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    May 2000

    .Materials Letters 43 2000 274280

    www.elsevier.comrlocatermatlet

    Tribological behaviour of SiC particle-reinforced copper matrixcomposites

    S.C. Tjong ), K.C. Lau

    Department of Physics and Materials Science, City Uniersity of Hong Kong, Tat Chee Aenue, Kowloon, Hong Kong,

    Peoples Republic of China

    Received 18 June 1999; received in revised form 26 November 1999; accepted 29 November 1999

    Abstract

    .Pure copper and its composites reinforced with SiC particles were prepared by hot isostatic pressing HIP process. The

    tribological behaviour of copper and composites was studied on a pin-on-disc tester. The pins were slid against a hardened

    steel disc under dry ambient conditions. In two-body abrasive wear measurements, the disc surface was bonded with a SiC

    abrasive paper of 240 grit size. The abrasive wear measurements showed that soft copper exhibits an extremely high wear

    loss. However, additions of SiC particles up to 20 vol.% appeared to improve the abrasive wear resistance of copper

    significantly under the applied loads of 1555 N. Dry sliding wear tests also indicated that the composite with 20 vol.% SiC

    exhibits a lower wear loss compared to pure copper. This was due to the reinforcing SiC particles being effective to reduce

    the extent of wear deformation in the subsurface region during sliding. q2000 Elsevier Science B.V. All rights reserved.

    Keywords: Wear; Composite, SiC particle; Copper; Hardness; Abrasive

    1. Introduction

    Materials with high electrical and thermal conduc-

    tivities, and high temperature strength have attracted

    considerable interest in recent years. Pure copper

    exhibits high electrical and thermal conductivities

    but it has some distinct shortcomings such as low

    hardness, low tensile and creep strengths. The devel-

    opment of Cu-based alloys with high tensile strengthand hardness is of primary importance. The mechani-

    cal strength of copper can be increased dramatically

    )

    Corresponding author. Tel.: q852-2788-7702; fax: q852-

    2788-7830. .E-mail address: [email protected] S.C. Tjong .

    either by age hardening or by introducing dispersoid

    particles in its matrix. The age-hardenable copper

    alloys are prone to precipitate coarsening at high

    temperatures, thereby reducing their strength drasti-

    cally. In this respect, dispersion-strengthened copper

    has the ability to retain most of its properties on

    exposure to high temperatures. Dispersoid particles

    such as oxides, carbides, borides are insoluble in the

    copper matrix, and are thermally stable at high tem-peratures. The dispersion-strengthened copper alloys

    generally can be classified as the copper-based ma-w xtrix composites 19 . Cu-matrix composites are

    promising candidates for applications in electrical

    sliding contacts such as those in homopolar machinew xand railway overhead current collection system 11 ,

    where high thermal electricalrthermal conductivity

    00167-577Xr00r$ - see front matter q 2000 Elsevier Science B.V. All rights reserved. .P I I : S 0 1 6 7 - 5 7 7 X 9 9 0 0 2 7 3 - 6

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    ( )S.C. Tjong, K.C. Lau rMaterials Letters 43 2000 274280 275

    and good wear resistant properties are needed. .Among various dispersoids, alumina Al O parti-2 3

    cle is commonly used to reinforce copper. The Al O2 3oxide dispersion strengthened copper alloys have

    been reported to exhibit superior elevated tempera-

    ture strength, increased hardness and improved creepw xresistance compared to pure copper 1 3 . Methods

    for the production of dispersion-strengthened copper

    matrix composites involve ingot casting and powder .metallurgy PM processes. The PM route consists of

    several processes like blending, compacting, and sin-

    tering. Blending is one of the crucial processes in

    PM where the metallic powders are mixed with the

    ceramic reinforced particles. Good blending pro-

    duces no agglomeration of both the metallic and

    ceramic particle powders. To achieve this, several

    parameters such as particle size, blending speed and

    duration should be taken into consideration. Conven-

    tional melting and casting has distinct limitations dueto the poor wettability between ceramic particles and

