advanced materials, designs and 3d package … advanced materials... · reliable two-phase cooling...
TRANSCRIPT
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ADVANCED MATERIALS, DESIGNS AND
3D PACKAGE ARCHITECTURES FOR
NEXT-GEN HIGH-POWER PACKAGING
D R . V A N E S S A S M E T
3 D S Y S T E M S PA C K A G I N G R E S E A R C H C E N T E R
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Outline
Why 3D for Next-Gen SiC Packaging?
Innovations in Package Design & Materials
Summary
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3D Systems Packaging Research Center at Georgia Tech
Comprehensive global Industry Consortium in System Scaling to enable supply-chain manufacturing to end-user needs
Industry culture and R&D infrastructure (300mm clean room facility)
Environmental Testing Shared User Labs
Plating Facility Substrate Cleanroom Assembly Facility
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Strategic Need: Packaging Solutions FOR WBG
Electrical power needs are increasing across the transportation field
Shift from Si to SiC with higher voltage/power ratings, switching speeds, max. junction temperatures in smaller footprint
Power ↑ + Size ↓ =
Temperature ↑
… but power packaging is slow to change and is now limiting the performance of power electronics
We need power electronics packaging AND cooling to catch up to the devices capability
Current SiC power moduleSource: Toyota
↑ capacity, ↑ efficiency, ↓ cost
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Evolution of Power Packaging Technologies
Oakridge Nat. Lab.
3D Power Package
Molded Power Cards
Infineon
Power Embedding
SchweizerElectronics
Conventional Power Module
Wire bonds, Single-side cooling, Separate power / control / drive integration
Elimination of bond wires, Double-sided cooling, Scalability in power
Modularity vs. Integration
Leadframe-based, Cu clip package, Low-cost
Heterogeneous integration, PCB-based processing
Packaging Trends:
↓parasitic L, ↑reliability, ↑thermal behavior
Leverage more standardized manufacturing
New solutions required to fully benefit from performance improvements of SiC
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Transition from Si to SiC… the “dv/dt” challenge
Two ways to solve the problem: topology, packaging
50 kV/us
1 nF
50 AParasitic capacitance
Heat sink
Si device 5-15 kV/us
SiC 50 kV/us
Common mode currents can lead to electrical discharge machining (EDM) on ball bearings, will be worse with SiC
Image of ball bearings in motor with voltage source converter
Fast rise and fall times of SiC devices result in high dv/dt Common mode currents EMI Complex gate driver
*Doyle Busse, Jay Erdman, Russel J. Kerkman, Dave Schlegel, and Gary Skibinski, “Bearing Currents and Their Relationship to PWM Drives “ IEEE IECON, 1995
Package parasitic capacitance plays a critical role in dv/dt capability
Source: Georgia Tech CDE
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What we can do on packaging side to address the transition to SiC
Parameters Current Packaging Solutions Our Targets
Heat Flux 200W/cm2 1kW/cm2
Breakdown Voltage 10kV >30kV
Max. Junction Temperature 150-175C >200C
Thermal Performance No thermal transient control Thermal transient suppression
Reliability Poor at full device rating Improved
Conventional Packaging PRC’s Solution: 3D Power Package with Die Stacking
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Beyond Traditional 3D: Die Stacking
Thermal & Reliability
Metallization thickness scaling up to X10 for thermal management
Cparasitic
DecoupledCparasitic
DecoupledParasitic capacitance
Minimum Parasitic inductance
Lparasitic
Lparasitic
Electrical
Metallization
Metallization
Power device
Stress buffering w/ advanced die-attach /
conductors
Solder or sintered Ag
Symmetric 3D structure
10X ↓ parasitic C with <1nH parasitic L
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Package Parasitic Capacitance
Conventional Novel 3D
BP-TN 123 pF 85 pF
BP-TO 140 pF 0.08 pF
BP-TP 15 pF 85 pF
BP-g_low 12 pF 0.015 pF
BP-g_high 9 pF 0.015 pF
CBN CBO CBP CBN CBO
CBP
Conventional Design Novel 3D Design
S2
S1
D2
D1
P
O
N
g1
g2
CTP
CTO
CTN
Cg_lo
w
Cg_high
He
ats
ink
Rgnd+Lgnd+Cgnd
iheatsink
Vs.
