about omics group
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About Omics Group
OMICS Group International through its Open Access Initiative is committed to make genuine and reliable contributions to the scientific community. OMICS Group hosts over 400 leading-edge peer reviewed Open Access Journals and organize over 300 International Conferences annually all over the world. OMICS Publishing Group journals have over 3 million readers and the fame and success of the same can be attributed to the strong editorial board which contains over 30000 eminent personalities that ensure a rapid, quality and quick review process.
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About Omics Group conferences
OMICS Group signed an agreement with more than 1000 International Societies to make healthcare information Open Access. OMICS Group Conferences make the perfect platform for global networking as it brings together renowned speakers and scientists across the globe to a most exciting and memorable scientific event filled with much enlightening interactive sessions, world class exhibitions and poster presentations
Omics group has organised 500 conferences, workshops and national symposium across the major cities including SanFrancisco,Omaha,Orlado,Rayleigh,SantaClara,Chicago,Philadelphia,Unitedkingdom,Baltimore,SanAntanio,Dubai,Hyderabad,Bangaluru and Mumbai.
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Dilute Nitrides – growth, characterisation and mid-infrared applications
A. Krier, M. de la Mare, P. Carrington, Q. Zhuang, M. Kesaria, M. Thompson
Physics Department, Lancaster University, UK
Optics 2014
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Outline
Dilute NitridesMBE growth on InAs and GaAs Structural and transport propertiesPL and EL Addition of Sb Devices
Summary
N
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Motivation
• Gas sensors - optical absorption;
CH4, CO2, CO • Industrial process control• Spectroscopy• Thermal imaging• Bio-medical diagnostics • Military - infrared countermeasures
Principal gas absorptions in the mid-infrared
5 4.5 4 3.5 30
50
1002000 2400 2800 3200
HCN
CH4
HCl
CO2
NO2
CO
Wavelength ( m )
HCl HCN NO2 CH4 CO CO2
Tra
ns
imis
sio
n (
% )
Wavenumber ( cm-1 )
For these applications we need LEDs, lasers and detectors operating at Room Temperature
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Dilute nitrides and the Mid-infrared Problems :- imbalance in the DOS of InAs
Auger recombination (CHSH)
Inter-valence band absorption (IVBA)
Inadequate electrical confinement - small band offsets
- No SI substrates Addition of N : Band anti-crossing effect- flexible wavelength tailoring without complex growth
Higher effective massthan in InAs or InSb and equalises DOS
Superior bond strengths and material stabilityCompared to CdHgTe
InAsN dilute nitride alloys offer some possibilities for improvement
2’1’
2
1
CB
LH
HH
Eg
Δ0
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1.40
1.60
1.80
2.00
-5.00 0.00 5.00
E (
k) (
eV)
k (108 m-1)
W. Shan et al., Phys. Rev. Lett. 82, 1221 (1999)
An empirical model
ECB
EN
E+
E-
N
CB
)(
)()()(
EkEV
VkEkEkE
22
CBNCBN
2
)(
2
)()( V
kEEkEEkE
Extended-localized state interaction
Anticrossing/repulsion between conduction-band edge and localized states decreases the band gap
introduces minigap(s) at low k-value in the CB
Band anti-crossing
GaAsN
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GaAsN InPN InAsN
N-levelCBE
0.2 eV 0.4 eV
DE = 1 eV
N-pairs and clusters
