONAL EXPERIENCE

ASM INTERNATIONAL, Phoenix, Arizona, September 2006 – Present (10+ years)

Global Licensing Manager, Department of Global Intellectual Property (IP) 2016 – Present Part of ASM’s Intellectual Property organization. Responsible for detailed planning and execution of ASM’s licensing efforts. Ensures licensing revenue receipts and suppliers’ performance obligations to ASM and its customers and is a key point of contact between ASM and its licensed suppliers, works with other ASM organizations and global stakeholders to support supplier/customer issues and contributes to identification of new opportunities for protecting or extracting value from ASM’s intellectual property. R&D Lab Facilities and Global Product Support Sr. Manager 2014 – 2016 Currently managing engineering R&D lab facilities. Managed product improvement projects within Global Product Support organization, including installation and maintenance of all chemical, electrical, process and other necessary facilities lines for R&D equipment.

R&D Lab Facilities Management Project and Business Management

Developed scope of work; managed contractors; led contract negotiation to achieve 15-20% improvement in project costs; managed safety, quality, on-time execution, and financial performance for each project. Improved structure of facilities project assessment and execution performance.

Achieved 95.6% on-time performance for all project tasks with outstanding quality, while managing multitude of product improvement projects within Global Product Support, including new products introduction such as Previum and Horizon. Developed and managed indicators for project tasks for Quality and on-time performance.

Supported EVAL/JDP penetrations for ALD and EPI product, including Intrepid NPI. Monitored IQ cost, execution, customer satisfaction and on-time execution. Designed resource allocation schedule for EPI evaluation projects for Toshiba, Samsung and other customers. Supervised installation of Intrepid Platform and 4 Intrepid Modules at Toshiba site.

Global Equipment Services Manager 2011 – 2014 Managed Installation/Qualification, Conversions, Upgrades, Demos and other equipment services for ASM customers worldwide. Responsibilities included management of 60+ field engineers to enable successful installation ramps at customer sites.

People/Project Management

Financial Leadership

Assembled, trained and coordinated the team of FSEs; drove on-time, high quality and incident-free installation and qualification with highest customer satisfaction

Achieved high customer and ASM marks, by developing and deploying a concept of High Performance Installation and Qualification Philosophy to maximize team performance

Met or exceeded financial performance of the organization. Developed quarterly and yearly budget based on equipment orders forecast. Ensured all financial & budgetary targets are met.

Technology Program Manager 2009 – 2011 Managed global ALD (Atomic Layer Deposition) 45nm & 32nm technology programs for Intel customer. Responsibilities included management, prioritization and coordination of the critical projects to enable success of the program as well as supervision of site program and operations managers.

IP Program Management Technical Program Leadership

Led ASM IP improvement program to identify and improve asset & building security, customer information security, global export policy and other aspects of ASM IP systems.

Facilitated and chaired global cross-functional team to execute on and implement all action items from comprehensive IP roadmap.

Led multiple task forces, such as Heaters and Mechanical Defects, using Model-Based and KT methodology. Reduced failure rate from 56% to 5% for heaters and from 43% to 2% for mechanical defects for all customer factories within 45nm and 32nm technologies.

Site Program and Operations Manager 2006 – 2008 Managed critical technology program and operations of ALD (Atomic Layer Deposition) at Intel. Responsibilities included hiring and training qualified personal for field service, daily operations management for equipment installation and sustaining as well as interactions with customer and ASM factory.

People Management

Managed team of 10 ALD field service engineers for Intel’s 45nm line. Provided engineers with clear expectations, directions and feedback system to improve their overall skills. Supervised installation and daily sustaining of 6 Polygon 8300 tools (ALD) at customer’s site. Tools were installed on or ahead of schedule and maintained 85+% availability over extended period of time.

Developed strong relationship with customers on site to ensure ASM site team provides high quality of service in injury free environment.

Alexander Markov 2 |P a g e

INTEL CORPORATION, Chandler, Arizona, September 1996 – August 2006 (10 years)

Thin Films Equipment Installation and Qualification Group Leader, Fab12/32, Arizona 2005 – 2006 Managed 30+ engineers and technicians to install and qualify high precision 300mm wafer fabrication Thin Films equipment into a world class semiconductor manufacturing facility.

Project/People Management Technical Leadership

100% on-schedule installation of PECVD and Metal PVD equipment, including Applied Materials Ultima and Endura, Novellus Vector and Sabre, and ASM Eagle

Led recovery plans for tools with negative floats after capacity model (MOR) changes to mitigate negative impact to the overall factory wafer starts ramp.

Provided team with clear guidance and set of expectations as well as removal of roadblocks to meet challenging time schedule with no safety or quality incidents.

High Density Plasma (HDP) Process Module Group Leader, Fab22, Arizona 2004 – 2005 Managed AMAT HDP tool set engineering group with tactical and strategic directions to provide injury free, high quality, Virtual Factory Best Tool Matching (BTM) methodology matched and targeted availability.

Structured Problem Solving Technology Leadership

Led 2 major Copper HDP area Task Forces during 130nm technology start-up and ramp. using structured model-based approach

Developed several methodologies to address defects level and equipment availability issues: hardware improvement (center nozzle resolution), clean time optimization, preventative maintenance (PM) quality improvement. As a result, Cu HDP tool availability has improved from ~60% to ~80%.

Led by example Engineering and Manufacturing partnership on the daily basis to significantly improve relationship between HDP engineers and technicians on the floor. Initiatives included developing HDP technical mentorship and training programs, engineering rotation on the floor and closed feedback loop system.

Engineering and Manufacturing Functional Area Manager, Fab22, Arizona 2000 – 2004 Managed Defect Metrology (DM) equipment engineering group for following tool sets: KLA-Tencor bright field 2135/2138 series, Dark Field Inspection tools (AIT), bare wafer surfscans, optical and scanned electron microscope (SEM) review equipment.

People Management Technical Leadership

Developed and managed quality and fast-pace manufacturing organization across all 4 shifts, effectively supporting critical factory Task Forces: Via Oxide Surface Particles, Metal Barrier Seed (TiN/Cu) residue excursion.

Significantly increased throughput, utilization & output for DM operations by using statistical methods to analyze and define optimal sample size to minimize defect data time lag feedback.

Developed 24X7 Defect Response program to sustain highly reliable defect excursion detection and response system. System enabled >85% material excursion free.

Defect Metrology Process Engineer, Fab12, Arizona 1996 – 2000 Engineer, responsible for Defect Metrology tool sets. KLA-Tencor AIT Surfscans, Tencor 7600 & 6200 Series Surfscans.

Technical Leadership Budget Management

Achieved >95% equipment availability and under 3 hours defect excursion response time. Developed, implemented and managed multiple systems to improve manufacturing output productivity and defect response effectiveness in Defect Metrology Functional Area.

Lead multiple Defect Reduction Teams to significantly reduce die yield losses due to defects and set Fab12 defect levels to the best in class.

Supervised group of engineering technicians to enable installation, qualification and sustaining of Defect Metrology equipment for 0.25 micron and 0.18 micron technologies.

EDUCATION

Master of Business Administration (MBA) Arizona State University (ASU), W.P. Carey School of Business, Tempe, Arizona

Master of Science in Chemical Engineering University of California, Los Angeles (UCLA), Los Angeles, California.

Bachelor of Science in Chemical Engineering Moscow University of Chemistry and Technology, Moscow, Russia.