    molten copper, leading to agglomeration of disper-

    soids. Moreover, the difference in the densities and

    the reinforcements can also cause segregation in thew xmelts 10,11 . Therefore, the PM route is ideal to

    prepare copper matrix composites because of itsw xefficient dispersion of fine particles 1 . In the case

    of carbide particle reinforcements, little information

    is available in literature concerning with the fabrica-

    tion and properties of SiC particle reinforced Cu-

    w xbased composites. Recently, Pelleg et al. 12 havefabricated SiC fibre reinforced copper matrix com-

    posites by means of induction melting and of PM .process followed by hot isostatic pressing HIP .

    They reported that a chemical reaction occurs at the

    SiC fibreliquid copper interface during induction

    melting. On the contrary, a clean interface is ob-

    served at the SiC Cu interface of composites pre-

    pared by HIP process. It is expected that hot isostati-

    cally pressed SiCCu composites exhibit goodw xstrength, electrical and mechanical properties 12 .

    Yih and Chung have fabricated Cu composites con-

    taining 3354 vol.% SiC whiskers by hot pressing.

    The whiskers were coated with copper prior to press-

    ing. They reported that the resulting composites ex-

    hibit several good properties such as low porosity,

    high hardness, low electrical resistivity and highw xthermal conductivity 13 . It is worth-noting that the

    above-mentioned studies were focused on the fabri-

    cation of SiCCu composites where the SiC rein-

    forcements were in the form of fibres and whiskers.

    Ductile copper generally exhibits poor wear resis-

    tance because of its low hardness. Materials removal

    in the form of wear debris are commonly observed

    on the copper surface during sliding against a hard-w xened steel counterpart 14 . Wear debris is formed by

    the delamination cracks developed near the subsur-

    face region of copper due to the localization ofw xplastic strain 14 . Ceramic reinforcements in the

    form of fibres and particulates are widely incorpo-

    rated in the soft and ductile materials, like alu-

    minium, to relieve the extent of wear deformation in

    the subsurface region. Consequently, the wear resis-

    tance of Al-based metals is improved considerablyw x1517 . As mentioned above, Cu-based composites

    show promise for applications in electrical sliding

    contacts. It is of practical importance to understand

    the wear behaviour of Cu-based composites. To thebest of our knowledge, no information is available in

    the literature concerning the wear properties of SiC

    particle-reinforced Cu-based composites, especially

    the abrasive wear. In this study, we attempt to

    fabricate the Cu composites reinforced with SiC

    particles by means of the HIP process, and to study

    the abrasive as well as dry sliding wear properties of

    resulting composites. Particular attention is paid on

    the abrasive wear behavior of the SiCCu compos-

    ite. The HIP process consisting of sintering the

    blended powders under the applications of high pres-sure and high temperature. This process involves the

    simultaneous application of a high-pressure usually.inert gas and an elevated temperature in a specially

    constructed vessel. The pressure applied is isostatic

    because it is developed with a gas, so that no alter-

    ation in component geometry occurs. Under these

    conditions of heat and pressure, internal pores of thew xmaterials are eliminated 18 . Several workers have

    successfully fabricated the Al-, Fe-, Ni-, and Ti-basedw xMMCs using HIP process 1922 .

