1-ltl technology detail

8/7/2019 1-Ltl Technology Detail

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Disruptive Technologies

That Are Entering The Marketplace

The Next Generation Of Electronics Manufacturing

Printed Electronics

&

The Next Generation Of Energy Storage

Ultra-High Energy Capacitors

&

Universal Personal Electronic Devices

U-PED

Note:

The technology as presented is purposely made to appear as simple. However, critical informationabout the dielectric composition and fabrication process has been purposely omitted, as it would representhighly confidential trade secrets. Any company or technical team believing they can make the technology work

without knowing these trade secrets will find out after great expense they are wrong. Information about thedielectric's composition or detailed fabrication process has not been given in any pending patent or in any

public disclosure. Without this information a technical team is wasting its time and their employer's money.Only companies that are in partnership with 1st Lighten The Load Inc. are granted access to trade secrets. Inspite of this warning a few companies and organizations known to us have unsuccessfully, after great expense,tried to manufacture their own samples.

Date: 13 March 2009

By: Mr. David KellyCTO of 1st Lighten The Load Inc.


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1st Lighten The Load Inc.

World Changing Technologies!

FIPO Box 88054; Calgary, AB; Canada T2C 4V9+1 (403) 536 9990 (Canada) www.1-LTL.com/

2008 all rights reserved. This document grants no rights or licenses for the described technology.

2

Table Of Contents

Description Page

1. Technology Overview 3

2. Market Approach 4

3. Licensing Options 5

4. New Products Using The Technology

i. UPED 7

ii. Electronics Manufacturing 11

iii. Energy Storage 12

5. Technology Development

i. Risk & Time To Market 15

ii. Development Steps 15

iii. Technical Support 16

6. Other Technologies Under Development 17

7. Other Information Including Contact 17

Appendix

A Diagram Views Of The New Manufacturing Process 18

Special Note:

This document is for information purposes only and the receipt of it does not grant any

rights to use or license for the technologies described herein.
http://www.1-ltl.com/http://www.1-ltl.com/


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1. Technology Overview

A new electronics fabrication technology was developed by 1st Lighten The Load Inc. as an

offshoot of 2 1/2 years of research into a new capacitor design and method of fabrication. The new

technology is disruptive to current high volume electronics manufacture in that it eliminates the need

for 95% of passive components. The new technology opens up a whole new range of products that can

be inexpensively manufactured. With all passive components fully integrated into the body of the

electronics assembly about the size of an equivalent PCB, no longer having a separate structure of

their own. The process is fully automated, eliminating almost all the labor, with high speed offabrication up to 3 square meters of finished electronics produced per minute, representing for example

100s of cellular phone assemblies per minute. The fabrication process is capable of making a 20-layer

circuit board with a total thickness of only 0.025mm (25 micron) with interlayer working voltages of

greater than 15 volts DC. The electronic assemblies of your cellular phones or other electronic

equipment will be reduced to the volume required by 2 times the area of paper (about the thickness of

the final PCB) that is required to mount the unpackaged integrated circuits used in your cellular phone.

The new fabrication technology was originally designed to manufacture ultra high energy

density capacitors. The energy density of these capacitors is able to approach that of current batteriesbut at a fraction of the cost. Capacitors used as primary energy storage have many advantages such as

unlimited life, fast recharge (seconds), are self-healing (cannot catch fire), and most important can be

integrated as part of a portable electronics device. Ultra high energy density capacitors can be made in

any form or shape and even as part of the outer case of a portable electronics device. A large market for

the ultra high energy density capacitors is for storing electric power by directly connecting them to DC

Transmission Lines. They can be used as primary energy storage for electric trains, ships, heavy

industrial equipment and eventually electric cars. The estimated cost of the ultra-high density capacitors

is projected to be about 50 to 100 dollars US per kilo-watt-hour, far less than the cost of current batterytechnology. A different document is available, on request, that goes into detail about the new ultra high

energy density capacitor technology.

The technology has been protected by a number of pending patents and a number of critical

trade secrets. Key trade secrets have been withheld and have been purposely selected to maximize the

expense of any corporation attempting to complete the technology without a license or co-operation

from 1st Lighten The Load Inc. The pending patent portfolio represents the degree that our technology


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is ahead of current capacitor research and establishes a very low probability that any University or

Government lab would complete the technology inexpensively and in a timely manner.

