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Page 1: 3Gb/s SDI Demo Board: Xilinx Version€¦ · 01/08/2009  · GS4911B Lock/Ref Status U22, U23. 3Gb/s SDI Demo Board: Xilinx Version User Guide 52857 - 1 August 2009 9 of 53 Proprietary

3Gb/s SDI Demo Board: Xilinx Version

User Guide

1 of 53

Proprietary & Confidential

3Gb/s SDI Demo Board: Xilinx VersionUser Guide52857 - 1 August 2009

www.gennum.com

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Contents

1. Overview..........................................................................................................................................................4

1.1 Features ...............................................................................................................................................4

1.2 Featured Devices ..............................................................................................................................4

2. Hardware .........................................................................................................................................................5

2.1 Gennum 3Gb/s SDI Demo Board .................................................................................................5

2.2 Xilinx Spartan-3A DSP 1800 Board ............................................................................................9

3. Detailed Description.................................................................................................................................. 10

3.1 Switches and Settings ................................................................................................................... 10

3.1.1 Power Switch (SW1).......................................................................................................... 10

3.1.2 Operating Modes (SW3 Bits 1-3)................................................................................... 10

3.2 Jumpers ............................................................................................................................................. 11

3.2.1 Video Source Selection (J13, J14).................................................................................. 11

3.2.2 FPGA PROG_B (JP7) .......................................................................................................... 11

3.2.3 Optical Module Enable (JP4) .......................................................................................... 11

3.3 LED Indicators ................................................................................................................................ 12

3.3.1 Power LED (D1) .................................................................................................................. 12

3.3.2 Lock Status LEDs (U4, U5, U13, U14, U22 and U23) ............................................... 12

3.3.3 Test Pattern Generator Status LEDs (D7-14) ............................................................. 12

3.3.4 FPGA Configure Done LED (D1) ................................................................................... 12

3.3.5 FPGA Reset LED (D6) ........................................................................................................ 13

3.4 Connectors ....................................................................................................................................... 13

3.4.1 Video Inputs A IN (J3, J4) and B IN (J6) ....................................................................... 13

3.4.2 AES Audio Inputs (J10, J11) ............................................................................................ 13

3.4.3 External Sync (J12) ............................................................................................................ 13

3.4.4 Optical Connector (U30).................................................................................................. 13

3.4.5 SDI Outputs (J8, J9) ............................................................................................................ 13

3.4.6 SDI Loop-Through (J5)...................................................................................................... 13

3.4.7 Audio Outputs (J1, J2)....................................................................................................... 14

3.4.8 GSPI Header (J7)................................................................................................................. 14

3.4.9 EXP Connector (JX1) ......................................................................................................... 14

3.5 Push Buttons .................................................................................................................................... 17

3.5.1 Reset (SW4) .......................................................................................................................... 17

3.5.2 Test Pattern (SW7 & SW8) ............................................................................................... 17

3.5.3 Test Pattern Video Standard (SW5, SW6) .................................................................. 18

3.5.4 SPI PROM Programming (J10)........................................................................................ 19

Version ECR Date Changes and / or Modifications

1 152458 August 2009 Updates to Figure 2-1 and Figure 2-2. Additional information added for enabling

the Optical Module.

0 152134 June 2009 New document.

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3.5.5 JTAG Programming (J2).................................................................................................... 19

4. Getting Started............................................................................................................................................. 20

4.1 Quick Start Guide .......................................................................................................................... 20

4.2 FPGA Configuration ..................................................................................................................... 22

4.2.1 JTAG Direct.......................................................................................................................... 22

4.2.2 SPI PROM.............................................................................................................................. 22

5. Advanced User Guide ............................................................................................................................... 22

5.1 Top Level Architecture ................................................................................................................ 22

5.2 Clock Tree and Data Path ............................................................................................................ 23

5.3 Pattern Generator .......................................................................................................................... 24

5.3.1 Top Level Architecture .................................................................................................... 25

5.3.2 Reset Network .................................................................................................................... 25

5.3.3 Clock Generator ................................................................................................................. 27

5.3.4 Colour Bar Generator ....................................................................................................... 27

5.3.5 20b to 10b Mux................................................................................................................... 28

5.4 Optical Module ............................................................................................................................... 29

5.5 Data Path .......................................................................................................................................... 31

5.6 I/O Timing Closure ........................................................................................................................ 31

5.7 Clock Termination ......................................................................................................................... 32

5.8 FPGA User Constraints ................................................................................................................ 33

5.8.1 Input Data Window Specification ............................................................................... 33

5.8.2 Internal Clock Constraints.............................................................................................. 33

5.8.3 MAXDELAY Constraints ................................................................................................. 33

5.8.4 Location Constraints......................................................................................................... 33

5.8.5 Non-Clock_Dedicated_Route........................................................................................ 34

5.8.6 Input Delay Adjustment.................................................................................................. 34

5.8.7 Output Timing Adjustment ............................................................................................ 34

5.9 Host Interface and Register Map .............................................................................................. 35

5.10 Suggestions .................................................................................................................................... 35

6. Related Documents.................................................................................................................................... 36

6.1 Gennum's Documentation .......................................................................................................... 36

6.2 Xilinx's Documentation ............................................................................................................... 36

7. Appendix....................................................................................................................................................... 37

7.1 Schematics ....................................................................................................................................... 37

7.2 Board Layout ................................................................................................................................... 48

7.3 Bill of Materials ............................................................................................................................... 50

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1. Overview

The 3Gb/s SDI Demo Board is designed to demonstrate the functionality, flexibility and implementation simplicity of Gennum’s 3G/HD/SD SDI devices. The Demo Kit consists of a 3Gb/s SDI Demo Board, FPGA source code and PC software. Paired with an additional Xilinx Spartan-3A DSP 1800A Board, it makes a versatile demo/evaluation platform for Gennum's 3Gb/s products. It is expected to help the users in system design with Gennum 3Gb/s devices.

The purpose of this document is to describe the functionalities and contents of Gennum's 3Gb/s SDI Demo Board for the Xilinx Spartan-3A DSP 1800A Board. Also included are a Quick Start Guide and an Advanced User Guide. If a quick start is anticipated, Please go to 4.1 Quick Start Guide.

The Schematics, Board Layout and the Bill of Materials are given in the Appendix section at the end of this document.

1.1 Features• Three 3G-SDI inputs with associated GS2974B Equalizers;

• Two Gennum GS2970 Receivers

• One 3G-SDI loop-through output

• Two Gennum GS2970 Transmitters

• External Sync input followed by a Gennum GS4911B Clock and Timing Generator

• Provision for a Gennum GO2921 Optical Transceiver (not supplied with the board)

• HSMC Connector Interface to Xilinx FPGA Board

• Two AES inputs for audio embedding

• Two AES outputs for audio de-embedding

• A standard Gennum SPI header

• Status indication LEDs and control jumpers

• Pass-through Mode

• Dual-Link to 3Gb/s conversion

• 3Gb/s to Dual-Link conversion

• Stand alone Video Test Pattern Generator (Both Genlock or Free-run)

• Audio embedding and de-embedding

• GSPI Daisy Chain

1.2 Featured DevicesGS2970 SD/HD/3G SDI Receiver complete with SMPTE Audio and Video Processing

GS2972 SD/HD/3G SDI Transmitter complete with SMPTE Audio and Video Processing

GS2974B Adaptive Cable Equalizer

GS2978 Multi-rate Dual Slew Rate Cable Driver

GS4911B HD/SD/Graphics Clock and Timing Generator with GENLOCK

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2. Hardware

When you receive the 3Gb/s SDI Demo Board, the kit includes:

• A 3Gb/s SDI Demo Board

• A Gennum Serial Peripheral Interface (GSPI) Dongle

Other items to be supplied by the customer:

• A Spartan-3A DSP 1800 Board

• A PC or laptop with ISE or iMPACT installed (optional)

• Xilinx Parallel Cable IV or Platform Cable USB II (optional)

2.1 Gennum 3Gb/s SDI Demo BoardFigure 2-1 shows the top side of the 3Gb/s SDI Demo Board:

Figure 2-1: Top Side of the 3Gb/s SDI Demo Board

AES Audio Output 1 (J1)

SDI Loop-through (J5)

SDI Input AIN1 (J3)

SDI Input AIN2 (J4)

SDI Inputs BIN1 (J6)

SDI Output AOUTn (J8)

SDI Outputs BOUTn (J9)

GSPI Header (J7)

Power StatusLED (D1)

Des Lock Status (U4, U5)

Ser Lock Status (U13, U14)

Source Selection (J13, J14)

AES Audio Input 1 (J10)

External Sync Input (J12)

Optical Transceiver Footprint (U30)

AES Audio Output 2 (J2)

AES Audio Input 2 (J11)

GS4911B Lock/RefStatus (U22, U23)

Optical Module Enable (JP4)

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Figure 2-2 show the bottom side of the 3Gb/s SDI Demo Board:

Figure 2-2: Bottom side of the 3Gb/s SDI Demo Board

NOTE: The board you receive may not look exactly the same as the board shown in Figure 2-1 and Figure 2-2 in terms of revision code, date code, etc.

Figure 2-3 shows the Gennum SPI Dongle Board:

Figure 2-3: Gennum SPI Dongle Board + Ribbon Cable

Parallel Connector (JX1)

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Figure 2-4 shows a block diagram of the features and signal flows of the 3G/s SDI Demo Board:

Figure 2-4: Block Diagram of the 3Gb/s SDI Demo Board

GS29703Gb/s, HD, SDSDI Receiver

Optical Transceiver Footprint

GS2972

GS2972

GS2974BEQ

PowerConditioning

SPIExtender

10

5

10

5

10

10

9

3

4

To Gennum parts

Data

STAT [0:4]

PCLK

Data

PCLK

PCLK

HVF

GSPI In

To pin control

GSPI

HVF 3

Data

PCLK

4Serial Audio

4Serial Audio

Data

AES Audio

AES Audio

SyncSeparatorGS4911B

Timing

PCLK

STAT [0:4]

A In

B In

A Out

B Out

Differential

Single-ended

Bus

A Loopback

EXT Sync.

GS2974BEQ

GS2974BEQ

GS2978CD

3Gb/s, HD, SDSDI Transmitter

3Gb/s, HD, SDSDI Transmitter

GS29703Gb/s, HD, SDSDI Receiver

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Table 2-1: 3Gb/s SDI Demo Board Legend

Description Label

SDI Input AIN1 J3

SDI Input AIN2 J4

SDI Input BIN1 J6

SDI Output AOUTn J8

SDI Output BOUTn J9

GSPI Header J7

AES Audio Input 1 J10

AES Audio Input 2 J11

Parallel Connector JX1

SDI Loop-through J5

AES Audio Output 1 J1

AES Audio Output 2 J2

Power Status LED D1

Receiver Lock Status Indicators U4, U5

Transmitter Lock Status Indicators U13, U14

Video Source Selection Jumpers J13, J14

External Sync Input J12

GS4911B Lock/Ref Status U22, U23

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2.2 Xilinx Spartan-3A DSP 1800 BoardFigure 2-5 shows the Xilinx Spartan-3A DSP 1800A Board. The switches, FPGA, connectors, jumpers, push buttons and LEDs used in this Demo Kit are highlighted in this figure:

Figure 2-5: Xilinx Spartan-3A DSP 1800A Board

HSMC (JX2)

Reset Button (SW4)

PWR (SW1)

5V DC In(J5)

OP Mode (SW3)

Reset LED (D6)

PG Std & Pattern (SW5, 6, 7 & 8)

SPI HDR (J10)

PROG_B (JP7)

JTAG (J2)

LEDs (D7-14)

FPGA (U6)

FPGA Config Done (D1)

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3. Detailed Description

This section describes the frequently used devices and their functions. For unused jumpers, switches, LEDs on the FPGA board, please refer to UG485 Getting Started with the Spartan-3A DSP S3D1800A Starter Platform User Guide.

3.1 Switches and Settings

3.1.1 Power Switch (SW1)

The PWR (SW1) on the Xilinx Spartan-3A DSP 1800A Board controls the power of the boards.

3.1.2 Operating Modes (SW3 Bits 1-3)

The current release of the FPGA code supports five distinct modes of operation: Pass-through, 3G Level B to Dual-Link, Dual-Link to 3G Level B, Test Pattern with Genlock and Test Pattern with Free-run modes. The operating mode can be set through a dip switch (SW3 bits 1-3), or by programming the FPGA’s internal registers through the SPI. Table 3-1 details how the operating mode is selected by the dip switches on the Xilinx Board:

Video Pass-Through mode: Received video from input A is passed to output A, and input B passed to output B without any process. All SD, HD and 3G formats are supported. For 3G, the default setting is Level A. If Level B is anticipated, the configuration for the GS2972 must be changed through the SPI.

3G Level B to Dual-Link mode (HD): 3G Level B video from input A is passed to outputs A and B as a two HD stream output.

Dual-Link (HD) to 3G Level B mode: Two HD signals, with the same standard, from inputs A and B are multiplexed onto a 10-bit stream and passed to output A. By default, the GS2972 is configured to output a 3G Level B video signal.

Table 3-1: Operation Modes set by SW3 on Xilinx Board

Dip Switch State Operation Mode Notes

SW3: Bits 1, 2, 3 OFF/OFF/OFF Video Pass-through All standards

OFF/OFF/ON 3G Level B to Dual-Link −

ON/OFF/OFF Dual-Link to 3G Level B YCbCr 422 10b. The monitor set to 1080i59.94

ON/ON/OFF Genlock Test Pattern Selected standards

ON/OFF/ON Free-run Test Pattern All standards and patterns

SW3: Bits 4 - 8 Not defined

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Stand-alone Video Test Pattern Generator - Free-Run Mode: The system generates a video test pattern signal using clock and timing from the GS4911B, with the GS4911B in free-run mode.

Stand-alone Video Test Pattern generator - Genlock Mode: Video test patterns are generated using clock and timing signals from the GS4911B, derived from an external Genlock source.

Other modes which may be implemented through a GS2970/72 configuration change are: 3G Level A to Dual-Link and Dual-Link to 3G Level A.

NOTE: the dip-switches on the Xilinx FPGA board are found to be unreliable after hundreds of times switching.

3.2 Jumpers

3.2.1 Video Source Selection (J13, J14)

Selection of the video input can be done from either the FPGA or from the jumper headers (J13 and J14) on the 3Gb/s SDI Demo Board.

When the jumpers are open (removed from the header), the FPGA takes over the control of the video input multiplexers. When the FPGA outputs ‘ones’, the jumper can override the settings.

Table 3-2 shows the selections available through jumpers J13 and J14:

3.2.2 FPGA PROG_B (JP7)

When the SPI PROM is programmed, the FPGA may be configured with Master Serial Mode. To do that, added a shunt on JP7 and program and SPI PROM using a Xilinx programming cable. Power-down the board and remove the shunt after programming. For more details, refer to Xilinx document xapp1053.pdf, “Flash Memory Boot Loading Using SPI with Spartan-3A DSP 1800A Starter Platform”.

3.2.3 Optical Module Enable (JP4)

Add a shunt on JP4 to enable the Optical Module.

Table 3-2: Video Source Selection by Jumpers on 3Gb/s SDI Demo Board

Jumper Video Path Jumper State Input Selected

J13 A Open AIN1

Closed AIN2

J14 B Open BIN1

Closed Optical

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3.3 LED Indicators

3.3.1 Power LED (D1)

D1 on the 3Gb/s SDI Demo Board indicates the power on/off state of the boards.

3.3.2 Lock Status LEDs (U4, U5, U13, U14, U22 and U23)

U4, U5, U13, U14, U22 and U23 on the 3Gb/s SDI Demo Board are bi-colour LEDs. They indicate the lock status of the Gennum Transmitter, Receiver and Clock/Timing devices.

3.3.3 Test Pattern Generator Status LEDs (D7-14)

LEDs D7-14 on the Xilinx Board indicate the type of the test pattern, the video standard, the clock lock status, 3G/HD, and configuration status.

3.3.4 FPGA Configure Done LED (D1)

D1 on the Xilinx Board indicates the FPGA configuration done status. When D1 (blue LED) is on, the FPGA configuration is completed from either the SPI PROM or JTAG.

