1 high speed interconnect solutions page 1 high speed interconnect solutions © 2005-2010, hirose...
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© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010
HIROSE ELECTRIC CO., LTD.HIROSE ELECTRIC CO., LTD.
March, 2010
IT3 series IT3 series High-speed mezzanine High-speed mezzanine
Connector SystemConnector System
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IT3 Series Design OverviewIT3 Series Design Overview
Flexibility:Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIE and XAUI as it is in tomorrow’s 20+ Gbps systems. With the ability to transmit differential, single-ended, and power through one package and being stackable from 15 – 40 mm, IT3 can solve your interface needs for both current and future generations.
Features:•Unique 3-piece structure for excellent reflow solderability•Differential, single-ended, and power•Low mating/extracting forces•Wide misalignment tolerances•Stacking heights from 15 to 40mm•Both SnPb and Pb-free are available•Staggered 1.5mm x 1.75mm BGA
A New Standard Mezzanine for Flexibility and Performance
Flexible Flexible 3-piece design3-piece design has many advantages has many advantages
Detachable(Mating) Side
Mating / Unmating
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Hirose IT3 vs. CompetitionHirose IT3 vs. Competition
Hirose IT3 Amphenol NexLev FCI GigArray
Pin counts : 100/200/300 100/200/300 200/296Stack heights : 10mm to 40mm 10mm to 33mm 15mm to 40mmSignal density : 73 diff pairs/inch 73 diff pairs/inch 66 diff pairs/inch
Sales channel : Direct / Disty Direct only Direct / Disty
2nd Source : Tyco None None
High ASP = $ 50 + per mated connectorHigh ASP = $ 50 + per mated connector
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High Speed “Terms” to Know: MechanicalHigh Speed “Terms” to Know: Mechanical
• BGA: Ball grid array interconnect system using reflow solder balls
• Ground: An electrical connection between a circuit and the earth
• Power: The rate of generation, transferring or using energy, measured in watts
• Stack Height: Vertical distance measured in mm between PCB & connector
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Application ExamplesApplication Examples
Internet Routers &Switches
Servers/Storage
Base Transceive
r Station
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Currently Available VariationsCurrently Available Variations
100 signals 200 signals 300 signals
10 x 10 20 x 10 30 x 10
Pb Mounting In production In production In production
Pb Mating In production In production In production
Pb-free Mounting In production In production In production
Pb-free Mating In production In production In production
12 mm Under planning Under planning Under planning
14 mm Under planning Under planning In production
15 mm Under Development In production In production
17 mm Currently no plan In production In production
20 mm In production In production In production
22 mm Currently no plan In production In production
25 mm In production In production In production
26 mm In production In production In production
28 mm In production In production In production
30 mm Currently no plan In production In production
32 mm Currently no plan In production In production
35 mm Under planning Under planning Under planning
38 mm In production In production In production
40 mm Under Development In production In production
Stacking HeightIn
terp
os
ers
So
ck
ets
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© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010
Available Sales toolsAvailable Sales tools
2D MechanicalDrawings
3D STEPFiles
SI Data
- General Presentation- Modeling- Detailed Test Reports (Available by Stack Height)- Test/Demo Board
Assembly and Design Notes
ProductBrochure
Qualification Data
- L1 Environmental Qualification Test Report
- L2 Long-term BGA Reliability Test Report
- L3 Manufacturing Yield Test Report
MechanicalShow & Tell
Samples
Sample DisplayCases
ComingComingMay 2010May 2010
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Available Sales toolsAvailable Sales tools
Technical Data
No Item Format File name (Ex.)
1 Simplified 3D modelSTEP (SAT &IGES are also available)
IT3M-300S-BGA.stp
2 Footprint data Allegro IT3M-300S-BGA.brd
3 Spice models Spice IT3-**H.sp
4 Touchstone model Touchstone IT3-300-**H.s60p
Technical Document
No Item FormatFile name (Ex.)
or Document number
1 2D drawing PDF IT3M-300S-BGA.pdf
2 Spec sheets PDF IT3M-300S-BGA.pdf
3 Contact reliability report PDF TR0636E-10018
4 Eutectic thermal cycling test report PDF TR0636E-10026
5 Lead free thermal cycling test report PDF TR0636E-20128
6 Temperature rise report PDF TR0636E-20041
7 SI report PDF IT3-**H.pdf
8 Assembly note PDF ETAD-F0457
9 Design note PDF ETAD-F0347
10 Customer demo board test report PDF IT3_demo_board_v2.pdf
11 Characterization board test report PDF IT3_Characterization_Board_v09.pdf
From Assembly Notes and Design Notes; documents 3 through 6 are based on EIA spec.
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High Speed “Terms” to Know: SIHigh Speed “Terms” to Know: SI
• Differential Signaling: Digital signals transmitted as the difference in voltage of a pair of signal lines
• Gbps: = Gigabits per second; a unit data transfer rate/speed = 1k megabits per second
• S. Parameter: Plots attenuation vs. frequency used to document connector performance and is also known as insertion loss
• SI: = Signal Integrity; Process of analyzing and making appropriate system design decisions
• Signal Ended Signaling: Signals transmitted over one wire using common ground return
• Spice Model: Simulated program with integrated circuit emphasis
• Touchstone File: Also known as SnP file; intended for use with documents and specifications for parameter data of active or passive interconnect network
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Assembly friendly unique 3-piece Assembly friendly unique 3-piece
X-ray inspection from bottom side
X-ray Inspection FriendlyX-ray Inspection Friendly
Low Thermal Mass Low Thermal Mass for Reflow processfor Reflow process
For any stacking height combination, receptacle is always same and its height is 6mm only.Small size of receptacle has wide process window for reflow profile.