2. Market Approach

The overall market for the different technologies is very large the smallest being the capacitor

industry which is $12.9 Billion US per year, the electronics fabrication industry is far greater and last

the future energy storage for renewable energy and automobiles eventually expected to exceed $100

Billion annually. Electric cars are soon to become a reality and with them a need for fast recharge

electric stations, the same as gasoline stations today. The market for electric car fast recharge stations in

the USA alone is expected to exceed $100 Billion US. Though market potential from each of these

markets is very large the need is to establish revenue from the technology as soon as possible.

The markets initially to be targeted will be the capacitor industry and high volume

electronics fabrication. For the capacitor market the technology is used to make lower cost and more

compact direct replacements for double layer capacitors (in working voltages greater than 15 volts),

metal film, electrolytic; and the manufacture of self-healing multi-layer ceramic capacitors. The market

for the capacitor production machines would be initially very large as the new high energy density

capacitors will quickly dominate most of the $12.9 Billion US capacitor market with devices to 1/10 th

the size and cost of manufacture. However, it must be remembered that the demand for discrete

capacitors will rapidly fall as this new electronics fabrication technology moves to dominate the market,

greatly reducing their use in electronic equipment. With this in mind within 10 years the $12.9 Billion

US capacitor market could easily drop below $2 Billion. The electronics fabrication industry would, for

the same reasons, be quickly dominated by this new technology as it represents an overall

manufacturing cost savings of about 30% for consumer electronics. Both these markets will typically

accept a new technology within 2 years of its introduction and have well accepted/established

accelerated life testing for new products.

After the fabrication equipment is in operation for these two markets, attention will turn to the

ultra-high energy density capacitor technology. The customers for this type of product are very

conservative and entry could take 2 to 4 years for full acceptance. The lowest cost market to enter

would be the electric grid storage where the energy is stored in environmentally controlled warehouse

sized facilities and their primary concern is cost per kilo-watt-hour of storage, operating life and energy


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loss in both the storing and discharging process. The industrial, train and marine applications can be

targeted at the same time. Their primary concerns is cost and they are not very concerned about size or

weight.

The last market to enter would be the automotive where cost, size and weight are all of high

importance. This means that after satisfying the electric grid storage market, research will turn to

weight and size reduction with the goal of dominating the automotive market. For Asian countries small

vehicles such as electric bikes and scooters would be a very large market with cost, not size the main

concern. For this reason the electric bike and scooter market could be used as a reliable testing ground

for the ultra-high energy storage capacitors that are eventually to be used in the automotive market.

At the same time the electronics fabrication can be used for the next generation of electronic

components. These devices would be high density and high values such as the UPED (see later) or solid

state hard drive replacement devices, miniature cellular phones etc..

3. Licensing Options

There are the usual questions such as why your company would benefit by licensing? First, the

IP owned by 1st Lighten The Load Inc. contains a number of primarily or top patents. This means the

small set of pending patents will eventually control the market place and companies who hold

secondary licenses can not with hold licenses to your company. New developments in the technology

will almost always be secondary patents so your company will remain in control of the technology.

Eventually a patent pool could be established where an organization holds or is able to grant a single

license to a company for the technology. This would be much more practical than having to negotiate

licenses with 10 or 30 individual companies.

Optionally your company is offered the opportunity to own the new technology so you can put

your competition out of business before they do it to you or to be used as a barging tool for cross

licensing of key technology that your competition owns. Your company can introduce the disruptive

technology in a controlled manner that fits your firms ability to transition into the new technology.

You would control the speed of the progression of the new technology rather than your competition.

Control of the new technology ensures your company has the latest and greatest miniature electronic

products, capturing the more profitable portion of the business. Without access to the disruptive


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technology your competition will not be able to match your companys new products in cost of

manufacture, size and features. Alternately your company may elect to purchase the technology then

license your competition, so you receive a portion of the proceeds from all products made etc.

Your company needs to take control of the IP to prevent chaos in the electronics fabrication

market that would result if the core IP is allowed to go free. Unless the IP is acquired there is a strong

probability that a substantial portion of the market place will go free. The worse case scenario is for the

top pending patents to be allowed to go free for the world or large portions of the market place. In such

a situation there would be a mad frenzy rather than controlled introduction to the market place. The

whole electronics industry would be disrupted with a rate of change that could cause severe economic

hardship. In addition new start up companies may emerge that dont have to convert existing fabrication

facilities or find jobs for personnel made redundant by the conversion to the new technology, causing

great financial strain and hardship for well established and mature manufacturers. The passive

component manufacturers would collapse prematurely obsolescing components while demand still is

high. Instead of an orderly transition of the industry to a new technology over 3 to 7 years period a

collapse of the electronics industry could occur in as little as 3 years.