Table 3-3: Lock Status

LED Function Green Red

U4 GS2970 A, U8 Lock Status Locked Unlocked

U5 GS2970 B, U11 Lock Status Locked Unlocked

U13 GS2972 A, U15 Lock Status Locked Unlocked

U14 GS2972 B, U16 Lock Status Locked Unlocked

U22 GS4911B, U19 Lock Status Locked Lock Lost

U23 GS4911B, U19 Ref Status Detected Lost

Table 3-4: LED D7-14 on the Xilinx Board

LED Description

D7, D8, D9, D10 Video Standard of the Test Pattern

D11 ON = Busy in configuration

D12 ON = Test Pattern Clock Locked

D13 Test Pattern Std: ON = 3G, OFF = HD

D14 ON = Tx/Rx/Genlock devices are configured

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3.3.5 FPGA Reset LED (D6)

D6 on the Xilinx Board indicates the FPGA reset status. When it is on, the FPGA is reset by the push button (SW4) or the power-on-reset circuit.

3.4 Connectors

3.4.1 Video Inputs A IN (J3, J4) and B IN (J6)

The 3Gb/s SDI Demo Board includes three SDI inputs. The applied SDI stream will first pass through Gennum's GS2974B Cable Equalizer before entering the Micrel SY58017U Mux. The output of the Mux is fed into the SDI input pins of the GS2970.

3.4.2 AES Audio Inputs (J10, J11)

Up to four channels of audio are supported by the Demo Board. Group One can be connected directly to the GS2972 as AES (J10, J11).

This configuration is meant to allow users to have the capability of evaluating audio embedding. For SD audio, when embedding audio with both groups, the audio needs to be synchronized externally.

3.4.3 External Sync (J12)

Gennum's GS4911B may be connected to the sync separator to provide synchronization to an external video timing reference. When in Free-run mode, the GS4911B can also be used to provide clock and timing signals for the stand-alone Pattern Generator.

3.4.4 Optical Connector (U30)

Optionally, a Gennum GO2921 Optical Module (U30) may be plugged into the cage provided. The GO2921 is an optical transceiver which allows input of a signal via optical fibre, and outputs a video signal from one of the GS2972 Transmitters (U15, U16). 3Gb/s, HD and SD video signals are supported.

3.4.5 SDI Outputs (J8, J9)

Two BNC connectors for SDI outputs, J8 and J9, are connected to the two GS2972 Transmitters U15, U16 respectively.

3.4.6 SDI Loop-Through (J5)

A re-clocked or non-re-clocked buffered version of the input stream from GS2970A is available on the serial loop-through output (J5). It is designed to be SMPTE compliant for voltage level, rise/fall time and return loss at three rates (SD, HD and 3G) using the compensation network. The GS2978 Cable Driver is necessary to guarantee return loss specification.

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The signal rate on the GS2978 Cable Driver is automatically set to SD or HD mode by the RATE_DET signal from the GS2970 (U8).

3.4.7 Audio Outputs (J1, J2)

For AES mode, AES-encoded CMOS-level signals are distributed through line drivers and supplied to two BNC connectors (J1, J2).

3.4.8 GSPI Header (J7)

The standard Gennum SPI header on the 3Gb/s SDI Demo Board, along with the optional SPI dongle, allow the user to explore all settings and tuning possibilities of Gennum's 3Gb/s SDI and timing products, through a USB connection to a PC.

Gennum's GS2970, GS2972 and GS4911B devices contain sets of internal status and configuration registers. These registers are available to the host via the SPI.

3.4.9 EXP Connector (JX1)

The EXP Connector JX1 on the 3Gb/s SDI Demo Board interfaces to the Xilinx Spartan-3A DSP 1800 Board.

Input Signals:

• 2 x 10-bit video data from two GS2970s

• 2 x PCLK from two GS2970s

• 2 x STAT[0:4] outputs from two GS2970s, HVF and rate detection

• Serial audio input ACLK, WCLK, DATA1_2 and DATA3_4 from one GS2970

• HVF, PCLK and ACLK1 from GS4911B

• Inputs from GSPI header SCLK, SDIN, CS

Output Signals:

• 2 x 10-bit video data from two GS2972s

• 2 x PCLK to GS2972s

• HVF input to first GS2972

• Serial audio input to first GS2972, ACLK, WCLK, DATA1_2 and DATA3_4

• SDOUT to the GSPI header

• SCLK, SDIN, 6 x CS for the GSPI on the board

• Output from the SPI on the board SDOUT

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Table 3-5: EXP Connector Signals

FPGA Pin Xilinx Board Net Name 3Gb/s SDI Board Net Name JX1 Pin Notes

AE25 EXP2_SE_IO_1 DESA_DATA13 1 −

V16 EXP2_SE_IO_0 DESA_DATA12 2 −

AF25 EXP2_SE_IO_3 DESA_DATA14 3 −

Y17 EXP2_SE_IO_2 DESA_DATA11 4 −

AE23 EXP2_SE_IO_5 DESA_DATA15 7 −

AA18 EXP2_SE_IO_4 DESB_AUD2 8 −

AF23 EXP2_SE_IO_7 DESA_DATA16 9 −

AC20 EXP2_SE_IO_6 DESA_DATA10 10 −

AD22 EXP2_SE_IO_9 DESB_DATA15 13 −

AA17 EXP2_SE_IO_8 GSPI0 14 −

AE21 EXP2_SE_IO_11 DESA_DATA18 15 −

AC19 EXP2_SE_IO_10 GSPI1 16 −

AD21 EXP2_SE_IO_13 DESA_DATA19 19 −

AB18 EXP2_SE_IO_12 DESB_AUD3 20 −

AC21 EXP2_SE_IO_15 DESB_DATA10 21 −

V15 EXP2_SE_IO_14 DESB_DATA11 22 −

U23 EXP2_SE_IO_17 DESA_STAT0 25 −

W15 EXP2_SE_IO_16 DESB_DATA12 26 −

U24 EXP2_SE_IO_19 DESA_STAT1 27 −

AB16 EXP2_SE_IO_18 DESB_DATA13 28 −

AD20 EXP2_SE_IO_21 DESA_DATA17 31 −

M21 EXP2_SE_IO_20 DESA_STAT3 32 −

AF19 EXP2_SE_IO_23 DESB_DATA16 33 −

AC16 EXP2_SE_IO_22 DESB_DATA14 34 −

AE19 EXP2_SE_IO_25 DESB_DATA17 37 −

U22 EXP2_SE_IO_24 DESA_STAT4 38 −

AD19 EXP2_SE_IO_27 DESB_DATA18 39 −

AC15 EXP2_SE_IO_26 DESB_DATA19 40 −

R20 EXP2_SE_IO_28 DESA_STAT2 41 −

AA13 EXP2_DIFF_CLK_IN_p DESB_AUD0 42 −

AF13 EXP2_SE_CLK_IN DESA_PCLK 43 −

Y13 EXP2_DIFF_CLK_IN_n DESB_AUD1 44 −

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R19 EXP2_SE_IO_29 DESB_STAT0 47 −

V14 EXP2_SE_IO_30 RESET 48 −

Y14 EXP2_SE_CLK_OUT DESB_PCLK 49 −

U15 EXP2_SE_IO_31 GSPI2 50 −

AD14 EXP2_DIFF_p21 SERA_PCLK 53 −

V10 EXP2_DIFF_p20 DESB_STAT3 54 −

AC14 EXP2_DIFF_n21 SERA_DIN19 55 −

W10 EXP2_DIFF_n20 GSPI8 56 −

K23 EXP2_SE_IO_32 DESB_STAT1 59 −

V13 EXP2_DIFF_p18 SERA_HVF1 60 −

M22 EXP2_SE_IO_33 DESB_STAT2 61 −

W13 EXP2_DIFF_n18 SERA_HVF0 62 −

AB12 EXP2_DIFF_p19 SERA_DIN18 65 −

Y12 EXP2_DIFF_p16 SERA_HVF2 66 −

AC12 EXP2_DIFF_n19 SERA_DIN17 67 −

AA12 EXP2_DIFF_n16 DESB_STAT4 68 −

AE17 EXP2_DIFF_p17 ACLK1 71 −

W17 EXP2_DIFF_CLK_OUT_p SERA_AUD0 72 −

AD17 EXP2_DIFF_n17 GSPI4 73 −

V17 EXP2_DIFF_CLK_OUT_n SERA_DIN14 74 −

AF20 EXP2_DIFF_p15 GSPI5 77 −

V12 EXP2_DIFF_p14 SERA_AUD2 78 −

AE20 EXP2_DIFF_n15 GSPI3 79 −

W12 EXP2_DIFF_n14 SERA_DIN16 80 −

AE9 EXP2_DIFF_p13 SERA_DIN13 81 −

AD11 EXP2_DIFF_p12 SERA_AUD1 82 −

AF9 EXP2_DIFF_n13 SERA_DIN12 83 −

AC11 EXP2_DIFF_n12 SERA_DIN15 84 −

AE8 EXP2_DIFF_p11 SERA_DIN15 87 −

AF14 EXP2_DIFF_p10 SERA_AUD3 88 −

AF8 EXP2_DIFF_n11 SERA_DIN10 89 −

AE14 EXP2_DIFF_n10 PCLK4911 90 −

Table 3-5: EXP Connector Signals

FPGA Pin Xilinx Board Net Name 3Gb/s SDI Board Net Name JX1 Pin Notes

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3.5 Push Buttons

3.5.1 Reset (SW4)

When the push button (SW4) is held low on the Xilinx Board, a reset signal is applied to the FPGA. It should be pushed every time after power-up or when the operating mode has changed. The power-on-reset circuit on the FPGA Board is not functional, since it is asserted for only 400ms before the FPGA configuration is done.

3.5.2 Test Pattern (SW7 & SW8)

The pattern generator is active when in the Test Pattern operating mode.

In Genlock mode, the pattern generator is synced to the external sync input. When in Free-run mode, it does not need an external sync input.

AD7 EXP2_DIFF_p9 SERB_PCLK 93 −

AB9 EXP2_DIFF_p8 GSPI6 94 −

AE7 EXP2_DIFF_n9 SERB_DIN19 95 −

AC9 EXP2_DIFF_n8 GSPI7 96 −

AC6 EXP2_DIFF_p7 SERB_DIN18 99 −

Y10 EXP2_DIFF_p6 TIMING0 100 −

AD6 EXP2_DIFF_n7 SERB_DIN17 101 −

AA10 EXP2_DIFF_n6 TIMING1 102 −

AC8 EXP2_DIFF_p5 SERB_DIN16 105 −

W9 EXP2_DIFF_p4 TIMING2 106 −

AB7 EXP2_DIFF_n5 SERB_DIN15 107 −

Y9 EXP2_DIFF_n4 GSPI_Dongle0 108 −

AE4 EXP2_DIFF_p3 SERB_DIN14 111 −

V11 EXP2_DIFF_p2 GSPI_Dongle1 112 −

AF4 EXP2_DIFF_n3 SERB_DIN13 113 −

U11 EXP2_DIFF_n2 GSPI_Dongle2 114 −

AE3 EXP2_DIFF_p1 SERB_DIN12 117 −

AF5 EXP2_DIFF_p0 GSPI_Dongle3 118 −

AF3 EXP2_DIFF_n1 SERB_DIN11 119 −

AE6 EXP2_DIFF_n0 SERB_DIN10 120 −

NOTE: 3.3V and 2.5V Power and Ground are supplied by the Xilinx FPGA Board through JX1.

Table 3-5: EXP Connector Signals

FPGA Pin Xilinx Board Net Name 3Gb/s SDI Board Net Name JX1 Pin Notes

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The output test pattern can be changed by using two push buttons: SW7 (PB3) for UP and SW8 (PB4) for DOWN. The video test patterns are shown in Table 3-6:

3.5.3 Test Pattern Video Standard (SW5, SW6)

The video standard of the test pattern can be changed by using two push buttons: SW5 (PB1) for UP and SW6 (PB2) for DOWN (Figure 2-5). The test pattern video standards are shown in Table 3-7.

NOTE: After power-up or reset, the board does not output a test pattern signal until SW5 or SW6 is pressed.

Table 3-6: Video Test Patterns

ID Pattern

0 Check Field/Pathological

1 100% Colour Bars

2 75% Colour Bars

3 SMPTE RP219 Bars

4 EG1 Bars

5 5 Step Stair Case

6 Luma Step

7 75% Blue

8 Green

9 Red

10 100% Black

11 40% Gray

12 100% White

13 75% Colour Bars

14 75% Colour Bars

15 75% Colour Bars

Table 3-7: Test Pattern Video Standards

LED7,8,9,10 GS4911B VID_STD Standard

0000 21 1080p60 1920x1080/60/1:1 148.5 MHz

0001 22 1080p59.94 1920x1080/59.94/1:1 148.35 MHz

0010 23 1080p50 1920x1080/50/1:1 148.5 MHz

0011 29 1080p30 1920x1080/30/1:1 74.25 MHz

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3.5.4 SPI PROM Programming (J10)

To program the SPI PROM, add a shunt on JP7 of the Xilinx Board and connect the Xilinx Programming Cable (with flying leads) to J10 of the Xilinx Board. Power-down the boards and remove the shunt after programming. For more details, please refer to Xilinx document xapp1053.pdf, “Flash Memory Boot Loading Using SPI with Spartan-3A DSP 1800A Starter Platform”.

3.5.5 JTAG Programming (J2)

The FPGA may be programmed any time when power is on through JTAG (J2) on the Xilinx Board. It is a preferred mode in code debugging stage. It is quick but it is volatile after power down.

0100 31 1080p29.97 1920x1080/29.97/1:1 74.175 MHz

0101 33 1080p25 1920x1080/25/1:1 74.25 MHz

0110 35 1080p24 1920x1080/24/1:1 74.25 MHz

0111 37 1080p23.98 1920x1080/23.98 74.175 MHz

1000 25 1080i60 1920x1080/60i 74.25 MHz

1001 26 1080i59.94 1920x1080/59.94i 74.175 MHz

1010 27 1080i50 1920x1080/50i 74.25 MHz

1011 11 720p60 1280x720/60/1:1 74.25 MHz

1100 12 720p59.94 1280x720/59.94/1:1 74.175 MHz

1101 13 720p50 1280/720/50/1:1 74.25 MHz

1110 14 720p30 1280x720/30/1:1 74.25 MHz

1111 15 720p29.97 1280x720/29.97/1:1 74.25 MHz

Table 3-7: Test Pattern Video Standards

LED7,8,9,10 GS4911B VID_STD Standard

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4. Getting Started

4.1 Quick Start GuideFigure 4-1 shows the minimum requirements for a basic setup.

Figure 4-1: Quick Start Basic Setup

Please follow the steps below to achieve a quick start up:

1. Slide the PWR ON/OFF switch (SW1) to the OFF position, and apply power to the jack (J5).

2. Confirm that all jumpers and switches are set to their default state.

3. Connect the Xilinx programming cable to the board, add a shunt to JP7, power-up the board and program the SPI PROM. Skip this step if the SPI PROM has been programmed or the factory default program in the PROM will be used. Refer to the Xilinx document ds593.pdf on how to use the Programming Cable.

4. If the SPI PROM has just been programmed, power-down the Xilinx Board, unplug the programming cable and remove the shunt on JP7.

5. Plug the SDI Demo Board JX1 connector (on the bottom side of the Gennum 3Gb/s SDI Demo Board) into the JX2 connector located on the right hand side of the Xilinx Board. Secure with the hardware provided (screws, stand-offs, washers and nuts).

6. Connect a SDI video source to the AIN1(J3), AIN2(J4) and BIN1(J6) BNC connectors located on the right-hand side of the SDI Demo Board. These connectors accept SD, HD and 3G SDI input signals. A loop-through output is available on J5 of the SDI Demo Board.

Xilinx Board3Gb/s SDI

Demo Board

J1

PWRLED

RESET

PWR SW

PWR Jack

Video Source (TG700)

AC Adaptor

SDI Monitor(WFM 7120)

AC

J2

J5

J3

J4

J6

J8

J9

J12

J10

J11

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7. Connect the output video cables to the AOUTn(J8) and BOUT(J9) BNC connectors located on the right-hand side of the SDI Demo Board.

