4._11301200_metal & equipment for hb led_semicon taiwan 2011
TRANSCRIPT
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Material and Equipment
Technologies for HB-LED
Manufacturing
2011 Brewer Science, Inc.
Ram K. Trichur
Director, Strategic Business Unit
SEMICON West 2011
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Slide 2Brewer Science, Inc., SEMICON Taiwan, 2011
Brewer Science Delivers Solutions
to These Markets
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Slide 3Brewer Science, Inc., SEMICON Taiwan, 2011
Brewer Science
In 1981, invented the anti-reflective coatingsmarketplace Maintain market share dominance for BARC 30 years of innovation enabling our customers to
overcome critical industry challenges
Global supply and support network
Corporate Headquarters, Rolla, Missouri Dr. Terry Brewer, President, CEO, Founder
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Slide 4Brewer Science, Inc., SEMICON Taiwan, 2011
Brewer ScienceSolutions for Advanced Packaging
Generic LED Fab Process Flow
Backend
ProcessesSubstrate
Growth
MOCVD
Processes
Front-End Chip
Manufacturing
Thin Wafer
Handling
TSV Creation/
Micromachining
Advanced
Interconnects
Surface
Modification
Planarization
Brewer Science offers varioustechnology solutions for advancedpackaging in LED manufacturing
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Slide 5Brewer Science, Inc., SEMICON Taiwan, 2011
Brewer ScienceSolutions for Advanced Packaging
Thin WaferHandling
TSV Creation/
Micromachining
Advanced
Interconnects
Surface
Modification
Planarization
Temporary Bonding Materials
Benchtop Wafer Debonding Tools
Adhesion Promoters
Low-Surface-Energy Materials
Self-Leveling Planarization Materials
Contact Planarization
Acid- & Base-Resistant Materials
Scratch-Resistant Materials for DRIE
Carbon NanotubeBased Conductors
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Slide 6Brewer Science, Inc., SEMICON Taiwan, 2011
Chemical Release
Technology
Slide Debonding
Technology
ZoneBONDTM
Technology
Brewer ScienceSolutions for Thin Wafer
HandlingHigh-Temperature-CapableTemporary Bonding Technology
Perforated Carrier
Solvent for Chemical Release
Low cost of ownershipand low initial investment Suitable for low-volumeoperations
Commercial technologyusing WaferBOND
CR-200 coating
Slide
Slide
Heat
Wafer sizes up to 300 mm
Automated and semi-automated debondingtools available
Commercial technologyusing WaferBOND
HT-10.10 coating
ZB Carrier
Release
Zone
Adhesive on Device
Stiction Zone
Alpha-stage technology
Room temperaturedebonding capability Higher throughput
capability
Compatibility - 100 mm to300 mm wafers possible
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Slide 7Brewer Science, Inc., SEMICON Taiwan, 2011
Motivation for Temporary Bonding
Wafer-Level Electrical Redistribution An intermediate 3-D TSV interposer can be
used between the LED component and the
PCB to drive electrical current and heataway from the LED chip
Temporary bonding is widely used in thefabrication of Si-based TSV interposers
AlN
LED chip
Si submountwith Cu TSVsCu-filledTSVs
Layer Transfer or Laser Lift-Off (LLO)Process Temporary bonding demands are increasing with
need for LLO technique - creating need to handlethin wafers using temporary bonding
Carrier
Sapphire
Laser
GaNMirror
Thin Wafer
handling
Courtesy of Shinko
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Slide 8Brewer Science, Inc., SEMICON Taiwan, 2011
Layer Transfer ProcessSapphire wafer with
active epi layer
Coat WaferBOND
material and bond totemporary carrier
Growth substrate
separation and n-side processing
Debond chip wafer
from temporary
carrier and cleanWaferBONDmaterial
Material Requirements for Layer Transfer Processes:
Stability during high-temperature processing (~ 250C)Ability to withstand acid or alkaline treatmentsStability during vacuum, CVD processesThin wafer handling capability to support epi and chip carrierSupport high shear stress during backgrinding (if not using LLO process)
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Slide 9Brewer Science, Inc., SEMICON Taiwan, 2011
Temporary Wafer Bonding Process
Supports all thin-wafer processes:
Layer transfer processes Grinding and thinning growth
substrates (sapphire or other)
Interposer layer orthrough-viaprocessing
Brewer Science provides complete
solution:
Uses standard bonding tools Brewer Science provides bonding
materials and process support
Brewer Science suppliesdebonding equipment
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Slide 10
Chemical Resistance of
WaferBONDHT-10.10 Material
15-m film on 4-inch Si wafer hot plate baked at 100C for 2 min
followed by a hot plate bake at 160C for 2 min
*HMDS pretreatment must be used for TMAH processing stability
Chemistry BathTemperature
