4” svg coat and develop trackmfz140.ust.hk/eq_manual/svg coat and develop track... ·...

NANOSYSTEM FABRICATION FACILITY (NFF), HKUST

Version 1.1 of 15

Standard Operating Manual

4” SVG Coat and Develop Track


Version 1.1 of 15

Contents

1. Picture and Location

2. Process Capabilities

2.1 Cleanliness Standard

2.2 Substrate Size

2.3 Substrate Material

2.4 Photoresist

2.5 Develop

2.6 Spin Speed

2.7 Hotplate Temperature

2.8 Baking Time

3. Contact List and How to Become a Qualified User

3.1 Emergency Response and Communications

3.2 Training to Become a Qualified User

4. Operating Procedures

4.1 System Description

4.2 Safety Warning

4.3 Operation Precautions and Rules

4.4 Initial Status Checks

4.5 Initial System Checks

4.6 Photoresist Coat operation Procedure

4.6.1 Loading a program

4.6.2 Cleaning the Photoresist Dispense Nozzle

4.6.3 Loading the cassette

4.6.4 Starting the process

4.6.4.1 Dynamic dispense

4.6.4.2 Manual dispense

4.6.5 Unloading the wafer

4.7 Photoresist Develop Operation Procedure




4.7.4 Unloading the wafer

4.8 Clean Up

4.9 Check Out

4.10 SVG Track Recipe


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4” SVG Coat and Develop Track

1. Picture and Location

Fig.1 This tool is located at NFF Phase II Cleanroom Class 100.

2. Process Capabilities

2.1 Cleanliness Standard: Clean/Semi-Clean

2.2 Substrate Size: 4” round wafer

2.3 Substrate Material: Silicon, Metal coated Quartz

2.4 Photoresist: Dynamic resist dispense for FuJi Film HPR504

Manual resist dispense for NFF standard resist

2.5 Develop: FHD-5

2.6 Spin Speed: ≤ 4000rpm

2.7 Hotplate Temperature: 105°C (HMDS), 110°C(soft bake) and 120°C (hard

bake)

2.8 Temperature accuracy: +/-0.1°C

2.9 Baking Time: 60, 120, 180 and 300 sec

3. Contact List and How to Become a Qualified User

3.1 Emergency Response and Communications

1. Security Control Center: 2358-8999 (24hr) & 2358-6565 (24hr)

2. Safety Officer: Mr. Wing Leong CHUNG 2358-7211 & 64406238

3. Deputy Safety Officer: Mr. Man Wai LEE 2358-7900 & 9621-7708

4. NFF Senior Technician: Mr. Henry YEUNG 2358-7896


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5. NFF Technician: Mr. Charles TANG 23587896

3.2 Training to Become a Qualified User

Please follow the procedure below to become a 4” SVG Coat and Develop Track

qualified user.

1. Read through the on-line equipment operating manual of the equipment;

http://www.nff.ust.hk/equipment-and-process/equipment-operation-manual.ht

ml

2. Attend the equipment hand-on operation training either by peer or NFF staff.

3. If training is provided by NFF staff, user must log in NFF equipment

reservation system, and register these trainings.

4. Send an e-mail to Mr. Henry YEUNG requesting 4” SVG Coat and Develop

Track qualified exam.

5. Pass the examination for the equipment operation and security.

4. Operating Procedures

4.1 System Description

The Silicon Valley Group (SVG) 8600 Series Track is a 4” photoresist coat and

develop wafer track (Fig.2). The photoresist coat line is closest to the operator

and runs from left to right. The develop line is further away from the operator

and runs from left to right also. The photoresist coat line contains four modules,

HMDS Prime oven, cool plate, spinner and soft bake oven. The photoresist coat

line is controlled by the left and the middle controller. The left controller

manages HMDS and cool plate. The middle controller manages spinner and soft

bake oven (Fig.3). The develop line contains two modules, spinner and hard bake

oven. They are controlled by the right controller (Fig.4).


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1. 4” SVG Track Figure

Fig.2 4” Photoresist coat and develop wafer track

2. Coat Track Controller

Fig.3 Coat and soft bake oven controller

Station Select Program Select

Develop Send Indexer Coat Send Indexer

Develop Receive Indexer

Coat Receive Indexer

Coat Cover

Temperature Controllers Coat Controllers Develop Controller

HMDS

Cool plate Soft bake

Hard bake

Develop

EMO

Event Select

Power Button Index Reset Button

Start Button


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3. Develop Track Controller

Fig.4 Develop and hard bake oven controller

Power button: Applies all operating voltages from the power supply module to the

card cage and the mechanical track.

Start: Begins processing of wafers if a loaded cassette is in place on the send indexer.

Restarts processing after any STOP command.

Station Select: Use to access either the spin or bake process station for programming.

Program Select: Use to select one of the nine process programs store in RAM

memory.

Event Select: Used to display the operation and associated process parameters

programmed for any of the nine possible events or steps in a designated process

program.

