230kv cable sizing 1 - copy

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  • 7/27/2019 230kv Cable Sizing 1 - Copy

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    i. Maximum Permissible Short Circuit Current For Conductor

    ST = Area of Conductor = 630 mm2

    T = duration of Short circuit = 1.0 sec

    K =Constant depending on the material = 226 A.s 1/2/mm2

    c = reciprocal of temperature coefficient of resistance = 234.5

    f = final temperature = 250c

    i = operating temperature of the conductor = 90c

    I ADIABATIC = K. ST / t x [ ln ((f+c) / (i+ c))]

    = 226 x 630/ (1) x [ln ( ( 250 + 234.5) / (90 +234.5 ) ) ] = 90.14 kA for 1 sec

    ii. Maximum Permissible Adiabatic Short Circuit Current For Lead Sheath

    tLEAD = thikness of lead = 8.70 mm ( Nominal )

    ALEAD = 2599 mm2-Material constants

    LEAD = reciprocal of temperature coefficient of resistance = 230 K

    K = constant depending on the material = 41.0 A.s 1/2/mm2

    -Short Circuit conditions

    t = Short circuit duration = 1.0seci = operating temperature of lead sheath = 85 cf = final temperature of lead sheath = 85 c

    -Maximum Permissible Adiabatic short circuit current

    I ADIABATIC = K. ST / t x [ ln ((f+c) / (i+ c))]

    =41 x 2599 / (1) x [ ln ((210 + 230) / (85+230))] = 61.61 kA for 1Sec

    iii . Maximum Permissible Non-Adiabatic Short Circuit Current For Lead Sheath

    -Non-Adiabatic Short Circuit Current For Lead Sheath

    i = volumetric specific heat of media either side of the sheath 2.4 x 106 & 2.4 x 106 (J/K .m3).

    i = thermal resistivity of media either side of the sheath 2.5K.m/W & 3.5K.m/Wi = volumetric specific heat of the sheath = 1.45E + 06

    = tLEAD = 8.70mm

    F = Constant = 0.7

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    M = [(2 / 2) + [(3 / 3)] / (2 1 x 10-3) F = 5.016E-02

    = heat loss factor= 1+ 0.61 Mt 0.069 ( Mt )2 +0.0043 ( Mt )3 = 1.030

    iV . Maximum Permissible Non-Adiabatic Short Circuit Current

    Isc = I ADIABATIC x

    = 61.61 x 1.030 = 63.48 kA for 1 second

    Loss factor for sheath and screen

    [ cross bonded screen, flat formation 300 mm spacing]

    1 = power loss in the sheath or screen, consists of losses :

    1 = 1+ 1

    where:

    1 =circulating currents

    1 = eddy currentsscreen = maximum operating temperature of the screen =85 c

    Lead sheath

    Alead = area of lead= 1647 mm2DMlead = mean diameter of lead = Dt3 + tpb =97.7 +5.1 = 102.8 mm

    = resistivity of lead at maximum operating temperature

    = lead / Rlead

    Eddy currents

    d = mean diameter of screen = 102.8 mm

    Rs = resist.lnce of screen at its maximum operating temperature

    ts = screen thickness == 5.1 mm

    Ds = diameter over screen = 107.9 mm

    = 2 x f = 2 x 60 =107.9

    m = ( / R s ) x 10-7 =

    0 = 6 ( m2 / (1+ m2) (d / 2s)2

    1 = (0.86 / m3.08)(d/2s) 1.4m + 0.7

    2 = 0

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    s = resistivity of screen material at maximum operating temperature

    1 =( 4 / (107 s))1/2

    gs = 1 +( ts / Ds)1.74 (1 Ds10-3-1.6)

    1 = Rs /R [ gs 0 (1+1+2) + (1 ts)4 / (12 x 1012) ]

    For cross bonded system

    1 =

    Total loss factor for sheath and screen

    For cross bonded system

    1 = 1+ 1

    1 =

    Loss factor for steel armour

    2 = 0

    Thermal resistance of the constituent parts of the cable: T 1,T2, T3

    Thermal resistance between conductor and sheath T 1

    T1 = ( T /2 ) ln (1+ 2 t1/dc )

    T = thermal resistivity of layer (km/W)

    t 1 = thickness of the layer (mm)d 1 = diameter under the layer (mm)

    thermal resistance of the semiconductive tape

    Tt1 = ( T /2 ) ln (1+ 2 t1/dc )

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    thermal resistance of the conductor screen

    Tcs = ( T /2 ) ln (1+ 2 t1/dc )

    thermal resistance of the insulation

    Tinsulation = ( T /2 ) ln (1+ 2 t1/dc )

    thermal resistance of the insulation screenTis = ( T /2 ) ln (1+ 2 t1/dc )

    thermal resistance of the semi conductive tape

    Tt2 = ( T /2 ) ln (1+ 2 t1/dc )

    Thermal resistance between sheath and armour T2

    T2 = 0.00 c /W

    Thermal resistance of outer sheath T3

    T1 = ( T /2 ) ln (1+ 2 t1/dc )

    Three Circuits in Flat Formation Laid Directly in Ground with Backfill

    L = depth from the surface of the ground to the group cent er= 1450 mm

    d1

    d2

    = distance between circuitsA & B = 1200 mm

    = distance between circuits B & C = 1200

    p bf = thermal resistivity of backfill = 1.2 C.m/W

    p r =thermal resistivity of the soil= 2.0 C.m/W

    External thermal reslistance T 4

    T'4 = externalthermal resistance

    T'\ = correction factor

    -External thermal resistance of the cable

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    ba' ba be' be bd' bdbe'bebfbf bl'

    bi

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    = distance from cable b to the Image of cable a = 2915 mm

    = distance from cable b to a = 300 mm

    = distance from cable b to the Image of cable c = 2915 mm

    = distance from cable b to c = 300 mm

    distance from cable b to the Image of cable d = 3036 mm

    = distance from cable b to d = 900 mm

    = distance from cable b to the Image of cable e = 3138 mm

    = distance from cable b to e = 1200 mm

    = distance from cable b to the Image of cable f = 3265 mm

    = distance from cable b to f = 1500 mm

    = distance from cable b to the Image of cable I = 3036 mm

    = distance from cable b to I = 900 mm

    70 kV) up to 500 kV (Um=550 kV) - Test methods and requirements

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