1 c osmic dust r eflectron for i sotopic a nalysis (cria) critical design review september 26, 2007...
TRANSCRIPT
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Cosmic dust Reflectron for Isotopic Analysis (CRIA)
Critical Design Review
September 26, 2007
Laura Brower: Project ManagerDrew Turner: Systems EngineerLoren ChangDongwon LeeWeichao Tu
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Agenda
• Organization
• System Design & Requirements
• Subsystem Design
• Test Plan
• Project Management Plan
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Professional B. Lamprecht
(LASP)
Professional S. Steg (LASP)
Professional M. Rhode (CU)
Organizational StructureCustomer
Z. Sternovsky
Customer Z. Sternovsky
AdministrationAdministration System EngineerSystem Engineer
ElectronicsElectronicsThermalThermalStructuresStructures
Project Manager L. Brower
CU Advisors X. Li
S. Palo
Student Lead D. Turner
Student Lead L. Brower
Student Lead W. Tu
Professional V. Hoxie (LASP)
Student Lead D. Turner
Professional M. Lankton (LASP)
P. Graf
Student Lead B. Hodgkinson
N. Little
Student Lead D. Lee
Professional G. Drake (LASP)
MaterialsMaterials
Student Lead L. Chang
Experienced Graduate K. Amyx (CU)
Ion OpticsIon Optics
Student Lead D. Turner
DetectorDetector
ManufacturingManufacturing
Professional G. Drake (LASP)
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Agenda
• Organization
• System Design & Requirements
• Subsystem Design
• Test Plan
• Project Management Plan
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System Level DiagramSupporting Electronics
Instrument Electronics
Structure
Thermal Control
Mass Analyzer
DetectorAnalyzerIonizer
•High voltage supply
•Oscilloscopes
•Computer
•Power source
•Charge Sensitive Amplifier
•Voltage dividers
•Heaters
•Thermocouples
(Gray area)
(Target) •Annular electrodes
•Ring electrodes
•Grounded grids
Line Key Power
High Voltage
Heat
Data
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Minimum Success Criteria• Achieve working instrument with mass resolution of
at least 100 m/Δm (Req: 1.TR2)
• Achieve TRL-5: Working prototype tested in relevant environments (Req: 1.TR4)
2. Hardware budget < $30k
3. Cleanliness reqs for Vac chambers
1. Meet assembly tolerances
4. Electronics accuracy
Key Build/Test Phase Requirements
Flowdown?
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Agenda
• Organization
• Background
• System Design & Requirements
• Subsystem Design
• Project Management Plan
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IonizerDetector
AnalyzerStructures
Structural Design
Fabrication Plan
Thermal
Electronics/CDH
Structures SubsystemLead: Drew Turner
Speakers: Drew Turner, Dongwon Lee
Assembly Plan
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Structure: Requirements Overview
Req No. Description Req Met? Verification Method
3.4DC1 Scaling of Ion optics by 5/8th of LAMA ion optics
Yes CAD design
3.4DC6, 3.4DC7, 3.4DC8
Electrically isolate high voltages CAD design, electronics potting, functional test
3.4DC5 Structure mass < 15 kg Yes CAD estimate 11.7 kg
3.4DC10, 3.4DC11
Light cannot enter instrument except at aperture
Yes CAD design
2.DC2 Minimize outgassing Vac test with Noryl insulators
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Hexagonal Structure: Overall CharacteristicsUnique Parts 29
Total No. of Mnf. Parts
96
Mass 11.64 kg
Fasteners <300*
*Not including instrument-spacecraft interface
*All blind fasteners will be vented
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Structure: Parts Summary
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Structure: Parts Summary
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AssembliesAnnular Electrode Assembly
Target Assembly
Main Housing Assembly
Detector Assembly
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Main Housing Assembly
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Main Housing Assembly
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Main Assembly
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Structure Materials
Noryl Delrin
Dielectric strength 500 V/mil 380 V/mil
Density 0.039 lb/in3 0.051 lb/in3
H2O absorption (in 24 hours) 0.07 % 0.25 %
