14/12/20111 chip in board encapsulation julien bonis [email protected]
TRANSCRIPT
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Encapsulation
Chip in board PCB FEV7 Chip bonding by CERNWire depth are about 0.3mm from surface
LAL encapsulation Hybrid SA (CH) encapsulation Manual process Industrial process
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LAL encapsulation method : Resin injection
Low viscosity epoxy (Araldite 2020) injected under Teflon cap Cavity for glue excess
Glue Viscosity [CPS]
Araldite 2020 150
Stycast 1265 600
EP30MD 1700
EPO-TEK E4110 1200Sole of the cap
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5mm
1mm
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Hybrid SA (CH) encapsulation method : Glob top (Jetting process)
Resine are spurt on bonding as ink on paper with inkjet printer
• Industrial automatic process • Black resine• Thin but irregular surface
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5mm
1mm
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Shortage of resine :
Hybrid S.A prefere realise themself bonding Present bonding wasn’t optimizise to globtop, too higth .PCB design should be modify to reduce wire length
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Jetting Globtop encapsulation
Disadvantages•Black opaque resin•Irregulare surface•Need fitting
Advantages•Industrial process, automatique and fast.•Subcontractor (bonding and encapsulation in same place)
Injection encapsulation under Téflon cap
Disadvantages•Manual process, need studies for industrialisation•No subcontractor possible•Polymerisation need time
Advantages•Transparent resin : visual bonding control•Flat surface•Sure result