    2. Experimental and results

    .Copper powder 99.9 percentage pct purity, Cu,

    Pb-2000 ppm, O-2000 ppm ; 50 mm in diame-. ter and SiC particles 99 pct purity; 75 mm in

    .diameter were purchased from Goodfellow Cam-

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    ( )S.C. Tjong, K.C. Lau rMaterials Letters 43 2000 274280276

    Fig. 1. Variation of density with SiC content for the CuSiC

    composites. The dash line is drawn based on the equation D sc .fD q 1yf D where D , D and D are the density of com-p m c p m

    posite, particle and metal matrix, respectively; and f is the

    volume fraction of reinforcing particles.

    bridge. The composites with 5, 10, 15 and 20 vol.%SiC were fabricated by HIP method. The Cu and SiC

    powders were mixed mechanically, and the blended

    powders were filled into copper tubes. The tubes

    were sealed by welding, and placed into an ABB .HIP equipment model QIH-3 . The samples were

    hot isostatically pressed at 8808C and 100 MPa for

    1.5 h. The density of copper composites was deter-

    mined according to Archimedes method. In this

    technique, density is determined by measuring the

    difference between the specimens weight in air and

    when it was suspended in distilled water at roomtemperature. The results showed that the density of

    composites is closed to that predicted from the theo- .retical calculation Fig. 1 , and there is no cavities

    observed in the composites after hipping. Moreover,

    Fig. 1 reveals that the density of composites tends to

    decrease with increasing SiC content. This is due to

    the density of SiC particles being much smaller than

    that of copper. The yield strength and percentage

    Fig. 2. Fractograph of composite with 20 vol.% SiC after tensile

    test.

    elongation of specimens were determined using an .Instron tensile tester model 4206 . Microhardness of

    both pure copper and composites were determinedusing an MXT-CX7 Vickers tester under an applied

    load of 10 g. Microhardness tests for composites

    were carried out in the matrix phase. The density and

    mechanical properties of specimens investigated are

    summarized in Table 1. Apparently, the hardness of

    copper generally improves considerably with the ad-

    ditions of SiC particles at the expense of its ductility.

    There is no improvement in the yield strength of

    composites associated with the SiC additions. This is

    possibly due to a large sized of SiC particles used,

    i.e., 75 mm. Fig. 2 shows a typical fractograph of thecomposite with 20 vol.% SiC after tensile tests. The

    nature of failure appears to be ductile and intergranu-

    lar. It is generally known that the yield strength of

    metal-matrix composites is dependent on the size

    of particle reinforcement. The yield strength of com-

    posites tends to decrease with increasing size of

    reinforcing particles. On the contrary, the wear resis-

    tance of metal-matrix composites is known to im-

    Table 1

    Mechanical properties of Cu and SiCCu composites

    Specimen Yield strength, Percentage Vickers Microhardness,

    MPa elongation, % HV

    Cu 154 36 82"2

    Cu5 vol.% SiC 113 19 99"4

    Cu10 vol.% SiC 108 12 113"2

    Cu15 vol.% SiC 98 7.9 100"5

    Cu20 vol.% SiC 97 6.5 101"5

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    ( )S.C. Tjong, K.C. Lau rMaterials Letters 43 2000 274280 277

    prove considerably with increasing the size of rein-

    forcing particles. As will be discussed later, the

    abrasive wear resistance of copper improves dramati-

    cally by reinforcing with SiC particles of 75 mm, and

    the abrasive wear resistance of CuSiC composites

    increases markedly with increasing SiC content. In

    this context, a compromise can be reached in the

    yield strength and wear resistance of CuSiC com-

    posites by properly controlling the size of reinforcingw xparticles. Indeed, Tjong and Lau 23 reported that

    the yield strength of Cu TiB composites increases2with increasing TiB content due to the size of TiB2 2reinforcing particles is smaller, i.e., 45 mm.

    Cylindrical pin specimens 5 mm in diameter and

    15 mm in length were prepared from the rods pro-

    duced by HIP. They were used for the abrasive and

    dry sliding wear measurements. Two-body abrasive

    wear tests were performed with a pin-on-disc tester

    .Plint Tribology model TE 67 . The pin was loadedagainst a rotating disc, which carried a bonded abra-

    .sive SiC paper of 240 grit ;60 mm . The applied

    normal loads used were 15, 35 and 55 N. The sliding

    velocity employed was 1 m sy1. To ensure fresh

    supply of abrasive particles to the pins, the worn SiC

    abrasive paper was replaced with the new one for

    every sliding distance of 20 m. The weight loss of

    the pin was measured at various intervals in an

    analytical balance of 0.0001=g precision. The

    weight loss was converted to volume loss values.