E.P. O’Reilly et al., SST 24 033001 (2009)
The band structure of III-V-Ns is determined by the distribution of energy levels due to N-impurities and N-clusters and their hybridization with the extended CB states
N levelsN-N pairs & clustersN relateddefects
CB
VB
E. P. O‘Reilly, A. Lindsay, and S. Fahy, J. Phys. Cond. Matt., 16, S3257 (2004)
Band structure
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MBE Growth on InAs and on GaAsV80 Molecular Beam Epitaxy (VG) with RF Plasma Nitrogen source, As and Sb valved cracker cells (EPI)Ga, In, Al and dopants GaTe and Be
Large parameter space for InAsN InAsN successfully grown on InAs with N < 2% and PL observed out to 4.5 µm
For growth on GaAs Optimum growth at substrate temperatures between 4000C- 4400C Nitrogen plasma setting fixed at 160 W with flux of 5x10-7 mbar
Growth rate of ~1µm per hourInAs control sample was grown under the same conditions
Sample TG Flux - As Flux - N2Plasma Power
N Content %
A0276 485 6.6x10-6 n/a n/a n/aA0282 420 2.2x10-6 6.12x10-7 160 0.6A0285 442 2.2x10-6 6.12x10-7 160 0.2A0299 376 2.2x10-6 6.3x10-7 160 1.0A0300 450 2.8x10-6 5.0x10-7 160 0.4
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X-ray diffraction
N=0.83% - tail indicates vertical N composition gradientN=0.34% - thickness fringes – good interface quality
Growth rate decreases with increasing N
asymmetrical (224) reflections measured for all samples
2 different layer peaks obtained - 2 dominant N compositions
Plastic relaxation- Vertical and horizontal
lattice deformations obtained
- Gives relaxed lattice const.and plastic deformation R
Layers with N< 1.2% are pseudomorphicBragg maps narrow in qII
N > 1.2% more diffuse scattering from misfit dislocations & defects
Onset of plastic relaxation at N~ 1.4%
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0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.601.0E+00
1.0E+01
1.0E+02
1.0E+03
1.0E+04
1.0E+05
1.0E+06
1.0E+07
Sample : A0299 InAsN 1% N
Depth (microns)
Inte
ns
ity
(c
s-1
)SIMS and TEM analysis
N is uniform
No evidence of unintentional impurities (C, O etc.) as-grown InAsN is of high purityAnalysis of secondary ion peaks from CsAsN+ enables accurate N determination-comparison with XRD data – N content is ~5% larger than determined from XRD Significant incorporation of non-substitutional N Higher dislocation density in InAsN – but obtain increase in PL Localisation, non-uniform PL emission from regions around dislocations?
InAs/GaAs
InAsN(1%) /GaAs
200 nm
200 nm
As
In
N
Ga
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Raman spectroscopy Weak InAs modes at 405 and 425 cm−1 and 2nd order InAs optical modes at 435, 450, 460 and 480cm−1
Additional N related features at 402, 415, 428 and 443 cm−1
(previously observed by Wagner et al. N ~ 1.2 %)
difference spectrum of highest N – lowest N content
443 cm−1 feature - also detected in FTIR NAs LVM from substitutional 14NAs
402 cm−1 and 415 cm−1 peaks from non-substitutional N-N or As-N split interstitials, (N antisites or interstitial N) rather than N-In-N complexesand As -N produce deviations from Vegard’s law
(Calculations predict N-N split interstitial at 419 cm−1
but also predict that the As-N split interstitial lies well above the LVM in GaAsN)
N related features
NAS As -N N-N
Ibanez et al, JAP (2010)
2nd order InAs modes
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0.0 0.4 0.8 1.2 1.610-2
10-1
100
101
Ga(AsN)
(m
2 V-1s-1
)
N (%)
T = 293 K
In(AsN)
0.0 0.1 0.2 0.3 0.4 0.5 0.60.01
0.1
1
10
GaAsN
Mob
ility
(m
2V
-1s-1
)
N-content (%)