There are many licensing options available for companies to consider. All licenses or full

purchase of the IP including staged payments (with performance clauses) that may be all cash or a

combination of cash and stock are available. If a company elects to pay with stock (or even stock

options) sale restrictions would be considered by 1st Lighten The Load Inc. such as shares not being

sold for a predetermined period of time or until a specific time after the new technology went into

production etc.

The purchase of the IP is available because at this time there are no licenses or other

encumbrances on the technology. Alternately a license exclusive or otherwise is available for a specifictechnology, such as the manufacturing equipment/fabrication process, UPED (see later), capacitor

technology for electronics, ultra-high energy density capacitors for energy storage for a specific market

etc. Selected markets may be a country, continent etc. A unique offer that is available is a first right of

refusal of any new technologies developed by the technical principles of 1st Lighten The Load Inc.

There are a number of new technologies under development for example an advanced form of e-paper


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above that currently manufactured, that retains its display statically and has a much faster rate of

writing so it supports low video in its active mode.

The purchaser or licensor of the manufacturing technology will get full technical support and

transfer of trade secrets as required until the process is up and operating. The technical team is available

for relocation either temporarily or on a permanent basis.

4. New Products Using The Technology

i. UPED stands for Universal Personal Electronic Device

1st Lighten The Load Inc offers cellular/ phone; LCD/OLED display; e-paper; electronic device

manufacturers a unique opportunity to acquire this technology that will be capable of miniaturizing

your products to their current size well beyond that of your competition. If your are in the cellular

phone market, owning our new technology can put your competition out of business before they do it to

you. Without access to the disruptive technology your competition will not be able to match your

companys new products in cost of manufacture, size and features.

This new manufacturing technology has made a new product possible called the UPED pronounced

U-pedthat is capable of replacing ALL of the portable electronic devices that are carried by customers.

It specifically targets the younger generation with the ultimate must haveproduct that will become a

necessityfor the education market. It is capable of capturing the music, video, cellular, cable

TV/satellite and software services that are paid as a monthly fee. One method of describing the product

is as a cellular phone that is also a fully capable personal computer that will dominate the education,

cellular phone, computer and electronics markets. It is in a way a product similar to the concept of a

Universal Remote Control that after being programmed removes the need for many individual

manufacturers remote controls. All personal electronic devices will eventually be replaced with this

single product.

The product is the next evolutionary step that will replace computers, both laptop and desk top as

they currently exist today. There are over 86 features, most are software and represent a potential

monthly rental surcharge that the customer will wish to add. There are over 30 new software


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opportunities created by the product, which will become must have add-on features for the teenage

market place.

The product requires the involvement of a number of major companies in different industries,

where each company will be able to put its competition out of business.

UPED Advantages; Quick Summary

1. Hardware; the UPED hardware will typically contain over 100 giga-byte of solid-state storage.

This could represent 50% of the flash storage market, providing a secure market protected by IP

for a memory chip manufacturer.

2. Software; the UPED is a computing device and cellular phone representing a new operating

system software market.

3. Music/video download market.

4. Cellular phone market,

5. Consumers electronics market; the revolutionary manufacturing process will make your

products the lowest cost to manufacture, smallest in size and must have as they are the only

products such as flat screen TVs, game boxes etc. that are able to interface with the UPED.

6. Satellite communication; the UPED is able to compete against land services, i.e. cable TV,internet etc. and is a low cost method to provide services for developing nations, representing

nearly 4-5 Billion potential customers. The UPED would interface to a new low earth orbit

array such that receiving antennas would be about 5 cm in size.

UPED: Advantages Detailed

Main Product:Features, Benefits and Income Generating Power

1. Top or primary patent as all other electronic devices would be secondary to it. In most countries this

means that the holder of the primary patent can not be refused a license for a secondary patent; many

patents that may not have included in their claims the provision of such a device makes no license

necessary to use their IP and it opens the opportunity for new patent applications to be filed for the

UPED application.

