367 controlled morphology of electrodeposited cu scn by variation of applied bias voltage

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Controlled morphology of electrodeposited CuSCN by variation of applied bias voltage ICAER-2013 Presented by SOHAM GHOSH Dept. Energy Science and Engineering

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Page 1: 367 controlled morphology of electrodeposited cu scn by variation of applied bias voltage

Controlled morphology of electrodeposited CuSCN by

variation of applied bias voltage

ICAER-2013

Presented by SOHAM GHOSH

Dept. Energy Science and Engineering

Page 2: 367 controlled morphology of electrodeposited cu scn by variation of applied bias voltage

Outline

• Sensitized solar cell (SSC),

• Motivation of the work,

• Applied bias dependent CuSCN morphology,

• Deposition time dependent CuSCN morphology,

• Application,

• Summary.

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Dye Sensitized Solar Cell

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Contains three individual layers

namely: the electron collector, absorber

layer or the dye and the electrolyte or

hole conducting material

e-h pairs separated due the presence

of band-offset at each interface

Easy fabrication; Less energy

consuming

Less pay-back period than Si based solar cell

Efficiency reached > 11% for lab based

devicesDSSC

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Semiconductor Sensitized Solar Cell

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•Dye is replaced by a low band-gap semiconductormaterial leading to an intermediate solid stateDSSC,•Electrolyte is also replaced by a solidsemiconductor making the whole device as a solidstate device.

CuSCN

FTO

ZnO

CdS

Au

ElectronHole

Degradation of dye with time (mainly the UV degradation)

Liquid electrolyte (improper packaging)

Page 5: 367 controlled morphology of electrodeposited cu scn by variation of applied bias voltage

Motivation of the work

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ZnO NanorodsSensitizerCuSCN

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Contd.

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FTO

CuSCN Nanorod

Electron Collector

Ag

Sensitizer

Page 7: 367 controlled morphology of electrodeposited cu scn by variation of applied bias voltage

Contd.

• The percolation of hole collecting material into the pores in nanoporous

substrates is quite limited,

• Inverse structural design using p-type semiconductor nanorods as

building blocks,

• Surface area will increase and interface charge recombination will

reduce resulting better charge transport,

• Hole conducting pathway that is likely to be diffusion limited in

comparison to the hoping and grain boundary dominated transport

mechanism.

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Page 8: 367 controlled morphology of electrodeposited cu scn by variation of applied bias voltage

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SEM images of the CuSCN films deposited at (A) -0.30 V, (B) -0.31 V, (C) -0.32 V, (D) -0.35 V, (E) -0.40 V (F) -0.42 V

Applied Bias Dependent CuSCN Morphology

Page 9: 367 controlled morphology of electrodeposited cu scn by variation of applied bias voltage

XRD Pattern of CuSCN

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10 15 20 25 30 35 40 45 50 55 60 65 70 75 80

* *

***

***

(10

7)

(24

1)

(01

5)

(00

6)

(10

1)

Inte

nsi

ty (

a.u

.)

2 Theta (deg.)

-0.30V

-0.31V

-0.32V

-0.35V

-0.40V

-0.42V

(00

3)

(10

4)

*

* FTO Glass

(11

3)

Page 10: 367 controlled morphology of electrodeposited cu scn by variation of applied bias voltage

Deposition Time Dependent CuSCN Morphology

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SEM of time dependant deposition film for (A) 1hr (B) 2hr (C) 3hr

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TEM of CuSCN Nanorods

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Transmission electron microscopy of CuSCN nanorods

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Photovoltaic Application

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Jsc = 8.8 mA/cm2Voc = 0.68FF = 0.63η = 3.9%

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Summary

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• Well shaped nanorods can be deposited under a potential of -0.3V,

• With increasing the applied potential nanorods were started

agglomerated gradually,

• With increasing deposition time the nanorods diameter started to

increase,

• Application for Semiconductor Sensitized Solar Cell.

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Page 15: 367 controlled morphology of electrodeposited cu scn by variation of applied bias voltage

Fabrication Methodology of Copper Thiocyanate

Experimental details:

• Electrolyte contains Cu+2 and SCN- ions in a water-ethanol system

Applied Potential: -0.3 to -0.42 V

Reaction at Cathode:

• Cu(ClO4)2 Cu2+ + 2ClO4-

• NaSCN Na+ + SCN-

• Cu+2 + SCN- CuSCN+

• CuSCN+ + e- CuSCN

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SEM images of the CuSCN films deposited at (A) -0.30 V, (B) -0.31 V

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SEM images of the CuSCN films deposited at (C) -0.32 V, (D) -0.35 V

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SEM images of the CuSCN films deposited at (A) -0.40 V, (B) -0.41 V