Voltage at heatsink node
Common mode current (noise)
Simplified networkANSYS MAXWELL simulations
LTSPICE simulations
• Minimized output capacitance with new design (die stacking)
• Impact of dv/dt coupling with parasitic capacitance of package significantly reduced
Simulations by H. Lee
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Package Parasitic Inductance
Conventional Design Novel 3D Design
35.5
24.5
1.77 1.75
0
5
10
15
20
25
30
35
40
loop1 loop2
Para
siti
c In
du
ctan
ce L
[n
H] Conventional
Novel 3D
• Significant reduction in parasitic inductance – matching other 3D solutions
• Faster response achieved with less resonance in the waveforms
• Significant reduction in switching losses
Vs. Double pulse tester setup for switching
performance comparison
Eon
[mJ]
Eoff
[mJ]
Conventional 0.80 0.27
Novel3D 0.48 0.19
Turn-on Turn-off
Switching energy loss
Simulations by H. Lee
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Package Thermal Design – Effect of Cu Thickness
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0 0.5 1 1.5 2 2.5 3
Therm
al R
esis
tance R
JA
[oC
/W]
Thickness of Heat-Spreader [mm]
h=10000
h=50000
300
310
320
330
340
350
0 0.2 0.4 0.6 0.8 1 1.2 1.4
Junction T
em
pera
ture
[K
]
Time [s]
heat spreader 0.2mmheat spreader 0.4mmheat spreader 1mmheat spreader 2mmheat spreader 3mm
70.0oC
62.3oC
56.4oC
50.7oC
44.9oC
Heat generation
100 W Heat transfer coefficient
10,000~50,000 W/m2K
Modeling by H. Lee
Contrary to 2D integration, increasing heat spreader thickness critical to thermal management in 3D
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Thermomechanical Modeling – Effect of Cu Thickness
0.0E+00
2.0E+08
4.0E+08
6.0E+08
8.0E+08
1.0E+09
1.2E+09
0 0.5 1 1.5 2 2.5 3 3.5
Vo
n-M
ises
Str
ess
[Pa]
Heat Spreader Thickness [mm]
Max. Stress on Die @ 105C
3.50E+07
3.70E+07
3.90E+07
4.10E+07
4.30E+07
4.50E+07
4.70E+07
4.90E+07
0 1 2 3
Vo
n-M
ises
Str
ess
[Pa]
Heat Spreader Thickness [mm]
Max. Stress Top Die Attach @ 105C
Max. Stress Bottom Die Attach @ 105C
0.00E+00
1.00E-02
2.00E-02
3.00E-02
4.00E-02
5.00E-02
6.00E-02
7.00E-02
0 0.5 1 1.5 2 2.5 3 3.5
Equ
ival
ent
Pla
stic
Str
ain
Heat Spreader Thickness [mm]
Max. Strain Top Die Attach @ 105C
Max. Strain Bottom Die Attach @ 105C
Uniform temperature 105oC
Max limit
Safe margin
Trade-offs between thermal & reliability performances material innovations to improve reliability
Modeling by H. Lee
Die stress Die-attach stress Die-attach plastic strain
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Key Basic Technologies For Next-Gen SiC PKG
SiC
Cu
SiC
Cu Cu / low-stress conductors(integrated heat spreading)
Die-attach by film sintering
High-temp. HV dielectrics / encapsulants
2-phase cold plate
Thinfilm insulators
Multiphysics Design
Transition from sequential electrical thermal mechanical to true multiphysics design
Understanding of tradeoffs
Materials Innovations
Die-attach film sintering (Cu, organics-free, compliant)
Low-stress, high-conductivity conductors (Cu-graphene)
High-temp. HV dielectrics / encapsulants / thinfilm insulators
System-level Cooling
Single phase: ↑temperature uniformity
Two phase: ↑dryoutperformance
Manufacturing
Standard panel-scale processing
Co-develop with supply chain
Reliability
Power & thermal cycling
↑ max. junction temp.