2. Education computers and personal computers will be made up of a UPED, with a separate display

such as a sheet of e-paper or OLED, a wireless key board and a mouse-like device. The e-paper or


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OLED can be incorporated inexpensively as part of the students note book i.e. embedded in the

cover. The UPED satisfies all other needs of the student in an electronic device: personal computer,

MP3 player, data storage, video and cellular phone etc.. Capturing the education market with the

technology keeps the younger population and their homes locked into your products for about 20

years of their life and they are more likely to keep using them as adults. With children of a family

using your product then it is only probable that the adults would use them as well. Some possible

versions of the UPED are: the EPED; Education Personal Electronic Device, and the CPED;

Corporate Personal Electronic Device etc..3. The UPED would be satellite capable with special integrated antenna as an add-on option (special flip

lid or cover) and compatible with near earth orbit satellite networks similar to Iridium. This opens a

financial opportunity for the construction of a much larger near earth orbit network to service Asia,

Africa, Russia, Middle-East, South and Central America. Satellite-capable phones with optional

antennas embedded in their flip lids create the new satellite customer base. The satellite UPED is a

way that a cellular provider can access the market for satellite internet and TV services for the large

regions of rural Asia, Africa, Russia, Middle-East, South and Central America that do not have

inexpensive access. It opens an opportunity for the cellular service providers to offer a competingservice to the existing and highly profitable cable TV/wired Internet market place. In developed

countries the common cable TV service costs $60US per month and Internet $39. This provides the

opportunity for an additional $100/month of service fees on top of the cellular monthly service

charge. Further with the UPED being used as a component of the satellite connection piracy is nearly

impossible though the protection offered by the embedded digital rights software. Cellular service

providers new satellite opportunity provides a much larger source of revenue allowing your company

to charge a greater royalty for your hardware. With a potential market of 5 Billion customers the

annual cash flow would be very large. Further the opportunity would provide a new commercialmarket for satellites and support of space programs of the participating nations such as Japan, China,

India, Russia and the European Union.

4. The manufacturing technology is ready to go to pilot stage of manufacture. This technology is very

similar to that Nokia was hoping to develop in 7 years for their Morph concept phone, described in

their February 2008 press release. They said it would take over 7 years, however the major

component of the fabrication technology is available for license today! So the UPED would be


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available for sale in 18 months along with ultra thin e-paper or OLED display & keyboard integrated

into a school notebook cover and a watch sized cellular phone with a wireless headset. The timing is

perfect with the new must have products entering the market place in sync with the economic

recovery and represents a major technological advancement not possible for your competition to

match in size or price. Another major benefit for your company is that the technology will establish

your company as the industry leader, moving far ahead of the present leader in this technology by

beating them to market with the next generation of personal electronic devices.

5. Controlling the education UPED market extends the control of the larger electronic market to yourcompany. With the UPED processing capability limited by lower power processors a large market for

accessories such as UPED LCD display/docking stations with high power coprocessors incorporated

inside for engineering/office computer workstations, game boxes, and home video displays etc. The

UPED can hold all personal data with additional storage for purchased/rental music, movies/videos

and games making it easier to control copy/digital use rights with physical CD & DVD made

obsolete. The manufacturer can preload, for a fee, the UPED flash storage with a selection of movies,

music and games that the users can purchase/rent at a discount. New business opportunities will open

for software applications and auxiliary devices such as docking stations integrated into homeentertainment, where displays screens are used as a computer/television etc..

1st Lighten The Load Inc offers cellular/ phone; LCD/OLED display; e-paper; electronic device

manufacturers a unique opportunity to acquire this technology that will be capable of miniaturizing

your products to their current size well beyond that of your competition. The cost savings is greatest

for those manufacturers that are making LCD/OLED large screen displays. Your company will be able

to manufacture wrist and credit card sized cellular phones with many of the features of your current

products. The size reduction includes the potential for substantial manufacturing costs savings as the

new electronics fabrication technology is easily automated and uses existing inexpensive industrialgrade materials. The technology produces OLED and e-paper displays at a much lower cost and thinner

than currently possible.

ii. Electronics Manufacturing

The fabrication process consists of the industrial inkjet printing of passive and active electronic

components in combination with a new continuous transfer printing technology used to print the pre-

etched electronic wire traces. The passive components do not have discrete bodies but are made from


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resistive inks or foil for resistors and various printed dielectrics for making capacitors. The transfer

printing process prints the pre-etched metal interconnection traces that interconnect the various passive

components and semiconductors together. Furthermore, the transfer printing process is used to print

high power or precision metal film resistors. The metal traces can be any metal alloy with thickness

ranging from 0.001 micron and greater. The passive components are embedded within the multi-layer

electronic assembly. The semiconductors are placed either on top of the finished assembly or embedded

within the structure, often using flip chip technology for making the electrical connections to the metal

traces. The technology eliminates the need to stack semiconductors but instead facilitates the stackingof them in the interlayers of the assembly.

