1-s2.0-s0167577x99002736-main
TRANSCRIPT
-
7/28/2019 1-s2.0-S0167577X99002736-main
1/7
May 2000
.Materials Letters 43 2000 274280
www.elsevier.comrlocatermatlet
Tribological behaviour of SiC particle-reinforced copper matrixcomposites
S.C. Tjong ), K.C. Lau
Department of Physics and Materials Science, City Uniersity of Hong Kong, Tat Chee Aenue, Kowloon, Hong Kong,
Peoples Republic of China
Received 18 June 1999; received in revised form 26 November 1999; accepted 29 November 1999
Abstract
.Pure copper and its composites reinforced with SiC particles were prepared by hot isostatic pressing HIP process. The
tribological behaviour of copper and composites was studied on a pin-on-disc tester. The pins were slid against a hardened
steel disc under dry ambient conditions. In two-body abrasive wear measurements, the disc surface was bonded with a SiC
abrasive paper of 240 grit size. The abrasive wear measurements showed that soft copper exhibits an extremely high wear
loss. However, additions of SiC particles up to 20 vol.% appeared to improve the abrasive wear resistance of copper
significantly under the applied loads of 1555 N. Dry sliding wear tests also indicated that the composite with 20 vol.% SiC
exhibits a lower wear loss compared to pure copper. This was due to the reinforcing SiC particles being effective to reduce
the extent of wear deformation in the subsurface region during sliding. q2000 Elsevier Science B.V. All rights reserved.
Keywords: Wear; Composite, SiC particle; Copper; Hardness; Abrasive
1. Introduction
Materials with high electrical and thermal conduc-
tivities, and high temperature strength have attracted
considerable interest in recent years. Pure copper
exhibits high electrical and thermal conductivities
but it has some distinct shortcomings such as low
hardness, low tensile and creep strengths. The devel-
opment of Cu-based alloys with high tensile strengthand hardness is of primary importance. The mechani-
cal strength of copper can be increased dramatically
)
Corresponding author. Tel.: q852-2788-7702; fax: q852-
2788-7830. .E-mail address: [email protected] S.C. Tjong .
either by age hardening or by introducing dispersoid
particles in its matrix. The age-hardenable copper
alloys are prone to precipitate coarsening at high
temperatures, thereby reducing their strength drasti-
cally. In this respect, dispersion-strengthened copper
has the ability to retain most of its properties on
exposure to high temperatures. Dispersoid particles
such as oxides, carbides, borides are insoluble in the
copper matrix, and are thermally stable at high tem-peratures. The dispersion-strengthened copper alloys
generally can be classified as the copper-based ma-w xtrix composites 19 . Cu-matrix composites are
promising candidates for applications in electrical
sliding contacts such as those in homopolar machinew xand railway overhead current collection system 11 ,
where high thermal electricalrthermal conductivity
00167-577Xr00r$ - see front matter q 2000 Elsevier Science B.V. All rights reserved. .P I I : S 0 1 6 7 - 5 7 7 X 9 9 0 0 2 7 3 - 6
-
7/28/2019 1-s2.0-S0167577X99002736-main
2/7
( )S.C. Tjong, K.C. Lau rMaterials Letters 43 2000 274280 275
and good wear resistant properties are needed. .Among various dispersoids, alumina Al O parti-2 3
cle is commonly used to reinforce copper. The Al O2 3oxide dispersion strengthened copper alloys have
been reported to exhibit superior elevated tempera-
ture strength, increased hardness and improved creepw xresistance compared to pure copper 1 3 . Methods
for the production of dispersion-strengthened copper
matrix composites involve ingot casting and powder .metallurgy PM processes. The PM route consists of
several processes like blending, compacting, and sin-
tering. Blending is one of the crucial processes in
PM where the metallic powders are mixed with the
ceramic reinforced particles. Good blending pro-
duces no agglomeration of both the metallic and
ceramic particle powders. To achieve this, several
parameters such as particle size, blending speed and
duration should be taken into consideration. Conven-
tional melting and casting has distinct limitations dueto the poor wettability between ceramic particles and
molten copper, leading to agglomeration of disper-
soids. Moreover, the difference in the densities and
the reinforcements can also cause segregation in thew xmelts 10,11 . Therefore, the PM route is ideal to
prepare copper matrix composites because of itsw xefficient dispersion of fine particles 1 . In the case
of carbide particle reinforcements, little information
is available in literature concerning with the fabrica-
tion and properties of SiC particle reinforced Cu-
w xbased composites. Recently, Pelleg et al. 12 havefabricated SiC fibre reinforced copper matrix com-
posites by means of induction melting and of PM .process followed by hot isostatic pressing HIP .