8. Connect the AES Audio Input signals to AES_IN1 (J10) and AES_IN2 (J11); AES_IN1 is for embedding audio channels 1 and 2, while AES_IN2 is for channels 3 and 4.

9. For Genlock to an external black burst signal, connect a source to EXT_SYNC (J12).

10. For de-embedded audio, connect the cables onto AUDIO_OUT1 (J1) and AUDIO_OUT2 (J2).

11. Set up the Operation Mode by SW3 (bits 1-3) on the Xilinx Board. Refer to Table 3-1: Operation Modes set by SW3 on Xilinx Board.

12. Set the PWR ON/OFF switch (SW1) to the ON position on the Xilinx Board. After D1 (a Blue LED) on the Xilinx Board is activated, manually reset the boards by pressing SW4 (RESET) button. The board performs an initialization after reset. First, the FPGA configures the I/O Expander's pins as outputs, and then the control pins on the Gennum devices are set by the I/O Expander. If required by the operating mode, the internal registers of the Gennum devices are written by the FPGA through the daisy-chained SPI to complete the initialization.

When a new operation mode is selected through the DIP switches, the devices on-board are programmed for the new mode by the FPGA via the GSPI daisy chain and the MAX 7301 I/O Expander.

The GS2970s and GS2972s are configured in SMPTE mode by default. They perform full SMPTE processing, and feature a number of signal integrity checks and measurement capabilities.

Refer to the GS2970 and GS2972 Data Sheets for a more detailed explanation of their modes of operation.

For the SDI receiver Rate Selection, the GS2970s automatically detect the input signal as SD-SDI, HD-SDI or 3G-SDI.

For the SDI Transmitter Rate Selection, the GS2972s are configured by the FPGA to output the detected rate. The FPGA reads the rate values from the SDI Receivers, and programs the RATE_SEL pins on the GS2972 accordingly via the I/O Expander.

When no video input signal is detected by either Equalizer (U6 or U7), the corresponding Receivers (U8, U11), can be placed in Standby mode. In this mode, no signal is generated at the output, and the power consumption is reduced. By default, this mode is disabled by DNP R130 and populating R131 on the SDI Demo Board.

In Pass-through Mode, Input A needs a valid signal for the board configuration to stabilize so that Input B can work without any interruption. This is due to the FPGA attempting to detect the input on A and configure the board, repeatedly.

In Test Pattern Generator Mode, the GS4911B is configured to provide the clock and timing signals of the selected standard. The test pattern output is available on SDI Output A (J8).

NOTE: After power-up or reset, the board does not output a test pattern signal until SW5 or SW6 is pressed. SMPTE RP219 Bars and EG1 EG1 Bars may not look exactly the same as that from other pattern generators.

13. In Pattern Generator Mode, the user can change the pattern by using push buttons SW7/8, or the Video Standard by using push buttons SW5/6 on the Xilinx Board.

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14. Every time, after a change to the Operating Mode, reset the boards by pressing the SW4 (RESET) button.

4.2 FPGA Configuration

4.2.1 JTAG Direct

J2 on the Xilinx Board is a JTAG port with direct access to the FPGA. The bit file may be downloaded to configure the FPGA any time after power-up, using iMPACT and Xilinx programming cables (Platform Cable USB II and Parallel Cable IV). Refer to the Xilinx documents for more details.

This method is appropriate for the code-debugging stage, since it is faster to update the configuration on the FPGA than it is to program a SPI PROM. However, it is volatile, and every time after power-up, the cable has to be used to download the code.

4.2.2 SPI PROM

When the code is fully debugged, or a live-on-power-up is anticipated, the code can be downloaded to the non-volatile SPI PROM on the Xilinx Board. The FPGA reads the data from the on-board PROM, and program itself in Master Serial Mode every time after power up.

To program the PROM, please refer to Xilinx document XAPP1053, “Flash Memory Boot loading Using SPI with Spartan-3A DSP 1800A Starter Platform”.

5. Advanced User Guide

The next step after evaluating Gennum’s 3Gb/s products, is to design the user application board, and the associated FPGA code. This chapter presents the implementation details of this demo/evaluation platform for the low cost Spartan 3A FPGA.

5.1 Top Level ArchitectureFigure 5-1 is a simplified diagram of the FPGA top level architecture. It consists of a Test Pattern Generator, Channel A/B Input Paths, a Board Control Unit, Output Mux A/B and a SPI Interface.

The Board Control Unit sets the operating mode, provides access to the internal registers via the SPI. It also sets the control pins of the Gennum devices, via Maxim's MAX 7301 I/O Expander.

The right and left side of the diagram lists the signals to or from various blocks on the board. Also illustrated are the data paths, clock paths and the major building blocks inside of the FPGA to achieve the five major operating modes. The signals in grayed-out text are reserved, and are not used in the current design.

Please refer to the FPGA code provided with the kit.

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Figure 5-1: Simplified Top Level Architecture

5.2 Clock Tree and Data PathFigure 5-2 shows the Test Pattern Generator data path, Receiver A Input Path, Receiver B Input Path, Output Muxing and Clock trees in detail.

To achieve the best performance in the low cost FPGA, the following design rules have been applied:

• No DCM is used in the Receiver A/B input/output paths to ensure low additive clock jitter to the Transmitters

• Input data are captured by the DDRs in the IOBs to ensure predictable timing margin

• Source synchronous output: DDR data and clock output both use DDR registers in the IOBs to achieve constant phase-relation, regardless of the FPGA package and S&P&R pass

• The clock trees are manually allocated, and locked so that the usage of the FPGA resources are minimized with the best performance, and there will be still some

reset_n

Desa_pclk10

Desa_pclk

Desa_stat5

Desb_pclk10

Desb_pclk

Desb_stat5

Timing3

pclk4911

Inv_pclkaInv_pclkb

clk

Sera_din10

Sera_pclk

Sera_HVF3

Serb_din10

Serb_pclk

LED_out8

To Ser A

To Ser B

From Des A

From Des B

From Genlock

System Signals

Pb_std2

Pb_patt2

dip_conf_sel2

gspi_dongle4

Dip_clk2

Dipb_clk2

To/From:Configuration I/F

FPGA

GSPI9

BoardControl

Test PatternGenerator

Channel AInput Path

Channel BInput Path

OutputMux A

OutputMux B

GSPInterface

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global clock resources available for the user. Please note; the Xilinx ISE tool is not able to automatically place and route the complicated clock trees

• The FIFO Rx_FIFO_A and Rx_FIFO_B are added for data crossing different clock domains. They are read after the rd_data_count reaches 9, and do not stop until the FIFOs are reset

Figure 5-2: Clock and Data Path

On the FPGA, the Pattern Generator produces a video signal based on the clock (PCLK4911) and timing signals (FPGA internal name FVH_in or FPGA pad name Timing[2:0]) from the GS4911B. The output multiplexer selects an output among the A and B video streams, and the Pattern Generator signal.

5.3 Pattern GeneratorThe Test Pattern Generator generates test patterns of up to sixteen HD/3G video standards and sixteen patterns, as show in Table 3-6 and Table 3-7. The GS4911B on the 3Gb/s SDI Demo Board provides the pixel clock and timing signals (HVF). It can be set for either Free-run mode or Genlock mode to an external sync signal.

Desa_pclkDesa_pclk_int

DDR_IN_3Desa_data Reg

RxFIFO

A

DESA_PCLK_sig

Reg

FIFOPatgen Reg

Desb_pclkDesb_pclk_int

DDR_IN_3Desb_data Reg

RxFIFO

B

DESB_PCLK_sig

Reg

Reg

Reg

DDR

DDR

Reg

pclk_PG

SERB_DIN

SERA_DIN

FVH_in

PCLK4911

DD

DCM_PLLx2

PatternGen &Mux

Pattern Generator

Des A input Path

Des B input Path

BUFGMUX

BUFGMUX

BUFGMUX

BUFGMUX

DDR SERA_PCLK

DDR SERB_PCLK

PCLK4911_buffed

Outputmuxing

Output Stage

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5.3.1 Top Level Architecture

Figure 5-3 illustrates the major blocks in the Pattern Generator, and the following items:

• The configuration signals from the control block of the FPGA on the left side

• The clock and timing signals from the GS4911B

• The system level clock and reset signals

• The generated test pattern data/clock/timing and lock signals on the left side

• The data flow between the blocks

The DCM_PLLX2 block generates 2x clock for all HD standards. Since the GS4911B provides 1x clock while the Transmitter is wired for 10-bit mode, this results in a requirement for a 2x clock. It also outputs DCM lock status for other blocks on the FPGA. The Pattern_Gen block generates 20-bit YCbCr data stream for the selected standard and pattern. The Max_20b_10b multiplexes the 20-bit data onto the upper 10-bit bus for all HD standards, and flows through the 20-bit data for all 3G standards. The output stage of the FPGA will multiplex 20-bit SDR (Single Data Rate) on to 10-bit DDR for all 3G standards.

Figure 5-3: Pattern Generator Top Level Architecture

5.3.2 Reset Network

Figure 5-4 shows the reset network of the design. SPI_Box, OutputMuxing, Ctrl_block, DDR in/out/clk blocks get the reset from FPGA pin (reset_n).

The Pattern Generator block (PG_TOP) is clocked by a variable clock from the GS4911B through a DCM. The reset is de-asserted after the clock is configured on the GS4911B and becomes stable on the DCM. The Pattern Generator gets a reset under the following conditions:

• The board resets when reset_n is asserted LOW; or

DCM_PLLX2

Gs4911_buffed

Clk_2x_sig

HVF_in DDPattern_Gen

HVF_in

HVF_patt_sig

Y_in

C_in

Max_20b_10b

HVF_out

Vid_out_H

Vid_out_L

Gs4911_buffed_out

Clk_out

rstclk

sys_clk

sel_20_10b_in

interlaced_inPatt_sel_in

4

Std_720p

3 DCM4911_LOCKEDDCM4911_LOCKED

3

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• The GS4911B is re-configured (indicated by ready_c), which may cause the clock frequency of the Pattern Generator to change

The reset signal to pattern_gen is held LOW until the PCLK4911 is stable, and the DCM in DCM_PLLX2 is locked to PCLK4911. The time is currently set to 1.3s, without checking GS4911B lock status. Ideally, the GS4911B clock lock status is used to reset the DCM.

Figure 5-4: FPGA Reset Network

reset_n rst_n rst

SPI_Box

OutputMuxing

Ctrl_block

DDR in/out/clk

PG_TOP

Ready_c:Indication that the modeconfiguration is done.

or

Dcm4911_locked

DCM_PLLX 2

Rst_PG

Dcm4911_locked

Pattern_Gen

rst

Rst to reset pix_countand Line_count

HV_Count.v

Rst to reset output

Rst to reset y_ramp_temp

Gen_path

Gen_Bar

clk

PCLK4911 clk_x2_sig

gs4911_buffed toctrl_block

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5.3.3 Clock Generator

The clock generator produces a 1x clock (clk0_out) and a 1x/2x switchable clock (clk2x_out). They are phase-aligned with the input clock PCLK4911. The 1x clock is used mainly by the pattern generator, and the 2x clock is used by the 20-bit to 10-bit multiplexer and the FPGA DDR data output stage.

The DCM Reset Manager extends the reset up to 1.3s after the GS4911B is configured and PCLK4911 is stable, before de-asserting the reset to the DCM.

The BUFGMUXs are wired as show in Figure 5-5, so that the DCMs within a pair may be use for the Pattern Generator. They are locked down in the UCF file, so that the timing is optimized with the minimum number of BUFGMUXs.

Figure 5-5: Clock Generator for the Pattern Generator

5.3.4 Colour Bar Generator

The Colour Bar Generator generates the patterns shown in Table 3-6, except Check Field/Pathological, which is generated by another sub-block (Gen_Path) in Pattern_Gen.

Figure 5-6 shows the signal flow of this sub-block.

PCLK4911

BUFGMUX

DCM

Clk0_buf

I0

Clk2x_buf

I1

‘0’

Clk0_out

CLKFB_IN

CLKIN_IN

BUFGMUX

I0

I1

CLK2X_OUT

CLK2X_SELECT_IN

DCM4911_L0CKED

RST_IN DCMReset

Manager

DCM_RST

sys_clk

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ved
Highlight
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Figure 5-6: Colour Bar Generator in Pattern_Gen

5.3.5 20b to 10b Mux

The Max_20b_10b block multiplexes the 20-bit data on to the upper 10-bit bus for all HD standards, and flows through the 20-bit data for all 3G standards. The data output stage of the FPGA will multiplex 20-bit SDR into 10-bit DDR for all 3G standards.

YC_rd_sync sub-block is used to synchronize the H leading edge with the 10-bit chroma output.

After reset, this block will wait for the FIFO to be filled, and then begin to read the data from both the Y and the C FIFO, until the falling edge of the H is detected. It will set the sel_y_c properly for the initial value, and sel_y_c/sel_y_c_n will toggle on every clk_x2 thereafter.

The FIFOs were designed for the data to cross different clock domains.

‘0’

‘1’

Y_ramp_en

Y_out_temp[9:0]

Y_ramp[9:0]Y_ramp_block(1 clk dly)

Ctrl_y_ramp_sig

HVF_del2[2:0]clk

Y_ramp_inc[15:0]Y_ramp_sel

Patt_sel[3:0]

Sel_V_region(1clk dly)

HVF_in[1]

Luma ROM10bx32

(1 clk dly)

Chroma ROM10bx64

(1clk dly)C_out[9:0]

Rom_addr[4:0]

Chroma_sel

ROM_addr_sel

Smpte_rom_addr[4:0]EG1_rom_addr[4:0]

Region_h[3:0]

Smpte_bar_adr_sel

Smpte_barEG1_bar

Patt_sel[3:0]

Bar

Pic_count[0]

Pic_count[10:0]HVF_del2_in[2:0]

Bar

HVF_del2_in[2:0] DD HVF_out[2:0]

rstclk

clk

clk

Sel_1080_720

Sel_720pcol_bar

step5_bar

V_change_con

Smpte1_barSmpte2_barSmpte3_barCol_bar7EG1_bar2

Y_out[9:0]

Y_ramp_init[15:0]Region_v[1:0]

Sel_H_region(1clk dly)

HVF_in[2:0]

Line_count[10:0]

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Figure 5-7: Mux_20_10b

5.4 Optical ModuleA connector and cage are provided on the board for an Optical Module as a resource for evaluation; an Optical Module can be purchase for evaluation, but it is not a major operation mode in this FPGA code design. The test wiring diagram of this module is shown in Figure 5-8. To test the Optical Module, follow the setup and procedure below.

Setup:

• Add a shunt on JP4 of the 3Gb/s Demo Board to enable the Optical Module

• Use a fibre cable for loop-back connection

• Operation Mode: Test Pattern Generator (SW3 bit1-3=”ON-OFF-ON”)

• Data Path: Pattern Generator on FPGA->Ser A->Optical Tx->Fibre->Optical Rx->Des B->FPGA->Ser B->SDI Monitor

Procedures:

To enable 3G mode, connect a 3Gb/s source to J6 (BIN1), remove the shunt on J14, power-up the boards, and then reset the boards. The FPGA will detect the rate on the Des B and configure Ser B for 3G mode. Then change the test pattern standard/pattern for 3G and add the shunt on J14.

CLK

HVF_IN[2:0]

C_IN[9:0]

CLK

CLK_X2

FIFO_13X4_inst_C

Din_C[12:0]Q_C_sig[12:0]

Rdusedw_C_sig[3]Rd_C_FIFO_sig

&

Sel_y_c

Rd_Y_FIFO_sig

Sel_20_10b

rst

rst

‘0’

‘1’

Vid_out_sig[12:0]

Vid_out_int1[19:0]DFFs

Sel_20_10b

Q_Y_sig[12:0]

YC_rd_sync

CLKrst

‘0’

‘1’

‘0’

‘1’Q_C_sig[12:3]

Rd_C_FIFO_sig

HVF_out_int1[19:0]

Q_Y_sig[0]

Sel_y_c_b

FIFO_13X4_inst_Y

HVF_IN[2:0]

Y_IN[9:0]Din_Y[12:0]

CLK_X2

Q_Y_sig[12:0]

Rdusedw_Y_sig[3]

Rd_Y_FIFO_sig

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To enable HD mode, connect a HD source to J6 (BIN1), remove the shunt on J14, power-up the boards, and then reset the boards. The FPGA will detect the rate on the Des B and configure Ser B for HD mode. Change the test pattern standard/pattern for HD and add the shunt on J14.