77K
InAsN
N reduces electron mobilityµ is limited by electron scattering by N-atoms, -pairs and clusters Model for GaAsN predicts a strong reduction of the mobility and electron mean free path due to the N-levels
Weak dependence of µ on N-content compared to GaAsN due to the proximity of the N-related states to the CBE
Impurity scattering dominant at high N
Residual carrier conc. increases for N >0.4%N incorporation introduces native donor states
Electrical properties InAsN on GaAs
A. Patanè et al Appl. Phys Lett. 93, 25106 (2008)
1 10 1000
1
2
3
4
5
H (
m2V
-1s-1
)
1.0%
x=0%
0.2%
0.6%0.4%
T (K)
0.0 0.5 1.01016
1017
nH (
cm-3
)
x (%)
T = 293K
Phonon scattering
impurity scattering
1000 nm n-type InAs(N)
Semi-insulating GaAs substrate
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The electron mass and its dependence on the excitation energy are weakly affected by the nitrogen
0.0 0.5 1.0 1.5 2.0
0.025
0.030
0.035
m
e*/m
0
N (%)
11.4 m 15.0 m 66.0 m 103.0 m
O. Drachenko et al. APL 98, 162109 (2011)
Electron Cyclotron Mass
GaAsN LCINS, O’Reilly
CR InAsN
CR/PR GaAsN(m
e)
Comparing the N-induced change of the mass in InAsN and GaAsN
The cyclotron mass increases with increasing x
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The increase of electron density with increasing N indicates a pinning of the Fermi level and implies a substantial density of native donor states
InAsN - Cyclotron Resonance
O. Drachenko et al. APL 98, 162109 (2011)
-4x106 0 4x106
0.3
0.4
0.5
2.0%
1.0%
(eV
)
k (cm-1)
N = 0%
EF
Pinning of the Fermi level
0.0 0.5 1.0 1.5 2.01016
1017
1018
n (
cm-3
)
N (%)0.0 0.5 1.0 1.5 2.01016
1017
1018
20 meV
80 meV 40 meV
n (
cm-3
)
N (%)
EF= 10 meV
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0 50 100 150 200 250 300
0.325
0.330
0.335
0.340
0.345
0.350
0.355
Ban
d G
ap E
nerg
y (e
V)
Temperature (K)
Eg=0.353-[1.1x10-4T2/(T+100)]
Photoluminescence InAsN on InAs Incorporation of small amounts of N into III-V’s causes conduction band anti-crossing leading to reduction in band gap
Good agreement with band anti-crossing model
(60 meV per 1%N)
Long low energy tail appears - localisation CMN = 2.5 eV at 4 K
caused by uneven nitrogen distribution- composition fluctuations or point defects
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J. Appl. Phys. 108, 103504 (2010)
PL is Gaussian at low T As T increases becomes asymmetric with high energy tail extends well above Eg
Lineshape - 2 effectsLocalization at low TFree carrier emission at high T
Photoluminescence Lineshape
0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
4K 20K 40K 60K 80K100K120K150K180K210K240K270K300K
Inte
nsity
Photon Energy (eV)
Conduction Band
Valence Band
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0.0 0.5 1.0 1.5 2.0 2.5 3.0
0.30
0.35
0.40
E0 InAsN/InAs
InAsN/GaAs InAsN/InAs E
0
InAsN/InAs o
BAC model
Ene
rgy
(eV
)
Nitrogen content (%)
0
PL obtained from InAsN on GaAs across the mid-IR spectral range with addition of small quantities (~ 1%) of nitrogen
Good agreement with band anti-crossing model
Inclusion of nitrogen improves the peak intensity InAsN > InAs on GaAs
Photoreflectance shows Δ0 is constant with increasing N
Activation energy increases with increasing N content – CHSH Auger detuning
InAsN on GaAs4K PL
improved PL
0 50 100 150 200 250 300
10-2
10-1
100
InAs/InAs InAs/GaAs InAsN(0.6%)/GaAs InAsN(1%)/GaAs
No
rma
lise
d P
L I
nte
nsi
ty (
a.u
.)
Temperature (K)
2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6
0
2
4
6
8
10
Inte
nsity
(a.
u.)