They reported that a chemical reaction occurs at the
SiC fibreliquid copper interface during induction
melting. On the contrary, a clean interface is ob-
served at the SiC Cu interface of composites pre-
pared by HIP process. It is expected that hot isostati-
cally pressed SiCCu composites exhibit goodw xstrength, electrical and mechanical properties 12 .
Yih and Chung have fabricated Cu composites con-
taining 3354 vol.% SiC whiskers by hot pressing.
The whiskers were coated with copper prior to press-
ing. They reported that the resulting composites ex-
hibit several good properties such as low porosity,
high hardness, low electrical resistivity and highw xthermal conductivity 13 . It is worth-noting that the
above-mentioned studies were focused on the fabri-
cation of SiCCu composites where the SiC rein-
forcements were in the form of fibres and whiskers.
Ductile copper generally exhibits poor wear resis-
tance because of its low hardness. Materials removal
in the form of wear debris are commonly observed
on the copper surface during sliding against a hard-w xened steel counterpart 14 . Wear debris is formed by
the delamination cracks developed near the subsur-
face region of copper due to the localization ofw xplastic strain 14 . Ceramic reinforcements in the
form of fibres and particulates are widely incorpo-
rated in the soft and ductile materials, like alu-
minium, to relieve the extent of wear deformation in
the subsurface region. Consequently, the wear resis-
tance of Al-based metals is improved considerablyw x1517 . As mentioned above, Cu-based composites
show promise for applications in electrical sliding
contacts. It is of practical importance to understand
the wear behaviour of Cu-based composites. To thebest of our knowledge, no information is available in
the literature concerning the wear properties of SiC
particle-reinforced Cu-based composites, especially
the abrasive wear. In this study, we attempt to
fabricate the Cu composites reinforced with SiC
particles by means of the HIP process, and to study
the abrasive as well as dry sliding wear properties of
resulting composites. Particular attention is paid on
the abrasive wear behavior of the SiCCu compos-
ite. The HIP process consisting of sintering the
blended powders under the applications of high pres-sure and high temperature. This process involves the
simultaneous application of a high-pressure usually.inert gas and an elevated temperature in a specially
constructed vessel. The pressure applied is isostatic
because it is developed with a gas, so that no alter-
ation in component geometry occurs. Under these
conditions of heat and pressure, internal pores of thew xmaterials are eliminated 18 . Several workers have
successfully fabricated the Al-, Fe-, Ni-, and Ti-basedw xMMCs using HIP process 1922 .
2. Experimental and results
.Copper powder 99.9 percentage pct purity, Cu,
Pb-2000 ppm, O-2000 ppm ; 50 mm in diame-. ter and SiC particles 99 pct purity; 75 mm in
.diameter were purchased from Goodfellow Cam-
-
7/28/2019 1-s2.0-S0167577X99002736-main
3/7
( )S.C. Tjong, K.C. Lau rMaterials Letters 43 2000 274280276
Fig. 1. Variation of density with SiC content for the CuSiC
composites. The dash line is drawn based on the equation D sc .fD q 1yf D where D , D and D are the density of com-p m c p m
posite, particle and metal matrix, respectively; and f is the
volume fraction of reinforcing particles.
bridge. The composites with 5, 10, 15 and 20 vol.%SiC were fabricated by HIP method. The Cu and SiC
powders were mixed mechanically, and the blended
powders were filled into copper tubes. The tubes
were sealed by welding, and placed into an ABB .HIP equipment model QIH-3 . The samples were
hot isostatically pressed at 8808C and 100 MPa for
1.5 h. The density of copper composites was deter-
mined according to Archimedes method. In this
technique, density is determined by measuring the
difference between the specimens weight in air and
when it was suspended in distilled water at roomtemperature. The results showed that the density of
composites is closed to that predicted from the theo- .retical calculation Fig. 1 , and there is no cavities
observed in the composites after hipping. Moreover,
Fig. 1 reveals that the density of composites tends to
decrease with increasing SiC content. This is due to
the density of SiC particles being much smaller than
that of copper. The yield strength and percentage
Fig. 2. Fractograph of composite with 20 vol.% SiC after tensile
test.
elongation of specimens were determined using an .Instron tensile tester model 4206 . Microhardness of
both pure copper and composites were determinedusing an MXT-CX7 Vickers tester under an applied
load of 10 g. Microhardness tests for composites
were carried out in the matrix phase. The density and
mechanical properties of specimens investigated are
summarized in Table 1. Apparently, the hardness of
copper generally improves considerably with the ad-
ditions of SiC particles at the expense of its ductility.
