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“Assuring Safe Space Exploration Through Test and Evaluation”

W. David BeverlyRITF Laboratoryat NASA Johnson Space Center

RECEIVING INSPECTION AND TEST FACILITY

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Overview of the RITF

Founded in 1989, the RITF is a critical support facility at NASA Johnson Space Center in the Safety and Mission Assurance Directorate.

The RITF is operated for NASA by SAIC and provides testing and evaluation, screening services, and training to the technical community. The lab is equipped with CNC milling capability to provide unique fixtures to accommodate unique testing needs.

The RITF operates the ESD Verification and Testing (EV&T) office and has established control programs for Electrostatic Discharge (ESD) and Counterfeit Parts Avoidance.

The RITF provides NASA and IPC Workmanship Standards training courses to students across the nation and Canada, training approximately 1200-1500 students annually.

The RITF is an AS9100-registered laboratory and holds an ISO/IEC17025 accreditation.

• Chemical analysis• Environmental testing• Failure analysis• Mechanical testing• Metallographic analysis• Radiographic analysis

Testing and Evaluation

• Counterfeit parts identification• Electronic component screening• Fastener acceptance screening• FOD and loose particle screening• Raw material validation (metallics)• Wire and cable acceptance screening

Screening Services

• Conformal coating• Crimping• Electrostatic discharge (ESD)• Fiber-optic terminations• Solder• Surface mount technology (SMT)• IPC J-STD-001E/S

Training

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SP3

• SP3 highlights the interdependent relationship between Structure, Properties, Processing, and Performance

Testing and Evaluation

Chemical analysis• Understanding of chemical composition and how it influences structure and properties to ensure

performance is maintained.

Environmental testing• Understanding of interaction between hardware and service environment to ensure performance is

maintained.

Failure analysis• Investigation of why hardware does not perform as expected.

Mechanical testing• Understanding of material properties such as strength, ductility, and wear resistance and how they

influence hardware performance while in service.

Metallographic analysis• Understanding of structure and processing of materials and the influence they have on hardware

performance.

Radiographic analysis• Understanding of structure and processing of components and the influence they have on

performance.

Structure

Processing

Performance

Properties

The RITF’s testing and evaluation capabilities allow for a complete assessment that characterizes hardware down to the component level and provides insight to its operation.

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The RITF’s screening services subject hardware, parts, components, and raw materials to a rigorous regimen of testing to identify and avoid use of counterfeit and substandard parts.

Counterfeit Screening

• Counterfeit screening is a series of additional tests that can disposition hardware, parts, and components and confirm whether a suspect part is indeed counterfeit

Screening Services

Counterfeit parts identification• An expanded regimen of testing and non-destructive evaluation is required to disposition

suspect parts that are flagged as being potentially counterfeit.

Electronic component screening• A regimen of testing is used to ensure that parts and components meet the respective

specifications for which they were procured.

Fastener acceptance screening• A regimen of testing is used to screen fasteners to ensure they perform according to the

specifications for which they were procured.

FOD and loose particle screening• A screening method to identify devices with loose particles that could become dislodged

and short out the device.

Raw material validation (metallics)• A screening regimen used to validate that metallic materials meet requirements of their

procurement specifications.

Wire and cable acceptance screening• A regimen of testing is used to screen wire and its insulation to assess performance in

extreme environments.

Additional Screening

Parts

FastenersWire & Cable

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Thermal Vacuum Testing

• Used to simulate near space environments

• Devices can be active while in the chamber.

• Can expose test hardware to thermal conditions while in the chamber

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Wire and Cable Testing• Spark test - culls poorly insulated areas

• Cold bend – force a cryogenically cooled wire length into a helix; poor insulation will crack.

• DWV – Wire at 1050 VDC in a saline solution;

current leakage indicates insulation cracks.

• EDS analysis - wire base metal and plating

• Wire wrap back – thermal shock the insulation

• Conductor resistance measurement

• Electrical cable shield coverage

• Inspection of conductor and shield strand plating

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Particle Impact Noise Detection

Particle Impact Noise Detection testing, known as PIND or PIN-D, is performed to detect loose particles inside a device cavity.