Wavelength (m)
InAs/GaAs
0.2%N
0.4%N
0.6%N
1%N
CO2
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Adding Sb - MBE growth of InAsSbN
N is hard to incorporateUse Sb to reduce lattice mismatch increase N incorporation improve quality
InAsConduction band
Valence band
Increasing N
Tensile strain
Increasing Sb
Compressive strain
Adding N to InAs
Adding Sb to InAs
Eg
Sb acts as surfactant to maintain 2D growth and reduces point defects - improves PLRed-shift of emission wavelength – need less N to reach longer wavelengthsSb reduces N surface diffusion length - increases N incorporation ~ 2.5xReduction of Sb segregation induced by N - increases Sb incorporation ~1.5x
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0.0 0.5 1.0 1.5 2.0
0.3
0.4
0.5
0.6
0.7
0.8
7.3
% S
b7
.0%
Sb
4.1
% S
b2
.6%
Sb
4.8
% S
b
E
ne
rgy
(eV
)
Nitrogen concentration (%)
E0
E0+SO
SO
Fits for InNAs
(d) In(N)AsSb0.0 0.5 1.0 1.5 2.0
0.3
0.4
0.5
0.6
0.7
0.8
(c) InNAs
This work: Ref.[31]: E0 E0
E0+SO E0+SO
SO SO
Fit
Energ
y (e
V)
Nitrogen concentration (%)
Photoreflectance
Kudrawiec et al. APL 99, 011904 (2011)
Δso > E0 Auger suppression
Advantage of InAsNSb over InAsNIn-plane strain for layers grown on InAscan be tuned from tensile to compressive- Tailor polarization in QW to be either TE or TMSb increases confinement in valence band - dominant polarisation is TE (e1-hh1)
Spin orbit splitting In InNAs & InAsNSb
Incorporation of Sb increases Δso and decreases E0 N does not change Δso
Both Sb and N reduce E0
~ 5 meV per 1% of Sb~ 60 meV per 1% N
InNAs InNAsSb
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Strong PL at room temperature - good optical quality Asymmetric shape
Narrow energy gap – free carrier emission is important Especially > 100 KHigh energy tail extends well above Eg
Gaussian at low TPL peak lower than Eg determined from PR Characteristic S-shape but with weak carrier localisation - Stokes shift <10 meV smaller than for InAsN
Composition fluctuations or point defects reduced due to surfactant effect of Sb
InAsSbN Photoluminescence
Latwoska et al, Appl. Phys. Lett 102, 122109 (2013)
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InAsN QW lasers on InPInAsN ridge lasers operating up to 2.6 µm have been demonstrated – grown by gas source MBElimited by N incorporation and critical thickness
4 QW InAsN/InGaAs on InP (5μs pulse width, 500 Hz repetition rate)Max. operating temperature 260 K with T0 = 110 K
Decreasing growth temp incorporates more N ….but reduces QW quality
D. K. Shih, H, H. Lin, and Y. H. Lin, IEE Proc. Optoelectronics 150, 253 (2003)
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MQW containing 18% N
on GaAs (UNM)- longest wavelength PL obtained from dilute Ngrowth temperature 500 0C
InAsN MQW grown by MOVPE
Osinski , Optoelectronics Review 11(4) 321-6 (2003)
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InAsSbN / InAs MQWs
-4000 -3000 -2000 -1000 0 1000 2000 3000 4000100
101
102
103
104
105
106
200 nm InAs Buffer Layer
InAs substrate
100 nm InAs Capping Layer
10x InAsNSb /InAs QW
(12x24 nm)
Growth of the MQWs calibrated using the same growth method of previously grown InAsNSb bulk layers
200 nm InAs Buffer layer grown at 480°C 10x InAsSbN/InAs QW grown at 420°C• Growth rate of 0.5µm per hour• Nitrogen plasma setting fixed at 160 W with flux of 6×10-6 mbar 100 nm InAs Capping Layer grown at 480°C As flux kept at minimum for growth of InAs layers
∆EV = 102meV
hh1 = 9meVhh2 = 36meV
InAs0.92Sb0.08InAs InAs
∆EV = 102meV
hh1 = 9meVhh2 = 36meV
InAs0.92Sb0.08InAs InAs
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InAsSbN/InAs MQW 4K photoluminescence
No blue-shift with excitation power - Type I QW
Band alignment determined by modification of InAsSb - Type II alignment with conduction and valence band offsets of 39 & 82 meV
ADDITION OF N :• Reduction in overall strain Reduction of band gap
• Conduction band further reduced by BAC model Reduction of 63 meV
3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4-1
0
1
2
3
4
5
6
7
2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6
Wavelength (m)
4K
=3.48me
1-lh
1
=3.68me
1-hh
1
Peak Wavelength
tot=3.62m
Re
lativ
e In
ten
sity
(a
.u.)