The new electronics fabrication process makes products such as the UPED possible and

inexpensive with the cost and size related to the number of silicon integrated circuits that it contains.

This technology was developed from the new capacitor fabrication technology developed to

manufacture a new type of ultra high energy density capacitor. As mentioned earlier in the document

the new fabrication technology is a combination of existing printing technologies combined with a new

transfer printing process. The technology is low risk as the work is deciding the size of machine to

fabricate and the selection of materials that will be used to fabricate electronic circuits from. Theprocess is more applied Engineering rather than Research & Development.

Fabrication Technology Capability: (patents pending and a large number of trade secrets)

Note; 1 micron = 0.025mm Scale of PCB is similar to first generation integrated circuit in terms ofresolution.

Track width: < 25micron (0.025mm), space < 25 micron, via 50V/micron

Metal track: Thickness from 0.002micron through 0.5 micron, any metal may be used that can beetched using an automated process: Special note, traces that are less than 0.008 micron inthickness are self-healing in the event of a short circuit, when fabricated from aluminumalloy.

Passive component integration: Components are integrated into the PCB and no longer requires aseparate assembly process or require PCB surface area.


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Resistors: Are fabricated using industrial ink jet or buried/etched metal film available in any value.Resistor values may be trimmed/adjusted with resistive ink tolerances to 1% and metal foil

better than 0.1%

Capacitors: They are fabricated and self-healing with the dielectric selectively deposited usingindustrial ink jet printing. Maximum dielectric energy density of 20J/cc is available, similarenergy density to current double layer capacitor, with working voltages as low as 6 volts.The super cap feature can supplement the battery when operating in cellular phone mode.

New dielectrics with 300J/cc energy density (close to that of a battery) are underdevelopment and expected to become available in 1 to 2 years and are fully self-healing(cannot cause a thermal event).

Inductors: Can be fabricated using industrial ink jet printing or integrated as a separate PCB layer.

Integrated Circuits: Are directly wire bonded to the PCB, alternately assembled as flip chip orminiature plastic package.

Active components: Industrial ink jet printing is used to deposit active components into layers asrequired. These components may be transistors, printed integrated circuits, OLED etc.

Advantages: The transfer printing process can be used to print whole or multiple layers of electronicsin a single operation. This makes possible the storing of finished electronic sub-layersassemblies for use at a later time, reducing the size and number of manufacturing machines

that are required. A single machine, is capable of fabricating the various sub-layers forstorage and then combine them later to form the final electronics assembly. This makes

possible pretesting of the subassemblies, trimming of component values and identifyingreject assemblies before integrated circuits are attached. The transfer printing of the metaltraces results in a thinner assembly and much better control of track impedance.

iii. Energy Storage

Until recently, research has been focused on new capacitor dielectrics for storing electric energy,

in a way they are like the filling in pie. Until now no one developed an inexpensive easy to manufacture

capacitor (the shell) to put these fillings into. This new storage technology can use nearly any type of

capacitor dielectric and make capacitors in high volumes using automated manufacturing lines. The

technology is polymer based (made from plastics), not toxic to the environment and made from

common inexpensive industrial grade materials. Using common inexpensive materials means there will

never be shortage in supply as plastic materials can be made from any organic material i.e. wood, oil

and coal. The parts can be easily recycled to make new capacitors. The new capacitors do not contain

any metals that are expensive or in short supply.


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The electronics fabrication technology was originally developed for the fabrication of a new

capacitor technology that has ultra-high energy density, about 30 times that of current double layer

capacitors and approaches the energy density of conventional battery technology. The size of the

capacitor is larger than that of a batteries but its cost of manufacture is much lower 50 to 100 US dollars

per kilo-watt hour. The capacitor life is greater than 500,000 cycles, it is self-healing eliminating risk of

fires, can be changed and discharged in seconds to a few minutes and depending upon selection of

materials is 90 to 97% efficient, wide range of operating temperature, contains no toxic materials and

can be easily recycled.The dielectric construction and composition is a highly guarded trade secret and only capacitor

samples made using dielectrics already in the public will be provided unless the technology is licensed

or purchased.

Preliminary research has been completed and aspects of the technology proven either

experimentally or empirically. The technology is now ready to advance to the pilot manufacturing

stage.