H2O saturation 0.20 % 0.90 %
Total material cost ~$150 ~$110
• Al T-6061 used for all metal parts• Noryl used for all insulator parts• Stainless steel fastners used with helicoils for small holes
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Annular Electrode Assembly
Annular Electrodes (BeCu 17200)
Annular Electrode Mount
Wiring Channel (Noryl)
Annular Electrode Standoff (Noryl)
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Annular Electrode Assembly
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Target AssemblyGrounded GridInner/Outer Target Electrode Standoffs
(Noryl)
Inner/Outer Target ElectrodesHexagonal Base
Silver Coated Target
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Target Assembly
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Detector AssemblyTop/Bottom Detector Grid Clamp
Detector Grid Detector Housing Cylinder
Detector
Detector Lid
(Insulation)Del Mar
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Main Assembly
Detector Assembly
Target Assembly
Main Housing Assembly
Annular Electrode Assembly
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Cable Layout
Heater/CSA High Voltage – Ion Optics
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Cable Layout: Target Electrodes
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Mechanical Ground Support Equipment Interfaces
• Remove-before-flight cover• Thermal Vacuum/Vibration Adapter Plate
Put CRIA on its side in TVAC
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Integration &Testing Features• Removal of Detector Assembly for Storage• Electrical / Soldering Access• Reconnecting the CSA• Panel removal for internal access
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Fabrication/Assembly Schedule
Assembly
Built In-House
Outsourced
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In-House Manufacturing Schedule
• 5 new undergraduates recently recruited• 2 new undergraduate machinists hired
(UROP funding)
• Working with DANDE to avoid conflicts in ASEN shop
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Status of Outsourced Parts
Part Vendor Cost Expect to Receive Status
Hex Base LASP ~ $2700 -- Received
Annular Electrode Mount
LASP ~$2700 Mid-Oct Currently being built
Annular Electrode Grid
FotoFab $800 Mid-Oct Order processing with vendor
Grounded Grid FotoFab ~$1300 Mid-Oct Order processing with vendor
Target Substrate
AnoPlate $250 Early-Oct Currently being silver plated
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Assembly Plan
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IonizerDetector
AnalyzerStructures
Voltage Divider Design
Thermal
Electronics/CDH
Analyzer SubsystemLead: Loren Chang
Speakers: Loren Chang
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Analyzer: Requirements
Requirement Description3.4.DC1 Scaling of Ion optics by 5/8th of LAMA ion optics
3.2.PR2 - PR4 Electrode voltages shall be within +/- 10 V of the specified values from SIMION simulation.
3.5.IR2 A voltage divider box shall provide the necessary voltages to the various subsystems.
3.5.PR2 All electronics shall maintain a voltage accuracy of 0.5% on the electrodes.
Updates?
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Voltage Dividers (VD)
• Converts 6 kV input ( µA) to voltages required for each electrode, as well as the target.
• Precise values assembled from discrete resistors. Electrodes must be held at 0.5% prescribed values.
• Design leaves space for additional corrector resistors.
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VD PCB Design• Dimensions: 6.8 x 5.55”.
• 2 layer FR4 board with 20 mil traces. 93 mil thickness (no breakdown issues).
• Total power draw: 0.78 W.
• Minimum component separation of 100 mils (larger for most components).
• Wires to resistors to be connected via terminal posts.
• PCB to be outsourced for etching. Soldering will be performed by team.
• Entire board will be potted once assembly is complete.
Pot with EN-4 and EN-11, potentially get
from LASP?
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VD Enclosure Design
• VD system uses DC. Shielding is not necessary.
• Dimensions approx.: 7 x 5.75”.
• Will be manufactured in house.