The test provides a nondestructive means of identifying those devices containing sufficient mass that, upon impact with the case, excite the transducer.

The equipment required for this test includes a threshold detector, a variable shaker and driver assembly to provide a sinusoidal motion to the DUT (device under test), a transducer and a shock mechanism capable of imparting shock pulses to the DUT.

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X-Ray Fluorescence SpectrometryThe system is widely used for elemental analysis and chemical analysis, particularly in the investigation of metals, glass, and ceramics.

Electronic Components are typically tested using this equipment:

RoHS and lead-free regulations caused concerns over lead/tin content.

Concerns over percent tin content and tin whisker susceptibility

Plating thickness measurements

TYPICAL APPLICATIONS• Foreign material analysis• Corrosion evaluation• Coating composition analysis• Rapid material alloy identification

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Real-Time RadiographyReal-time radiography (RTR), or real-time radioscopy, is a nondestructive test (NDT) method whereby an image is produced electronically, rather than on film, so that very little lag time occurs between the item being exposed to radiation and the resulting image.                    We utilize X-Ray radiography to inspect for wire sweeping and other wire bond problems, die attach voids, package voids and cracks. It is excellent for determining leadframe outlines as well.

Fig. 1.  Example of a Top View X-ray Photo of an IC

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Metallographic Preparation

The basic steps for proper metallographic specimen preparation include:documentation, sectioning and cutting, mounting, planar grinding, rough polishing, final polishing, etching, microscopic analysis, and hardness testing.

The RITF maintains all the necessary equipment in our sample room for proper metallographic preparation for supporting materials screening, validation and failure analysis. Equipment includes: abrasive cutoff saws, precision cutoff saw, grinding and polishing equipment, mounting, necessary chemicals for etching.

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Tensile, Compression, Bending

The RITF provides a comprehensive line of mechanical testing by using our Tinius Olsen Universal load frame with a capacity of 200,000lbs tension/compression and an MTS system with capabilities from 5lbs to 10,000lbs. The testing provides valuable data to the customer validating analyses and verifying the mechanical properties prior to use.

Typical Testing:Fasteners Kevlar ThreadsRounds and Flats NomexWeld Coupons Velcro StrapsDouble Shear Bend TestingMetallics Non-metallics

Fig. 1 – Nomex thread tensile test

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Mechanical Testing and Analysis Capabilities Hardness Testing

Concerning the mechanics of materials testing, hardness is the resistance to indentation, and is often a means of easily measuring a specified quantity which indicates something about the strength and heat treatment of the metal or elastomer in terms of durometer hardness testing.

Capabilities:Rockwell Hardness – A, B, CSuperficial – 15, 30, 45, T&NMicrohardness – Knoop & VickersDurometer – Shore A & D

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Optical Emission Spectrometry (OES)

Our ARL 3460 spectrometer provides the OES capability at the JSC. This instrument is critical in determining the chemical composition (quantitative) of iron, nickel, and aluminum based alloys. It is a critical tool in the lot validation of raw materials, failure analysis, and lot homogeneity testing.

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SEM/EDS Examination and Analysis

SEM Evaluation of microelectronic and associated materials processing anomalies. Using proven analytical techniques such as metallography, light and scanning electron optics coupled with energy dispersive spectroscopy, we are able to isolate and solve materials-related issues. This is a valuable tool in our process in performing any root cause failure analysis jobs.

Qualitative Analysis - The sample x-ray energy values from the EDS spectrum are compared with known characteristic x-ray energy values to determine the presence of an element in the sample. Parts/components too small to be analyzed on our OES are tested using EDS to determine chemical composition.

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Training

Conformal coating

Crimping

Electrostatic discharge (ESD)

Fiber-optic terminations

Solder

Surface mount technology (SMT)

IPC J-STD-001E/S

The RITF training provides hands-on instruction of electronic workmanship processes, procedures, practices, and methods required for critical and high reliable applications.