Specification envelope for the capacitor technology:

Special Note: The capacitor performance is dependent upon selection of materials used in its

construction.

Dielectric constant up to 15,000

Working voltage >1000 Volt per mil (25 micron or 0.025mm)

Energy density using proprietary technology >300J per cc

Note: This energy density far exceeds any current capacitor technology.

Pulse capable with reduced energy density

Self-healing comparable if not superior to metalized film capacitor

Operating temperature typical 25 to 105 Celsius; special -65 to 300 Celsius

Space grade is possible, superior to batteries

Not operating -273 through 350 Celsius

Dielectric loss 0.01 through 5% depending on dielectric selection

Common design voltage 50 through 5000V

Upper voltage-limit none; construction similar to metal film capacitors


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Thermal/Mechanical shock minimal to none

Toxic or restricted materials may be manufactured using nontoxic materials

Manufacturing cost $2 to $30 per kilo per 1000cc of volume

For 300J of energy, use 1/2CV2 to determine cost.

i.e. 2uF 1000V, cost in volume $0.02 to $0.30US each

The technology is a form of super capacitor with energy densities up to and exceeding 300

joule per cc, greater than currently possible with any other capacitor. It is capable of replacing batteries

in industrial, military or hostile environments such as that encountered in satellites. Cost is substantially

less than competing capacitor technologies. It utilizes an industry accepted self-healing technology

with a proven track record and operates such that defects are internally disconnected; serving a similar

purpose to a circuit breaker that protects a home against electrical shorts. This is unlike most capacitor

technologies that require external protection circuitry to disconnect a defective device from its

neighbors to prevent thermal events. Single devices may be made with operating voltages from 25

through 250,000 volts DC; well suited for use in electronics, hybrid electric cars, transmission line

storage, Military and Space.

A second technology that 1st LTL acquired is a new failure resistant electrode structure for use

in traditional ceramic capacitor. It is a failure resistant electrode structure that provides internal

protection against short circuits in a ceramic capacitor, reducing greatly the risk of thermal events. This

makes it ideal for the electronic industry as traditionally a shorted ceramic capacitor resulted in a circuit

board failure. With the new electrode structure the capacitors become self-healing so short circuits are

no longer possible. So the circuit board continues to function improving product reliability. The new

electrode structure is fully compatible with current ceramics and does not suffer from delamination

greatly improving product yields. The electrode material doesnt flow into capacitor structure voids,

and provides a better voltage gradient than current electrode materials. Finally the new electrode

material costs less than $30 per kilo, is compatible with electrode ink formulations, fabrication

processes and is readily available with particle sizes less than 50nm.

5. Technology Development

i. Risk & Time To Market


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Next a full sized production machine would be constructed for the manufacture of capacitors.

Following the full scale construction of the production capacitor line a production sized machine would

be built for the volume manufacture of electronics assemblies.

The technology would be developed as follows. The fabrication machines are constructed using

current industrial ink jet printing process for deposition of insulating polymers, printable resistors,

capacitors, active components and the patent pending transfer printer for deposition of the metal traces.

The metal layers produced by transfer printing would have lower resistance and much thinner than

conductors deposited using industrial ink jet printing. Very little fundamental R&D would be required

with the bulk of the work applied Engineering. Completion of the lab units would takeabout 6 months

and the production machines would follow about 6 months later. Volume production of the new high

energy density capacitors in conjunction with the high volume printed electronics would begin about 18

months after the start of the project. This of course assumes adequate staff is available for simultaneous

development of both the capacitor and electronics fabrication production machines.

The new manufacturing process makes possible a new ultra-high energy density capacitor

design that can be made for materials until now unsuitable for the fabrication of capacitors. The volume

of the ultra-high energy density capacitors is expected to eventually exceed 50 Million metric ton per

year at a cost of $5,000 to $30,000US per metric ton.

iii. Technical Support

Full technical support is available from the main technology inventor. Relocation is available

for the time required to get the technology operational and transfer the technology trade secrets. Direct

access to the inventor will cut the development time and cost in half with the best possible

manufacturing technology. Depending upon the terms and conditions of the license or purchase

agreement technical support is available on a as needed basis and for any new inventions related to the

technology.

6. Other Technologies Under Development

There are a number of other technologies that are under development, most are at the conceptual

stage and with a few mature in development.