Aluminum box with cutouts on sides to allow wire passage
Board mounted to enclosure using 4 x 0.118” screws on standoffs
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Electronics Schedule
IssueCompletion
DateNotes
VD PCB component testing. 10/9/2007Measuring ordered components to determine attainable precision.
CSA testing. 9/31/2007 Testing CSA impulse response at STP.
VD PCB etching.9/28/2007
(Submission)
To be outsourced to Sunstone. Current quote is ~$400 for two boards with 1 week manufacture time.
VD PCB assembly. 10/19/2007 All soldering in-house.
VD testing (non thermovac) 10/29/2007VDs to be run at lower voltages at STP to determine possible voltage drift. Correctors added if required.
Integration with main CRIA instrument.
11/5/2007
Electronics testing (thermovac)
11/2007 CRIA tested in relevant environment.
Put into excel
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Electronics/CDH SubsystemLead: Weichao Tu
Speakers: Weichao Tu
IonizerDetector
AnalyzerStructures
Electronics Design
Thermal
Electronics/CDH
CSA Layout/ Assembly
Testing
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Electronics: Requirements (key pre-flight ones)
Requirement Description
3.5.PR3All electronics used in design shall operate in a vacuum environment without failure
3.5.PR2All electronics shall maintain a voltage accuracy of 0.5% on all the electrodes
3.5.PR1The voltage ripple on any of the electrodes shall not exceed [0.1%] of the applied voltage
3.5.PR4The instrument shall be able to detect charge signals on the target and grounded grid for data triggering
4.5.DC2The voltage divider box shall be located outside of the instrument body
4.5.DC3 The CSA box shall be located close to the charge detector
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DET
CRIA
Oscilloscope (500 MHz)
HV Supply 1(+20kV)
Target
Ring Electrodes
Annuli Electrodes
Detector(-1~2 kV and -100V)
Lab Supporting Electronics
Decontam. Heater (11.5 V, 24W)
Electrical Block Diagram (Preflight Design)
CSA
CSA
Amplifier Box
HV Supply 2(-3 kV)
DividerBox
(+6kV)
Inside Electronics
VoltageSupply
CSA(6V, 14mW)
0.15W
0.6pW
~24W
POWERMax: <25 W
Coax Coax
Coax
HV wire
HV wire
HV wire
HV wire
HV wire
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CSA SubsystemAssembly– CSA: A250F/NF (2)– FET: SK152 (2)– Board: PC250F (2)
A250F/NF ConnectionPC250F Layout
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Functional Test• Soldering A250F/NF, FET• Function-test with
– A pulser• Transition time < 20 ns• Step: 22 mV
– A test capacitor• 2 pF
– 22 mV step into 2 pF simulates the charge generated in a silicon detector by a particle losing 1MeV
– Measure the output• Noise Measurement
– Test with• A post amplifier• MCA or RMS Voltmeter
Test Circuit
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Signal Input
Coax
SMA
SMA
Signal Output
Power Input
Twisted wire pair(+6V& ground)
Coax
A250
Dimensions: 1 X 2 X 3 inches
Assemble into CSA Box
Updates?
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Triggering Test• Object: To test the combined triggering
signals from the target and the grounded grid • Test Procedure
– Connect one CSA to the target, the other CSA to the grounded grid
– CSA Noise Floor Test • Connect the output signal to a Post-Amp and MCA/RMS
voltmeter• Record the change of noise with temperature
– Triggering Test • Laser-simulated impact• To determine whether resulting signals are detectable
above the noise floor • Record the S/N and its change with temperature
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IonizerDetector
AnalyzerStructures
Target Heater Design
Thermal
Electronics/CDH
Heater Locations
Thermal SubsystemLead: Laura Brower
Speakers: Laura Brower
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Requirement Description
3.6.FR1 Power allocation is 20 W
3.6.PR1 Target shall be heated to 100oC
3.6.IR1 Target heater shall be electrically insulated from the target
3.6.IR3 Target heater shall be thermally insulated from the instrument
4.6.IR1, 4.6.IR2 The backside of the target heater shall be covered in a low emissivity material
???? Electronics (CSA/VD?) must be maintained between -25 C and 100 C??