There is no improvement in the yield strength of
composites associated with the SiC additions. This is
possibly due to a large sized of SiC particles used,
i.e., 75 mm. Fig. 2 shows a typical fractograph of thecomposite with 20 vol.% SiC after tensile tests. The
nature of failure appears to be ductile and intergranu-
lar. It is generally known that the yield strength of
metal-matrix composites is dependent on the size
of particle reinforcement. The yield strength of com-
posites tends to decrease with increasing size of
reinforcing particles. On the contrary, the wear resis-
tance of metal-matrix composites is known to im-
Table 1
Mechanical properties of Cu and SiCCu composites
Specimen Yield strength, Percentage Vickers Microhardness,
MPa elongation, % HV
Cu 154 36 82"2
Cu5 vol.% SiC 113 19 99"4
Cu10 vol.% SiC 108 12 113"2
Cu15 vol.% SiC 98 7.9 100"5
Cu20 vol.% SiC 97 6.5 101"5
-
7/28/2019 1-s2.0-S0167577X99002736-main
4/7
( )S.C. Tjong, K.C. Lau rMaterials Letters 43 2000 274280 277
prove considerably with increasing the size of rein-
forcing particles. As will be discussed later, the
abrasive wear resistance of copper improves dramati-
cally by reinforcing with SiC particles of 75 mm, and
the abrasive wear resistance of CuSiC composites
increases markedly with increasing SiC content. In
this context, a compromise can be reached in the
yield strength and wear resistance of CuSiC com-
posites by properly controlling the size of reinforcingw xparticles. Indeed, Tjong and Lau 23 reported that
the yield strength of Cu TiB composites increases2with increasing TiB content due to the size of TiB2 2reinforcing particles is smaller, i.e., 45 mm.
Cylindrical pin specimens 5 mm in diameter and
15 mm in length were prepared from the rods pro-
duced by HIP. They were used for the abrasive and
dry sliding wear measurements. Two-body abrasive
wear tests were performed with a pin-on-disc tester
.Plint Tribology model TE 67 . The pin was loadedagainst a rotating disc, which carried a bonded abra-
.sive SiC paper of 240 grit ;60 mm . The applied
normal loads used were 15, 35 and 55 N. The sliding
velocity employed was 1 m sy1. To ensure fresh
supply of abrasive particles to the pins, the worn SiC
abrasive paper was replaced with the new one for
every sliding distance of 20 m. The weight loss of
the pin was measured at various intervals in an
analytical balance of 0.0001=g precision. The
weight loss was converted to volume loss values.
Dry sliding wear measurements were performedon pure copper and Cu20 vol.% SiC composite
using the pin-on-disc tester. The pins were slid
against a hardened steel disc with a hardness of HRC
60. The disc was rotated at 1 m sy1, and the normal
load varied from 15 to 55 N. The worn surfaces of
pins subjected to both abrasive and sliding wear tests
were observed in a scanning electron microscope .SEM .
3. Discussion
We first consider the results of abrasive wear
measurements. Fig. 3 shows the variation of volume
loss with sliding distance for pure copper and com-
posite specimens tested under an applied load of
15N, and a sliding velocity of 1 m sy1. Pure copper
exhibits an extremely high weight loss during abra-
Fig. 3. Variation of volume loss with sliding distance for all
specimens tested under an applied load of 15 N and a sliding
velocity of 1 m sy1 .
sive sliding as expected. And an increase in wear
volume with increasing sliding distance is observed.Moreover, the addition of only 5 vol.% SiC particle
appears to reduce its volume loss remarkably due to
the incorporation of SiC particles leads to an in- .crease in the hardness of specimen Table 1 . Further
increasing SiC content results in a considerable re-
duction in volume loss, especially for composite
containing 20 vol.% SiC. Fig. 4 shows the variation
of abrasive wear resistance with SiC content for the
specimens tested at different applied normal loads.