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7. Other Information Including Contact

No one can prevent you from doing business with 1st Lighten The Load Inc. as it is the legal owner

of the technology. A number of very critical trade secrets have been purposely left out of the patent

applications to slow or even frustrate anyone attempting to illegally use or develop the technology. 1st

Lighten The Load Inc. technical experts are available to assist licensed companies to ensure that they

are first to market. It is prudent to assume that all forms of communication with 1stLighten The Load

Inc. to be intercepted or even possibly interfered with by one or more of our North American

competitors or governments, because of the magnitude of change represented by this technology. 1st

Lighten The Load Inc. answers and responds to all calls and enquiries. For contact in person you may

reach 1st Lighten The Load Inc. at its head office located at;

312 Erin Woods Drive SE,

Calgary, Alberta, Canada, T2B 2X8

Cordially Yours,

Mr. David Kelly

CTO 1st Lighten The Load Inc.Direct Line: +1-403-201-8555, e-mail: [email protected]

Alternate lines +1-403-536-9990 and +1-403-245-9229 (Canada) FAX:

Couriered packages:

Mr. David Kelly1st Lighten The Load Inc.312 Erin Woods Drive SE,Calgary, Alberta, Canada, T2B 2X8
http://www.1-ltl.com/mailto:[email protected]:[email protected]://www.1-ltl.com/


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Appendix A

Note:The technology as presented is purposely made to appear as simple. However,

critical information about the dielectric composition and fabrication process has been purposelyomitted, as it would represent highly confidential trade secrets. Any company or technical teambelieving they can make the technology work without knowing these trade secrets will find outafter great expense they are wrong. Information about the dielectric's composition or detailed

fabrication process has not been given in any pending patent or in any public disclosure. Withoutthis information a technical team is wasting its time and their employer's money. Only companiesthat are in partnership with 1st Lighten The Load Inc. are granted access to trade secrets. In spiteof this warning a few companies and organizations known to us have unsuccessfully, after great

expense, tried to manufacture their own samples.

Diagram Views Of The New Manufacturing Process

This section is a very brief overview of our new fabrication technology and

is not controlled by NDA agreement. Further details about the technology in

greater detail than what has been provided may require the execution of a NDA

agreement.

The heart of the technology is a continuous transfer printing process. Figure

1. shows a simple representation of the process used to coat the transfer film with

a metal layer from a few to hundreds nanometers thick. The coating metal often

is copper, aluminum alloy, resistive alloy for the formation of precision metal

film resistors or other suitable material.


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The process is very similar to that used to metalize the dielectric in metal

film capacitors. The process limitations are dependent on the film composition

and the transfer film temperature capability, which limits the amount of metal

deposition that can be made in a single pass. Figure 1. represents an evaporative

coater where the desired metal is vaporized under vacuum and the metal vapor

directed at the transfer film surface passing underneath. Material other than metal

can be deposited onto the transfer film surface so long as the film temperature

doesnt exceed the material limits. The coating of the transfer film can in many

applications use the same metalization equipment as used in the manufacture of

metal film capacitors. In many applications the metal film is purposely made

highly resistive for the fabrication of precision resistors.

Figure 2. represents a typical Assembly Layer, greatly magnified where the

round black areas are electrical connections to an adjacent layer and the black


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rectangles are where resistive ink is deposited to form embedded resistors. The

degree of magnification is very high where the traces, black lines are normally

less than 1 mil (25 micron) wide with 1 mil (25 micron) spaces. Below the

sample of an assembly layer, Figure 1. and to the left are examples of resistive

elements fabricated in various shapes. The different shapes provide different

resistance, power dissipation and working voltages often made using a common

resistive ink or resistive metal film.

The remainder of the page purposely left blank


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The ratio of length to width determines the actual resistive value and

different inks are often applied on the same layer if high resistance is required.

Various other electronic components can be printed such as PTC fuses, varistors,

transistors (usually of the FET type) etc..

To the right and below the example of the Assembly Layer is a cross section

of a printed capacitor. The electrodes are often designed to be self-healing and

fabricated from a few nanometers of aluminum. The dielectric is often ink jet

printed and may have a high dielectric constant if loss or leakage is not important

alternately using a lower dielectric constant if high frequency performance is

required. Fabrication often uses a dielectric value from 5 to over 15,000 with a

thickness down to a few micrometers if a ceramic polymer is used and less than a

micrometer if it is an unfilled polymer. Working voltages are usually greater than

5 volts per micron and a special dielectric enhancement process is available to

increase the mixed ceramic polymer dielectric constant and saturation energy

density by a factor of 10 in many applications. Multi-layer capacitors are

fabricated by interconnecting alternating layers together. Ultra-high energy

density capacitors with energy density approaching that of a conventional battery

are fabricated using 1

st

Lighten The Load Inc.s special dielectric, which is as awell guarded trade secret. The use of the ultra-high energy density capacitor

technology allows the rechargeable energy storage to be incorporated as part of

the electronic assembly, easily fabricated in any geometry or shape to efficiently

use available space within a portable electronic device. The ultra-high energy


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density capacitor could be fabricated as part of the outer product shell with a thin

protective layer to prevent penetration. The capacitor of this type uses self-

healing electrodes to eliminate the risk of a thermal event.

