2015/11/21 1 semiconductor technology -cmos- fire tom wada

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22/06/27 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

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Page 1: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 1

SEMICONDUCTOR TECHNOLOGY-CMOS-

Fire Tom Wada

Page 2: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 2

What is semiconductor and LSIs

Huge number of transistors can be integrated in a small Si chip.

The size of the chip is roughly the size of nails.

Currently, 10M transistors can be integrated.

1000 times integration comparing to 20 yrs ago.

The cost of the chip is roughly same. All electronic equipments are powered by

LSIs. PCs, Cellular phones, 3D graphics,

Internet.

Page 3: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 3

PC mother board

Large Scale Integration

Page 4: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 4

SONY PLAYSTATION 2 MAINBOARD

Rendering LSI

High Speed Memory

Graphics LSI

Direct RDRAM

Page 5: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 5

Mobile Phone MainboardMobile Phone MainboardMemory, Logic,

Analog

Page 6: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 6

Key device is LSI

INTEL Pentium III module

Page 7: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 7

This is a packaged LSI-Pentium III 300MHz Cache LSI-

15 mm

20 mm

Page 8: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 8

Si chip is molded in the package.

2 million transistor Chip is connected to the pins thru

wires.

Page 9: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 9

6 inches Si wafer

Page 10: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 10

8 inches Si wafer

Hundreds of Chips

on a Si

Wafer

Page 11: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 11

Several hundreds of chips are fabricated on a wafer simultaneously.

Page 12: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 12

Chip photo- Motion Estimation Chip for HDTV camera -

9.1 mm

8.6 mm

Your small

finger’s nail size.

200M transistor

s.

Page 13: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 13

Scanning Electron Microscope photo- Cross-section of the LSI -

0.5 micron

Page 14: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

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Structure Of CMOS LSI

Isolation PN-Isolation, Local oxidation

Si Substrate Bulk, epitaxial , SOI

Well Structure N-type well in P-type Substrate

Latch Up PNP Bipolar Transistor and NPN Bipolar Transistor

Fabrication Process Technology

Page 15: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 15

Cross-section of the LSI

P-type Si substrateN-type well

N+ N+ P+ P+

Metal wiring

Poly-silicon

Poly-silicon

N-type MOS transistor

P-type MOS transistor

Si wafer

Page 16: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 16

Transistor module ( FEP)

65nmLithography(VUV, EPL) Mask

CMPplanarization

Low Resistance Contact withHigh Aspect ratio

High κGate insulator

Fine Cu interconnectLow κ

interdielectric

SiGe/Metal gate

Multi-level Metalization

Module( BEP)

Low Resistance Ultra shallow junction

Low stress Shallow Trench Isolation

Advanced Process Development

Page 17: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 17

LSI integration trend- Moore’s law -

Wide-TV, PHS Wide-TV, PHS phonephone

DVD player

DVD-ROM

DVD-RAMDVD recorder

Source: SEMATEC

81

10B

1B

100M

10M

1M

100K

10K

1K83 85 87 89 91 93 95 97 99 01 03 05 07 09

0.8 0.5 0.3 0.18

CHANNEL LENGTH (MICRON)

0.13

Digital HDTV receiver

Nu

mb

er

of

tran

sis

tors

on

a

ch

ip

The number of transistors are

increasing by 58% per year.

- Moore’s Law -

Page 18: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 18

Communications and Consumer Products Drive Semiconductor

Sources: Applied Materials Corporate Marketing estimates, Dataquest

35%

30%

25%

20%

15%

10%

5%

0%0% 5% 10% 15% 20% 25% 30% 35%

CAGR % (1997-2002)

SemiconductorIndustry

Ap

plicati

on

Mark

et

Gro

wth

SC Content (As % of Equipment Cost)

3rd Generation

2nd Generation

1st Generation

ColorTV

ColorTV

CarRadioCar

Radio

VideoCameraVideo

Camera

PortableComputingPortable

ComputingSwitching& LAN

Switching& LAN

HDTVHDTV

MultimediaPC

MultimediaPC

Advanced DesktopPC and WorkstationAdvanced Desktop

PC and Workstation

AutomotiveApplications/GPS

AutomotiveApplications/GPS

DVDPlayerDVD

Player

Set-TopBox

Set-TopBox

Internet Game Consoles

Internet Game ConsolesSmart

Cards/KiosksSmart

Cards/KiosksSmart

Appliance-PhoneSmart

Appliance-Phone

Digital CameraDigital Camera

40% 45% 50% 55%

40%

45%Cellular PhonesCellular Phones

Page 19: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

FABRICATION PROCESS ISSUES

23/04/20 19

Page 20: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 20

Ultra Clean Room

Page 21: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 21

Basic LSI process

Layer Deposition

lithography

etching

cleaning

M1

M2

M3

M4

M5

M6

M7

SEM photo of Logic LSIs

Page 22: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 22

Projection

A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A

Lens

Si Wafer

Mask

Lens

Light Source

X

Y

Stage

Page 23: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 23

Wafer Test

scribing

Chips

Mounting

Bonding

Enclosing

marking

Final Test I

Burn-In

Ex.)Vcc:7V , Temp.:125 , 24℃ ~ 42hrs

Remove Process defect Chips

Functional Test , DC TestA

ssem

bly

Flo

w

Shipping TestFinal Test II

Packaging & Test

Sample

Wafer

Functional Test , DC/AC Test

Functional Test(at Speed) , DC/AC Test

Pre Test

Testing

Page 24: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

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Large Scale Integration

NMOS , PMOS and Wiring All Logic Function can be made Memory Element Can be made

Billions of Transistors and wiring make LSI!

Page 25: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

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CMOS NOT (Inverter)

Page 26: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

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CMOS NAND と NORA B f

0 0 1

0 1 1

1 0 1

1 1 0

A B f

0 0 1

0 1 0

1 0 0

1 1 0

Page 27: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 27

Classification Of LSI

1. Logic LSI: Micro Processor, Digital Signal Processor (DSP), FPGA2. Memory LSI: RAM (DRAM, SRAM), ROM (Flash Memory)3. Analog LSI: ADC, DAC, Filter, Amplifier

Micro Processor (PC’s central processing Unit) Perform Digital computation according to the program in Memory Integration in 7000 times in 25 years, (Moor’s Law) Clock Speed : 700 times in 25 years

Memory LSI:   Dynamic Random Access Memory: Main memory for Computer, 4-

times density in 4 years Static Random Access Memory : work memory for mobile

equipments Flash Memory : Nonvolatile memory , Digital Camera Storage

Analog LSI: Used for interface, high speed RF interface, Analog to Digital

Conversion, Digital to Analog Conversion

Page 28: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

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Analog to Digital Conversion

ADC LSI

Analog to Digital

Sample the analog wave

Convert to Digital format in Binary

Same as f(t) to AnContinuous time

Discrete time

Page 29: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

23/04/20 29

SoC Flash Memory

Chip photo 1

Page 30: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

Chip photo 2

23/04/20 30

Mobile Digital TV receiver

Page 31: 2015/11/21 1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

Final Report Task

Please make a report on DSP or FPGA device and System design using the device in English or Japanese.

Evaluation: 30% on device 30% on system 40% on design using the device

Please submit a report [email protected]

no later than January 31st.

31 23/04/20