1 draft - not for publication april 5-7, 2006, maastricht itrs - ye itwg meeting in maastricht april...
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DRAFT - NOT FOR PUBLICATION April 5-7, 2006, Maastricht
ITRS - YE ITWG
Meeting in MaastrichtApril 6-7, 2006
Lothar Pfitzner, ++49 9131 761 110, [email protected] Nutsch, ++49 9131 761 115, [email protected]
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DRAFT - NOT FOR PUBLICATION April 5-7, 2006, Maastricht
Maastricht 2006 YE ITWG Meeting Participants
• 12 Participants (Europe, Japan, USA)
– Lothar Pfitzner (Fraunhofer IISB)– Ines Thurner (Infineon)– Dilip Patel (ISMI)– Sumio Kuwabara (NEC)– Andreas Nutsch (Fraunhofer IISB)– Andreas Neuber (MW Zander)– Dieter Rathei (D R Yield)– Dirk de Vries (Philips)– Chris Muller (Purafil)– Francois Finck (ST)– Allyson Hartzell (Exponent)– Dave Roberts (Air Products)
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DRAFT - NOT FOR PUBLICATION April 5-7, 2006, Maastricht
YE TWG• Topics
– DDC: update the tables
– DDC: remark that metrology tools need to be available for technology development 18 to 24 months before each technology generation ius actually introduced
– YMDB: Defect budget survey will be done in Japan, the data will be supplied to ITRS, if other regions participate
– YMDB: The defect size distribution will be kept on scaling with 1/x³. Remark: it might be possible for smaller defect size the defect numbers might increase significantly stronger, because effects e.g. nucleation are expected
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DRAFT - NOT FOR PUBLICATION April 5-7, 2006, Maastricht
Cross TWG• Cross TWG
– Lithography– ESH– FEP– Interconnect– Factory Integration– Test
• Topics– Lithography: For immersion lithography: Is there a need for a new
method for defect inspection? Is a specific defect specification required? – Answer: no additional specs. Follow up: exchange on information on sensitivity etc. (requirements on defect detection)
– FEP: Yield model in ITRS: requires input from Fabs requires further discussion
– FEP: Defect budgets: still no new survey available– TEST: Common coordinate system neccessary
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DRAFT - NOT FOR PUBLICATION April 5-7, 2006, Maastricht
Cross TWG
• Cross TWGs of WECC
– Litho: Further improve definition of interfaces and parameters
– Factory integration (FI): Further clarification of interfaces
– Front end processing (FEP): Follow-up on AMC and CVD/ALD precursor specifications
– Assembly and Packaging: Second contact with regard to new requirements
– ESH: Yield modelling for impact analysis will be difficult due to potential reliability issues, further coordination on CVD/ALD precursor material screening and yield impact analysis of recycling