Figure 3. represents a greatly simplified cross section of the continuous

transfer printing process. Considerable detail has been omitted for purposes of

confidentiality. The transfer process preferentially uses a proprietary solvent

adhesion release system rather than a thermal or pressure transfer process.

The transfer film is represented by number 25, the circuit to be transferred

on the film is 26, the transfer roller is 28 and the layer the electronics is being

transferred onto is 27. Number 29 represents the transfer film leaving the area

without the circuits and 30 are the circuits transferred onto the assembly layer.


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Electrically conductive channels are used to interconnect the traces between

layers and are sometimes deposited on top of the layer being transferred or onto

the assembly prior to the transfer process.

Figure 4. provides additional information about the transfer process and the

overall fabrication equipment with proprietary information omitted for purposes

of confidentiality. In the top figure, number 1 represents a roll of the substrate

layer the electronics is constructed on top of or a previously stored partially

completed electronics assembly fed into the fabrication machine at number 2.

Numbers 3, 4, 5, 6 and 7 represent fabrication cells where a new layer is added

onto the structure. The fabrication machine is made from a number of identically

constructed fabrication cells, numbered 3 through 7 that are individually

programmed to manufacture each specific layer. In this way the machine is very

versatile but simple in construction.


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Number 8 represents the final area where the assembly is pretested and if it

passes integrated circuits are added then the final process cure or other remaining

process steps such as test, burn in final product assembly etc. are performed.

A more detailed cross section of one the fabrication cells is represented by

the bottom portion of Figure 4. Number 21 represents the substrate layer the

electronics is being fabricated on top off. Numbers 15 and 16 are various ink jet

printers depositing insulating layers, conductive interconnect to the next layer,

passive components etc. prior to the transfer printing of the next layer. In the

next section number 17 is the roll holding the layer to be transfer printed, 18 the

stage where the adhesion of the components on the transfer film is reduced prior

to printing at roller 19. Number 20 is the roll that takes up the transfer film for

recycling and 23 the fabrication proceeding to the next assembly stage. The

whole process is quite fast and can progress at rates of 1 to 2 meters per minute

with each cell typically 0.5 to 2 meters long. Each of the transfer printing cells

has similar construction however, they are individually programmed to fabricate

an individual layer.

Figure 5. represents a cross section of a finished electronics assembly with

a large number of layers and buried integrated circuits. An assembly of this type

is an alternative to the expensive process of stacking integrated circuits and wellsuited for complex assemblies such as solid state drives and complex electronic

devices such as our UPED.


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Figure 5. has a lot of individual parts and is greatly magnified with an

assembly typically only 2.5mm thick. In the figure, 62 represents a core, often a

metal alloy or ceramic material often less than 0.25 mm thick, used to limit the

thermal expansion in the plane where the integrated circuits are assembled. These

core layers control thermally induced mechanical stress and spread the heat away

from the integrated circuits while conducting heat to the outer portion of the

assembly. Number 61 represents a hole used for mounting the assembly and 60 a

hole that has conductive paths made through it to electrically interconnect circuits

on either side of the core layer. Number 63 represent various integrated circuits

assembled often using flip chip interconnections and in the Figure 5 there are

circuits buried in lower layers, producing a three D electronic assembly. Number

64 is often a polymer filler used to fill in around the integrated circuits to provide

a level surface to bond the next assembly on top. Electrical interconnects are


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passed through this layer to connect the different circuit layers together. Number

65 represents two active electronic layers stacked on top of each other and 66 is a

similar arrangement on the opposite side. In very complex assemblies addition

heat spreaders may be incorporated for thermal management and to control

thermal stress applied to the integrated circuits. Figure 5 is greatly simplified

with proprietary confidential information eliminated. The final electronics

assembly may be fabricated to be flexible through the proper selection of

polymers and materials used in construction.

1-ltl technology detail

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