3D Power Card with Die Stacking
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PRC’s Die-Attach Solution: Nanoporous-Cu Film Sintering
Thin NP-Cu cap
High compliance pre-sintering
Low-cost synthesis by selective etching
• Electroplating• Furnace or arc
melting
Cu pillar with NP-Cu caps (semi-additive processing)
Die-attach films, inserts or preforms
Nanoporous (NP) Cu: nanoscale metal sponges
Controlled densification
Collaboration with Prof. Antoniou
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Versatility in Implementation
Sacrificial carrier
Sacrificial carrier with a seed layer
Sacrificial carrier
Cu-Zn
Deposit Cu-X alloy layer 15–30 µm thick
Cu-Zn
Isolate the Cu-X film and dealloy
Standalone NP-Cu films
Nano-Cu film
NP-Cu film with a Cu core
Copper foil Copper foil
Deposit Cu-Zn alloy layer 5-30 µm thick
After dealloying
Thin Cu foil
Cu-Zn
Cu-Zn
Copper foil
Nano-Cu film
Nano-Cu film
Sputter oxide and Ti/Cu seed layer on Si wafer
Photoresist lamination and patterning
Deposit Cu-Zn alloy layer 5 – 10 µm thick
Lift-off photoresist, etch Ti/Cu seed and dealloy
Patterned nano-Cu on substrate/device
Collaboration with Prof. Antoniou
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NP-Cu Die-Attach Films on Thinfilm Cu Core
• Total thickness easily adjustable
• 8-10µm nano-Cu films on both sides
Dealloying
Collaboration with Prof. Antoniou Data collected by K. Mohan
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Sintering Demo of NP-Cu Film on Bulk Cu
~1.5cm x 1.5cmDiced into sections ~25mm2
10MPa, 250C, 30min, forming gas
>99% density achieved
Cu foil
Cu metallization
Cu metallization
Cu metallization
Sintered foam
Sintered foam
Cu foil
Cu metallization Cu metallization
Sintered foam
Collaboration with Prof. Antoniou Data collected by K. Mohan
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Direct Patterning by Semi-Additive Processing
Silicon
Silicon
Cu Metallization
Cu Metallization
NP-Cu
9MPa, 250C, 30min, forming gas
Die: 6.5mmx6.5mmSubstrate: 10mmx10mm
Apply & pattern on substrate, wafer,
busbar, etc
Collaboration with Prof. Antoniou Data collected by K. Mohan
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4” Wafer Bumping – Semi-additive Process
Precursor alloy: Cu-Zn
Successful plating of Cu-Zn in all the patterns, smooth surface profile, uniform Cu-Zn composition across wafer
5mmx5mm die size
30um
~8um Cu+Cu-Zn
Collaboration with Prof. Antoniou Data collected by K. Mohan
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4” Wafer Bumping – NP-Cu Cap Formation
• Initial Cu:Zn ~ 35:65• Dealloying time in dil. HCl:
90-120min• Feature sizes: 40-250nm
Uniform and smooth surface morphology of NP-Cu caps
after dealloying
Cu pillar
NP-Cu cap
30um dia
Collaboration with Prof. Antoniou Data collected by K. Mohan
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Cu Pillar with NP-Cu caps – Assembly Demo
Assembly parameters: 30MPa, 300C, 30min, forming gas
Collaboration with Prof. Antoniou Data collected by K. Mohan
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Low-stress Conductors: Cu-Graphene Composites
Laminates vs. Composites
Cu composites preferred to retain thermal conductivity of Cu while offering a CTE range
Cu/Mo/Cu
Cu-graphene bulk composites
• Tailorable CTE 3-15ppm/K with λ ~ 460W/m·K
• “Second sound” effect in graphene
• Direct plating & vacuum powder processing
• Applications: Cu functionalization, metallization on DBC/AMB substrates, integrated heat spreaders
• Electrochemical exfoliation of graphene from graphite
Lin et al (2017)
• Orientation control by magnetic field
Implementation in plating line
Plasma sintering
PRC’s Solution
Low-cost Synthesis
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High-temperature HV Mold Compound (Prof. C.P. Wong)
High-Temperature Dielectrics & EMCs
High-temp. & high-conductivity hybrid dielectrics
High-temp. dielectrics with improved interfacial reliability & processability
Low-cost and polymer-compatible hermetic coating
BCBHigh-temp. glass PKG with BCB
Polyimide
Titania-organic hybrid
CE/EP chemistry
Treated/ coated silica
New concept for high-temp. stability
Formulation design for:• High-temperature stability • High breakdown voltage
With Prof. Losego
With Prof. Losego
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New ConceptPrior Art
• Aluminum channels brazed onto substrate, single phase, WEG (Prius)
• Snaking injection-molded copper channels, single phase, WEG (Volt)
CAD model
NEW CONCEPTS
• Additively manufactured (AM) foam-type structures
– Rhombic dodecahedron unit cell for stochastic foam imitation
• Elimination of contact resistance
– Direct printing to eliminate thermal interface materials
• Local control of parameters such as pores per inch (PPI), porosity (ε), elongation, etc. – Allows for localized hotspot cooling, thermal gradient management, vapor pathways
System-level Cooling: Advanced Cold Plates
• Decrease temperature non-uniformity and hotspot formation in single phase
• Increase critical heat flux by delaying dryout failure for reliable two-phase cooling
Collaboration with Prof. Joshi
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Summary
Advances in several building block technologies from low to high power electronics for next-gen 3D power modules
– High-density passives
– Package designs for high dv/dt capability vs. soft switching topologies
– Low-cost sintered Cu die-attach films
– Low-CTE high-conductivity conductors
– High-temperature dielectrics and interfaces
– Low-cost panel-based fabrication with supply chain
First prototype (SiC full-bridge rectifier) expected in 2019 end
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Acknowledgements
This work is funded by PRC’s Industry Consortium & SRC’s “Global Research Collaboration”
Collaborators: GRAs K. Mohan, H. Lee, R. Sosa, J. Li, J. Broughton, GT Profs. Antoniou, Joshi, Losego, Wong, Center for Distributed Energy
PRC & IEN staff & infrastructures
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Back-Up Slides
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Nanoporous (NP) Cu Synthesis – Concept
Dissolution of more reactive ‘B’ element in the etchant
Rearrangement of ‘A’by surface diffusion
Final nanoporous structure after dealloying
Hakamada, M. and M. Mabuchi (2013)." Critical Reviews in Solid State and Materials Sciences 38(4): 262-285.
