3D INDUSTRIAL IMAGING

We make invisible objects visible! 3DII’s commitment to provide others with a clear insight through our innovative solutions and imaging software

3D Industrial Imaging Co., Ltd. #301-2 Institute of Computer Technology Seoul National University Seoul, South Korea 151-742 Tel: +82 70 8766 2390 Fax: +82 28 777 555 E-mail: threedii@gmail.com Web: http://www.3dii.kr

3D Industrial Imaging (3DII) develops, distributes, and sells X-ray imaging software and

specialized defect inspection software for non-destructive testing (NDT).

3DII also provides innovative solutions regarding visual processing and process control to its

valuable customers, manufacturers and research institutes.

3DII is very interested in not only being a business partner but also being a partner for challenging

projects utilizing 2D or 3D X-ray inspection systems and visual processing. 3DII’s software skills

and experience will lead your business to success in future projects.

VX-FAMILY SOFTWARE

VX3D VXPI

VXEI VX2D

VX3D is 3DII’s software platform for the visualization

and analysis of CT data. VX3D offers intuitive

visualization solutions, such as auto cropping, clipping,

and zoom cube functions. VX3D also provides users with

various measurement tools and powerful reporting

functions for 2D or 3D data analysis.

VX3D was specially developed for practical and industrial

CT applications. VX3D is able to perform defect analysis

for industrial purposes by adding optional modules, such

as VXPI (porosity detection module) and VXEI

(electronic chip inspection module).

Key Features

2D and 3D visualization of volume data

Provides various tools for 2D or 3D measurement:

Poly-line lengths, distances, angles, areas, etc.

Profile function for density information

Reporting tools

No limit on data quantity (depending on system

memory)

GPU-accelerated optimization

Clipping function for analyzing the inside of an object

in any desired direction

Zoom cube function for analyzing the volume of

interest

Auto cropping function for reducing the

rendering time

Currently available add-on modules:

VXPI (porosity detection module)

VXEI (electronic chip inspection module)

VXPI is an automatic porosity detection module based

on 3D X-ray CT imaging data, which can be used as an

add-on module of VX3D or as stand-alone software.

VXPI is able to provide information on the size, volume,

location, and density of inclusions and cavities and can

detect defects, such as shrinkage cavities, gas pores,

and foreign materials in aluminum, magnesium, iron,

zinc, and plastic.

VXPI can be used for defect analysis of metallic cast

parts (aluminum, magnesium, iron, and zinc) as well as

plastic cast parts using 3D X-ray CT imaging data.

Customized setup for identifying defects is available

depending on the manufacturer’s quality requirements

for casting components.

Add-on module of VX3D

Ultra fast speed using GPU computation

Less than 3 seconds to analyze a 512x512x512

pixel file (256Mb)

Applicable to in-line inspection systems

Detects shrinkage cavities, gas pores, and foreign

materials

Color-coded visualization of the size of cavities

Easy to use

Customized setup available

Stand-alone software available

VXEI is an electronic chip inspection module based on

3D CT X-ray imaging data, which can act as VX3D’s

add-on module or as stand-alone software. Based on

the ball shape, location, and volume information, VXEI is

able to detect defects, including open solder joints,

missing solder joints, solder bridges, and abnormal

solder balls (big, small, or head-in-pillow shapes).

VXEI can be used for the non-destructive automated

inspection of solder joints in various types of packages,

such as BGA, PoP, and SoC, in semiconductors and

electronic chips.

Once the X-ray image evaluation environment of VXEI is

customized to the manufacturer’s standards and

requirements, VXEI can identify defects automatically

through a very simple process.

Add-on module of VX3D

Ultra fast speed using GPU computation

Less than 2 seconds to analyze a 12mmx14mm

PoP chip

Applicable to in-line inspection systems

Detects open solder joints, missing solder joints,

solder bridges, and abnormal shapes (big, small, or

head-in-pillow)

Automated alignment correction of the chip axis

Easy to control and adjust parameters

Customized setup available

Stand-alone software available

VX2D is 3DII’s 2D X-ray imaging software for measuring

and analyzing 2D slice data. VX2D offers various

measurement tools and can export the measurement

information to Excel. VX2D also enables users to

perform more advanced analyses using various filtering

functions.

The Ball Void Detection Module is an optional module of

VX2D for the automated X-ray analysis of solder balls.

Supported image formats: *.bmp, *.jpg, *.raw

Exports the measurement information to Excel

3D surface plot function for creating a 3D image

based on density information

Unit conversion function

Various image filtering functions: Gaussian,

brightness/contrast, sharpness, edge detection filters,

etc.

Ball Void Detection Module can inspect the following

features:

Missing solder balls

Void size

Void percentage

Number of void