Power-down the boards. Remove the shunt on JP4 of the 3Gb/s SDI Demo Board. Remove the Optical Module from the cage.

Figure 5-8: Optical Module Test Data Flow

SDOn

U11Des B

U15Ser A

U16Ser B

U30OPT

SDO

Fibre

AOUTnJ8

BoutJ9

1

0

J14

BIN 1J6

FPGA

R5

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5.5 Data PathFigure 5-9 shows the input data to clock phase and output data to clock phase in the FPGA. Please refer to the GS2970 and GS2972 data sheets to verify your design.

Figure 5-9: Data Clock Phase

5.6 I/O Timing ClosureThe 3Gb/s SDI Demo Board is designed to work with Xilinx FPGA Evaluation Boards with HSMC connectors. To use the limited number of the signal pins on the HSMC connector for 4 Gennum's SDI devices, parallel data busses are all wired in 10-bit mode. When the video is 1080p60, the data rate even rise up to 297Mb/s in LVCMOS DDR

Y0 Y1Cb0 Cr0DESA_DATA Y2 Cb1 Y3 Cr1

DESA_PCLK

Y0 Y1Vid_in_a_d1[9:0] Y2 Y3

Cb0 Cr0 Cb1

Y0SER_DIN Cb0 Cr0 Cb1Y1 Y2

Y0

Cb0

Y1

Cr0

Y2

Cb1

Y3

Cr1

DESA_PCLK_sig

SERA_PCLK

Delayed SERA_PCLK

Vid_in_a_d1[19:10]

Vid_out_a_d1[9:0]

Vid_out_a_d1[19:10]

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mode. The traces are around 7 inches long with the impedance uncontrolled, length unmatched on the Xilinx FPGA board. Timing has to be carefully budgeted, constrained and verified on the board for reliability. This topic will be discussed in the rest of this section. In the end user products, shorter, impedance-controlled and length-matched traces are recommended for best timing margin and signal integrity.

5.7 Clock TerminationThe FPGA drives the GS2972s in source synchronous mode. All output data bits and clock signals use DDRs in the IOBs to minimize the skew. There are some options for the clock implementation to achieve the data to clock setup/hold time required by the GS2972:

• Use a DCM to shift the clock by 90° to centre the clock edge in the data window. It provides the best timing margin but it costs the FPGA DCM/BUFG clock resources and adds clock jitter

• Use the general routing resources in the FPGA to adjust the clock delay to centre the clock edge in the data window; the clock routing has to be done manually in the FPGA each time with S&P&R (Synthesize, Place and Route pass)

• Use the drive-strength/slew-rate adjustment of the output buffers to shift data/clock; the highest drive strength can not be used because of the excessive overshoot, undershoot and crosstalk. Some low drive-strength options can not be used due to the slow fall-time of the buffers, so the delay adjustment through OBUF is very limited. It is difficult to achieve the optimal timing with this method

• Use capacitive load on the clock line to delay the clock. Based on the Xilinx WP217 and Spartan 3 DSP switching characteristics, the clock may be delayed by an external capacitive load. Simulation has been done to verify the possibility of this solution

The DDR data and clock both use DDR registers in IOBs, which means the data and clock are edge aligned off the FPGA with the same load.

When loaded with a 33pF capacitor in parallel with a 150Ω resistor, the clock is delayed by ~1.2ns on the PCLK input pin of the GS2972. Figure 5-10 illustrates this idea.

To improve the timing margin, the clock is further delayed on the GS2972 by turning on the PCLK delay line on the GS2972.

Figure 5-10: Clock Termination

GS2972

150R 33p

PCLKFPGA 50Ω transmission line

DIN50Ω transmission line

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5.8 FPGA User ConstraintsThe timing constraints need to be specified in the ucf file, to guide the ISE Tools to route the design with the timing met. For the board level timing parameters, the following work has been done to optimize the board level timing margin:

• The de-serializer output timing is sample-verified

• The FPGA output timing is simulated for signal integrity and timing

• The serializer input timing is sample verified

• FPGA I/O timing constraints are set-up based on the timing measurement and the switching parameters of the Gennum devices

Some user constraints are set in the ucf file to achieve the timing goal. To help the application designers to get the similar performance, some examples are given in this section.

5.8.1 Input Data Window Specification

The constraint below specifies the DDR data to clock timing of the channel A input. The setup time is 1.45ns and the hold time is 0.45ns on the FPGA pins:

NET “DESA_DATA<*>” TNM = Data_In_A;TIMEGRP “Data_In_A” OFFSET = IN 1.45ns VALID 1.9ns BEFORE “DESA_PCLK” RISING;

5.8.2 Internal Clock Constraints

The constraints below specify the clock periods of the internal generated clock signals. They may not be listed on the Timing Constraints GUI of ISE, but they need to be specified in the UCF file to meet the timing requirements of the design:

NET “Inst_PG_Top/gs4911_buffed” TNM_NET = “gs4911_buffed”;TIMESPEC TS_gs4911_buffed = PERIOD “gs4911_buffed” 6.6ns HIGH 50%;NET “Inst_PG_Top/clk_x2_sig” TNM_NET = “clk_x2_sig”;TIMESPEC TS_clk_x2_sig = PERIOD “clk_x2_sig” 6.6ns HIGH 50%;

5.8.3 MAXDELAY Constraints

The routing delay of the clock signals must be controlled. Here are some examples of the delay constraints for the clock signals:

NET “DESA_PCLK” MAXDELAY = 1ns;NET “DESB_PCLK“ MAXDELAY = 1ns;NET “DESA_PCLK_sig” MAXDELAY = 1.8ns;NET “DESB_PCLK_sig” MAXDELAY = 1.8ns;

5.8.4 Location Constraints

When the usage of the clock resources is high, the ISE Tool will not be able to automatically place the clock primitives to achieve the timing. The instances have to be

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manually locked down in the ucf file. Here are some examples to place the instances on the FPGA:

INST “DESB_PCLK_buf” LOC = BUFGMUX_X2Y1;INST “DESA_PCLK_buf” LOC = BUFGMUX_X1Y1;INST “Inst_OutputMuxing/BUFGMUX_inst_A” LOC = BUFGMUX_X1Y0;INST “Inst_OutputMuxing/BUFGMUX_inst_B” LOC = BUFGMUX_X2Y0;

5.8.5 Non-Clock_Dedicated_Route

When a clock input uses a non-dedicated-clock input pin or there is no associated BUFGMUX available, the clock uses general routing resources to reach a BUFGMUX or DCM.

Here is an example of this attribute and the data to clock timing constraints:

NET “PCLK4911” CLOCK_DEDICATED_ROUTE = false;NET “TIMING<*>” IFD_DELAY_VALUE= 3;NET “TIMING<*>” TNM = “GS4911_FVH”;TIMEGRP “GS4911_FVH” OFFSET = IN 5 ns VALID 6 ns BEFORE “PCLK4911” TIMEGRP “gs4911_buffed”;

5.8.6 Input Delay Adjustment

When the ISE Tool is not able to meet the input timing constraints, an adjustment of the input delay for clock and/or data may help. Here is an example:

NET “DESA_PCLK” IBUF_DELAY_VALUE=0;NET “DESA_DATA*” IFD_DELAY_VALUE=3;NET “DESB_PCLK” IBUF_DELAY_VALUE=0;NET “DESB_DATA*” IFD_DELAY_VALUE=2;

5.8.7 Output Timing Adjustment

When the FPGA output timing does not meet the requirement by GS2972s, the drive-strength and slew-rate may be adjusted to shift the clock to data phases slightly. Here is an example:

NET “SERA_DIN*” DRIVE = 8;NET “SERA_DIN*” SLEW = fast;NET “SERA_PCLK” DRIVE = 16;NET “SERA_PCLK” SLEW = FAST;NET “SERA_HVF*” DRIVE = 8;NET “SERA_HVF*” SLEW = FAST;

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5.9 Host Interface and Register MapHost_if is a configuration and status register block accessible by PC through a GSPI dongle.

Figure 5-11: Host Interface Block Diagram

5.10 Suggestions• BUFG MUXes and DDRs have some routing limitations, do a floor plan with Xilinx

Tools before PCB layout

• Try to use short traces with controlled impedance and matched length for the Data/Clock/Timing signals between the FPGA and 3G Ser/Des to gain maximized timing margin

reset

Host_ifGspi_clkGspi_cs

Gspi_sdinGspi_sdout

pclkValue_in[11:0]Patt_sel[3:0]Patt_reg_ctrlstd_sel[3:0]Std_reg_ctrl

Conf_sel_reg_ctrlConf_sel[2:0]

CSR signalsSPI_BOX

GSPI_dongle[3]Gspi_cs

GSPI_dongle[0]Gspi_sclk

GSPI_dongle[1]Gspi_din

GSPI_dongle[2]Gspi_sdout

SPI_Module_Out(0)

SPI_Module_Out(1)GSPI_Internal_CSSPI_Module_Out(11)

When Gspi_dongle[3] = ‘0’, the GSPI dongle will control Ser/Des/CSR.Otherwise, SPI_Int_Ctrl will control.

SPI_Int_Ctrl SPI_Module_Out(4)

Table 5-1: Host Interface Register Map

Address Register Name Bits Access Reset Value

Valid Range

Descriptions

0 r0r.Patt_sel 3:0 R/W 0000 0 - 15 Pattern selection register

r0r.Patt_reg_ctrl 4 R/W 0 0 - 1 0: Pattern is controlled by push buttons

1: Pattern is controlled by register

1 r1r.Std_sel 3:0 R/W 0000 0 - 15 Video standard register of the test pattern

r1r.Std_reg_ctrl 4 R/W 0 0 - 1 0: Standard is controlled by push buttons

1: Standard is controlled by register

2 r2r.Conf_sel 2:0 R/W 000 0, 1, 4, 6, 7 Operation mode selection register

r2r.Confi_sel_reg_ctrl 3 R/W 0 0 - 1 0: Operation mode is controlled by push buttons

1: Operation mode is controlled by register

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6. Related Documents

6.1 Gennum's Documentation• GS2970 Datasheet (Doc ID 47478)

• GS2972 Datasheet (Doc ID 47479)

• GS4911B Datasheet (Doc ID 36655)

• GS2974B Datasheet (Doc ID 45062)

• GO2921 Datasheet (Doc ID 47116)

• GS2978 Datasheet (Doc ID 37186)

• FPGA code

6.2 Xilinx's Documentation• UG485 Getting Started with the Spartan-3A DSP S3D1800A Starter Platform User

Guide

• Sp3A-DSP-1800A-Starter-Schematic-Rev1.pdf

• xapp1053.pdf Flash Memory Boot loading Using SPI with Spartan-3A DSP 1800A Starter Platform

• ds593.pdf Platform Cable USB II Advance Product Specification

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7. Appendix

7.1 Schematics

Figure 7-1: Top Schematic

SERA_AUD[3..0]

CONTROL_25

GNDGND

ALPBCK

GND Clips

VCC_3.3V

TOP

AUDIO_OUT1

AUDIO_OUT2

VIDEO IN

Page 02_VIDEO INPUT A AND B

AIN1

AIN2

ALPBCK

AUDIO_OUT1

AUDIO_OUT2

DESA_DATA[19..10]

DESA_STAT[4..0]

DESA_PCLK

GSPI[8..0]

RESET

BIN1

BIN2

BIN2n

DESB_DATA[19..10]

DESB_STAT[4..0]

DESB_PCLK

DESB_AUD[3..0]

CONTROL_[27..0]

SDOUT_RXB

BIN1

GNDA

DESB_PCLK

GNDA

1

3 245

J11

BCJ-FPLV01

DESB_DATA[19..10]

DESB_STAT[4..0]

BIN2

EXT SYNC

Page 08_EXTERNAL SYNC

EXT_SYNC TIMING[2..0]

PCLK4911

GSPI[8..0]

RESET

SDOUT_TXB

CONTROL_25

ACLK1

1

3 245

J1

BCJ-FPLV01

DESB_AUD[3..0]

1

2 3 4 5 6 7

J3

UCBBJE20-1

1

3 245

J2

BCJ-FPLV01

CONTROL_[27..0]

ACLK1

SERA_DIN[19..10]

GSPI_Dongle[0:3]

BIN2n

SDIA2

CONTROL_[27..0]

GSPI_Dongle[0..3]

VIDEO OUT

Page 06_VIDEO OUT

AOUT

AOUTnSERA_AUD[3..0]

SERA_DIN[19..10]

SERA_HVF[2..0]

SERA_PCLK

BOUT

AES_IN1

AES_IN2

SERB_DIN[19..10]

CONTROL_[27..0]

SERB_PCLK

RESET

GSPI[8..0]

SDOUT_RXB

SDOUT_TXB

RESET

SDOUT_RXB

AUD OUT2

GND

AUD OUT1

GND

1. Net TIMING[2:0] and PCLK4911: +/-0.5"

Extra Trace Length Matching Requirement:

1

3 245

J10

BCJ-FPLV01

SERB_DIN[19..10]

2. SERA_PCLK, SERA_HVF[2:0] and SERA_DIN[19:10]: +/-0.25"

SERB_PCLK

SDOUT_RXB

OPTIB

TIMING[2..0]

LPBCK

GNDA_CD

1

2 3 4 5 6 7

J4

UCBBJE20-1

PCLK4911

GND

AUD IN2GND

AUD IN1

1

2 3 4 5 6 7

J5

UCBBJE20-1

R14675R

OPT_TD+

GND

SYNC

AOUTn

1

2 3 4 5 6 7

J6

UCBBJE20-1

SDIB1

CONTROL_[27..0]

1

2 3 4 5 6 7

J8

UCBBJE20-1

BOUT1

2 3 4 5 6 7

J9

UCBBJE20-1

GSPI[8..0]

RESET

AES_IN1

1

3 245

J12

BCJ-FPLV01

AES_IN2

GSPI2: SDOUTGSPI1: SDINGSPI0: SCLK

EXT_SYNC

GNDA

IO Expander

Page 10_IO EXPANDER

GSPI[8..0]

CONTROL_[27..0]

RESET

AOUTSERA_PCLK

Optical

Page 14_Optical

OPT_TD+

OPT_RD+

OPT_RD-

GNDA

EXP_CONNECTOR

Page 09_FPGA INTERFACE

GSPI_Dongle[0:3]DESA_DATA[19..10]

DESA_STAT[4..0]

DESA_PCLK

DESB_DATA[19..10]

DESB_STAT[4..0]

DESB_PCLK

DESB_AUD[3..0]

SERA_DIN[19..10]

SERA_HVF[2..0]

SERA_PCLK

SERA_AUD[3..0]

SERB_DIN[19..10]

SERB_PCLK

TIMING[2..0]

PCLK4911

GSPI[8..0]

RESET

ACLK1

SDIA1

Power

Page 11_Power

RESET

DESA_DATA[19..10]

GSPI[8..0]

12345678910

J7

TSW-105-07-L-DGNDA

SDOUT_TXB

RESET

GSPI[8..0]

DESA_STAT[4..0]

CS0_0 GSPI_Dongle3

JTAG/HOSTb

BOUT

R2 10KR3 10K

GSPI

CS3_0

SDOUT_0 GSPI_Dongle2

R1 10K

SDIN_0 GSPI_Dongle1VCC_3.3VSCLK_0 GSPI_Dongle0

AIN1

1 TP1

1 TP2

GND

SERA_HVF[2..0]

GSPI[8..0]

DESA_PCLK

1 TP4

1 TP3

RESET

GSPI4: CS1 -> DESBGSPI3: CS0 -> DESA

GSPI8: CS5 -> IO EXPGSPI7: CS4 -> GS4911GSPI6: CS3 -> SERBGSPI5: CS2 -> SERA

GSPI[8..0]

