2d/3d integration challenges: dynamic reconfiguration and design for reuse
TRANSCRIPT
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2D/3D Integration Challenges: Dynamic Reconfiguration and
Design for Reuse
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OUTLINE
• 2D/3D INTEGRATION TECHNOLOGY: DESIGN TRENDS AND CHALLENGES
• DESIGN PRODUCTIVITY GAP
• SYSTEM LEVEL REQUIREMENTS
• 2D/3D CIRCUIT DESIGN FLOW
• DYNAMIC RECONFIGURATION
• DESIGN FOR REUSE
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2D INTEGRATION TECHNOLOGY• DRIVING FORCE: MOORE’S LAW
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3D INTEGRATION TECHNOLOGY
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DESIGN CHALLENGES• Cost of design is the greatest threat to continuation
of the semiconductor roadmap (ITRS 2007)
• Manufacturing:– NRE costs: millions of dollars (mask set + probe card)
– cycle times: weeks, low uncertainty
• Design and verification:– NRE costs: tens of millions of dollars not including
frequent re-spins
– cycle times: months or years, high uncertainty
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DESIGN PRODUCTIVITY GAP
• capability of technology doubling every 36 months • demand for software doubling every 10 months• productivity for hardware-dependent software
doubling every 5 years
ITRS Roadmap
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SYSTEM-LEVEL REQUIREMENT TRENDS
Year 2009 2010 2011 2012 2013 2014 2015 2016 2017
Design reuse (% of logic)
38% 40% 41% 42% 44% 46% 48% 49% 51%
Reconfigurability (% of functionality)
30% 35% 38% 40% 42% 45% 48% 50% 53%
Verification engineer productivity (millions of transistor/year)
13.5 17.6 23.1 30.3 39.8 52.3 69.6 91.8 121.0
ITRS Roadmap
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DIGITAL SYSTEM DESIGN FLOW
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RECONFIGURATION• ABILITY OF A CIRCUIT TO ADAPT ITS
FUNCTIONALITY STATICALLY OR DYNAMICALLY– MICROPROCESSOR: FULLY PROGRAMMABLE– ASIC: APPLICATION-SPECIFIC– FINE-GRAIN RECONFIGURATION
• BIT-LEVEL (FPGA/CPLD)– COARSE-GRAIN RECONFIGURATION
• WORD LEVEL (ALU)– APPLICATION CLASS-SPECIFIC
RECONFIGURATION• ASIP• FLEXIBLE ARCHITECTURES
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ENIAC PRIORITIES: ADVANCED ARCHITECTURES
• With respect to new chip architectures in the context of Nanoelectronics, R&D is mainly driven by two basic challenges: – enormous complexity– huge None- Recurring-Engineering (NRE) costs of future
nanoelectronic SoCs.• Priorities until 2013
– Modelling and optimisation of Network-on-Chip architectures
– Modelling and evaluation of Multi-Core-Architectures– Reconfigurable systems– Development and evaluation of innovative communication
concepts– Self-adapting architectures for application-specific
requirements
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DESIGN FOR REUSE (1/2)
• MOST CIRCUIT DESIGNS ARE PREVIOUS REDESIGNS WITH:– NEW FEATURES– BUGS FIXED– IMPROVED PERFORMANCE– INTEGRATION INTO A SINGLE SoC
• AIM OF REUSE:– USE OF DESIGN IN MULTIPLE SYSTEMS OF
DIFFERENT SPECIFICATIONS WITH LITTLE/NO MODIFICATIONS
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DESIGN FOR REUSE (2/2)• ADDITIONAL LOGIC FOR EASY INTEGRATION
– GENERIC INTERFACE– MULTIPLE INTERFACE SUPPORT (COMMUNICATION PROTOCOLS)
• MULTIPLE VERSIONS WITH DIFFERENT SPECS AND PARAMETERS– WORD LENGTH– PARALLEL/SERIAL EXECUTION etc.
• MULTIPLE HDL DESCRIPTIONS– VHDL– VERILOG
• MULTIPLE IMPLEMENTATIONS– ASIC (VARIOUS TECHNOLOGIES)– FPGA (VARIOUS TECHNOLOGIES)
• VERIFICATION TO A HIGHER LEVEL OF CONFIDENCE• DESIGN FOR REUSE REQUIRES 3x DESIGN FOR USE
EFFORT
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EUROPEAN EDA ROADMAP PRIORITIES
• V7: IP Reuse Platform and Emerging NoC Environments
• Correct and robust design• Well-defined and clear design flow with adequate
documentation• General functionality and easily configurable design
to solve a general problem and fit different applications
• Portability to run with all major commercial simulation tools and multiple technologies
• Rigorous well-designed and documented verification and validation
• Well-defined synthesis scripts
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ARTEMIS TECHNOLOGY DOMAINS AND CHALLENGES
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ENIAC PRIORITIES: IP REUSE
• Priorities until 2013– Technology independent IP-transfer– Standards to describe IPs as well as plug-intools for
IP interfacing and IP packaging– Concepts for automatic integration of IPs in on-chip
networks– Comprehensive processes for the integration of IP
modules from different suppliers– Heterogeneous multi-core architectures including
software• Priorities from 2013 to 2020
– Black box and grey box verification of IPs at the system level
– Strategies for automatic verification of IP integration