No need to reflow
Reflow receptacle onlyReflow receptacle only
Lead-Free applications benefit from our easy reflow process design.
1.1. Significantly reduces Significantly reduces frequency of false callsfrequency of false calls
2.2. Simple receptacle design Simple receptacle design gives clear vision for X-ray gives clear vision for X-ray inspection.inspection.
“Mounting receptacle”Reflow-mounted on PCB
“Interposer”Installed onto “Mounting receptacle” after reflow
“Mating receptacle”Mated with “Interposer”
IT3 3-Piece Design Features & BenefitsIT3 3-Piece Design Features & Benefits
IT3 series mounting & mating procedureIT3 series mounting & mating procedure
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HRS IT3 SeriesHRS IT3 Series : 10˚ acceptable: 10˚ acceptable Competitors’Competitors’ : Not acceptable: Not acceptable
Mating / Un-mating operationMating / Un-mating operation
Industry standard footprintIndustry standard footprint
IT3 3-Piece Design Features & BenefitsIT3 3-Piece Design Features & Benefits
IT3D/M -***S - BGA
0.7
5 m
m
0.875 mm
Signal BGA Signal BGA
Ground BGAGround BGA
HRS IT3 SeriesHRS IT3 Series : 3˚ acceptable: 3˚ acceptable Competitors’Competitors’ : Not acceptable: Not acceptable
High reliableHigh reliableBGA connectionBGA connection
*Patent Pending
IT3’s unique 3 piece design and construction gives industry leading BGA reliability, while still providing the density of 73 differential pares per linear inch.
The IT3’s divided receptacle structure reduces thermal stress and ensures long-term reliability of the BGA ball connection with the PWBDrop-in replacement for NexLevDrop-in replacement for NexLev
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Lower forceInsertion and Extraction
Displacement of spring
(mm)
Con
tact
for
ce (
N)
0
Contact normal force
Spring workload
is decreased.
Pre-load structure
Housing design prevents pin stubbing
Exposed contacts
Existing solution
IT3 Series
IT3 Supplier A
Appx. 200 pos. 90 N 145 N
Appx. 300 pos. 135 N 218 N
IT3 3-Piece Design Features & BenefitsIT3 3-Piece Design Features & Benefits
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IT3 connectors
PCB
IT3 series for 30mm (or any) stacking height application
3-Piece Connector Assembly Benefit3-Piece Connector Assembly Benefit
Already confirmed that there Already confirmed that there are no issues to mount Hirose are no issues to mount Hirose IT3 series connectors on the IT3 series connectors on the bottom side of PCB for 2bottom side of PCB for 2ndnd reflow soldering by major reflow soldering by major CEMs. CEMs.
2nd Reflow soldering compatible2nd Reflow soldering compatible
Other supplier for 30mm height application
6m
m
19
.7m
m
May not suitable for 2nd May not suitable for 2nd Reflow soldering due to Reflow soldering due to
the weight.the weight.
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© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010
Robust and Reliable Solder Ball AttachmentRobust and Reliable Solder Ball AttachmentH
igh
Spee
d In
terc
onne
ct S
olut
ions
Not to scale
After reflow soldering
Uncontrolled co-planarity brings the migration of solder ball from low to high temperature side during reflow, which causes the soldering failure.
The countermeasures are to improve the excess co-planarity or to implement the thicker metal mask to cover such co-planarity.
As a contact lead is positioned into a solder ball, it prevents the ball from pealing off during severe shock &vibration test.
Hirose IT3 series Other connector & silicon device package
Since the receptacle’s contact resides in the BGA ball, the IT3 is very strong for shock and vibration. (Patent Pending)
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Unique Interposer Design for Signal IntegrityUnique Interposer Design for Signal Integrity
Interposerwafer
• Micro strip line structure• Up to 6.25G bps with fully populated
pin assignment• Over 10G bps with skipped pin
assignment for differential pairs• Also can be used for power lines
Interposer wafer structure
Signal / Ground configuration
Signal Ground
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IT3 vs. IT2IT3 vs. IT2
BGA grid 0.7 x 0.875 (mm) 1.0 x 1.0 (mm)
# of ballsSignal: 300
Ground: 270Signal : 180
Ground : 200
Receptacle size 56 x 19.2 x 6 (mm) 48.2 x 22.6 x 5.25 (mm)
* Because of connector structure, IT2 cannot have pins skipped for faster data transfer requirement.
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Hybrid (Selectively Loaded) Type AvailableHybrid (Selectively Loaded) Type Available
• IT3HY (85&100Ω) mating / internal structure
IT3HY-100P-38H(schematic only)
IT3D-100S-BGA
IT3M-100S-BGA
85Ω QPI wafer(typical for new Server applications)
Existing 100Ωwafer(typical for Telecom applications)
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IT5 vs. IT3
• IT5 has improved ICR (with 8-aggressor FEXT) for 25 Gbps data rate with plenty of margins.
IT3 IT5
12.5 GHz
Via stub