AIN2

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Figure 7-2: Video Input A and B

AUDIO_OUT1 1

ALPBCK1

AIN21

AIN11DESA_PCLK 9

DESA_STAT[4..0] 9

DESA_DATA[19..10] 9

AUDIO_OUT2 1

GSPI[8..0]6,8,9,10

Standby _SERB

GSPI[8..0]

+3.3V_2974

SDOUT_RXB 6

RATE DET

R51.15K

C10

4u7

DESA_LPBCKn

DESA_LPBCK

C2710n

C241u

C2610n

C2310n

R7

0R

C2810n

C2510n

DNP

GND

VCC_3.3V

C12

4u7

C110n

CONTROL_[27..0]10CONTROL_[27..0]

Standby _SERB

GNDA

EQUALIZER A

Page 03_EQUALIZERS A

AIN1

AIN2

EQA1_SDIEQA1_SDIn

EQA2_SDIEQA2_SDIn

Standby _SERA

CONTROL_26

C4610n

C4410n

C4510n

C4310n

VCC_1.2V

GND

GNDA

C20.1u

VIDEO IN A

GS2970Apins B2, C3, C4

GS2970A GS2970B GS2970Bpins B2, C3, C4

DESERIALIZER A

Page 04_DESERIALIZER A

SWA_SDI

SWA_SDIn

DESA_DATA[19..10]

DESA_STAT[4..0]

DESA_PCLK

DESA_LPBCK

DESA_LPBCKn

AUDIO_OUT1

AUDIO_OUT2

RESET

GSPI[8:0]

XTAL_OUT

RATE DET Lock A

SDOUT_RXA

Standby _SERA

CONTROL_[4..0]

+3.3VA_2970

A SRC SEL

CONTROL_26

R128

10KR12913.7K

CONTROL_26

CABLE DRIVER

Page 12_Cable Driv er

DESA_LPBCK

DESA_LPBCKnALPBCK

RATE DET

GNDA

CONTROL_[4..0]

GS2970A

C2110n

C2210n

C2010n

C191u

EQB1_SDI

GS2970Apins B1, H1, E1

RESET11

C3010n

C3110n

C3210n

C2910n

IOVDD_2970

GS2970B pins D6, E6, F6, G6

C710n

GS2970A pins D6, E6, F6, G6

RESET

EQB1_SDIn

GNDA

C310n

C5010n

C4810n

C4910n

C4710n

Lock A

GNDA

RESET

Standby _SERA

EQA2_SDI

XTAL_OUT XTAL_OUT

EQA2_SDIn

R1413.7K

R12

10K

EQA1_SDI

CONTROL_27

EQA1_SDIn

BIN2n14

BIN214

BIN11

DESB_AUD[3..0] 9

12

J14

CONTROL_27

IN01

/IN02

VT016

IN13

/IN14

VT15

SEL6

VC

C1

8G

110

G2

11

G3

14

G4

15

Q12

/Q9

VC

C2

13

NC7

PA

D17

U2

SY58017U

SWB_SDIn

SWB_SDI

C510n

C60.1u

VIDEO IN BB SRC SEL

DESB_PCLK 9

DESB_STAT[4..0] 9

DESB_DATA[19..1

RESET

DESERIALIZER B

Page 05_DESERIALIZER B

SWB_SDI

SWB_SDIn

DESB_DATA[19..10]

DESB_STAT[4..0]

DESB_PCLK

GSPI[8..0]

DESB_AUD[3..0]

RESET

XTAL_OUT

Lock B

SDOUT_RXA

SDOUT_RXB

CONTROL_[8..5]

Standby _SERB

EQUALIZER B

Page 13_Equalizer B

BIN1

EQB1_SDIEQB1_SDIn

Standby _SERB

CONTROL_27

C391u

GSPI[8..0]

C4210n

C4010n

CONTROL_[8..5]

C4110n

GNDA

+1.2VA_2970

Standby _SERA

+3.3V_2974

GS2970Bpins B1, H1, E1

+3.3V_2974

GS2970B

Lock B

12

J13

GS2970B pins A7,D10,G10,K7GS2970A pins A7,D10,G10,K7

Lock ALock B

GND

VCC_3.3VIOVDD_2970

GND

VC

CA

1

VC

CB

10

A0 2

A13

TR04

TR16

GN

D5

OEb7

B09

B18

U3

FXL2TD245

GND

VCC_3.3V

GND

A1 green1

A2 red2

K13

K24

U5

HSMF-C165

B Lock

A1 green1

A2 red2

K13

K24

U4

HSMF-C165

A LockVCC_3.3V

R10

75R

GND

R8

75R

C9 4u7

SDOUT_RXA

R41.15K

C11 4u7

IN01

/IN02

VT016

IN13

/IN14

VT15

SEL6

VC

C1

8G

110

G2

11

G3

14

G4

15

Q12

/Q9

VC

C2

13

NC7

PA

D17

U1

SY58017U

C141u

C351u

GS2970 Power Decoupling & Filtering

C341u

C3610n

R90R

R110R

R60R

C3810n

C1310n

R130R

C3310n

C1810n

C1710n

+3.3V_2974

C3710n

C1610n

VCC_1.2V

GND

GND

VCC_3.3V

C151u

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Figure 7-3: Equalizer A

EQA1_SDIn 2

EQA1_SDI 2

AIN21

AIN11

R2237R4

EQA2_SDIn 2

EQA2_SDI 2

R2175R

C691u

GNDA

SDI2

SDI3

VE

E4

VE

E1

AGC5

AGC6

BYPASS7

MCLADJ8

TA

BT

AB

VE

E9

SDO10

SDO11

VE

E12

VC

C13

MUTE14

CD15

VC

C16

U7GS2974B

GNDA

C74470n

EQ A2

CONTROL_26 CONTROL_26

C6310n

C6610n

EQUALIZER A

C2521u

C2531u

GNDA

C6210n

C591u

GNDA

R15 75R

L2 6n2

C60470n

C5410n

+3.3V_2974

C5510n

C58 4u7

C57 4u7

CD_1R1737R4

R1675R

C561u

GNDA

SDI2

SDI3

VE

E4

VE

E1

AGC5

AGC6

BYPASS7

MCLADJ8

TA

BT

AB

VE

E9

SDO10

SDO11

VE

E12

VC

C13

MUTE14

CD15

VC

C16

U6GS2974B

GNDA

C61470n

R180R

R190R

C651u

GNDA

EQ Power Decoupling & Filtering

C641u

VCC_3.3V +3.3V_2974

GND

EQ A1

GND

VCC_3.3V

C22110n

GNDCD_2

GND

CD_1

R130

DNP

Standby _SERACONTROL_26

R1310R

Standby _SERA

I11

GN

D2

I03

Z 4VC

C5

S6

U31

NC7SP157P6X

CD_2

GNDA

C7510n

C721u

GNDA

R20 75R

L3 6n2

C73470n

C6710n

+3.3V_2974

C6810n

C71 4u7

C70 4u7

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Figure 7-4: Deserializer A

DESA_STAT[4..0] 9

DESA_DATA[19..10] 9

SWA_SDIn2

SWA_SDI2 DESA_LPBCK 12

DESA_PCLK 9

DESA_LPBCKn 12

C76

22u

CONTROL_0

SDOUT_RXA5

CONTROL_1

SDOUT_RXAR36 22R

R29 10K

R38 22R1

2

Y1 CS10-27.000M

C80 16p

C79 16p

C8410n

CONTROL_3

GNDA

GNDA

Floating or +3.3V or GND

12. Impedance controlled signals(refer to PCB layout guide).

RESET

8. Lable the connectors, LEDs, DIP sw itches and jumpers. Lable some critical signals on the connectors;

R25 DNP

DESA_DATA18

CONTROL_4

R23105R

GNDA

DESA_DATA17

+1.2VA_2970

IOVDD_2970

4. SQT and TMM series connectors are rated for 3A from 20C-80C, w ith operation temp range of -65-+125C

RESET11

R24DNP

Close to GS2970A

DESA_DATA16DESA_DATA15

R39 22R

Close to GS2970A

SWA_SDI

RESET

VCC_1.2V

5. IOVDD_2970 can be +3.3v, w hich is supplied by this board through a 1-ohm jumper, or differentvoltage supplied by the output board connected to it, in w hich case the 1-ohm jumper shall be removed;

DESA_DATA14

10. Analog pow er and ground isolation(refer to PCB layout guide).

9. Minimum of 3x trace w idth spacing for GS2970_DOUT10~19, GS2970_PCLK;

SWA_SDIn

11. Critital 3G signal layout(refer to PCB layout guide);

GSPI3GSPI0GSPI1

SDOUT_RXA

+3.3VA_2970

DESA_DATA11

DESA_DATA13

DESA_DATA10

DESA_DATA12

DESA_LPBCKn

DESA_LPBCK

7. Use BNC ground as the ground test points;

+3.3VA_2970

GSPI[8:0]5,6,8,9,10

DESA_PCLKR35 22R

13. Via size test points should be as close as possible to the pins;

CONTROL_[4..0]

6. The value of the serial resistors on video output port w ill be determined by board signal integrity test;

Standby _SERA

DESA_STAT1 V ADESA_STAT0 H A

GND

DESA_STAT2 F A

GND

123456789

10111213141516

RN1 742C163220

C78 47n

+1.2VA_2970

R32 1.15K

R27 22R

LB_CONT Settings:

DESA_DATA19

3. Pow er consumption:2. DNP(Do Not Populate);

+1.2V217GS2970_1

+3.3V75

0

Notes:

Dev ice

0GS2978 51

C77 1u

65

217mA

1. This board is GS2960/1 compatible;

GS2974

Total 191mA

CONTROL_2

Close topin C1 & D1 of GS2970A

XTAL_OUT

Standby _SERA

R37 1.15K

DESA_STAT3 Lock A

DESA_STAT4

XTAL_OUT

DESA_AOUT_1/2

AUDIO_OUT1 1AUDIO_OUT1

XTAL_OUT

R26 0R

AUDIO_OUT2 1AUDIO_OUT2

IOVDD_2970

DESA_AOUT_3/4

GND

VBGA1

LFA2

LB_CONTA3

VC

O_V

DD

A4

STAT0A5STAT1A6STAT2B5

STAT3B6

STAT4C5

STAT5C6

IO_V

DD

1A

7

PCLKA8

DOUT0K8DOUT1J8

DOUT2K9DOUT3K10DOUT4J9DOUT5J10DOUT6H9DOUT7H10DOUT8F9DOUT9F10

DOUT10E9DOUT11E10

DOUT12C8DOUT13C10DOUT14C9DOUT15B10DOUT16B9DOUT17A10DOUT18A9DOUT19B8

A_V

DD

B1

PLL

_VD

D1

B2

RSV1B3

VC

O_G

ND

B4

IO_G

ND

1B

7

SDIC1

A_G

ND

1C

2

PLL

_VD

D2

C3

PLL

_VD

D3

C4

RESETC7

SDID1

A_G

ND

2D

2

A_G

ND

3D

3

PLL

_GN

D1

D4

CO

RE

_GN

D1

D5

CO

RE

_VD

D1

D6

SW_END7

JTAG/HOSTD8

IO_G

ND

2D

9

IO_V

DD

2D

10

SD

I_V

DD

E1

A_G

ND

4E

3

PLL

_GN

D2

E4

CO

RE

_GN

D2

E5

CO

RE

_VD

D2

E6

SDOUT_TDOE7

SDIN_TDIE8

TERMF1

RSV3F2

A_G

ND

5F

3

PLL

_GN

D3

F4

CO

RE

_GN

D3

F5

CO

RE

_VD

D3

F6

CS_TMSF7 SCLK_TCKF8

RSV4G1

RSV5G2

RC_BYPG3

RSV2G4

CO

RE

_GN

D4

G5

CO

RE

_VD

D4

G6

SMPTE_BYPASSG7

DVB_ASIG8

IO_G

ND

3G

9

IO_V

DD

3G

10

BU

F_V

DD

H1

BU

F_G

ND

H2

AUDIO_EN/DISH3

WCLKH4

TIM_861H5

XTAL_OUTH6

20BIT/10BITH7 IOPROC_EN/DISH8

SDOJ1

SDO_EN/DISJ2

AOUT_1/2J3

ACLKJ4

AOUT_5/6J5

XTAL2J6

IO_G

ND

4J7

SDOK1

STANDBYK2

AOUT_3/4K3

AMCLKK4

AOUT_7/8K5

XTAL1K6

IO_V

DD

4K

7

SD

I_G

ND

E2

U8

GS2970_1

RATE DET

R28 22R

Lock A Lock A 9

R33 0RR34 0R

RATE DET 12RATE DET

CONTROL_[4..0]

DESERIALIZER A

C820.1u

C81

0.1u

A3

B4

R5

GND

2

Vcc

1

110R

U10

SN65LVDT2

C850.1u

C83

0.1u

AES AUDIO OUT

AUDIO_OUT1

AUDIO_OUT2

A3

B4

R5

GND

2

Vcc

1

110R

U9

SN65LVDT2

GNDGND

GND

VCC_3.3V

GND GND

VCC_3.3V

GND

DESA_AOUT_3/4

DESA_AOUT_1/2

Standby _SERA

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Figure 7-5: Deserializer B

DESB_DATA[19..10] 9

DESB_PCLK 9

DESB_AUD[3..0] 9

Standby _SERB Standby _SERB Standby _SERB

XTAL_OUT4 XTAL_OUT

C8910n

GNDA

GNDA

Floating or +3.3V or GND

12. Impedance controlled signals(refer to PCB layout guide).

RESET

8. Lable the connectors, LEDs, DIP sw itches and jumpers. Lable some critical signals on the connectors;

R44 DNP

DESB_DATA18

R42105R

GNDA

DESB_DATA17

+1.2VA_2970

IOVDD_2970

GSPI[8..0]

4. SQT and TMM series connectors are rated for 3A from 20C-80C, w ith operation temp range of -65-+125C

R43DNP

Close to GS2970B

DESB_DATA16DESB_DATA15

Close to GS2970B

GSPI[8..0]

XTAL_OUT

SWB_SDI

DESB_ACLK DESB_AUD1DESB_WCLK DESB_AUD0

R61 22RR62 22R

VCC_1.2V

5. IOVDD_2970 can be +3.3v, w hich is supplied by this board through a 1-ohm jumper, or differentvoltage supplied by the output board connected to it, in w hich case the 1-ohm jumper shall be removed;

DESB_DATA14

10. Analog pow er and ground isolation(refer to PCB layout guide).

9. Minimum of 3x trace w idth spacing for GS2970_DOUT10~19, GS2970_PCLK;

DESB_DATA[19..10]

SWB_SDIn

11. Critital 3G signal layout(refer to PCB layout guide);

GSPI4GSPI0SDOUT_RXA

+3.3VA_2970

DESB_DATA11

DESB_DATA13

DESB_DATA10

DESB_DATA12

7. Use BNC ground as the ground test points;

+3.3VA_2970

DESB_PCLKR52 22R

13. Via size test points should be as close as possible to the pins;

DESB_AOUT3_4 DESB_AUD3DESB_AOUT1_2 DESB_AUD2

6. The value of the serial resistors on video output port w ill be determined by board signal integrity test;

GND

R4510K

123456789

10111213141516

RN2 742C163220

C88 47n

CONTROL_6

+1.2VA_2970

R48 22R

LB_CONT Settings:

DESB_DATA19

R49 22R

3. Pow er consumption:2. DNP(Do Not Populate);

+1.2V217GS2970_1

+3.3V75

0

Notes:

Dev ice

0GS2978 51

C87 1u

65

217mA

1. This board is GS2960/1 compatible;

GS2974

Total 191mA

Close topin C1 & D1 of GS2970B

DESERIALIZER B

R54 1.15K

C86

22u

CONTROL_5

CONTROL_7

CONTROL_[8..5]10

CONTROL_8

IOVDD_2970

GND

CONTROL_[8..5]

