11/8/99 sfr workshop - education 1 small feature reproducibility a focus on semiconductor technology...

11/8/99 SFR Workshop - Education

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Small Feature Reproducibility

A Focus on Semiconductor Technology Education

UC-SMART Major Program Award

D.B. Graves, T.J. King, and C.J. Spanos

Second Annual Workshop

11/08/99


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Agenda

8:30 – 9:00 Introductions, Overview / Spanos

9:00 – 10:15 Lithography / Spanos, Neureuther, Bokor

10:15 – 10:45 Break

10:45 – 12:00 Sensor Integration / Poolla, Smith, Solgaard, Dunn

12:00 – 1:00 lunch, poster session begins

1:00 – 2:15 Plasma, TED / Graves, Lieberman, Cheung, Aydil, Haller

2:15 – 2:45 CMP / Dornfeld

2:45 – 3:30 Education / Graves, King, Spanos

3:30 – 3:45 Break

3:45 – 5:30 Steering Committee Meeting in room 775A / Lozes

5:30 – 7:30 Reception, Dinner / Heynes rm, Men’s Faculty Club


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MilestonesYear 1 Conduct first Inter-campus seminar series and Industry

workshop. Modify UCB/EE143 for deployment in the fall of 1999. Design Equipment Laboratory.

Year 2 Conduct second Inter-campus seminar series and Industry

workshop. Implement Equipment Laboratory for deployment in Spring

2000.


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EE 143: Processing and Design of IC’s

• Name changed to “Microfabrication Technology”– course now covers MEMS as well as IC device technology

• Prerequisites changed to sophomore physics and electronics

(Phys 7B & EE 40 or equivalent) – course is more accessible to students in ChE, ME, MSE, Physics, etc.

• New equipment to be purchased by Spring 2000

– will ease impact of increased enrollment (to 48 students per semester)

• Laboratory units on (1) oxidation and (2) lithography to be

shared with the new SMART equipment lab


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EE 143 Enrollment History

0

10

20

30

40

50

Fall1995

Fall1996

Sp1997

Fall1997

Sp1998

Fall1998

Sp1999

Fall1999


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Undergrads (30%)

Graduates (70%)

EE 143 Fall 1999 Enrollment Statistics

EE (39%)

ME (39%)

MSE (6.5%)

ChE (6.5%)

Physics (6.5%)

NE (2%)

(46 students total)


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Changes to EE 143 Implemented in Fall 1999

• Additional graduate-student instructors hired– one extra laboratory section to accommodate 8 more students– new weekly discussion sections (2) to supplement lectures– design of new mask set

• Elimination of selected topics– bipolar junction transistor & DRAM devices and technology

• Addition of new topics– surface-micromachining technology– mechanical properties of thin films– MEMS device structures: operation and design, process integration

• Changes made in laboratory component– elimination of bipolar junction transistor characterization


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• Improvements to existing test structurese.g. increase # of contact holes, increase overlay error tolerance

– for improved device yield

• Addition of MEMS test structures:– actuators

• thermal bimorphs (using poly-Si resistive heaters)

– sensors• strain gauge (poly-Si piezoresistors)

– fold-up structure (Campanile)

Modifications to EE 143 Mask Set (to be completed in Fall 1999)


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Further Changes to EE 143 Lab (Spring 2000)

• Deployment of new mask set

• Addition of thin-film device characterization

work

• Installation of new equipment

– new wafer-probe station

– spin-rinse-dryer

– furniture


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• New joint EECS/ChE/ME/MSME course at UCB available to

B.S., M.S., and Ph.D. students.• Important component in education/training plans.• Focus on equipment and processes; existing labs focus on

device fabrication (e.g. UCB/EE143).• Emphasis on chemical and physical processes occurring within

equipment, including transport, plasma and chemical kinetics,

materials science.• This project has been accelerated.

SMART Lab Overview


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Smart Lab Outline


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• 10 weeks lab; 5 weeks lectures/presentations• Lectures taped, available for review• Web component: equipment models, virtual equipment (e.g.

vacuum systems), readings• 10-12 students/section; 4 sections/week• Timing

Lab debugged in fall 1999First class spring 2000

SMART Lab Description


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• Lab space renovation completed• Vacuum systems apparatus constructed and operating• Plasma etcher installed and working• CMP equipment installed• Electroplating experiment under consideration• Web page development begun, equipment model obtained (G.

Rubloff, U. Maryland), global plasma simulation development

begun

SMART Lab Development Status


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Lab Space Renovation (1 Gilman Hall)


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Vacuum Systems Experiment


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Plasma Systems Experiment (I)


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Vacuum/Plasma Systems Apparatus


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Plasma Systems Experiment (II)Plasma-Therm 500 Series


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Please Help!

Two 300W, 13.56 MHz RF power supplies withmatching networks and PC-compatible outputs areneeded for the SMART equipment lab.

We can also use “educational props” (i.e. picturesvideos, chip cutouts, demo wafers, etc.)

See David Graves if you can arrange for a donation.


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Student-Company Interactions: Web Page Links

• Company human resources

• Student resumes (on web site already)

• Posting for job/intern opportunities


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http://sfr.berkeley.edu Interactive Seminars


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Fall 99 On-line Seminars


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New Curricula in Semiconductor Manufacturing

• New EECS sample program in semiconductor manufacturing at UCB effective fall 1999

• Chemical Engineering option in electronic materials processing at UCB will incorporate new SMART lab

• List of suggested courses (Chem Eng, EECS, IEOR, and MSE at UCB; EEC at UCD) relevant to semiconductor manufacturing posted on SMART web site


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Summary

• Major restructure of senior IC processing course.• New semiconductor equipment laboratory course.• Student training at BS, MS, and Ph.D. levels• Possible ‘outreach’ programs: short courses/summer lab

programs.• New curricula in semiconductor manufacturing.• On-line seminars and workshops.


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2000-2002 Ideas

• Semiconductor Internships• Deployment of Short Courses• Distance learning on 143/123• Focus on other campus deployment: UCD, UCSB,

UCLA

11/8/99 sfr workshop - education 1 small feature reproducibility a focus on semiconductor technology...

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