Index Reset: Depress INDEX RESET once. Send indexer is returned to top position.

Depress INDEX RESET twice. Receive cassette is returned to top position.

4.2 Safety Warning

1. Follow NFF Health and Safety Manual.

2. Never operate the system with covers removed.

3. Never operate system without trained and approved by NFF staff.

4. Never operate the system without exhaust.

5. Covers and process cups may only be removed by authorized personnel!

6. Do not place your hand in the path of the track’s moving parts and indexer.

Index Reset Button

Start Button

Power Button Station Select Program Select


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7. Resists may have irritating effects to eyes, skin and mucous membranes! Read

and obey Material Safety Data Sheet (MSDS) of the corresponding materials

used in the system!

8. The substrate, the hotplate and its cover are hot. Touching can lead to skin burns.

9. If an error or problem occurs, stop all work immediately. Leave notice that the

machine is not to be used and contact the staff. Do not attempt to fix the problem.

10. The Emergency Off – Button (EMO Button) shuts down the machine

immediately. Only use the EMO in emergency situations. Emergency situations

are where injury of personnel or serious damages of the system impends

immediately.

11. According to the general fire emergency procedure of HKUST, please report the

accident to the Security Control Center first. The nature of other emergencies will

determine whether you will call police, staff, or both. If someone is injured, the

9-999 emergency number should be called before calling staff. If there is a facilities

problem, such as a flood or a utility problem that does not present a danger to lab

users but may result in damage to equipment, the staff or FMO need to be called.

The 9-999 emergency should not be called for facility or equipment problem.

Always call 9-999 when a potentially life threatening situation might exist (injury,

fire, gas leak, etc.)

4.3 Operation Precautions and Rules

1. Do not operate the equipment unless you are properly trained and approved by

NFF Staff.

2. Please check the checklist and fill all the details of the log sheet attached.

3. Wipe with a fresh cleanroom wiper with Acetone or IPA to clean the rim of resist


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bottle after each use if manual apply the photoresist to your wafer.

4. Return small resist bottle back to assigned small resist bottle storage cabinet after

each use.

5. Do not remove the cassette if the elevator is not at the top.

6. No temperature change of the hotplate stations.

7. Use NFF standard photoresist only, No polyimide, No double side coating, No

SU8, No LOL2000 and No PDMS in this track.

8. Remember to place the wafer face up.

9. Close the coater cover doors after each use.

10. All recipe programming is done by NFF Staff. If you need a special recipe, you

may request a new recipe to Staff.

4.4 Initial Status Checks

1. Please check the status of shutdown notice posted in the NFF reservation

website.

2. Please check-in the equipment via card reader.

3. Before operate the machine, please check the checklist and fill all the details of

the log sheet attached.

4.5 Initial System Checks

Before starting, verify the machine is in the correct idle state:

1. Verify the system is Power ON. If machine is off, do not reboot. Contact staff on

the “contact list”.

2. Verify that exhaust systems are properly connected.

3. Check photoresist waste container is not full under track.

4. Check the HPR 504 supplied is not empty under track (Fig.5).


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Fig.5 HPR504 and Waste Container

5. Check track is in AUTO mode for Coater and Develop line. You can choose

“AUTO” mode by pressing the Manual-Single-Auto key until the LED light

next to “AUTO” is illuminated.

6. Verify the track is in the standby state. There should no wafers are processing

and the elevator of indexer at the top position.

7. Make sure that no objects are blocking the path of the moving parts.

8. Check the hotplate temperature (Fig.6).

Fig.6 HMDS, Soft Bake, Hard Bake oven controller

4.6 Photoresist Coat Operation Procedure


1. Select your desired HMDS program.

HMDS Soft Bake Hard Bake

HPR504 Waste Container


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If you need HMDS, select Program 1, press number 1 followed by the

PROGRAM SELECT button or scroll through all programs by pushing the

PROGRAM SELECT button repeatedly until the desired program is displayed

on left controller. Other programs are not HMDS.

2. Select your desired dispense program.

Note that the middle controller is 2 separate display windows on the control

panel. The upper display window shows parameters for Coater. The lower

display window shows parameter for OVEN. In order to select the dispense

program, the COATER display is selected, a “*” sign appears at the left of the

COATER display and when the OVEN display is selected, a “+” sign appears at

the left of the OVEN display. You can press “STATION SELECT” button to

switch between the active displays for COATER or OVEN controller on the

control panel keyboard. To select different programs, please see above

instruction.

3. Select your desired oven program.

Active the OVEN display and select desired program as above instructions. The

OVEN is 110°C fixed.

4.6.2 Cleaning the Photoresist Dispense Nozzle

The coat track is set to dispense FujiFilm HPR504 positive photoresist. If you

need manual to pour photoresist, you can skip this section.

1. A resist nozzle that has not been used for more than 30mins. The dried resist

may be formed at its tip to affect the uniformity and cause the particulate

problem.