Wavelength (m)
1.8W 1.6W 1.2W 1W 0.8W 0.6W 0.5W 0.4W 0.2W 0.1W 0.06W 0.03W
e - hh1
e - lh1
2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0-0.001
0.000
0.001
0.002
0.003
0.004
0.005
0.006
0.007
0.008
0.009
Inte
nsi
ty (
a.u
.)
Wavelength (m)
4.38 m Bulk
3.62 m MQW
4K
3.62 µm (expt.) 3.48 µm
N =1%, Sb 6%
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2.5 3.0 3.5 4.0 4.5
0.00
0.01
0.02
0.03
0.04
0.05
0.06
0.07
Inte
nsity
(a.
u.)
Wavelength (m)
30mA 50mA 75mA 100mA 150mA
4K
InAsSbN MQW LEDp-i-n diode containing 10xInAsSbN QW in active region N =1%, Sb 6%
Longest wavelength dilute nitridelight emitting device to date
InAs (100) substrate
n InAs
p InAs
2500 3000 3500 4000 45000
10
20
30
40
50
EL
Inte
nsity
(a.u
.)
Wavelength (nm)
25mA 50mA 75mA 100mA 150mA 200mA
C-H absorption
300 K EL
n+-InAs
p+-InAs
InAsNSb MQW
4 K EL
LED output power : 6 µW at 100 mA drive current and internal RT efficiency ~ 1%
InAsSbN e-hh1InAsSb e-hh1InAsSb e-hh2
0 50 100 150 200 250 300
2
4
6
8
10
12
Out
out P
ower
(W
)
Current (mA)
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R0A ~1/n
3 4 5 6 7 8 9 10 11 12 13
2
3
4
5
6
7
89
10
R0A
(cm
2 )
1000/T (K-1)
(R0A) 1/n2
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.50.1
1
10
EL
em
issio
n (
a.u
)
Ph
oto
resp
on
se
(a
.u.)
Wavelength (m)
InAsSbN MQW p-i-n photodetector
-0.20 -0.15 -0.10 -0.05 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.350.00E+000
5.00E+016
1.00E+017
1.50E+017
2.00E+017
2.50E+017
3.00E+017
3.50E+017
4.00E+017
A0363
C-2 (
F-2)
Voltage (V)
Vbi=0.19V
1/C2=2(Vbi-V)/A2qN
A
Slope = NA
x-intercept = Vbi
NA = 8.3x1017cm-3
-0.5 0.0 0.5 1.0 1.51E-6
1E-5
1E-4
1E-3
0.01
0.1
Cu
rre
nt (A
)
Voltage (V)
4 K 20K 40K 60K 80K 100K 120K 140K 160K 190K 220K 250K 280K 300K
Cut-off λ ~ 4 μmIdeality factor = 1.6R0A T<120 K generation-recombination dominates T>220K diffusion limited recombination is dominantCapacitance at 0V =2.54 nF Built in potential = 0.19 V Carrier concentration = 8.3x1017 cm-3
R0A ~1/n2
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New prospectsRecent results on rapid thermal annealing (RTA) show a large x20 increase in PL intensity of InAsN-no increase in residual carrier concentration
H irradiation also increases PL intensityIn InAsN
GaAsN +H results in passivation of N which restores the bandgap (reversibly)
Can create GaAsN quantum dots
GaAsN
GaAs
hydrogen
Change to GaInAsN - single photon sourcesMicro – LED arrays
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Summary The successful MBE growth of InAsN directly onto InAs and GaAs substrates has been obtained with N up to ~ 2%
Behaviour of N in InAs different to N in GaAs Mobility is reduced but shows weak dependence on N contentFermi level pinning and native donor states PL was obtained which covers the mid-infrared (2-5 μm) spectral range in good agreement with the BAC model