The abrasive wear resistance is defined as the in-
verse of volume loss. Evidently, the abrasive wearresistance of copper composites increases with in-
creasing SiC volume content, particularly at low
applied normal load of 15 N. This is because SiC
abrasives can penetrate easily to soft copper during
sliding, resulting in excessive material removal from
the worn surface of pure copper. However, the mate-
rial removal is reduced markedly in composites due
to the SiC reinforcing particles can resist the micro-
cutting action of abrasives.
Wear behaviour of materials is a complicated
phenomenon due to many variables such as sliding
parameters, materials properties, abrasive effects and
lubricating conditions, etc., governing it. For two-w xbody abrasive wear, Rabinowicz 24 has attempted
to relate the volume loss with the hardness of materi-
als and operational parameters. The volume loss is
considered to be resulted from the removal of mate-
rial chips from the specimen due to the microcutting
-
7/28/2019 1-s2.0-S0167577X99002736-main
5/7
( )S.C. Tjong, K.C. Lau rMaterials Letters 43 2000 274280278
Fig. 4. Variation of abrasive wear resistance with SiC content for
all specimens tested under an applied load of 15 N, a sliding
velocity of 1 m sy1 , and a sliding distance of 40 m.
of abrasive particles. Mathematically, it is expressedas follows,
Vs kPLrH 1 .
where V is the volume loss, P the applied load, L
the sliding distance, H the hardness of specimen and .k the wear coefficient. Eq. 1 indicates that the
volume loss of a material is inversely proportional to
its hardness. Hence, the composites with higher SiC .contents exhibit a better wear resistance Fig. 3 due
to SiC additions improve the hardness of specimens
as indicated in Table 1. .Fig. 5 a shows the longitudinal cross-section
SEM micrograph of the composite with 20 vol.%
SiC after sliding against the disc bonded with SiC
abrasive paper under an applied load of 15 N, a
sliding velocity of 1 m sy1, and a sliding distance of
40 m. Some SiC particles are exposed to the worn
surface of this composite specimen. The reason for
this is explained as follows. When the surface of
composite initially comes in contact with SiC abra-
sive paper, adhesive contact occurs. The SiC abra-
sive particles with sharp edges then cause mi-
croploughing and grooving in the surface of copper
matrix. Therefore, materials in the form of chips are
removed from the grooves, thereby exposing SiC
particles. In this case, the SiC abrasives come in
direct contact and slide against with the SiC reinforc-
ing particles. The larger size of SiC reinforcing
particles can offer protection to the Cu matrix during
sliding. Once the reinforcing SiC particles fracture or
loosen from the copper matrix, they can be removed
easily from the matrix, resulting in a certain amount ..of material loss Fig. 5 b .
Finally, we discuss the dry sliding wear behaviour .of pure copper and composite specimens. Fig. 6 a
.and b summarize the results of dry sliding wear
measurements for pure copper and composite with .20 vol.% SiC. Fig. 6 a clearly indicates that the
composite specimen experiences a lower wear loss
compared to pure copper. It can be seen from Fig. .6 b that increasing sliding velocity leads to a further
reduction in volume wear. In the case of pure cop-
per, the asperities of the counterpart steel disc can
deform, penetrate and cut into the copper surface
during dry sliding wear. This is because pure copper
is much softer than the steel counterpart. This results
.Fig. 5. a SEM longitudinal cross-section micrograph of the
composite with 20 vol.% SiC after abrasion wear tests. The
composite was subjected to an applied load of 15 N, a slidingy1 .velocity of 1 m s , and a sliding distance of 40 m; b other
region of composite tested under similar conditions.
-
7/28/2019 1-s2.0-S0167577X99002736-main
6/7
( )S.C. Tjong, K.C. Lau rMaterials Letters 43 2000 274280 279
. .Fig. 6. a Volume loss vs. sliding distance and b volume loss
vs. applied load for pure copper and composite with 20 vol.% SiC
subjected to dry sliding wear tests.
in plastic strain localization in the subsurface region,leading to the formation of delamination cracks Fig.
Fig. 7. SEM plan micrograph showing the formation of delamina-
tion surface cracks in copper after sliding against a hardened disc
at an applied load of 35 N, sliding velocity of 1 m s y1 and a
sliding distance of 2500 m.
Fig. 8. Vickers microhardness depth profiles for pure copper and
composite with 20 vol.% SiC after sliding against a hardened disc
at an applied load of 35 N, sliding velocity of 1 m s y1 and a
sliding distance of 2500 m.