Alloying and chemical delalloying
A-B alloy fabrication:
• Electro-deposition• Co-sputtering• Melt spinning• Furnace melting
Dealloying parameters are:
• Etchant chemistry• Dealloying time• Applied potential (Vc)• Temperature
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NP-Cu deforms at very low load
Limit to amount of displacement of the NP-Cu before micro-cracking starts: ~20% of initial height (conservative estimate)
The Promise of Nanoporous (NP) Cu: Compliance
Die
Substrate
100µm
Cu pad
Die
Substrate
100µm
pm
h/hnano-Cu
pm
, M
Pa
hNP-Cu
`
Possible cracking in the NP-Cu
1 µm1 µm
(experimental data for hnano-Cu=2µm)
Experiments at room temperature
Courtesy of A. Antoniou
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The Promise of Nanoporous (NP) Cu: Sintering Kinetics
Thermal sintering carried out in inert N2 and reducing environments (N2 + 3% H2)
Studies ongoing to understand nature of sintering under different environments to be able to design NP metals
for sintering applications
N. Shahane, V. Smet, A. Antoniou “Anomalous coarsening in nanoporous metals” (nearing submission)
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The Promise of Nanoporous (NP) Cu: Sintering Kinetics
• More complex mechanism than simple surface diffusion under heat• Surface diffusion driven kinetics under electrolyte coarsening
Grain-growth model
Arrhenius function
Combined equation
The initial results indicate NP metals have very high surface energy resulting in complex sintering kinetics that need to be further studied and understood
N. Shahane, V. Smet, A. Antoniou “Anomalous coarsening in nanoporous metals” (nearing submission)
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Wafer Bumping Process Flow – Solder vs. NP-Cu Caps
Substrate (Si, Organic, Glass)
Package RDL
Seed layer deposition (Ti/Cu)
PR patterning
Cu-Zn co-plating Sn-Ag co-plating
PR strip and dealloying PR strip and solder reflow
Etch seed layer and dicing Etch seed layer and dicing
Nanocopper foam caps fabrication Solder cap fabrication
Chip/Substrate
Assembly
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Concept of anisotropic foams for stress buffering in die-attach
Cu foil
Power dieMetallization
DBC
Nano-Cu foam filmLarge - area insert
Anisotropic nano-Cu foams with Cu core
Power diemetallization
DBC
Anisotropic densified structure with good thermal and electrical performance in Z direction and compliance in X-Y plane
Anisotropic platinum foams with vertical channels
Antoniou, Antonia, et al., 2009
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EDX Analysis of Sintered Joint
• All-Cu joints• Residual Zn<0.2%
Si substrate
Si die
Cu metallizationDensified foam
Cu pillar
Data collected by K. Mohan
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Fracture Interface Analysis after Die Shear Test
Die-side Substrate-side
• Failure within the sintered foam layer, not at the interface, signifying good metallurgical bonding between NP- and bulk-Cu
• NP-Cu caps were able to compensate for the variation in their heights as well as the surface roughness of the substrates
Data collected by K. Mohan
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Improve Dielectric-Metal Adhesion: Vapor-Phase-Infiltration
Polymer
O O O O O O O
CopperSeed layer
VPI modified surface
Adhesion improvement by chemical modification
• Peel strength increases with time of infiltration, indicating that more exposure to precursor is favorable
VPI Temperature 150 CVPI Temperature 120 C
Collaboration with Prof. Losego