    Dry sliding wear measurements were performedon pure copper and Cu20 vol.% SiC composite

    using the pin-on-disc tester. The pins were slid

    against a hardened steel disc with a hardness of HRC

    60. The disc was rotated at 1 m sy1, and the normal

    load varied from 15 to 55 N. The worn surfaces of

    pins subjected to both abrasive and sliding wear tests

    were observed in a scanning electron microscope .SEM .

    3. Discussion

    We first consider the results of abrasive wear

    measurements. Fig. 3 shows the variation of volume

    loss with sliding distance for pure copper and com-

    posite specimens tested under an applied load of

    15N, and a sliding velocity of 1 m sy1. Pure copper

    exhibits an extremely high weight loss during abra-

    Fig. 3. Variation of volume loss with sliding distance for all

    specimens tested under an applied load of 15 N and a sliding

    velocity of 1 m sy1 .

    sive sliding as expected. And an increase in wear

    volume with increasing sliding distance is observed.Moreover, the addition of only 5 vol.% SiC particle

    appears to reduce its volume loss remarkably due to

    the incorporation of SiC particles leads to an in- .crease in the hardness of specimen Table 1 . Further

    increasing SiC content results in a considerable re-

    duction in volume loss, especially for composite

    containing 20 vol.% SiC. Fig. 4 shows the variation

    of abrasive wear resistance with SiC content for the

    specimens tested at different applied normal loads.

    The abrasive wear resistance is defined as the in-

    verse of volume loss. Evidently, the abrasive wearresistance of copper composites increases with in-

    creasing SiC volume content, particularly at low

    applied normal load of 15 N. This is because SiC

    abrasives can penetrate easily to soft copper during

    sliding, resulting in excessive material removal from

    the worn surface of pure copper. However, the mate-

    rial removal is reduced markedly in composites due

    to the SiC reinforcing particles can resist the micro-

    cutting action of abrasives.

    Wear behaviour of materials is a complicated

    phenomenon due to many variables such as sliding

    parameters, materials properties, abrasive effects and

    lubricating conditions, etc., governing it. For two-w xbody abrasive wear, Rabinowicz 24 has attempted

    to relate the volume loss with the hardness of materi-

    als and operational parameters. The volume loss is

    considered to be resulted from the removal of mate-

    rial chips from the specimen due to the microcutting

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    ( )S.C. Tjong, K.C. Lau rMaterials Letters 43 2000 274280278

    Fig. 4. Variation of abrasive wear resistance with SiC content for

    all specimens tested under an applied load of 15 N, a sliding

    velocity of 1 m sy1 , and a sliding distance of 40 m.

    of abrasive particles. Mathematically, it is expressedas follows,

    Vs kPLrH 1 .

    where V is the volume loss, P the applied load, L

    the sliding distance, H the hardness of specimen and .k the wear coefficient. Eq. 1 indicates that the

    volume loss of a material is inversely proportional to

    its hardness. Hence, the composites with higher SiC .contents exhibit a better wear resistance Fig. 3 due