Localisation and free carrier effects are important in interpretation of PL spectraN reduces band gap but has little effect on T sensitivity
Photoreflectance shows N has no effect on Δo
Auger CHSH de-tuning is possible
Addition of Sb increases N incorporation –structural and optical properties - improved and bright PL obtained from Type I InAsSbN/InAs MQWs
First long wavelength dilute N LED operating at 300 K good prospects for device applications if electron concentration can be controlled
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Acknowledgements
A. Patane Nottingham University Transport measurements
R. Beanland & A. Sanchez University of Warwick TEM
J. Ibanez University of Madrid Raman spectroscopy
R. Kudrawiec Institute of Physics, Wroclaw Photoreflectance M. Latkowska
O. Drachenko Helmholtz-Zentrum Cyclotron resonance M. Helm Dresden-Rossendorf
M. Schmidbauer Leibniz-Institute, Berlin X-ray diffraction
Financial support from EPSRC (EP/G000190/01) and also for providing a studentship for M. de la Mare
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InAsSbN MQW LEDN =1%, Sb 6%
2400 2600 2800 3000 3200 3400 3600 3800 4000 4200
0.002
0.004
0.006
0.008
0.010
0.012
Inte
nsit
y (a
.u.)
Wavelength (nm)
4K 20K 40K 60K 80K 100K 120K 140K 160K 190K 220K 250K 280K 300K
Comparison of the temperature dependence of the EL with that of type II InAsSb/InAs reveals more intense emission at low temperature
Improved temperature quenching up to T~200 K where thermally activated carrier leakage becomes important and further increase in the QW band offsets is needed
Increasing the nitrogen content above 0.5% reduces the band gap sufficiently such that the energy gap Eo becomes less than Δso effectively detuning the CHSH Auger recombination mechanism
Comparison with InAsSb
InAsSbN e-hh1InAsSb e-hh1InAsSb e-hh2
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PL analysis temperature dependence
2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6
0.0
0.2
0.4
0.6
0.8
1.0
Inte
nsity (
a.u
.)
Wavelength (m)
300K
CO2
InAsN(1%) exhibits very weak temperature quenching ~ 8xPL emission obtained up to room temperature without annealing Peak wavelength near 4 µm – appropriate for CO2 detection
2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6-1
0
1
2
3
4
5
6
7
8
A0299
Inte
nsi
ty (
a.u
.)
Wavelength (m)
4K 20K 40K 60K 80K 100K 120K 140K 160K 190K 220K 250K 280K 300K
CO2
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InAsN
X-valley
L-valley
<100> <111>
G-valley
Energy
Wave vector
Eg-G = 0.35 eV EL=1.08 eV EX=1.37 eV
N
GaAsN
X-valley
L-valley
<100> <111>
G-valley
Energy
N
Eg-G = 1.42 eV EL~0.3 eV EX~0.3 eV
Comparing III-N-Vs
The energy of the N-level (EN~ 1eV) is larger than the threshold energy for impact ionization (~ Eg-G).
The energy of the N-level (EN~ 0.2eV) is smaller than the threshold energy for impact ionization (~ Eg-G).