2. Take an acetone squirt bottle from the Acetone/IPA cabinet and cotton stick


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from cotton stick storage box.

3. Wipe the nozzle with acetone moistened cotton stick before running your

dummy wafer. (Remember gently to wipe the nozzle).

4. Return the acetone squirt bottle back to the cabinet and dispose used cotton

stick.


1. If necessary, press INDEX RESET button once to bring the send

indexer up to top position, or twice for the receive indexer up to top position. If

you press the INDEX RESET button, you must remove the cassettes completely

off the elevator and put them on the elevator to reset the send and receive

elevator purpose for the cassette to go down.

2. Load an empty cassette on the receive indexer (right side, Fig.7).

3. Load the cassette containing your device wafers (face up) and 1 or 2 dummy

wafers (at the bottom) on the send indexer (left side). The dummy wafers might

have some resists on the front side. If you re-use them, make sure the backside

without resist.

Fig. 7 Place cassette on Send Indexer and Receive Indexer

Send Indexer Receive Indexer


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4.6.4.1 Dynamic Dispense

1. Press START button on the middle controller keypad. The receive cassette and

send cassette will lower until it senses a wafer. The wafer will be transferred to

the HDMS prime oven for priming, cool plate, spinner for the dispense

procedure, then to the OVEN for soft baking, and receive cassette.

2. The process step will be displayed on the display of controller.

4.6.4.2 Manual Dispense

1. Press START button on the middle controller keypad. The receive cassette

and send cassette will lower until it senses a wafer. The wafer will be

transferred to the HDMS prime oven for priming, cool plate and then spinner

(Fig.9).

2. Take out the desired standard photoresist bottle from standard photoresist

storage cabinet and pick a piece of polyester cleanroom wiper.

3. After wafer transfer to spinner, spindle lower down, open the coater cover door.

Pour the photoresist to the wafer (10sec for you to apply the photoresist). You

should cover at least the central 1/3 of the sample.

4. Close Coater Cover Door.

5. Wipe with a fresh polyester cleanroom wipe with Acetone to clean the rim of

resist bottle after each use.

6. The process step will be displayed on the display of controller


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Fig. 8 The flow to pour the resist on the wafer

4.6.5 Unloading Wafer

1. After the track has finished processing all wafers, the receive indexer will not

move to the top. Do not remove the cassette if the elevator is not at the top.

2. Double click the INDEX RESET button on the middle controller to

move the receiver elevator to the top.

4.7 Photoresist Develop Operation Procedure


Follow the section 4.6.1


Follow the section 4.6.3


1. Press START button on the right controller keypad. The receive cassette and

Cool plate Open cover door and resist bottle

Pour resist Close cover door and clean rim


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send cassette will lower until it senses a wafer. The wafer will be transferred to

the Develop Station for developing, oven for hard bake if you select, then

receive cassette (Fig.9).

2. The process step will be displayed on the display of controller.

.

Fig. 9 The flow to develop wafer

4.7.4 Unloading Wafer

Follow the section 4.6.

4.8 Clean Up

1. Dispose used cleanroom wiper to Rubbish bin and change the gloves if necessary.

2. Return dummy wafer photoresist bottle back to the original place

4.9 Check out

1. Check out the equipment via card reader immediately after use.

2. Fill in the details, problems or comments in the log sheet.

Puddle develop

Rinse Spin dry

Load wafer


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4.10 SVG Track Recipe

Program Descriptions

PRIME / OVEN ( Track 1A )

1 HMDS prime, 105 C, 30 sec

2 – 9 Not used

COATER ( Track 1B) 1 Dynamic dispense, 4000 rpm, 30 sec. with front side and backside rinse

2 Manual dispense, 4000 rpm, 30 sec. with backside rinse only

3 Dynamic dispense, 4000 rpm, 30 sec. with backside rinse only

4 Manual dispense, 4000 rpm, 30 sec. with front side and backside rinse

5 – 7 Defined by users

6 Manual dispense, 4000 rpm, 30 sec. with backside rinse only

8 Front side and backside rinse

9 For spin speed checking

OVEN ( Track 1B ) for COATER 1 Soft bake, 110 ºC, 60 sec.

2 Soft bake, 110 ºC, 90 sec.




6 Proximity bake, 110 C, 60 sec

7 – 9 Not used

Developer ( Track 2A ) 1 For puddle develop 65 sec

2 For puddle develop 130 sec.



5 – 7 Not used

8 Rinse only

9 For spin speed checking

OVEN ( Track 2A ) for Developer 1 Hard bake, 120 C, 60 sec

2 Hard bake, 120 C, 90 sec

3 Hard bake, 120 C, 120 sec

4 – 9 Not used

ARM PROGRAM for COATER ( Track 1B ) 1 Move the arm to starting position of dynamic dispense

2 Arm motion for dynamic dispense

3 Move the arm to the home position

4 Move the arm to the wafer edge

5 Arm motion for removal the front side edge beam of the wafer

6 – 9 Not used

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