R51 1.15K

SDOUT_RXB

R53 22RR55 22RR56 22R

SDOUT_RXB SDOUT_RXB 6

RESET11RESET

DESB_STAT3 Lock B

VBGA1

LFA2

LB_CONTA3

VC

O_V

DD

A4

STAT0 A5STAT1A6STAT2B5

STAT3B6

STAT4C5

STAT5C6

IO_V

DD

1A

7

PCLKA8

DOUT0K8DOUT1J8

DOUT2K9DOUT3K10DOUT4J9DOUT5J10DOUT6H9DOUT7H10DOUT8F9DOUT9F10

DOUT10E9DOUT11E10

DOUT12 C8DOUT13C10DOUT14C9DOUT15 B10DOUT16B9DOUT17A10DOUT18A9DOUT19B8

A_V

DD

B1

PLL

_VD

D1

B2

RSV1B3

VC

O_G

ND

B4

IO_G

ND

1B

7

SDIC1

A_G

ND

1C

2

PLL

_VD

D2

C3

PLL

_VD

D3

C4

RESETC7

SDID1

A_G

ND

2D

2

A_G

ND

3D

3

PLL

_GN

D1

D4

CO

RE

_GN

D1

D5

CO

RE

_VD

D1

D6

SW_END7

JTAG/HOSTD8

IO_G

ND

2D

9

IO_V

DD

2D

10

SD

I_V

DD

E1

A_G

ND

4E

3

PLL

_GN

D2

E4

CO

RE

_GN

D2

E5

CO

RE

_VD

D2

E6

SDOUT_TDOE7

SDIN_TDIE8

TERMF1

RSV3F2

A_G

ND

5F

3

PLL

_GN

D3

F4

CO

RE

_GN

D3

F5

CO

RE

_VD

D3

F6

CS_TMSF7 SCLK_TCKF8

RSV4G1

RSV5G2

RC_BYPG3

RSV2G4

CO

RE

_GN

D4

G5

CO

RE

_VD

D4

G6

SMPTE_BYPASSG7

DVB_ASIG8

IO_G

ND

3G

9

IO_V

DD

3G

10

BU

F_V

DD

H1

BU

F_G

ND

H2

AUDIO_EN/DISH3

WCLKH4

TIM_861H5

XTAL_OUTH6

20BIT/10BITH7 IOPROC_EN/DISH8

SDOJ1

SDO_EN/DISJ2

AOUT_1/2J3

ACLKJ4

AOUT_5/6J5

XTAL2J6

IO_G

ND

4J7

SDOK1

STANDBYK2

AOUT_3/4K3

AMCLKK4

AOUT_7/8K5

XTAL1K6

IO_V

DD

4K

7

SD

I_G

ND

E2

U11

GS2970_1

GSPI0

DESB_STAT4

GSPI4R59 22R

SDOUT_RXA4 SDOUT_RXA

R60 22R

DESB_STAT[4..0] 9

DESB_STAT1 V BDESB_STAT0 H B

DESB_STAT2 F B

SWB_SDIn

SWB_SDI

SWB_SDIn2

SWB_SDI2

Lock B 9Lock B

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Figure 7-6: Serializer A

SERA_DIN[19..10]9

SERA_AUD[3..0]9

AOUTn 14

AOUT 1

SERA_HVF[2..0]9

C90

22u

SDOUT_RXB5

SERB_Locked

C9210n

C11010n

SERB Pins G1,H10

SERA_PCLK9

CONTROL_2

GND

SDOUT_RXB

C2181u

R80 75RSERB Pins A6,B6

10. Impedance controlled signals(refer to PCB layout guide).

R69150R

C121 4u7

R78 75R

IOVDD_2972

R75 75R

C12610n

C1081u

C113

10n

C101 1u

C114

10n

C1041u C99

10n

C97 10u

C9510n

R640R

SERB_Locked

C119 4u7

C12210n

R76750R

C12510n

C941u

C1071u

L5 5n6

C1241u

R810R

R77 75R

R700R

R66 200R

R790R

AOUT

C9310u

AOUTn

Return Loss compensation Network

R63105R

C1231u

SERA Pins A5,E1,K8,G10

C102 100p

SERA_SDI_SDOn

C10910n

SERA_SDI_SDO

VC

O_V

DD

B7

VBGA8

VC

O_G

ND

B8

TDIE7

RSV7A9

TIM_861G3

PCLKB4

IO_V

DD

1G

1

DIN18A2 DIN19B3

LFA7

AV

DD

A10

AG

ND

2B

10

DIN17A1

CO

RE

_VD

D3

K8

GRP1_EN/DISH6

DETECT_TRSF3

CO

RE

_GN

D5

E6

AG

ND

1B

9

DIN16B2

CO

RE

_VD

D4

G10

PLL

_VD

D1

A6

PLL

_VD

D2

B6

RSV1D5

STANDBYD3

ACLK1K7

WCLK1J7

AIN_1/2J6

DIN14C2 DIN15B1

CO

RE

_GN

D2

C5

CO

RE

_GN

D1

B5

RSV4D6

RSV5D7

DVB_ASIG5

LOCKEDH4

GRP2_EN/DISH5

AIN_3/4K6

DIN12C3 DIN13C1

RSV6D8

TMSE8TDOF8

RATE_SEL0E3

CO

RE

_GN

D4

E5

CO

RE

_VD

D2

E1

ACLK2K5

IO_V

DD

2H

10

DIN10D2 DIN11D1

RSV3F4

TCKJ8

CO

RE

_GN

D8

G9

20BIT/10BITG4

CO

RE

_GN

D6

F5

CO

RE

_VD

D1

A5

WCLK2J5

IO_G

ND

1G

2

DIN8F2 DIN9F1

RSV2F7

CD

_GN

D4

F9

CD

_GN

D3

E9

IOPROC_EN/DISG7

SMPTE_BYPASSG6

RESETG8

AIN_5/6J4

ANC_BLANKH3

DIN6H2 DIN7H1

CD

_GN

D2

D9

CO

RE

_GN

D3

E2

AUDIO_INTH7

CS_TMSK9

SCLK_TCKJ10

SDOUT_TDOJ9

AIN_7/8K4

H/HSYNCA4

DIN4J2 DIN5J1

CO

RE

_GN

D7

F6

PLL

_GN

D3

C8

PLL

_GN

D2

C7

PLL

_GN

D1

C6

SDO_EN/DISD4

SDIN_TDI K10

V/VSYNCC4

IO_G

ND

2H

9

DIN2K2 DIN3K1

RSETF10

CD

_VD

DE

10

SDOC10

SDOD10

CD

_GN

D1

C9

JTAG/HOSTH8

F/DEA3

RATE_SEL1E4

DIN0K3 DIN1J3

U15GS2972

C120 10n

C9810n

C10610n

C112

10n

C1031u

C111

10n

CONTROL_[27..0] 10

RESET11

GNDA

GSPI[8..0] 4,5,8,9,10GNDA

GNDA

GNDA

GNDA

GNDA

VCC_3.3V

VCC_3.3V

VCC_1.2V

VCC_1.2V

CDVDD_2972

+1.2VA_2972

IOVDD_2972

+1.2VA_2972

+1.2VA_2972 IOVDD_2972

CDVDD_2972

VCC_1.2V

GNDACDVDD_2972

GND

CDVDD_2972

GND

GND

GND

GND

GND

GND

GND

C10533p

GSPI[8..0]

Close toGS2972A

+3.3VA_2972

SERA_PCLK

R730R

R670R

SERB_Locked7

SERA_Locked

SERA_WCLK1SERA_AUD0SERA_ACLK1SERA_AUD1

SERA_AIN3_4SERA_AUD3SERA_AIN1_2SERA_AUD2

5. Use BNC ground as the ground test points;3. Pow er consumption:

2. DNP(Do Not Populate);

235mA

C2201u

GND

Close to GS2972A

+1.2V

SERA_VSERA_HVF1SERA_FSERA_HVF2

SERA_HSERA_HVF0

86+3.3V

RESET

SERA_DIN14SERA_DIN15SERA_DIN16

GS2972 Power Decoupling & Filtering

SERA_DIN19SERA_DIN18SERA_DIN17SERB Pin E10

SERA_DIN11SERA_DIN10

SERA_DIN12SERA_DIN13

GS2972Dev ice

6. Lable the connectors, LEDs, DIP sw itches and jumpers. Lable some critical signals of the connectors;

Notes:

0Others 3

CONTROL_15CONTROL_14

CONTROL_13

CONTROL_11CONTROL_12

CONTROL_16

0 5LEDs

11. Via size test point should be as close as possible to the pin;

SERA Pin A10

VCC_3.3V

1. This board is GS2962 compatible;

SERA Pins A6,B6

SDOUT_RXBGSPI0GSPI5

SDOUT_TXA

SERA Pin E10

235mATotal 94mA

7. Minimum of 3x trace w idth spacing for GS2972_DIN10~19, GS2972_PCLK;

4. IOVDD_2972 can be +3.3v, w hich is supplied by this board through a 1-ohm jumper, or differentvoltage supplied by the input board connected to it, in w hich case the 1-ohm jumper shall be removed;

8. Analog pow er and ground isolation(refer to PCB layout guide);

CONTROL_[27..0]

SERA_DIN[19..10]

9. Critital 3G signal layout(refer to PCB layout guide);

SERA Pins G1,H10 VCC_3.3VTx A Lock

A1 green1

A2 red2

K13

K24

U13

HSMF-C165GND

GND

R65

75R

GND

SERA_Locked

VCC_3.3VIOVDD_2972

VC

CA

1

VC

CB

10

A02

A13

TR04

TR16

GN

D5

OEb7

B09

B18

U12

FXL2TD245

GND

GSPI0

SERB Pins A5,E1,K8,G10

C2171u

75 OHM CONTROLLED IMPEDANCE

GSPI5

CONTROL_9

L4

BEAD_FERRITE_SM

C10010n

SERIALIZER A

SDOUT_TXA 7

+3.3VA_2972

75 OHMCONTROLLEDIMPEDANCE

SERB Pin A10

R12610K

C12710n

C12810n

C2191u

CONTROL_1

C117

10n

C116

10n

C118

10n

C115

10n GND

C9110n

L6 5n6

C9610n

VCC_3.3VTx B Lock

GND

R71

75RA1 green

1A2 red

2

K13

K24

U14

HSMF-C165

CONTROL_10

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Figure 7-7: Serializer B

SERB_LockedSERB_Locked 6

CONTROL_24

SERB_SDI_SDOn

BOUT

SERIALIZER B

R92

75R

75 OHM CONTROLLED IMPEDANCE

CONTROL_23CONTROL_22

CONTROL_20CONTROL_21

CONTROL_19

+3.3VA_2972

75 OHMCONTROLLEDIMPEDANCE

C129

22u

GNDA

CONTROL_6

R94105R

SERB_AIN_1/2

R12710K

R93105R

C131 1u

10. Impedance controlled signals(refer to PCB layout guide).

GND

SERB_AIN_3/4

Return Loss compensation Network

CONTROL_18

SERB_SDI_SDO

C134 4u7

CONTROL_[27..0]

Close toGS2972B

SERB_PCLK

SERB_Locked

3. Pow er consumption:

2. DNP(Do Not Populate);5. Use BNC ground as the ground test points;

235mA

GSPI[8..0] 4,5,8,9,10GSPI[8..0]

GSPI6GSPI0

GND

Close to GS2972B

+1.2V86+3.3V

RESET

SERB_DIN14

SERB_DIN16SERB_DIN15

SERB_DIN18SERB_DIN17

SERB_DIN19

SERB_DIN11SERB_DIN10

SERB_DIN13SERB_DIN12

GS2972Dev ice

6. Lable the connectors, LEDs, DIP sw itches and jumpers. Lable some critical signals of the connectors;

GND

SERB_AIN_3/4

C139

0.1u

VCC_3.3V

GNDC1400.1u

A3

B4

R5

GND

2

Vcc

1

110R

U18

SN65LVDT2

GND GND

Notes:

0 3Others50LEDs

11. Via size test point should be as close as possible to the pin;

SDOUT_TXB 8

1. This board is GS2962 compatible;

SDOUT_TXAGSPI0GSPI6

SDOUT_TXB

235mA 94mATotal

7. Minimum of 3x trace w idth spacing for GS2972_DIN10~19, GS2972_PCLK;

4. IOVDD_2972 can be +3.3v, w hich is supplied by this board through a 1-ohm jumper, or differentvoltage supplied by the input board connected to it, in w hich case the 1-ohm jumper shall be removed;

8. Analog pow er and ground isolation(refer to PCB layout guide);

SERB_DIN[19..10]

L7 5n6

9. Critital 3G signal layout(refer to PCB layout guide);

C132 100p

R82105R

R89750R

VC

O_V

DD

B7

VBGA8

VC

O_G

ND

B8

TDIE7

RSV7 A9

TIM_861G3

PCLKB4

IO_V

DD

1G

1

DIN18A2 DIN19B3

LFA7

AV

DD

A10

AG

ND

2B

10

DIN17A1

CO

RE

_VD

D3

K8

GRP1_EN/DISH6

DETECT_TRSF3

CO

RE

_GN

D5

E6

AG

ND

1B

9

DIN16B2

CO

RE

_VD

D4

G10

PLL

_VD

D1

A6

PLL

_VD

D2

B6

RSV1D5

STANDBYD3

ACLK1K7

WCLK1J7

AIN_1/2J6

DIN14C2 DIN15B1

CO

RE

_GN

D2

C5

CO

RE

_GN

D1

B5

RSV4 D6

RSV5D7

DVB_ASIG5

LOCKED H4

GRP2_EN/DISH5

AIN_3/4K6

DIN12C3 DIN13C1

RSV6D8

TMSE8TDOF8

RATE_SEL0E3

CO

RE

_GN

D4

E5

CO

RE

_VD

D2

E1

ACLK2K5

IO_V

DD

2H

10

DIN10D2 DIN11D1

RSV3F4

TCKJ8

CO

RE

_GN

D8

G9

20BIT/10BITG4

CO

RE

_GN

D6

F5

CO

RE

_VD

D1

A5

WCLK2J5

IO_G

ND

1G

2

DIN8F2 DIN9F1

RSV2F7

CD

_GN

D4

F9

CD

_GN

D3

E9

IOPROC_EN/DISG7

SMPTE_BYPASSG6

RESETG8

AIN_5/6J4

ANC_BLANKH3

DIN6H2 DIN7H1

CD

_GN

D2

D9

CO

RE

_GN

D3

E2

AUDIO_INTH7

CS_TMSK9

SCLK_TCKJ10

SDOUT_TDOJ9

AIN_7/8K4

H/HSYNCA4

DIN4J2 DIN5J1

CO

RE

_GN

D7

F6

PLL

_GN

D3

C8

PLL

_GN

D2

C7

PLL

_GN

D1

C6

SDO_EN/DISD4

SDIN_TDI K10

V/VSYNCC4

IO_G

ND

2H

9

DIN2K2 DIN3K1

RSETF10

CD

_VD

DE

10

SDOC10

SDOD10

CD

_GN

D1

C9

JTAG/HOSTH8

F/DEA3

RATE_SEL1E4

DIN0K3 DIN1J3

U16GS2972

SERB_AIN_1/2

SERB_AIN_3/4

R83 200R

C13333p

C130 10u

R86150R

R88 75R

AES_IN11

BOUT 1

AES_IN21

SERB_DIN[19..10]9

SERB_PCLK9

RESET11

GNDA

CONTROL_[27..0] 10

+1.2VA_2972

GNDA

GNDA

IOVDD_2972

+1.2VA_2972

CDVDD_2972

VCC_1.2V

GND

CDVDD_2972

GND

GND

GND

IOVDD_2972

SDOUT_TXA 6

C138 4u7

R90 75R

R91 75R

C136 10nGNDA

CDVDD_2972

75 OHM CONTROLLED IMPEDANCE

CONTROL_17

GND

C135

0.1uC1370.1u

VCC_3.3V

GND

A3

B4

R5

GND

2

Vcc

1

110R

U17

SN65LVDT2

SERB_AIN_1/2

GND GND

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Figure 7-8: External Sync

PCLK4911 9

TIMING[2..0] 9

EXT_SYNC1

RE

SE

T

1V8_GS4911

VDD_XTAL_GS4911

12

Y2

CS10-27.000M

C171

24p

R10210K

C170

38p

IO_V_GS4911

LOCK_LOSTREF_LOST

R1001M

GND

VCC_3.3VIO_V_GS4911

GND

GND

VC

CA

1

VC

CB

10

A02

A13

TR04

TR16

GN

D5

OEb7

B09

B18

U21

FXL2TD245

GND

VCC_3.3V

GND

A1 green1

A2 red2

K13

K24

U23

HSMF-C165

REF_LOST

VCC_3.3V

A1 green1

A2 red2

K13

K24

U22

HSMF-C165LOCK_LOST

R107

75R

R108

75R

PCLK4911SDOUT_TXB7

TP6

SDOUT_TXB

XTAL1

VBLANK2

SYNCLOCK3

PWDN4

SDENB5

SCL6

SDA7

GN

DD

18

HIN9

SYNCIN10

VERTIN11

LEVEL12

GN

DA

113

VC

CA

114

VC

CA

215

GN

DA

216

GN

DD

217

VC

CD

118

SYNCOUT19

BACKPORCH20

HOUT21

VERTOUT22

ODD/EVEN23

XTALN24

U20

EL4511CUZ

C1730.1u

VCC_3.3VVCC_3.3V

C1720.1u

R101 10K

C175(NP)

R106 22RR105 22R

ACLK1

R104 22R

GSPI2

IO_V

_GS

4911

ACLK1

GSPI7

CONTROL_25

EXTERNAL SYNC.