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0 20 40 600
1
0 20 40
15.0m = 66.0m
11.4m
x = 1.1%
1.9%
1.1 %
Tra
nsm
issi
on
B(T)
= 11.4 µmT = 4.2K
N = 0%N = 0%
N = 1.1%
Patanè et al. PRB 80 115207 (2009)
0 2 4 6 8 10
Tra
nsm
issi
on (
arb.
unit
s)
B (T)
c*e 2/eBm
ee mm 025.0*
ee mm 027.0*
ee mm 060.0*
ps15.0~e
ps10.e
x=0%
0.4%
1.0%
ee mm 029.0*
ps1.0~e
0.6%
T =100 Ku= 2.9THz
ps20.0~e
InAs1-xNx
InAsN - Cyclotron ResonanceMagneto-transmission in pulsed magnetic field B up to 60T and monochromatic excitation by QCL
Minimum at the resonance field Bc gives me* = eBCl/(2pc)
Area of the CR minimum gives electron density n
CR quenches in GaAsN (0.1%) due to low μ
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Photoreflectance Spectroscopy
PR spectra can be fitted using
where C and θ are amplitude and phasem=2.5 for b-b
InAsN on InAs
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InAsN
X-valley
L-valley
<100> <111>
G-valley
Energy
Wave vector
Eg-G = 0.35 eV EL=1.08 eV EX=1.37 eV
N
GaAsN
X-valley
L-valley
<100> <111>
G-valley
Energy
N
Eg-G = 1.42 eV EL~0.3 eV EX~0.3 eV
Avalanche photodiodes
The energy of the N-level (EN~ 1eV) is larger than the threshold energy for impact ionization (~ Eg-G).
The energy of the N-level (EN~ 0.2eV) is smaller than the threshold energy for impact ionization (~ Eg-G).
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InAsN: Impact IonizationRapid increase of current at large electric fields (>1kV/cm) due to impact ionization (IO).
-4 -2 0 2 4
-0.1
0.0
0.1
0 2 40.00
0.06
x=0.6%L=2m
5m10m
0 2 40.00
0.05
x=0%
10m
5m
L=2m
x =0.6%
x =0%
L = 10mW = 5m
I (A
)
V (V)
T=77K2mm
I
Makarovsky et al., APL 96, 052115 (2010)
At x~1%, electric fields for impact ionisation are larger than those measured in InAs, although the threshold energy is smaller
The reduction of the band gap energy by the N-atoms combined with impact ionization is of interest for IR-Avalanche Photodiodes
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Dilute nitrides
Harris, J. S. Semiconductor Science and Technology 17, 880 (2002)
N introduces tensile strain (on InAs or GaAs)disorder and strong bowing
D. Sentosa, X. Tang,a, and S.J. Chua, Eur. Phys. J. Appl. Phys. 40, 247–251 (2007)
N
InAs InN
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InAsN Photoreflectance
Where, x is the N content
Solid lines are fits to
N does not change Δso
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Fit using
Includes localized and band-band transitionsA = scaling factorEcr = energy of crossover between equationsK = smoothing parameterσ relates to slope of DOS
Set K = kBT/σ and Ecr = Eg + kBT/σ
n= 0.5 to 2 for momentum conserving non-conserving transitions
Best fit when n=1Black arrows – Eg determined from PL fittingRed arrows – PL peak
Note the difference which increases with T
Photoluminescence curve fitting
Latwoska et al, Appl. Phys. Lett 102, 122109 (2013)
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Temperature dependence
Bose-Einstein formula
Eg obtained from PLspectral fittingdeviates from PL peak value especially at T> 80K
Free carrier emission must be taken into account
fitting gives: e-phonon coupling constant, αB ~ 20 meV and average phonon temperature, θB ~ 140 K
N incorporation significantly reduces Eg in InNAsSb but has almost no effect on temperature dependence
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Comparison of change in energy gap with TInNAsSb 65 meVInAs 66 meVInSb 62 meV
whereas 1% N in GaAs reduces T dependence of Eg by 40%
Temperature dependence of bandgap
BAC model gives good agreement
T dependence of Eg in InNAsSb is notsensitive to N due to large separation between EN and EM (~ 1 eV)
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