    to SiC additions improve the hardness of specimens

    as indicated in Table 1. .Fig. 5 a shows the longitudinal cross-section

    SEM micrograph of the composite with 20 vol.%

    SiC after sliding against the disc bonded with SiC

    abrasive paper under an applied load of 15 N, a

    sliding velocity of 1 m sy1, and a sliding distance of

    40 m. Some SiC particles are exposed to the worn

    surface of this composite specimen. The reason for

    this is explained as follows. When the surface of

    composite initially comes in contact with SiC abra-

    sive paper, adhesive contact occurs. The SiC abra-

    sive particles with sharp edges then cause mi-

    croploughing and grooving in the surface of copper

    matrix. Therefore, materials in the form of chips are

    removed from the grooves, thereby exposing SiC

    particles. In this case, the SiC abrasives come in

    direct contact and slide against with the SiC reinforc-

    ing particles. The larger size of SiC reinforcing

    particles can offer protection to the Cu matrix during

    sliding. Once the reinforcing SiC particles fracture or

    loosen from the copper matrix, they can be removed

    easily from the matrix, resulting in a certain amount ..of material loss Fig. 5 b .

    Finally, we discuss the dry sliding wear behaviour .of pure copper and composite specimens. Fig. 6 a

    .and b summarize the results of dry sliding wear

    measurements for pure copper and composite with .20 vol.% SiC. Fig. 6 a clearly indicates that the

    composite specimen experiences a lower wear loss

    compared to pure copper. It can be seen from Fig. .6 b that increasing sliding velocity leads to a further

    reduction in volume wear. In the case of pure cop-

    per, the asperities of the counterpart steel disc can

    deform, penetrate and cut into the copper surface

    during dry sliding wear. This is because pure copper

    is much softer than the steel counterpart. This results

    .Fig. 5. a SEM longitudinal cross-section micrograph of the

    composite with 20 vol.% SiC after abrasion wear tests. The

    composite was subjected to an applied load of 15 N, a slidingy1 .velocity of 1 m s , and a sliding distance of 40 m; b other

    region of composite tested under similar conditions.

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    ( )S.C. Tjong, K.C. Lau rMaterials Letters 43 2000 274280 279

    . .Fig. 6. a Volume loss vs. sliding distance and b volume loss

    vs. applied load for pure copper and composite with 20 vol.% SiC

    subjected to dry sliding wear tests.

    in plastic strain localization in the subsurface region,leading to the formation of delamination cracks Fig.

    Fig. 7. SEM plan micrograph showing the formation of delamina-

    tion surface cracks in copper after sliding against a hardened disc

    at an applied load of 35 N, sliding velocity of 1 m s y1 and a

    sliding distance of 2500 m.

    Fig. 8. Vickers microhardness depth profiles for pure copper and

    composite with 20 vol.% SiC after sliding against a hardened disc

    at an applied load of 35 N, sliding velocity of 1 m s y1 and a

    sliding distance of 2500 m.

    .7 . The excessive delamination of surface layers of

    copper leads to a high wear loss, which increases

    with increasing the sliding distance as shown in Fig. .6 a . Addition of 20 vol.% SiC particles to copper

    matrix considerably increased the hardness of com-

    posite and resulted in a reduction of the extent of

    plastic deformation of matrix. In this case, the wear

    loss of the composite is reduced considerably. Fig. 8

    shows the microhardrness depth profiles of the worn

    surfaces of pure copper and composite with 20 vol.%

    SiC after sliding against a hardened disc at a slidingvelocity of 1 m sy1 , an applied normal load of 35 N

    and a sliding distance of 2500 m. Apparently, pure

    copper shows the evidence of work-hardening due to

    plastic strain localization in the subsurface region on

    sliding against a hardened disc. Thus, the microhard-

    ness of subsurface region of pure copper is higher

    than the underlying material. It is noticed that the

    microhardness of copper matrix of the composite

    near the subsurface region is reduced considerably

    due to the SiC addition. This is because the incorpo-

    ration of SiC particles to copper is very effective in

    reducing the extent of strain localization in the sub-w xsurface region. More recently, Tjong and Lau 23

    also reported that the copper composites reinforced

    with TiB particles also exhibit superior wear resis-2tance compared to pure copper. And the wear resis-

    tance of CuTiB composites is comparable to that2of CuSiC composites in this study.

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    ( )S.C. Tjong, K.C. Lau rMaterials Letters 43 2000 274280280

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