Thermal Requirements
Updates?
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Target Heater Configuration
• The heater is wrapped in a thin Kapton coating• An additional layer DuPont Kapton FN (Kapton
type: 150FN019) provides the electrical insulation sufficient to shield the heater from the target at 5 kV.
Minco Heater
0.5 mm Target Kapton FN (Kapton type: 150FN019)
0.1” Al target substrate
Where purchase from/cost?
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Heater Locations• Heater location on electronics has not been analyzed
Location 1:
underneath target substrateLocation 2:
on Voltage Divider box
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Agenda
• Organization
• Background
• System Design & Requirements
• Subsystem Design
• Test Plan
• Project Management Plan
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Meeting Requirements through Testing
TRL 5: test CRIA in a relevant environment
• Performance reqs• Analysis (thermal, ion optics, electronics)• Test Plan/ Verification
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How to Reach TRL 5
Required for TRL 5:• Vacuum Testing
– Test performance of CRIA (measure m/Δm) using laser ablation of target to simulate dust impacts
• Thermal Vacuum Testing– Monitor temperature response of structure, detector,
voltage divider electronics, etc. during Thermal Balance Test and Thermal Cycle Test
• UV Testing– Test signal response of detector exposed to UV
Additional Testing• Vibration Testing
– Shake/vibe based on NASA criteria for launch
TRL 5: test CRIA in a relevant environment
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Pre-testing Tasks:
•Instrument checkout (test resistors, etc.)
Vacuum Testing
Location: CU campus, Z. Sternovsky’s lab
Operating Pressure: 10^-5 Torr
Cost: $0 to operate vacuum
Schedule: expect 1 week of testing in Oct, budget 1 month of testing
Test Type Component Description Measure/ Record
Functional Target Heater
Heat target to 100C
Target substrate temp
Performance Instrument Simulate dust w/laser ablation
Obtain spectra, monitor voltages
Test Matrix
Lab Support Equipment:
•2 HV Supplies (power detector)
•Oscilloscope
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Pre-testing Tasks:
•Instrument checkout
•Clean Room practices during assembly
•RGA, TQCM, possibly BOT
Thermal Vacuum TestingTest Type Component Description Measure/
Record
Functional Target Heater
Heat target to 100C during -50C thermal balance test
Target substrate temp
Thermal Balance
Instrument Steady state at
-50C, +40C
Monitor instr temps
Thermal Cycle
Instrument Cycle between
-50C, +40C
Monitor instr temps
Location: LASP (MOBI or BEMCO)
Operating Pressure: <10^-5 Torr
Cost: Budgeting $1000 for oper equip / personnel time
Schedule: expect 2-3 days of testing in Nov, budget 1 month of testing
Test Matrix
Lab Support Equipment:
•Low voltage power supply
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Test Schedule
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Agenda
• Organization
• Background
• System Design & Requirements
• Subsystem Design
• Test Plan
• Project Management Plan
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Cost Budget
Insert Details of Big items
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Risk Assessment
???????
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Special Thanks:• LASP for providing internal Funding and Support• CU Aerospace Engineering Sciences Dept. Funding and Support• Keegan Amyx• Chelsey Bryant• Josh Colwell• Ginger Drake• Paul Graf• Vaughn Hoxie• Bret Lamprecht• Mark Lankton• Mike McGrath• Matt Rhode• Steve Steg• The Heidelberg dust group
And of course: Xinlin Li, Scott Palo, and Zoltan Sternovsky
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Questions?
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Backup Slides
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Structure: Upcoming Work
• Complete Finite Elements Structural Analysis– Fundamental mode– Ultimate and Yield Stresses– Fastener pull-out strength
• Review Design and Produce Mechanical Drawings