.7 . The excessive delamination of surface layers of
copper leads to a high wear loss, which increases
with increasing the sliding distance as shown in Fig. .6 a . Addition of 20 vol.% SiC particles to copper
matrix considerably increased the hardness of com-
posite and resulted in a reduction of the extent of
plastic deformation of matrix. In this case, the wear
loss of the composite is reduced considerably. Fig. 8
shows the microhardrness depth profiles of the worn
surfaces of pure copper and composite with 20 vol.%
SiC after sliding against a hardened disc at a slidingvelocity of 1 m sy1 , an applied normal load of 35 N
and a sliding distance of 2500 m. Apparently, pure
copper shows the evidence of work-hardening due to
plastic strain localization in the subsurface region on
sliding against a hardened disc. Thus, the microhard-
ness of subsurface region of pure copper is higher
than the underlying material. It is noticed that the
microhardness of copper matrix of the composite
near the subsurface region is reduced considerably
due to the SiC addition. This is because the incorpo-
ration of SiC particles to copper is very effective in
reducing the extent of strain localization in the sub-w xsurface region. More recently, Tjong and Lau 23
also reported that the copper composites reinforced
with TiB particles also exhibit superior wear resis-2tance compared to pure copper. And the wear resis-
tance of CuTiB composites is comparable to that2of CuSiC composites in this study.
-
7/28/2019 1-s2.0-S0167577X99002736-main
7/7
( )S.C. Tjong, K.C. Lau rMaterials Letters 43 2000 274280280
References
w x .1 A. Upadhyaya, G.S. Upadhyaya, Mater. Des. 16 1995 41.w x2 S.E. Broyles, K.R. Anderson, J.R. Groza, J.C. Gibeling,
.Metall. Mater. Trans. 27A 1996 1217.w x3 Y.Z. Wan, Y.L. Wang, G.X. Cheng, H.M. Tao, Y. Cao,
.Powder Metall. 41 1998 59.w x .4 S.Y. Chang, S.J. Lin, Scr. Mater. 35 1996 225.
w x5 J. Lee, N.J. Kim, J.Y. Jung, E.S. Lee, S. Ahn, Scr. Mater. 39 .1998 1063.
w x6 C. Sauer, T. Weissgaerber, W. Puesche, G. Dehm, J. Mayer, .B. Kieback, Int. J. Powder Metall. 33 1997 45.
w x7 C. Sauer, T. Weissgaerber, J. Mayer, W. Puesche, B. Kieback, .Z. Metallkd. 89 1998 119.
w x8 C. Biselli, D.G. Morris, N. Randall, Scr. Metall. Mater. 30 .1994 1327.
w x .9 D. Paulmier, A. Bouchoucha, H. Zaidi, Vacuum 41 1990
2213.w x10 Metals Handbook, 9th edn., Vol. 7, American Society for
Metals, 1984, pp. 710 716.w x .11 A.K. Garg, L.C. De Jonghe, J. Mater. Sci. 28 1993 3427.
w x .12 J. Pelleg, M. Ruhr, M. Ganor, Mater. Sci. Eng. 212A 1996
139.w x .13 P. Yih, D.D.L. Chung, J. Mater. Sci 31 1996 399.w x .14 A.T. Alpas, H. Hu, J. Zhang, Wear 162164 1993 188.w x .15 J. Zhang, A.T. Alpas, Mater. Sci. Eng. A 161 1993 273.w x .16 Z.C. Feng, K.N. Tandon, Scr. Metall. Mater. 32 1995 523.w x17 S.C. Tjong, S.Q. Wu, H.C. Liao, Compos. Sci. Technol. 57
.1997 1551.
w x18 H.V. Atkinson, B. Rickinson, in: Hot Isostatic Processing,Adam Hilger, New York, 1990, p. 1.
w x .19 S.C. Tjong, K.C. Lau, Compos. Sci. Technol. 59 1999
2005.w x20 E. Pagounis, M. Talvitie, V.K. Lindroos, Compos. Sci. Tech-
.nol. 56 1996 1329.w x21 Z.P. Xing, J.T. Guo, Y.F. Fan, L.G. Yu, Metall. Mater.
.Trans. A 28 1997 1079.w x22 J.Q. Jiang, T.S. Lim, Y.J. Kim, B.K. Kim, H.S. Hung, Mater.
.Sci. Technol. 12 1996 262.w x23 S.C. Tjong, K.C. Lau, Mater. Sci. Eng., in press.w x24 E. Rabinowicz, in: Friction and Wear of Materials, Wiley,
New York, 1965, pp. 168169.