advanced circuit packaging with cbm technology
DESCRIPTION
A brief introduction about the cooperation between Luleå University of Technology and CPD Center AB.TRANSCRIPT
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Possibilities and challenges in electronics building and production
technology
On some cooperation with CPD Center AB
Professor Jerker DelsingEISLAB
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High density electronics
DriversPrice - price scales with size and volume
Low power - shorter leads, less R,LC -> lower operation voltage (P=U2/R)
Performance - shorter leads -> higher clock frequencies
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Comparison Si - PWB
Silicon: 8 - 32 nmPCB: 50 - 250 um
3 - 4 order of magnitude in difference
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What about PWB?!
First PCB:s early 1900The print and etch process patented 1913 - PWB
Feature sizes Trace width - 40 um -- 100 um Via size - 50 um - .... Multi layer boards - 40 layers
Limitation due to the etch process
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Component package
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Chip bonding
Bondwires usually consist of one of the following materials:
Aluminum
Copper
Gold
Wire diameters start at 15 µm and can be up to several hundred micrometres for high-powered applications.
Thermosonic bonding
Ultrasonic bonding
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The wet PCB dream
Sequential Build Up of PWB parts
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The CBM process
• Polymer molecules attach and create Polymer “structures” on the surface
• Works UP FROM surface instead of DOWN INTO surface
• First molecule fastens on surface with a strong covalent bonding
• On surface and inside holes (1:12)
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Copper Build-up
Bare substrate
Polymer Structure build-up
0.5 – 4 μmElectroless Copper
Galvanic platingto desired level
CBM process
Standard processes
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Cu on Teflon© (with primer, TetraEtch)
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Etching vs Sequential build Up (SBU)
SBU
Potentially smaller feature sizes
Enabling embedded component - embedded chip technology
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What’s the difference?
Standard Copper
CBM™ copper
FR4
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First experiments
10 um line width
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Strategies for circuit board interconnect based on the
CBM™ process
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Solder free interconnect
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Solder free interconnect
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Solder free interconnect
Application of CBM™ grafting chemistry
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Solder free interconnect
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Solder free interconnect
CBM™ grafting polymer
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Solder free interconnect
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Solder free interconnect
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Benefits
Takes away:Capsule ~35% of component costBonding ~35% of component cost
Smaller feature sizes at circuit board enablesCircuit board area reductionSmall chip pads
100x100 um today -> 5x5 um -> chip area saving of 400 times100 pads -> 1mm2 -> 0.0025 mm2
Chip size directly proportional to costShorter interconnect leads
Less RLCLower power requirementsHigher performance
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Can we do this today?
LTU has the following lab facilities currently used in research cooperation with CPD Center AB
Clean room facility featuring Down to ISO 14644-1 class 5 CBM™ process Lithography Via hole drilling
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CBM
Lab scale CBM process capable of small series production
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Lithography
Laser lithography Advanced laser writer Line width < 700 nm
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Via making - laser ablation
Cold ablation via diameter<5um