RESET11

GS4911_H

RESET

R149DNP

GS4911_F

R150200R

GS4911_V

GS4911_V

GS4911_F

GS4911_H

CONTROL_2510

TIMING[2..0]

C174

0.1u

VID_PLL_GND4 VID_PLL_VDD3

XTAL_VDD5

X16

X27

XTAL_GND8

CORE_GND9

PH

S_G

ND

55

PH

S_V

DD

54

ANALOG_VDD10

NC111

ANALOG_GND12

AUD_PLL_GND13

AUD_PLL_VDD14

10FID15

HSYNC16

VS

YN

C17

IO_V

DD

18

FS

YN

C19

NC

220

VID

_ST

D0

21

VID

_ST

D1

22

VID

_ST

D2

23

VID

_ST

D3

24

VID

_ST

D4

25

VID

_ST

D5

27

AC

LK1

28

AC

LK2

29

AC

LK3

30

IO_V

DD

31

CO

RE

_VD

D26

AS

R_S

EL2

32

ASR_SEL133ASR_SEL0 34TIMING_OUT135TIMING_OUT236

IO_VDD38TIMING_OUT439

TIMING_OUT3 37

TIMING_OUT540

LVDS/PCLK3_VDD45PCLK346

LVDS/PCLK3_GND48

PCLK347

PC

LK2

49

PC

LK1&

2_G

ND

52

PC

LK1

51

IO_V

DD

50

TIMING_OUT641TIMING_OUT742TIMING_OUT843

PC

LK1&

2_V

DD

53

LOCK_LOST1

REF_LOST2

GE

NLO

CK

64

CORE_VDD44

JTA

G/H

OS

T56

SC

LK_T

CLK

57S

DIN

_TD

I58

SD

OU

T_T

DO

59C

S_T

MS

60R

ES

ET

61IO

_VD

D62

NC

363

GND_PAD65

U19

GS4911

GND

GND

R1030R

TIMING0

IO_V_GS4911

TIMING1

LOCK_LOST

C15410n

C14510n

C14910n

C14810n

C14710n

C15010n

DECOUPLING@ PIN 5

GND

1V8_Core_GS4911VCC_1.8V

C15610uC166

10u

R990R C167

0.1uC1650.1u

C16910n

REF_LOST

C16810n

IO_V_GS4911

GND

CONTROL_25

C1570.1u

DECOUPLING @ PINS18,31,38,50,62

C1600.1u

R980R C161

10nC16410n

C16310n

C16210n

TIMING2

C15510n

VCC_3.3V

C15810u

C15910u

DECOUPLING @PINS 26,44

GND

VDD_XTAL_GS4911VCC_3.3V

C15310u

C15210u

R960R

C1510.1u

GS4911 decoupling

GND

1V8_GS4911VCC_1.8V

C14310uC142

10u

GSPI0

R950R C144

0.1uC1410.1u

GS

PI7

C14610n

DECOUPLING @ PINS 3,10,14,45,53,54GSPI[8..0]

GSPI[8..0]4,5,6,9,10

GS

PI2

TP5

SD

OU

T_T

XB

1V8_Core_GS4911

GS

PI0

GND

GND

GND

R9710K

V_Sy ncH_Sy nc

GND

PC

LK49

11

IO_V

_GS

4911

IO_V_GS4911

1V8_GS4911

1V8_GS4911

1V8_GS4911

1V8_

Cor

e_G

S49

11

F_Sy nc

1V8_

GS

4911

1V8_

GS

4911

IO_V

_GS

4911

V_STD_Sel

IO_V

_GS

4911

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Figure 7-9: FPGA Interface

Figure 7-10: SPI I/O Expander

AC6

+2.5V RAW

DESB_AUD[3..0]

DESA_DATA[19..10]

GSPI_Dongle[0:3]

DESA_DATA[19..10]4

DESA_PCLK4

DESA_STAT[4..0]2,4

GND

DESB_AUD[3..0]5

DESB_PCLK5

DESB_STAT[4..0]2,5

DESB_DATA[19..10]5

SERA_AUD[3..0] 6

SERA_PCLK 6

SERA_HVF[2..0] 6

SERA_DIN[19..10] 6

PCLK49118

TIMING[2..0]8

SERB_PCLK 7

SERB_DIN[19..10] 7

GSPI0GSPI[8..0]4,5,6,8,10

DESA_STAT0

SERB_DIN19

SERA_AUD[3..0]

SERA_DIN15

EXP CONNECTOR

SERA_DIN14

DESA_DATA11

AC19

GND

DESB_STAT3

AD19

DESA_STAT0

AC9

SERA_DIN18

AD6

TIMING[2..0]

SERA_DIN14

DESB_AUD2

GSPI_Dongle0

GSPI1

AB18

DESB_DATA12

R20*

SERB_DIN18

Y10

AC8

SERA_AUD2

DESA_STAT1 DESB_DATA10

DESA_DATA10

GSPI8

AF13

V15

SERA_DIN13

GSPI2

SERA_DIN16

DESB_DATA18

SERB_DIN11

AA10

AB7

DESB_AUD3

SERB_DIN17

DESA_STAT2

R19*

GSPI_Dongle1

DESA_DATA17

W15

DESB_DATA17

SCLK_FPGA

GSPI4

GSPI3

SERA_DIN12

DESA_STAT1

W9

AE4

DESA_STAT3

DESB_AUD0

SERA_AUD0

DESB_PCLKY14

SERB_DIN16

SERA_DIN19

AB16

SERB_DIN12

DESB_DATA16

Y9

AF4

GSPI4

SERA_DIN11

DESB_AUD3

GSPI_Dongle2

SERA_AUD3

AD14

DESB_DATA15

DESA_STAT2DESB_AUD0

DESA_DATA19

*M21

TIMING0

SERA_AUD1DESB_STAT2

DESB_DATA15

SERB_DIN15

DESB_STAT0

V11

AE3

DESB_DATA19

DESA_PCLK

GSPI5

AC14

SERA_DIN10

SERA_DIN12

SERB_DIN13

AC16

DESA_DATA18

GSPI_Dongle3

DESB_DATA14

U11

+3.3V RAW

AF3

DESA_DATA15

DESA_STAT3

SERA_PCLK

SERA_AUD2

SERA_DIN18

TIMING1

SERB_DIN14

GSPI6

DESB_STAT1

K23*

RESET

*U22

* indicates that this signal is routedthrough a FET switch (U5) on the Xilinxboard; only STAT signals allowed on pinsmarked with a *.

DESA_DATA17

DESB_DATA18

DESB_DATA13

AF5

SERA_DIN[19..10]

SERA_DIN11

SERA_DIN17

M22*

GND

TIMING2

DESB_STAT2 SERA_AUD3

SERB_PCLK

SERB_DIN14

SERB_DIN13

DESA_STAT4AC15

DESA_DATA16

GSPI7

DESB_DATA12

AE6

GSPI2

SERB_PCLK

V13

AB12

ACLK1

DESB_STAT3

SERA_DIN16

DESA_DATA15

AA13

DESB_DATA17

SERB_DIN12

AE25

DESB_DATA11

GSPI6

SERA_DIN10

SERA_HVF[2..0]

W13

SERB_DIN15

AC12

ACLK1

GSPI0

Y13

DESB_STAT4

DESA_DATA14

DESB_STAT0

AF25

DESB_DATA[19..10]

DESB_DATA10

CS1 = DESBCS0 = DESA

SERB_DIN11

GSPI7

Y12

AE17

DESA_DATA13

V14

RESET 8RESET

DESA_DATA16AE23

CS2 = SERA

SERA_PCLK

DESB_PCLK

SERB_DIN16

ACLK1

DESA_STAT4

AA12

AD17

DESA_DATA12

GSPI1

GSPI8

AF23

SERA_HVF1

GSPI[8..0]

U15

CS3 = SERB

SERB_DIN10

PCLK4911

DESA_DATA19

GND

CS4 = GS4911

DESA_DATA11

AD22

W17

AF20

DESB_DATA14

SERB_DIN[19..10]

DESB_AUD2

SERA_DIN17

CS5 = IO EXP

DESB_STAT1

SERB_DIN17

SERA_HVF0

DESA_PCLK

AE21

DESA_DATA10

V17

GSPI3AE20

V10

DESA_DATA18

PCLK4911

AD21

SERA_HVF0

DESA_DATA14

V12

AE9

W10

SERA_HVF2

AC21

AF9

DESB_DATA16

DESA_STAT[4..0]

W12

DESB_DATA13

TIMING0

SERA_AUD1

V16

SERA_HVF1

SERB_DIN19

U23*

DESA_DATA13

AE8

DESB_STAT4

AD11

Y17

SERA_HVF2

U24*

AC11

AF8

GND

TIMING1

SERA_DIN13

SERB_DIN18

AA18

R148 22R

DESA_DATA12

AD20SERA_DIN19

AF14

AD7

SERA_AUD0

AC20

GSPI5

DESB_DATA19

AF19

TIMING2

AE14

AE7

GSPI_Dongle[0:3]1

DESB_STAT[4..0]

GND

SERA_DIN15

DESB_AUD1

SERB_DIN10

22

44

66

88

1010

1212

1414

1616

1818

2020

2222

2424

2626

2828

3030

3232

3434

3636

3838

4040

4242

4444

4646

4848

5050

5252

5454

5656

5858

6060

6262

6464

6666

6868

7070

7272

7474

7676

7878

8080

8282

8484

8686

8888

9090

9292

9494

9696

9898

100100

102102

104104

106106

108108

110110

112112

114114

116116

118118

120120

11

33

55

77

99

1111

1313

15 15

1717

1919

2121

2323

2525

2727

2929

3131

3333

3535

3737

3939

4141

4343

45 45

4747

4949

51 51

5353

5555

5757

5959

6161

6363

6565

6767

6969

7171

7373

7575

7777

7979

8181

8383

8585

87 87

8989

9191

9393

9595

9797

9999

101101

103103

105105

107107

109109

111111

113113

115115

117117

119119

122122

124124

126126

128128

130130

132132

121121

123123

125125

127127

129129

131131

JX1

QSE-060-01-L-D-A

AA17

AE19

+2.5V RAW

GSPI_Dongle0

GSPI_Dongle2GSPI_Dongle1 +3.3V RAW

DESB_DATA11

DESB_AUD1

AB9

GSPI_Dongle3

CONTROL_[27..0] 2,4,5,6,7,8

GSPI[8..0]4,5,6,8,9

CONTROL_21

CONTROL_4CONTROL_4 DESA_SW_EN

CONTROL_22

CONTROL_26SOURCE A

CONTROL_5CONTROL_5 DESB_TIM861R109

39k

CONTROL_23

CONTROL_27SOURCE B

CONTROL_6CONTROL_6 B_SMPTE_BYPASSn

CONTROL_24

CONTROL_7CONTROL_7 DESB_IO_PROC_EN/DISb

CONTROL_25CONTROL_26

CONTROL_8CONTROL_8 DESB_SW_EN

CONTROL_27

GSPI8

CONTROL_9CONTROL_9 SERA_TIM861CONTROL_10CONTROL_10 SERA_STDBY

Control Register Address:Control_0: 24

CONTROL_11CONTROL_11 SERA_RATE_SEL0 Control_1: 25

R151DNP

R152200R

Control_3: 27Control_2: 26CONTROL_12CONTROL_12 SERA_RATE_SEL1

VCC_3.3V

Control_7: 2BControl_6: 2AControl_5: 29Control_4: 28

Control_8: 2C

Control_11: 2FControl_10: 2EControl_9: 2D

Control_14: 32Control_13: 31Control_12: 30

Control_15: 33

CONTROL_13CONTROL_13 SERA_IO_PROCE_EN/DISb

Control_19: 37Control_18: 36Control_17: 35Control_16: 34

V+35

GND238 GND137

ISET36

DIN33

CSn34

SCLK32

DOUT40

P3129

P3027

P2925

P2823

P2722

P2621

P2519

P2418

P430

P528

P626

P724

P81

P93

P105

P117

P122

P134

P14 6

P158

P169

P1710

P1812

P1913

P2014

P2115

P2216

P2317

GND339

N.C131

N.C220

N.C311

TA

BT

AB

U24

MAX7301ATL+

Control_21: 39Control_20: 38

Control_23: 3BControl_22: 3A

CONTROL_[27..0]

CONTROL_14CONTROL_14 SERA_DETECT_TRS

VCC_3.3V

C1761u

CONTROL_15CONTROL_15 SERA_ANC_BLANKb

GSPI1

CONTROL_16CONTROL_16 SERA_GRP1_EN_DISb

Control_25: 3DControl_24: 3C

Control_27: 3FControl_26: 3E

GSPI0GSPI1

DESA_TIM861

CONTROL_17CONTROL_17 SERB_TIM861

A_SMPTE_BYPASSnA_DVBASIDESA_IO_PROC_EN/DISbDESA_SW_ENDESB_TIM861B_SMPTE_BYPASSnDESB_IO_PROC_EN/DISbDESB_SW_ENSERA_TIM861SERA_STDBYSERA_RATE_SEL0SERA_RATE_SEL1

CONTROL_0CONTROL_0 DESA_TIM861

SERA_IO_PROCE_EN/DISb

CONTROL_18CONTROL_18 SERB_STDBY

SERA_DETECT_TRSSERA_ANC_BLANKbSERA_GRP1_EN_DISbSERB_TIM861SERB_STDBYSERB_RATE_SEL0SERB_RATE_SEL1SERB_IO_PROCE_EN/DISb

C17747n

GSPI8

CONTROL_19CONTROL_19 SERB_RATE_SEL0

CONTROL_20SERB_RATE_SEL1

SERB_DETECT_TRSSERB_ANC_BLANKbSERB_GRP1_EN_DISb

CONTROL_21SERB_IO_PROCE_EN/DISb

4911 GenlockSOURCE ASOURCE B

GSPI[8..0]