Time Results
Acetone 25C 25 min film unchanged
0.26N TMAH* 60C 30 min film unchanged
6N HCL 60C 30 min film unchanged
15% H2O2 60C 40 min film unchanged
30% NH4OH 25C 30 min film unchanged10% KI in H2O 25C 20 min film unchanged
EtOH 25C 5 min film unchanged
MeOH 25C 5 min film unchanged
IPA 25C 5 min film unchanged
Cyclohexanone 25C 5 min film unchanged
Ethyl Lactate 25C 5 min film unchanged
PGMEA 25C 5 min film unchanged
PGME 25C 5 min film unchanged
30% HCL 25C 90 min film unchanged
70% HNO3 25C 1 hr film unchanged
30% KOH 85C 1 hr film intact, but peeling atedges
WaferBONDHT-10.10 bonding material has been shown to be stable through a widevariety of wet chemical processes used during TSV creation
I will insert 2 images
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Slide 11
WaferBONDTechnology in TSV Application
WaferBONDHT-10.10material coated on
device wafer
Bonded tocarrier
Thinneddevice wafer
TSV creation
Debonded
TSV wafer
70-m thick wafer, 1:1
aspect ratio vias, copper
redistribution layer
Silicon interposer, RDL - Fuji
All processing, including via etching, passivation, and
metallization, is completed at wafer level
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Chemical Release
Technology
Slide Debonding
Technology
ZoneBONDTM
Technology
Brewer ScienceSolutions for Thin Wafer
HandlingHigh-Temperature-CapableTemporary Bonding Technology
Perforated Carrier
Solvent for Chemical Release
Low cost of ownershipand low initial investment
Suitable for low-volumeoperations
Commercial technologyusing WaferBOND
CR-200 coating
Slide
Slide
Heat
Wafer sizes up to 300 mm
Automated and semi-automated debondingtools available
Commercial technologyusing WaferBOND
HT-10.10 coating
ZB Carrier
Release
Zone
Adhesive on Device
Stiction Zone
Alpha-stage technology
Room temperaturedebonding capability Higher throughput
capability
Compatibility - 100 mm to300 mm wafers possible
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Debonding Process Chemical Release
Slide 13
Thinned device
substrate
Perforated wafer
as carrier
Features Spin-applied thermoplastic bonding material - WaferBOND CR-200
material
Debonded and released in a solvent low-stress process Compatible with most wafer sizes Low equipment cost for demounting Suitable for low-volume applications
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Debonding Process Chemical Release
Slide 14
SeparationJig
Removal Solvent Perforated Carrier
Low-stress solvent bath demounting from carrier
Separated Device Wafer
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Slide 15Brewer Science, Inc., SEMICON Taiwan, 2011
Debonding Process - Slide Debonding
Slide
Slide
Heat
Spin rinse with
solvent & spin dry
Thinned device
substrate
Reuse carrier
Thinned device
carrier
Enabled by
WaferBOND family of temporary bonding materials Cee 1300DB thermal slide-off debonding tool
Features
Semi-automated or automated debonding process Compatible with wafer sizes up to 300 mm Suitable for R&D to high-volume applications
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Slide 16Brewer Science, Inc., SEMICON Taiwan, 2011
Cee1300DB Slide Debonding Tool
Proven on:
Sapphire Silicon Silicon carbide GaAs, InP Multiple diameters
(3, 4, 6, 8, and 12 in)
Semiautomatic, tabletop thermal slide-off debonding tool for use
with WaferBONDtemporary bonding material.
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Room Temperature Separation ZoneBOND
System
Basic Process Flow:
1. Coat polymer adhesive on device
2. Create carrier: Release zone & stiction zone
3. Bond face to face
4. User processes: Thin, pattern, etc.
5. Remove stiction zone adhesive
6. Mount device side on film frame
7. Separate carrier from adhesive
8. Clean adhesive from device
Device
Carrier
Stiction ZoneRelease ZoneZB Carrier
Adhesive on Device
1
2
Device
Carrier
Polymer Adhesive3
4
Thin Device
7
8
5 6&
Alpha-stage technology
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Room Temperature Separation ZoneBOND
System
Slide 18
Features Low mechanical & thermal stress on
device wafer
Separate carrier away from adhesive,not device
Room temperature debonding Enables the use of adhesives that are
tolerant of higher temperatures
Eliminates the conflict of adhesivetemperature capability versustemperature requirements fordebonding
Designed for higher debondingthroughput
Compatible with wafer sizes 100 mm to300 mm
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Summary
Brewer Science is an established technologypartner in the microelectronics industry with
strong expertise in IC, MEMS, optoelectronics,
nanotechnology, and compound
semiconductors
We provide strong expertise in thin waferhandling and advanced packaging with material
and equipment technologies for LED
manufacturing
Slide 19