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American Association for Laboratory Accreditation (A2LA) to ISO/IEC17025◦ Meets NASA-STD-6008 requirements for mechanical

parts testing and analysis◦ Only Lab at JSC to perform mechanical parts testing

per NASA-STD-6008 requirements AS 9100 Rev. C Registered (NQA)

◦ Quality management system◦ Training and documented procedures allow for efficient

testing to customer schedule and requirements

Accreditation and Registration

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Back-up

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Capability/Tool Description Applications Benefits

Failure AnalysisTesting/Analysis of a component, board, LRU which has failed during it's life cycle and determining the root cause.

This type of testing/analysis support can be applied during various phases of the part or component such as design, in-use/flight, after useful life, etc.

Provides the knowledge for repair, lessons learned as to not repeat problem, design modifications to avoid preliminary failures.

Destructive Physical Analysis (DPA)

A careful systematic approach to disassembling a component, electronics board, part, LRU, etc. to evaluate it down to the basic material and construction level.

Using proven analytical techniques such as metallography, light and scanning electron optics coupled with energy dispersive spectroscopy, one can isolate and solve materials-related issues.

Solving unique problems ranging from contamination issues to complex failure analysis. Should your materials needs be strictly metallurgical in nature, we have a complete laboratory and the background to solve the questions.

Screening of parts and component

Testing and analysis of samples of parts and components to ensure they meet their respective specifications to which they were procured.

With the shift of procurements to COTS hardware and the ever increasing problems with counterfeiting, the importance of screening continues to grow.

Screen out non-compliant parts and components increasing the reliability and safety of our hardware by precluding the use/installation of bad or counterfeit parts in our hardware.

Particle Impact Noise Detection (PIND)

Particle Impact Noise Detection testing, known as PIND or PIN-D, is performed to detect loose particles inside a device cavity.

This is a non-destructive test to identify any devices that may have particles such as solder balls that could become dislodged and short out the device internally.

Screening with this test could prevent a latent failure which could result in a loss of mission.

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Capability/Tool Description Applications Benefits

Fine/Gross Leak TestingHermiticity testing (seal, fine and gross leak tests) to determine the effectiveness of sealed packages.

Seal integrity testing is crucial for hermetically sealed packages in military, space, and commercial applications prior to their use.

Seal integrity testing is crucial for hermetic packages in military, space, and commercial applications. A loss of hermeticity is a reliability concern and will allow moisture and contaminants to enter the package cavity shortening device lifetime.

Emission MicroscopyThis instrument is used to detect defects in integrated circuits by means of light emission in operation mode.

Gate oxide breakdown, Current flow across p-n junctions, Hot electron effects, CMOS Latch-up, EOS/ESD damage, Saturated MOS devices, Analog MOSFETs

Failure analysis tool for locating IC failures, front and backside, with simplicity, efficiency and accuracy.

SEM Examination

The scanning electron microscope has many advantages over traditional microscopes. The SEM has a large depth of field, which allows more of a specimen to be in focus at one time. The SEM also has much higher resolution, so closely spaced specimens can be magnified at much higher levels.

Non destructive tool used in failure analyses to examine samples at extremely high magifications, high resolution, and with greater depth of field.

Much higher magnification and resolution than optical microscopes and also provides depth of field. Additionally one can utilized the EDS system for qualitative chemical analysis.

Terminal Strength

The forces applied consist of direct axial, radial or tension pulls, twist, bending torsion, and the torque exerted by the application of nuts or screws on threaded terminals.

This test is performed to determine whether the design of the terminals and their method of attachment can withstand one or more of the applicable mechanical stresses to which they will be subjected during installation or disassembly in equipment.

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Capability/Tool Description Applications Benefits

Energy Dispersive Spectroscopy

Energy-dispersive X-ray spectroscopy (EDS or EDX) is an analytical technique used for the elemental analysis or chemical characterization of a sample.

EDS is used as a screening tool as well as in root cause failure analysis to determine elemental compositions, identify contaminants, and provide the qualitative analysis of various samples. •Foreign material analysis• Corrosion evaluation• Coating composition analysis• Rapid material alloy identification• Small component material analysis• Phase identification and distribution

The sample x-ray energy values from the EDS spectrum are compared with known characteristic x-ray energy values to determine the presence of an element in the sample. Quantitative results can be obtained from the relative x-ray counts at the characteristic energy levels for the sample constituents.

