a cross layer design exploration of charge- recycled power-delivery in many-layer 3d-ic runjie zhang...
TRANSCRIPT
![Page 1: A Cross Layer Design Exploration of Charge- Recycled Power-Delivery in Many-Layer 3D-IC Runjie Zhang Kaushik Mazumdar Brett H. Meyer Ke Wang Kevin Skadron](https://reader035.vdocuments.us/reader035/viewer/2022062805/5697bfb71a28abf838c9eb45/html5/thumbnails/1.jpg)
A Cross Layer Design Exploration of Charge-Recycled Power-Delivery in Many-Layer
3D-ICRunjie Zhang
Kaushik Mazumdar Brett H. Meyer
Ke Wang Kevin Skadron Mircea Stan
DAC 15’
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Outline
• Introduction
• Background
• PDN Modeling for 3D-IC
• Results and future work
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Introduction
• the number of physical layers in a 3DIC stack is expected to increase in the future, the already serious problems of delivering power to and removing heat from the 3D stack will be even worse.
• Previous research proposals suggest using the voltage stacking to build the power delivery network for 3D-IC
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Voltage Stacking
• 3D IC power delivery walls arise due to unsustainable increase in current
• Solution for delivering increased power without increase in current is to increase voltage
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Voltage Stacking
• Off-Chip Power Loss : times
• IR Drop : k times
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SC converter
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Switch Capacitor Model
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Switch Capacitor Model
• has 2 asymptotic limits : Slow Switching Limit () and Fast Switching Limit ()
• => Ideal Switches, Current Impulsive in nature, Impedance inversely proportional to Switching Frequency
• => Switches and capacitance resistance dominate, capacitance act as fixed voltage source, Impedance independent of Switching frequency
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Close loop and Open loop
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PDN Modeling for 3D-IC
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Simulation Setup
• Many core Processor Modeling• Use 40nm, dual-core ARM Cortex A9 and replicate it 8 times to build a single-
layer, 16core processor
• It can handle the temperature below 100 Celsius with 8 layer of its example 16 core processor
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Simulation Setup
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Results
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Results
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Results