CONTROL_22SERB_DETECT_TRS

SPI I/O EXPANDER

CONTROL_23SERB_ANC_BLANKb

CONTROL_1CONTROL_1 A_SMPTE_BYPASSn

CONTROL_24SERB_GRP1_EN_DISb

CONTROL_20

CONTROL_254911 Genlock

CONTROL_2CONTROL_2 A_DVBASI

GSPI0

CONTROL_3CONTROL_3 DESA_IO_PROC_EN/DISb

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Figure 7-11: Power

Figure 7-12: Cable Driver

POWER

C1880.1u C223

0.1u

C189

4u7

Heat sinkon copper

500mA+2.5V RAW

GND

VCC_1.8VTP8

+1.8V

GND

TP7+1.2V

1500mA

Heat sinkon copper

+2.5V RAW

Debuggingpower supply

C187

1u

1

2

3JP1

RESET

R1125k1

GND

+2.5V RAW

L8 BEAD_FERRITE_SM

RESET 4,5,6,7,8

L9

BEAD_FERRITE_SM

PWR

R110

240R

GND

D1

LNJ311G8PRA

C18022u

C178

22u

C1790.1u

C1811u

+3.3V RAW TP9 VCC_3.3V

GND

+3.3V

+2.5V RAW

VCC_3.3V

C2431u

C2761uC244

10u

C24210u

C24510n

C182470u

R1431.15K

R142576R

IN15

IN26

IN37

IN48

BIAS10

PG9

OUT11

OUT418OUT319OUT220

NC617

FB16EN

11

SS15

GN

D12

NC

413

NC

514

NC

12

NC

23

NC

34

Pad

21

U25

TPS74201_RGW

GND

GNDGND

VCC_3.3V

VCC_1.2V

VIN1

EN3 VOUT5

BYP4

GN

D2

U26MIC5319-1.8YD5 TR

RATE DET4

SDI1

SDI2

NC

15

GN

D3

DISABLE6

NC

414

SD/HD10

TA

B17

NC

28

SDO11

SDO12

NC

515

NC

313

NC7

RSET4 V

CC

9

NC

616

U28GS2978

R1210R

R116 75R

R11575R

R117 75RR11849R9

C1971u

R11949R9

C1981u

C19210n

R113750R

C193 4u7

C19610n

L10 5n6

C19510n

C19110n

C194 4u7

R11475R

R1200R

C19910n

DESA_LPBCK4

ALPBCK 1DESA_LPBCKn4

GNDA_CD

+3.3V_2978

+3.3V_2978

GNDA_CD

GNDA_CDGNDA_CD

+3.3V_2978

GND

VCC_3.3V

GNDA_CD

GNDA_CD

C28010n

75-ohm traces

CABLE DRIVER ONVIDEO CHANNEL ALOOP-THROUGH

CD Power Decoupling & Filtering

GNDA_CD

50-ohm traces

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Figure 7-13: Equalizer B

Figure 7-14: Optical Transceiver

R12375R

C204 4u7

R12437R4

C20010n

SDI2

SDI3

VE

E4

VE

E1

AGC5

AGC6

BYPASS7

MCLADJ8

TA

BT

AB

VE

E9

SDO10

SDO11

VE

E12

VC

C13

MUTE14

CD15

VC

C16

U29GS2974B

L11 6n2

CD_3

R122 75R

C2021u

C2051u

C20810n

EQ B1

C20110n

C207470n

C203 4u7

C206470n

BIN11

EQB1_SDIn 2

EQB1_SDI 2

CONTROL_27

+3.3V_2974

GNDA

GNDA

GNDA

GNDA

C2541u

EQUALIZER B

Standby _SERB

Standby _SERB

C22210n

GND

VCC_3.3V

GND

GND

CD_3

CONTROL_27R132

0RR133DNP

I11

GN

D2

I03

Z4V

CC

5

S6

U32

NC7SP157P6X

C2100.1u

R12549R9

C2120.1u

C2160.1u

L13

1uH

C2140.1u

VEE11

TX_FAULT2

NC13

VEE24

I2C_CLK5

I2C_DATA6

VEE37

RX_LOS8

NC29

NC310 VEE4 11RD-12RD+13VEE5 14VCC_RX15VCC_TX16VEE617TD+18TD-19TX_DIS20

M1

21

M2

22

M3

23

M4

24

M5

25

M6

26

M7

27

M8

28

M9

29

M10

30

M11

31

U30

GO2921

L12

1uH

OPT_TD+ 6

OPT_RD- 2

OPT_RD+ 2

VCC_3.3V

VCC_3.3V

R13475R

Remove this resistor when theoptical module is installed.

GNDA

GNDA

GNDA

C20910u

GNDA

C21110u

GNDA

GNDA

GNDA

U33 U34

C21310u

C21510u

OPTICAL TRANSCEIVER

12

JP4

GND

EN_Transceiver

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7.2 Board LayoutThe 3Gb/s SDI Demo Board is a 8-layer board with controlled impedance requirement. The layers are Top, Gnd1, Pwr1, Pwr2, Gnd2, Sig1, Gnd3 and Bottom. Figure 7-15 and Figure 7-16 show the Top and Bottom layers of the board. The Allegro brd file and Gerber files are provided as part of the kit where the details of all layers may be viewed.

Figure 7-15: Top Layer

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Figure 7-16: Bottom Layer

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7.3 Bill of MaterialsTable 7-1 lists all of the parts used on the 3Gb/s SDI Demo Board. For additional information of the parts, such as manufacturer and part numbers, please refer to the Excel spread sheet provided with the kit.

Table 7-1: Bill of Materials

Quantity Reference Designator Description

30 C1, C3, C5, C7, C13, C23, C33, C54, C55, C62, C63, C66, C67, C68, C75, C84, C89, C98, C106, C122, C191, C192, C196, C199, C200, C201, C208, C221, C222, C245

Capacitor; ceramic 10000pF 16V 10% X7R 0402

22 C2, C6, C81, C83, C135, C139, C141, C144, C151, C157, C160, C165, C167, C172, C173, C179, C188, C210, C212, C214, C216, C223

Capacitor; ceramic 0.10μF 10V X7R 0402

10 C9, C10, C11, C12, C57, C58, C70, C71, C203, C204 Capacitor; ceramic 4.7μF 6.3V X5R 0402

30 C14, C24, C34, C64, C65, C77, C87, C94, C101, C103, C104, C107, C108, C123, C124, C131, C176, C181, C187, C197, C198, C217, C218, C219, C220, C243, C252, C253, C254, C276

Capacitor; ceramic 1μF 10V X5R 0402

4 C15, C19, C35, C39 Capacitor; ceramic 1μF 10V X5R 0402

62 C16, C17, C18, C20, C21, C22, C25, C26, C27, C28, C29, C30, C31, C32, C36, C37, C38, C40, C41, C42, C43, C44, C45, C46, C47, C48, C49, C50, C91, C92, C95, C96, C99, C100, C109, C110, C111, C112, C113, C114, C115, C116, C117, C118, C125, C126, C127, C128, C145, C146, C147, C148, C149, C150, C154, C155, C161, C162, C163, C164, C168, C169

Capacitor; ceramic 10000pF 16V 10% X7R 0402

6 C56, C59, C69, C72, C202, C205 Capacitor; ceramic 1μF 10V X5R 0402

6 C60, C61, C73, C74, C206, C207 Capacitor; ceramic 0.47μF 6.3V X5R 0402

6 C76, C86, C90, C129, C178, C180 Capacitor; ceramic 22μF 10V X5R 0805

3 C78, C88, C177 Capacitor; ceramic 47000pF 10V 10% X7R 0402

2 C79, C80 Capacitor; ceramic 16pF 50V S 0402 UHI Q

2 C82, C85 Capacitor; ceramic 0.10μF 10V X7R 0402

15 C93, C97, C130, C142, C143, C152, C153, C156, C158, C159, C166, C209, C211, C213, C215

Capacitor; ceramic 10μF 6.3V X5R 0603

2 C102, C132 Capacitor; ceramic 100pF 25V NP0 0402

2 C105, C133 Capacitor; ceramic 33pF 50V 5% C0G 0402

6 C119, C121, C134, C138, C193, C194 Capacitor; ceramic 4.7μF 6.3V X5R 0402

2 C120, C136 Capacitor; ceramic 10000pF 16V 10% X7R 0402

3 C137, C140, C174 Capacitor; ceramic 0.10μF 10V X7R 0402

1 C170 Capacitor; ceramic 39pF 50V 5% C0G 0402

1 C171 Capacitor; ceramic 24pF 50V C0G 0402

1 C182 Capacitor; tantalum 470μF 10V 10% LOESR SMD

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1 C189 Capacitor; ceramic 4.7μF 6.3V X5R 0402

2 C195,C280 Capacitor; ceramic 10000pF 16V 10% X7R 0402

2 C242, C244 Capacitor; ceramic 10μF 6.3V X5R 0603

1 D1 LED; pure green face up 1206

1 JX1 Connector, receptacle; hi-speed dual 120-position

5 J1, J2, J10, J11, J12 Connector, 75Ω BNC; front chassis-mount right-angle

6 J3, J4, J5, J6, J8, J9 Connector; RF/Coaxial

1 J7 Connector, header; 10-position 0.100" DL gold

3 J13, J14, JP4 Connector, header; 0.100 single STR 36-position

3 L2, L3, L11 Inductor; 6.2nH 300mA 0402

3 L4, L8, L9 Filter Chip; 120Ω 3A 0603

4 L5, L6, L7, L10 Inductor; 5.6nH 300mA 0402

2 L12, L13 Inductor; 1.0μH 20% 445mA 1210

2 RN1, RN2 Resistor, array; 22Ω 16-term 8RES SMD

12 R1, R2, R3, R12, R29, R45, R97, R101, R102, R126, R127, R128 Resistor; 10kΩ 1/16W 5% 0402 SMD

7 R4, R5, R32, R37, R51, R54, R143 Resistor; 1.15kΩ 1/16W 1% 0402 SM

19 R6, R7, R9, R11, R13, R18, R19, R64, R67, R70, R73, R79, R81, R95, R96, R98, R99, R120, R121

Resistor; 0Ω 1/10W 5% 0402 SMD

8 R8, R10, R65, R71, R107, R108, R116, R146 Resistor; 75.0Ω 1/16W 1% 0402 SMD

2 R14, R129 Resistor; 13.7kΩ 1/16W 1% 0402 SMD

18 R15, R16, R20, R21, R75, R77, R78, R80, R88, R90, R91, R92, R114, R115, R117, R122, R123, R134

Resistor; 75.0Ω 1/16W 1% 0402 SMD

3 R17, R22, R124 Resistor; 37.4Ω 1/16W 1% 0402 SMD

4 R23, R42, R63, R82 Resistor; 105Ω 1/10W 1% 0603 SMD

5 R26, R33, R34, R131, R132 Resistor; 0Ω 1/10W 5% 0402 SMD

20 R27, R28, R35, R36, R38, R39, R48, R49, R52, R53, R55, R56, R59, R60, R61, R62, R104, R105, R106, R148

Resistor; 22.0Ω 1/16W 1% 0402 SMD

3 R66, R83, R150 Resistor; 200Ω 1/16W 1% 0402 SMD

2 R69, R86 Resistor; 150Ω 1/16W 1% 0402 SMD

3 R76, R89, R113 Resistor; 750Ω 1/16W 1% 0402 SMD

2 R93, R94 Resistor; 105Ω 1/10W 1% 0603 SMD

1 R100 Resistor; 1.00MΩ 1/16W 1% 0402 SMD

1 R103 Resistor; 0Ω 1/10W 5% 0402 SMD

Table 7-1: Bill of Materials

Quantity Reference Designator Description

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1 R109 Resistor; 39kΩ 1/16W 5% 0402 SMD

1 R110 Resistor; 240Ω 1/16W 1% 0402 SMD

3 R118, R119, R125 Resistor; 49.9Ω 1/16W 1% 0402 SMD

1 R142 Resistor; 576Ω 1/16W 1% 0402 SMD

1 R152 Resistor; 200Ω 1/16W 1% 0402 SMD

1 R112 Resistor; 5.1kΩ 1/16W 1% 0402 SMD

2 U1, U2 IC; MUX 2:1 DIFF PREC HS 16-MLF

3 U3, U12, U21 Translator; 2-bit LV DL 10MICROPAK

4 U4, U5, U22, U23 Agilent HSMF-C165 Miniature Bi-colour Surface Mount Chip LED

3 U6, U7, U29 Gennum GS2974B Adaptive Cable Equalizer

2 U8, U11 Gennum GS2970 3G/HD/SD-SDI Deserializer

5 U9, U10, U17, U18 IC; diff line DVR/RCVR HS SOT23-5

2 U13, U14 Agilent HSMF-C165 Miniature Bi-colour Surface Mount Chip LED

2 U15, U16 Gennum GS2972 3G/HD/SD-SDI Serializer

1 U19 Gennum GS4911B Clock and Timing Generator

1 U20 IC; VID Sync Separator HDTV 24QSOP

1 U24 IC; I/O Port Expander 40-TQFN

1 U25 IC; LDO REG 1.5A w/PROG SS 20QFN

1 U26 IC; REG LDO 500mA 1.8V TSOT23-5

1 U28 Gennum GS2978 Cable Driver

1 U30 Connector and Cage for Gennum SFP Optical Module

2 U31, U32 IC; MUX ULP 2-INP NONINV SC70-5

2 Y1, Y2 Crystal; 27.0000 MHz 18pF SMD

Table 7-1: Bill of Materials

Quantity Reference Designator Description

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OTTAWA232 Herzberg Road, Suite 101 Kanata, Ontario K2K 2A1 Canada

Phone: +1 (613) 270-0458

Fax: +1 (613) 270-0429

CALGARY3553 - 31st St. N.W., Suite 210 Calgary, Alberta T2L 2K7 Canada

Phone: +1 (403) 284-2672

UNITED KINGDOMNorth Building, Walden Court Parsonage Lane, Bishop’s Stortford Hertfordshire, CM23 5DB United Kingdom

Phone: +44 1279 714170

Fax: +44 1279 714171

INDIA#208(A), Nirmala Plaza, Airport Road, Forest Park Square Bhubaneswar 751009 India

Phone: +91 (674) 653-4815

Fax: +91 (674) 259-5733

SNOWBUSH IP - A DIVISION OF GENNUM439 University Ave. Suite 1700 Toronto, Ontario M5G 1Y8 Canada

Phone: +1 (416) 925-5643

Fax: +1 (416) 925-0581

E-mail: [email protected]

Web Site: http://www.snowbush.com

MEXICO288-A Paseo de Maravillas Jesus Ma., Aguascalientes Mexico 20900

Phone: +1 (416) 848-0328

JAPAN KKShinjuku Green Tower Building 27F 6-14-1, Nishi Shinjuku Shinjuku-ku, Tokyo, 160-0023 Japan

Phone: +81 (03) 3349-5501

Fax: +81 (03) 3349-5505

E-mail: [email protected]

Web Site: http://www.gennum.co.jp

TAIWAN6F-4, No.51, Sec.2, Keelung Rd. Sinyi District, Taipei City 11502 Taiwan R.O.C.

Phone: (886) 2-8732-8879

Fax: (886) 2-8732-8870

E-mail: [email protected]

GERMANYHainbuchenstraße 2 80935 Muenchen (Munich), Germany

Phone: +49-89-35831696

Fax: +49-89-35804653

E-mail: [email protected]

NORTH AMERICA WESTERN REGIONBayshore Plaza 2107 N 1st Street, Suite #300 San Jose, CA 95131 United States

Phone: +1 (408) 392-9454

Fax: +1 (408) 392-9427

E-mail: [email protected]

NORTH AMERICA EASTERN REGION4281 Harvester Road Burlington, Ontario L7L 5M4 Canada

Phone: +1 (905) 632-2996

Fax: +1 (905) 632-2055

E-mail: [email protected]

KOREA8F Jinnex Lakeview Bldg. 65-2, Bangidong, Songpagu Seoul, Korea 138-828

Phone: +82-2-414-2991

Fax: +82-2-414-2998

E-mail: [email protected]

DOCUMENT IDENTIFICATIONUSER GUIDEInformation relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Gennum assumes no liability for any errors in this document, or for the application or design described herein. Gennum reserves the right to make changes to the product or this document at any time without notice.

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Gennum Corporation assumes no liability for any errors or omissions in this document, or for the use of the circuits or devices described herein. The sale of the circuit or device described herein does not imply any patent license, and Gennum makes no representation that the circuit or device is free from patent infringement.

All other trademarks mentioned are the properties of their respective owners.

GENNUM and the Gennum logo are registered trademarks of Gennum Corporation.

© Copyright 2009 Gennum Corporation. All rights reserved.

www.gennum.com

GENNUM CORPORATE HEADQUARTERS4281 Harvester Road, Burlington, Ontario L7L 5M4 Canada

Phone: +1 (905) 632-2996 Fax: +1 (905) 632-2055

E-mail: [email protected] www.gennum.com

CAUTIONELECTROSTATIC SENSITIVE DEVICES

DO NOT OPEN PACKAGES OR HANDLE EXCEPT AT A STATIC-FREE WORKSTATION