Printed Wiring Board Evaluations

Printed Wiring Board coupons are submitted that represent a build of boards. These coupons are mounted, ground to midway point on through-holes, and polished for examination under high magnification for verification of attributes.

Customers submit sample coupons for verification of quality/reliability of a production lot of printed wiring boards.

The screening of the PWB coupons can identify problems with the manufacturing processes/ production run of the actual boards that could result in premature failures and/or manufacturing issues during the population of the boards.

Wire/Cable TestingWire and cable testing is performed by conducting multiple tests including spark testing, cold bend, dimensional, …..etc.

All flight wire and cable requires screening testing prior to use.

Prevents non-compliant wire and cable from being used in NASA hardware preventing probable failures later in the life cycle.

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Capability/Tool Description Applications Benefits

Radiographic Examination (Real Time)

Real-time radiography (RTR), or real-time radioscopy, is a nondestructive test (NDT) method whereby an image is produced electronically, rather than on film, so that very little lag time occurs between the item being exposed to radiation and the resulting image.

X-Ray radiography is commonly used to inspect for wiresweeping and other wirebond problems, die attach voids, package voids and cracks. It is excellent for determining leadframe outlines as well. Traditional x-ray systems use photosensitive films to record the x-ray image.

Provides a very useful tool for non-destructively examining of components, assemblies, or materials for internal problems that would otherwise go undetected and could lead to failure. This is also useful in screening of various components such as batteries.

X-Ray Fluorescence Spectroscopy

X-ray fluorescence (XRF) is the emission of characteristic "secondary" (or fluorescent) X-rays from a material that has been excited by bombarding with high-energy X-rays or gamma rays. This is widely used for elemental analysis and chemical analysis, particularly in the investigation of metals, glass, ceramics

XRF is typically used as a quick tool to determine the percent composition of solder used on boards, plating thickness, and qualitative chemical analysis of elements during investigations.

Determining the percent composition of solders allows us to inform the customer of the need to take precautionary measures in the cases where the tin content is high to prevent the growth of tin whiskers. It also allows us to determine if plating thicknesses comply with specifications.

Thermal Conditioning (Burn In)

Burn-in is the process by which components of a system are exercised prior to being placed in service (and often, prior to the system being completely assembled from those components).

The intention is to detect those particular components that would fail as a result of the initial, high-failure rate portion of the bathtub curve of component reliability. If the burn-in period is made sufficiently long (and, perhaps, artificially stressful), the system can then be trusted to be mostly free of further early failures once the burn-in process is complete.

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Capability/Tool Description Applications Benefits

Temperature & Humidity Cycling

Die Shear

Die Shear Testing is the process of determining the strength of adhesion of a semiconductor die to the package's die attach substrate (such as the die pad of a lead frame or the cavity of a hermetic package), by subjecting the die to a stress that's parallel to the plane of die attach substrate, resulting in a shearing stress between: 1) the die-die attach material interface; and 2) the die attach material-substrate interface.

The general purpose of die shear testing is to assess the over-all quality of the die attach process, including the integrity of the materials and the capabilities of the processes used in mounting the die (and other elements, if any) to the package substrate. Mil-Std-883 Method 2019 is the most widely-used industry standard for performing this test.

IR Thermography

Infrared Thermography, thermal imaging, thermographic imaging, or thermal video, is a type of infrared imaging science. Thermographic cameras detect radiation in the infrared range of the electromagnetic spectrum (roughly 900-14,000 nanometers or 0.9-14 µm) and produce images of that radiation.

It shows a visual picture so temperatures over a large area can be compared. It allows detection of deteriorating (i.e. at higher temperature) components prior to their failure. It can be used to measure or observe in areas inaccessible or hazardous for other methods. It is a non-destructive test method. It can be used to find defects in shafts and other metal parts.

Better sensitivity than x-rays / crystal films.- Affected panel easily indentified- Results immediately known- No specific safety required